CN101827927B - 一种等离子刻蚀残留物清洗液 - Google Patents
一种等离子刻蚀残留物清洗液 Download PDFInfo
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- CN101827927B CN101827927B CN2008801130471A CN200880113047A CN101827927B CN 101827927 B CN101827927 B CN 101827927B CN 2008801130471 A CN2008801130471 A CN 2008801130471A CN 200880113047 A CN200880113047 A CN 200880113047A CN 101827927 B CN101827927 B CN 101827927B
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- 238000004140 cleaning Methods 0.000 title abstract description 23
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- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 2
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 claims description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 claims description 2
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 claims description 2
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- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 2
- 229920000768 polyamine Polymers 0.000 claims description 2
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
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- 239000000908 ammonium hydroxide Substances 0.000 description 1
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- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
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- ZZVUWRFHKOJYTH-UHFFFAOYSA-N diphenhydramine Chemical compound C=1C=CC=CC=1C(OCCN(C)C)C1=CC=CC=C1 ZZVUWRFHKOJYTH-UHFFFAOYSA-N 0.000 description 1
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- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
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- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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Abstract
本发明公开了一种等离子刻蚀残留物清洗液,其含有:二甲亚砜、多元醇单烷基醚、水、氟化物、多氨基有机胺、氨基酸和叔胺。本发明的清洗液清洗能力强,可有效去除金属线(Metal)、通道(Via)和金属垫(Pad)晶圆上的等离子刻蚀残留物,而且对非金属材料(如SiO2、离子增强四乙氧基硅烷二氧化硅(PETEOS)、硅和低介质材料等)和部分金属材料(如Ti、Al和Cu)等有较小的腐蚀速率,可适用于批量浸泡式、批量旋转喷雾式和单片旋转式的清洗方式,具有较大操作窗口,在半导体晶片清洗等微电子领域具有良好的应用前景。
Description
技术领域
本发明涉及半导体制造工艺中的一种清洗液,具体的涉及一种等离子刻蚀残留物清洗液。
技术背景
在半导体元器件制造过程中,光阻层的涂敷、曝光和成像对元器件的图案制造来说是必要的工艺步骤。在图案化的最后(即在光阻层的涂敷、成像、离子植入和蚀刻之后)进行下一工艺步骤之前,光阻层材料的残留物需彻底除去。在掺杂步骤中离子轰击会硬化光阻层聚合物,因此使得光阻层变得不易溶解从而更难于除去。至今在半导体制造工业中一般使用两步法(干法灰化和湿蚀刻)除去这层光阻层膜。第一步利用干法灰化除去光阻层(PR)的大部分。第二步利用缓蚀剂组合物湿蚀刻/清洗工艺除去剩余的光阻层,其具体步骤一般为清洗液清洗/漂洗/去离子水漂洗。在此过程中,只能除去残留的聚合物光阻层和无机物,而不能攻击损害金属层(如铝层)。
现有技术中典型的清洗液有以下几种:胺类清洗液,半水性胺基(非羟胺类)清洗液以及氟化物类清洗液。其中,前两类清洗液需要在高温下清洗,一般在60℃到80℃之间,存在对金属的腐蚀速率较大的问题。而现有的氟化物类清洗液虽然能在较低的温度(室温到50℃)下进行清洗,但仍然存在着各种各样的缺点。例如,不能同时控制金属和非金属基材的腐蚀,清洗后容易造成通道特征尺寸的改变,从而改变半导体结构;蚀刻速率较大,使得清洗操作窗口比较小等。
US 6,828,289公开的清洗液组合物包括:酸性缓冲液、有机极性溶剂、含氟物质和水,且pH值在3~7之间,其中的酸性缓冲液由有机羧酸或多元酸与所对应的铵盐组成,组成比例为10∶1至1∶10之间。US 5,698,503公开了含氟清洗液,但大量使用乙二醇,其清洗液的粘度与表面张力都很大,从而影响清洗效果。US 5,972,862公开了含氟物质的清洗组合物,其包括含氟物质、无机或有机酸、季铵盐和有机极性溶剂,pH为7~11,由于其清洗效果不是很稳定,存在多样的问题。
因此,为了克服现有清洗液的缺陷,适应新的清洗要求,比如环境更为友善、低缺陷水平、低刻蚀率以及较大操作窗口等,亟待寻求新的清洗液。
发明概要
本发明所要解决的技术问题是为了克服现有的等离子刻蚀残留物清洗液存在的腐蚀速率大,不能同时控制金属和非金属的腐蚀,清洗窗口小,清洗能力不足以及清洗效果不稳定等等缺陷,而提供一种具有较强的清洗能力,且腐蚀速率小,可同时控制金属和非金属的腐蚀,清洗窗口大,清洗效果稳定的等离子体刻蚀残留物清洗液。
本发明的等离子体刻蚀残留物清洗液含有二甲亚砜、多元醇单烷基醚、水、氟化物、多氨基有机胺、氨基酸和叔胺。
其中,所述的二甲亚砜(DMSO)的含量较佳的为质量百分比1~75%。
其中,所述的多元醇单烷基醚较佳的为乙二醇单烷基醚、二乙二醇单烷基醚、丙二醇单烷基醚、二丙二醇单烷基醚和三丙二醇单烷基醚中的一种或多种。其中,所述的乙二醇单烷基醚较佳的为乙二醇单甲醚、乙二醇单乙醚和乙二醇单丁醚中的一种或多种;所述的二乙二醇单烷基醚较佳的为二乙二醇单甲醚、二乙二醇单乙醚和二乙二醇单丁醚中的一种或多种;所述的丙二醇单烷基醚较佳的为丙二醇单甲醚、丙二醇单乙醚和丙二醇单丁醚中的一种或多种;所述的二丙二醇单烷基醚较佳的为二丙二醇单甲醚、二丙二醇单乙醚和二丙二醇单丁醚中的一种或多种;所述的三丙二醇单烷基醚较佳的为三丙二醇单甲醚。多元醇单烷基醚的含量较佳的为质量百分比1~70%。
其中,所述的氟化物较佳的选自氟化氢、或氟化氢与碱形成的盐,优选氟化氢(HF)、氟化铵(NH4F)、氟化氢铵(NH4HF2)、四甲基氟化铵(N(CH3)4F)和三羟乙基氟化铵(N(CH2OH)3HF)中的一种或多种。所述的碱较佳的选自氨水、季胺氢氧化物和醇胺。所述的氟化物的含量较佳的为质量百分比0.01~20%。
其中,所述的水的含量较佳的为质量百分比15~65%。
其中,所述的多氨基有机胺较佳的为二乙烯三胺、五甲基二乙烯三胺和多乙烯多胺中的一种或多种,更佳的为五甲基二乙烯三胺。所述的多氨基有机胺的含量较佳的为质量百分比0.1~20%。
其中,所述的氨基酸较佳的为2-氨基乙酸、2-氨基苯甲酸、亚氨基二乙酸,氨三乙酸和乙二胺四乙酸中的一种或多种,更佳的为亚氨基二乙酸。所述的氨基酸的含量较佳的为质量百分比0.1~10%。
其中,所述的叔胺较佳的为三乙胺、三丙胺、N,N-二甲基乙醇胺、N,N-甲基乙基乙醇胺、N-甲基二乙醇胺和三乙醇胺中的一种或多种,更佳的为三乙醇胺。所述的叔胺的含量较佳的为质量百分比0.1~20%。
本发明的清洗液还可包含其它本领域常规添加剂,如金属防腐剂(如铜的防腐剂:苯并三氮唑;又如铝的防腐剂:聚丙烯酸)。
本发明的清洗液经上述成分简单混合均匀即可制得。本发明的清洗液可在较大的温度范围内使用,一般在室温到55℃范围内,并且可应用于各种清洗方式,如批量浸泡式、批量旋转式和单片旋转式。本发明所用试剂及原料均市售可得。
本发明的积极进步效果在于:本发明的清洗液清洗能力强,可对金属线(Metal)、通道(Via)和金属垫(Pad)晶圆进行清洗,有效去除等离子刻蚀残留物,而且对非金属材料(如SiO2、离子增强四乙氧基硅烷二氧化硅(PETEOS)、硅和低介质材料等)和部分金属材料(如Ti、Al和Cu)等有较小的腐蚀速率,可同时控制金属和非金属的腐蚀。此外,本发明的清洗液可适用于批量浸泡式(wet Batch)、批量旋转喷雾式(Batch-spray)和单片旋转式(single wafer tool)的清洗方式,具有较大操作窗口。
发明内容
下面通过实施例的方式进一步说明本发明,但并不因此将本发明限制在所述的实施例范围之中。
实施例1~16
表1给出了本发明的等离子刻蚀残留物清洗液的实施例1~16,按表中配方,将各组分混合均匀,即可制得各实施例的清洗液。
表1本发明的等离子刻蚀残留物清洗液1~16
效果实施例
采用实施例14的清洗液对金属线、通道和金属垫进行清洗,并测试其对金属铝和非金属(PETEOS)的腐蚀速率。
清洗液的金属腐蚀速率测试方法:
1)利用Napson四点探针仪测试4*4cm铝空白硅片的电阻初值(Rs1);
2)将该4*4cm铝空白硅片浸泡在预先已经恒温到35℃的溶液中30分钟;
3)取出该4*4cm铝空白硅片,用去离子水清洗,高纯氮气吹干,再利用Napson四点探针仪测试4*4cm铝空白硅片的电阻值(Rs2);
4)重复第二和第三步再测试一次,电阻值记为Rs3;
5)把上述电阻值和浸泡时间输入到合适的程序可计算出其腐蚀速率。
清洗液的非金属腐蚀速率测试方法:
1)利用Nanospec6100测厚仪测试4*4cm PETEOS硅片的厚度(T1);
2)将该4*4cmPETEOS硅片浸泡在预先已经恒温到35℃的溶液中30分钟;
3)取出该4*4cmPETEOS硅片,用去离子水清洗,高纯氮气吹干,再利用Nanospec6100测厚仪测试4*4cmPETEOS硅片的厚度(T2);
4)重复第二和第三步再测试一次厚度记为T3;
5)把上述厚度值和浸泡时间输入到合适的程序可计算出其腐蚀速率。
表2给出了实施例14的清洗液的清洗效果和腐蚀速率。
表2实施例14的清洗液的清洗效果和腐蚀速率
从表2中可以看出:本发明的清洗液对半导体制成中所用的金属(如金属铝)和非金属(如PETEOS)基本不会侵蚀,其腐蚀速率均接近或小于半导体业界通常所要求的2埃每分钟。用实施例14的清洗液对等离子刻蚀残留物进行清洗后发现,其等离子刻蚀残留物均被去除,而且基本没有腐蚀金属和非金属。
Claims (2)
1.一种等离子体刻蚀残留物清洗液,其特征在于:所述清洗液由含量为质量百分比1~75%的二甲亚砜、质量百分比1~70%的多元醇单烷基醚、质量百分比15~65%的水、质量百分比0.01~20%的氟化物、质量百分比0.1~20%的多氨基有机胺、质量百分比0.1~10%的氨基酸和质量百分比0.1~20%的叔胺组成,其中:所述的多元醇单烷基醚为乙二醇单烷基醚、二乙二醇单烷基醚、丙二醇单烷基醚、二丙二醇单烷基醚和三丙二醇单烷基醚中的一种或多种;所述的氟化物选自氟化氢、氟化铵、氟化氢铵、四甲基氟化铵和三羟乙基氟化铵中的一种或多种;所述的多氨基有机胺为二乙烯三胺、五甲基二乙烯三胺和多乙烯多胺中的一种或多种;所述的氨基酸为2-氨基乙酸、2-氨基苯甲酸、亚氨基二乙酸、氨三乙酸和乙二胺四乙酸中的一种或多种;所述的叔胺为三乙胺、三丙胺、N,N-二甲基乙醇胺、N,N-甲基乙基乙醇胺、N-甲基二乙醇胺和三乙醇胺中的一种或多种。
2.如权利要求1所述的等离子体刻蚀残留物清洗液,其特征在于:所述的乙二醇单烷基醚为乙二醇单甲醚、乙二醇单乙醚和乙二醇单丁醚中的一种或多种;所述的二乙二醇单烷基醚为二乙二醇单甲醚、二乙二醇单乙醚和二乙二醇单丁醚中的一种或多种;所述的丙二醇单烷基醚为丙二醇单甲醚、丙二醇单乙醚和丙二醇单丁醚中的一种或多种;所述的二丙二醇单烷基醚为二丙二醇单甲醚、二丙二醇单乙醚和二丙二醇单丁醚中的一种或多种;所述的三丙二醇单烷基醚为三丙二醇单甲醚。
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