CN101821866B - 具有粘接的半导体波长转换器的发光二极管 - Google Patents

具有粘接的半导体波长转换器的发光二极管 Download PDF

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Publication number
CN101821866B
CN101821866B CN2008801107526A CN200880110752A CN101821866B CN 101821866 B CN101821866 B CN 101821866B CN 2008801107526 A CN2008801107526 A CN 2008801107526A CN 200880110752 A CN200880110752 A CN 200880110752A CN 101821866 B CN101821866 B CN 101821866B
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China
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led
textured surface
wavelength converter
converter
stack
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Expired - Fee Related
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CN2008801107526A
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Chinese (zh)
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CN101821866A (zh
Inventor
托米·W·凯利
迈克尔·A·哈斯
凯瑟琳·A·莱瑟达勒
特里·L·史密斯
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • H10H20/819Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82Roughened surfaces, e.g. at the interface between epitaxial layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018Bonding of wafers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/81Bodies
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0756Stacked arrangements of devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8511Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512Wavelength conversion materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/882Scattering means

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CN2008801107526A 2007-10-08 2008-09-09 具有粘接的半导体波长转换器的发光二极管 Expired - Fee Related CN101821866B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US97830407P 2007-10-08 2007-10-08
US60/978,304 2007-10-08
PCT/US2008/075710 WO2009048704A2 (en) 2007-10-08 2008-09-09 Light emitting diode with bonded semiconductor wavelength converter

Publications (2)

Publication Number Publication Date
CN101821866A CN101821866A (zh) 2010-09-01
CN101821866B true CN101821866B (zh) 2012-05-23

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CN2008801107526A Expired - Fee Related CN101821866B (zh) 2007-10-08 2008-09-09 具有粘接的半导体波长转换器的发光二极管

Country Status (7)

Country Link
US (1) US20100283074A1 (enExample)
EP (1) EP2206164A2 (enExample)
JP (1) JP2010541295A (enExample)
KR (1) KR20100077191A (enExample)
CN (1) CN101821866B (enExample)
TW (1) TW200924249A (enExample)
WO (1) WO2009048704A2 (enExample)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8523419B2 (en) 2007-05-20 2013-09-03 3M Innovative Properties Company Thin hollow backlights with beneficial design characteristics
TWI467283B (zh) 2007-05-20 2015-01-01 3M Innovative Properties Co 具有半反射鏡組件之再循環背光
EP2535766A3 (en) 2007-05-20 2013-05-01 3M Innovative Properties Company Asymmetric reflective film and backlight having a hollow cavity, which recycles the light
EP2232591A4 (en) * 2007-12-10 2013-12-25 3M Innovative Properties Co Down-converted light emitting diode with simplified light extraction
WO2009085594A2 (en) * 2007-12-28 2009-07-09 3M Innovative Properties Company Down-converted light source with uniform wavelength emission
US8637883B2 (en) * 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
CN102150289B (zh) * 2008-07-16 2014-11-12 3M创新有限公司 稳定光源
WO2010027648A1 (en) * 2008-09-04 2010-03-11 3M Innovative Properties Company I i-vi mqw vcsel on a heat sink optically pumped by a gan ld
US8385380B2 (en) 2008-09-04 2013-02-26 3M Innovative Properties Company Monochromatic light source
US20110156002A1 (en) * 2008-09-04 2011-06-30 Leatherdale Catherine A Light source having light blocking components
JP2012514335A (ja) 2008-12-24 2012-06-21 スリーエム イノベイティブ プロパティズ カンパニー 両方の側の波長変換器及びそれを使用する光生成デバイスの作製方法
US8350462B2 (en) 2008-12-24 2013-01-08 3M Innovative Properties Company Light generating device having double-sided wavelength converter
DE102009020127A1 (de) * 2009-03-25 2010-09-30 Osram Opto Semiconductors Gmbh Leuchtdiode
CN102804422A (zh) * 2009-05-05 2012-11-28 3M创新有限公司 用于与led结合使用的重发光半导体载流子器件及其制造方法
US8994071B2 (en) 2009-05-05 2015-03-31 3M Innovative Properties Company Semiconductor devices grown on indium-containing substrates utilizing indium depletion mechanisms
KR20120016262A (ko) * 2009-05-05 2012-02-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 향상된 추출 효율을 갖는 재발광 반도체 구조물
DE102009023351A1 (de) 2009-05-29 2010-12-02 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
JP2012532454A (ja) * 2009-06-30 2012-12-13 スリーエム イノベイティブ プロパティズ カンパニー カドミウム非含有の再発光半導体構成体
JP2012532453A (ja) 2009-06-30 2012-12-13 スリーエム イノベイティブ プロパティズ カンパニー 調節可能な色温度を備えた白色光エレクトロルミネセンスデバイス
US8304976B2 (en) 2009-06-30 2012-11-06 3M Innovative Properties Company Electroluminescent devices with color adjustment based on current crowding
DE102009027977A1 (de) * 2009-07-23 2011-01-27 Osram Opto Semiconductors Gmbh Leuchtdiode und Verfahren zur Herstellung einer Leuchtdiode
DE102009048401A1 (de) 2009-10-06 2011-04-07 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil
DE102009058006B4 (de) 2009-12-11 2022-03-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil
DE102010006072A1 (de) * 2010-01-28 2011-08-18 OSRAM Opto Semiconductors GmbH, 93055 Optoelektronisches Halbleiterbauteil und Verwendung eines optoelektronischen Halbleiterbauteils in einem Kfz-Schweinwerfer
JP5454303B2 (ja) * 2010-03-30 2014-03-26 ソニー株式会社 半導体発光素子アレイ
TW201208143A (en) * 2010-08-06 2012-02-16 Semileds Optoelectronics Co White LED device and manufacturing method thereof
KR20130128420A (ko) 2010-11-18 2013-11-26 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리실라잔 결합층을 포함하는 발광 다이오드 성분
WO2012164456A1 (en) * 2011-06-01 2012-12-06 Koninklijke Philips Electronics N.V. Method of attaching a light emitting device to a support substrate
DE102011122778B3 (de) 2011-11-24 2013-03-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung einer Lumineszenzkonversions-Leuchtdiode
KR101894025B1 (ko) * 2011-12-16 2018-09-03 엘지이노텍 주식회사 발광소자
US9054235B2 (en) 2013-01-22 2015-06-09 Micron Technology, Inc. Solid-state transducer devices with optically-transmissive carrier substrates and related systems, methods, and devices
JP6396419B2 (ja) 2013-03-29 2018-09-26 フィリップス ライティング ホールディング ビー ヴィ 波長変換素子を有する発光装置
CN104103731A (zh) * 2013-04-03 2014-10-15 新世纪光电股份有限公司 发光二极管结构及其制作方法
US9054063B2 (en) * 2013-04-05 2015-06-09 Infineon Technologies Ag High power single-die semiconductor package
TWI766580B (zh) * 2013-07-29 2022-06-01 晶元光電股份有限公司 一種半導體裝置
TWI722242B (zh) * 2013-07-29 2021-03-21 晶元光電股份有限公司 一種半導體裝置
DE102015105693B4 (de) * 2015-04-14 2021-05-27 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierendes Halbleiterbauelement und Verfahren zur Erzeugung von Strahlung unter Verwendung eines strahlungsemittierenden Halbleiterbauelements
US10488018B2 (en) 2015-08-17 2019-11-26 Infinite Arthroscopy, Inc. Limited Light source
US11330963B2 (en) 2015-11-16 2022-05-17 Lazurite Holdings Llc Wireless medical imaging system
DE102016101442B4 (de) * 2016-01-27 2025-03-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Konversionselement und strahlungsemittierendes Halbleiterbauelement mit einem solchen Konversionselement
DE102016104280A1 (de) * 2016-03-09 2017-09-14 Osram Opto Semiconductors Gmbh Bauelement und Verfahren zur Herstellung eines Bauelements
CN106410006B (zh) * 2016-06-22 2018-08-17 厦门乾照光电股份有限公司 一种集成可见光指示装置的紫外发光二极管及其生产方法
JP6793846B6 (ja) 2017-02-15 2020-12-23 インフィニット アースロスコピー インコーポレーテッド, リミテッド ヘッドユニットと集積光源を備える光ケーブルとを備える無線医療撮像システム
JP6911541B2 (ja) * 2017-05-31 2021-07-28 セイコーエプソン株式会社 発光装置およびプロジェクター
KR102384731B1 (ko) * 2017-10-17 2022-04-08 삼성전자주식회사 Led 장치 및 그 제조 방법
CN112086548A (zh) * 2018-07-16 2020-12-15 厦门三安光电有限公司 微发光装置及其显示器
CN110875344A (zh) * 2018-08-31 2020-03-10 昆山工研院新型平板显示技术中心有限公司 一种led显示器件的制备方法及led显示器件
CN109841710B (zh) * 2019-04-12 2020-05-15 南京大学 用于透明显示的GaN Micro-LED阵列器件及其制备方法
US11637219B2 (en) 2019-04-12 2023-04-25 Google Llc Monolithic integration of different light emitting structures on a same substrate
JP7071648B2 (ja) * 2019-05-16 2022-05-19 日亜化学工業株式会社 発光装置及び発光装置の製造方法
DE102019115351A1 (de) 2019-06-06 2020-12-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterbauelement mit Strahlungskonversionselement und Verfahren zum Herstellen von Strahlungskonversionselementen
JP7520106B2 (ja) 2019-08-20 2024-07-22 ソウル バイオシス カンパニー リミテッド ディスプレイ用発光素子およびそれを有するディスプレイ装置
USD938584S1 (en) 2020-03-30 2021-12-14 Lazurite Holdings Llc Hand piece
USD972176S1 (en) 2020-08-06 2022-12-06 Lazurite Holdings Llc Light source
GB2600429B (en) * 2020-10-28 2023-11-01 Plessey Semiconductors Ltd High colour purity LED

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007109792A (ja) * 2005-10-12 2007-04-26 Sony Corp 半導体発光素子および波長変換基板
WO2007105626A1 (ja) * 2006-03-10 2007-09-20 Matsushita Electric Works, Ltd. 発光素子

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5898185A (en) * 1997-01-24 1999-04-27 International Business Machines Corporation Hybrid organic-inorganic semiconductor light emitting diodes
US5895932A (en) * 1997-01-24 1999-04-20 International Business Machines Corporation Hybrid organic-inorganic semiconductor light emitting diodes
JPH10270799A (ja) * 1997-03-21 1998-10-09 Sanyo Electric Co Ltd 発光素子
WO2001041225A2 (en) * 1999-12-03 2001-06-07 Cree Lighting Company Enhanced light extraction in leds through the use of internal and external optical elements
JP3407730B2 (ja) * 2000-11-02 2003-05-19 サンケン電気株式会社 半導体発光装置の製法
US6841802B2 (en) * 2002-06-26 2005-01-11 Oriol, Inc. Thin film light emitting diode
KR100576856B1 (ko) * 2003-12-23 2006-05-10 삼성전기주식회사 질화물 반도체 발광소자 및 제조방법
JP4622253B2 (ja) * 2004-01-22 2011-02-02 日亜化学工業株式会社 発光デバイス及びその製造方法
JP2005259891A (ja) * 2004-03-10 2005-09-22 Toyoda Gosei Co Ltd 発光装置
US7361938B2 (en) * 2004-06-03 2008-04-22 Philips Lumileds Lighting Company Llc Luminescent ceramic for a light emitting device
JP4632697B2 (ja) * 2004-06-18 2011-02-16 スタンレー電気株式会社 半導体発光素子及びその製造方法
US7534633B2 (en) * 2004-07-02 2009-05-19 Cree, Inc. LED with substrate modifications for enhanced light extraction and method of making same
JP2006041077A (ja) * 2004-07-26 2006-02-09 Sumitomo Chemical Co Ltd 蛍光体
US7462502B2 (en) * 2004-11-12 2008-12-09 Philips Lumileds Lighting Company, Llc Color control by alteration of wavelength converting element
US7402831B2 (en) * 2004-12-09 2008-07-22 3M Innovative Properties Company Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission
JP4971672B2 (ja) * 2005-09-09 2012-07-11 パナソニック株式会社 発光装置
TW200729540A (en) * 2006-01-27 2007-08-01 San-Bao Lin Improvement of brightness for light-emitting device
US20090008729A1 (en) * 2007-07-03 2009-01-08 Advanced Chip Engineering Technology Inc. Image sensor package utilizing a removable protection film and method of making the same
US7538359B2 (en) * 2007-08-16 2009-05-26 Philips Lumiled Lighting Company, Llc Backlight including side-emitting semiconductor light emitting devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007109792A (ja) * 2005-10-12 2007-04-26 Sony Corp 半導体発光素子および波長変換基板
WO2007105626A1 (ja) * 2006-03-10 2007-09-20 Matsushita Electric Works, Ltd. 発光素子

Also Published As

Publication number Publication date
WO2009048704A3 (en) 2009-05-28
CN101821866A (zh) 2010-09-01
KR20100077191A (ko) 2010-07-07
EP2206164A2 (en) 2010-07-14
TW200924249A (en) 2009-06-01
WO2009048704A2 (en) 2009-04-16
JP2010541295A (ja) 2010-12-24
US20100283074A1 (en) 2010-11-11

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