CN101807537A - Position registration mechanism, processing unit (plant) and position alignment method - Google Patents
Position registration mechanism, processing unit (plant) and position alignment method Download PDFInfo
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- CN101807537A CN101807537A CN201010115105A CN201010115105A CN101807537A CN 101807537 A CN101807537 A CN 101807537A CN 201010115105 A CN201010115105 A CN 201010115105A CN 201010115105 A CN201010115105 A CN 201010115105A CN 101807537 A CN101807537 A CN 101807537A
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Abstract
The invention provides a kind of position registration mechanism, processing unit (plant) and position alignment method, it can not make the semiconductor wafer breakage that contains warpage, can make this semiconductor wafer and chuck table carry out position alignment accurately.Position registration mechanism comprises: interim mounting workbench (23), and it forms the external diameter of diameter greater than semiconductor wafer (W), and has the adsorption plane (25) that the portion of outer peripheral edges at least of semiconductor wafer is adsorbed; Image mechanism (24), its outer peripheral edges portion to the semiconductor wafer that is adsorbed in adsorption plane makes a video recording; Control part (19), it calculates the position data at the center of semiconductor wafer according to the view data of the outer peripheral edges portion of semiconductor wafer; With wafer supply unit (17), it has aimed under the state of center of maintenance face (56) of the chuck table (52) that keeps semiconductor wafer the center of semiconductor wafer in the position data according to the center of semiconductor wafer, with the semiconductor wafer mounting in maintenance face.
Description
Technical field
The present invention relates to position registration mechanism, processing unit (plant) and the position alignment method when the grinding of semiconductor wafer and attrition process, the position of semiconductor wafer adjusted.
Background technology
In the past, as making semiconductor wafer carry out the position registration mechanism of position alignment with respect to the chuck table of grinding attachment, known have after with the center of the interim mounting workbench of being centrally located in of semiconductor wafer the mechanism (for example, with reference to patent documentation 1) of transfer to the chuck table.This existing position registration mechanism constitutes to be had: interim mounting workbench, and its diameter is littler than the diameter of semiconductor wafer; A plurality of pins, they can move diametrically with respect to the center of interim mounting workbench around interim mounting workbench; And carrying out on the interim mounting workbench behind the location the transfer portion of semiconductor wafer transfer to the chuck table.
In this position registration mechanism, when semiconductor wafer by mounting during in interim mounting workbench, a plurality of pins to the center of interim mounting workbench move and with the outer peripheral face butt of semiconductor wafer, the center of semiconductor wafer is located in the center of interim mounting workbench thus.Then, the semiconductor wafer absorption behind the location is remained in transfer portion, and by the revolution of transfer portion mounting in the upper surface of chuck table.At this moment because on the rotary track that is centered close to transfer portion of the center of interim mounting workbench and chuck table, so the position alignment at the center of the semiconductor wafer after the transfer center of chuck table.
Patent documentation 1: TOHKEMY 2003-133392 communique
But, in above-mentioned existing position registration mechanism, contain at semiconductor wafer under the situation of warpage, when the outer peripheral face butt of a plurality of pins and semiconductor wafer, semiconductor wafer is positioned interim mounting workbench in the mode of its offset amount corresponding with warpage.Therefore, when having arrived the semiconductor wafer transfer on the chuck table, the problem that existence can not make position and the position at the center of chuck table at the center of semiconductor wafer aim at accurately.Particularly, slim semiconductor wafer contains warpage mostly and can't carry out position alignment accurately, and might breakage with the pin butt time.
Summary of the invention
The present invention puts in view of the above problems and finishes, and its purpose is to provide a kind of and can make the semiconductor wafer breakage that contains warpage and can make this semiconductor wafer and chuck table carry out position registration mechanism, processing unit (plant) and the position alignment method of position alignment accurately.
Position registration mechanism of the present invention is characterised in that this position registration mechanism comprises: workpiece support, and it is bigger than the external diameter of workpiece that it forms diameter, and have the adsorption plane that the portion of outer peripheral edges at least of above-mentioned workpiece is adsorbed; The position data acquisition unit, it is used to obtain the position data of the outer peripheral edges portion of the above-mentioned workpiece that is adsorbed in above-mentioned adsorption plane; The position data calculating part, it calculates the position data at the center of above-mentioned workpiece according to the position data of the outer peripheral edges portion of above-mentioned workpiece; And position alignment portion, its under the state of the center of the maintenance face of the maintenance workbench that the position data according to the center of above-mentioned workpiece has aimed at the center of above-mentioned workpiece to keep above-mentioned workpiece, with above-mentioned workpiece mounting in above-mentioned maintenance face.
Position alignment method of the present invention is characterised in that, this position alignment method has following steps: with the step of workpiece mounting in workpiece support, wherein, it is bigger than the external diameter of above-mentioned workpiece that above-mentioned workpiece support forms diameter, and have the adsorption plane that the portion of outer peripheral edges at least of above-mentioned workpiece is adsorbed; Obtain the step of position data of the outer peripheral edges portion of the above-mentioned workpiece that is adsorbed in above-mentioned workpiece support; Calculate the step of position data of workpiece centre at the center of the above-mentioned workpiece of expression according to the position data of the outer peripheral edges portion of above-mentioned workpiece; And under the state of the center of the maintenance face of the maintenance workbench that the position data according to the center of above-mentioned workpiece has aimed at the center of above-mentioned workpiece to keep above-mentioned workpiece, with above-mentioned workpiece mounting in the step of above-mentioned maintenance face.
According to these structures, even contain at workpiece under the situation of warpage, it is adsorbed that the portion of outer peripheral edges at least of workpiece also can be adsorbed face, thus the warpage of having corrected workpiece.Thus, can under the state of the warpage of having corrected workpiece, obtain the position data of outer peripheral edges portion, therefore can correctly calculate the position data at the center of workpiece, can make the center of workpiece aim at the center that keeps workbench accurately.In addition, the location that does not need the butt by a plurality of pins to carry out on workpiece support can prevent the breakage when position alignment of slim workpiece.
In addition, about the present invention, in above-mentioned position registration mechanism, the outer peripheral edges portion of above-mentioned workpiece be formed with the above-mentioned workpiece of expression towards labeling section, above-mentioned position data calculating part calculates the position data at the center of above-mentioned workpiece according to the position data of the outer peripheral edges portion of above-mentioned workpiece, and above-mentioned position data calculating part according to above-mentioned labeling section calculate the expression above-mentioned workpiece towards angle-data, above-mentioned position alignment portion is according to the position data and the above-mentioned angle-data at the center of above-mentioned workpiece, make the center of above-mentioned workpiece aim at the center of above-mentioned maintenance face, and make above-mentioned workpiece towards aim at above-mentioned maintenance face towards.
In addition, about the present invention, in above-mentioned position registration mechanism, above-mentioned workpiece support has makes the light transmissive transmittance section of irradiation to the outer peripheral edges portion of above-mentioned workpiece at least, and above-mentioned workpiece support constitutes and can rotate around the axle with above-mentioned adsorption plane quadrature, above-mentioned position data acquisition unit is made of image mechanism, and this image mechanism has: irradiation portion, and its outer peripheral edges portion to above-mentioned workpiece shines; And image pickup part, it reads the transmitted light that has seen through above-mentioned workpiece through above-mentioned transmittance section, and above-mentioned image mechanism is used to obtain the view data of the outer peripheral edges portion of above-mentioned workpiece.
Processing unit (plant) of the present invention has: above-mentioned position registration mechanism; And organisation of working, its center at above-mentioned workpiece has been aimed under the state of center of above-mentioned maintenance workbench above-mentioned workpiece has been processed.
According to the present invention, can not make the semiconductor wafer breakage that contains warpage, and can make this semiconductor wafer and chuck table carry out position alignment accurately.
Description of drawings
Fig. 1 is the figure of the execution mode of expression position registration mechanism involved in the present invention, and it is the stereoscopic figure of grinding attachment.
Fig. 2 is the figure of the execution mode of expression position registration mechanism involved in the present invention, and it is the partial enlarged drawing of grinding attachment.
Fig. 3 is the figure of the execution mode of expression position registration mechanism involved in the present invention, and it is the key diagram of the shooting processing of semiconductor wafer.
Fig. 4 is the figure of the execution mode of expression position registration mechanism involved in the present invention, and it is the figure that expression utilizes the view data that image pickup part photographs.
Fig. 5 is the figure of the execution mode of expression position registration mechanism involved in the present invention, and it is the figure of the centre coordinate of the expression semiconductor wafer that contains warpage.
Fig. 6 is the figure of the execution mode of expression position registration mechanism involved in the present invention, and it is the key diagram of semiconductor wafer with respect to the position alignment of chuck table.
Fig. 7 is the figure of the execution mode of expression position registration mechanism involved in the present invention, the molar behavior flow process that its position alignment that is processing unit (plant) carries out is handled.
Fig. 8 is the figure of the variation of expression position registration mechanism involved in the present invention.
Fig. 9 is the figure of the execution mode of expression position registration mechanism involved in the present invention, and it is the stereoscopic figure of semiconductor wafer.
Label declaration
1: grinding attachment (processing unit (plant)); 4: move into and take out of unit (position registration mechanism); 5: wafer process unit (organisation of working); 14: move into and take out of arm; 15: interim mounting portion; 16: the rotation cleaning part; 17: wafer supply unit (position alignment portion); 18: the wafer recoverer; 19: control part (position data calculating part, position alignment portion); 23,94,96: interim mounting workbench (workpiece support); 24: image mechanism (position data acquisition unit); 25: adsorption plane; 25a: endless groove; 25b: straight-line groove; 27: irradiation portion; 28,93,97: image pickup part; 52: chuck table (maintenance workbench); 56: maintenance face; 82: recess; 94: peristome; W: semiconductor wafer.
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are elaborated.The related position registration mechanism of present embodiment makes semiconductor wafer carry out position alignment accurately with respect to chuck table by warpage of correcting semiconductor wafer and the center that correctly calculates semiconductor wafer.At first, before the position registration mechanism related to embodiments of the present invention describes, the semiconductor wafer as processing object is carried out simple declaration.Fig. 9 is the stereoscopic figure of the related semiconductor wafer of embodiments of the present invention.In addition, in Fig. 9, the back side state up of expression semiconductor wafer.
As shown in Figure 9, semiconductor wafer W forms roughly discoideus, and is the not shown preset lines of cutting apart that clathrate arranges from the teeth outwards and marks off a plurality of zones.Integrated circuit), LSI (Large Scale Integration: device 81 such as large scale integrated circuit) by cutting apart in each zone that preset lines marks off, be formed with IC (Integrated Circuit: in the central authorities of semiconductor wafer W.In addition, be formed with the recess 82 of expression crystal orientation in the outer peripheral edges portion of semiconductor wafer W.Be pasted with boundary belt 83 on the surface of semiconductor wafer W, add man-hour, come protection device 81 by this boundary belt 83 at the back side to semiconductor wafer W.Moved into to grinding attachment 1 under the state of the semiconductor wafer W of Gou Chenging in being accommodated in the box 2 (with reference to Fig. 1) of moving into side like this.
In addition, in the present embodiment, as workpiece, with semiconductor wafer W such as silicon wafer or GaAs is that example describes, but be not limited to this structure, also can be, require the various rapidoprints of flatness as workpiece from micron order to submicron order with the ductile material of inorganic material substrate, plate-shape metal or the resin of pottery, glass, sapphire class.
Next, the example that the position registration mechanism that embodiments of the present invention are related is applied to grinding attachment that sees figures.1.and.2 describes.Fig. 1 is the stereoscopic figure of the related grinding attachment of embodiments of the present invention.Fig. 2 is the partial enlarged drawing of the related grinding attachment of embodiments of the present invention.In addition, in the following description, the example that position registration mechanism is applied to grinding attachment is described, but not only can be applied to grinding attachment the processing unit (plant) that also can be applied to make the center of semiconductor wafer to aim at the center of chuck table.
As shown in Figure 1, grinding attachment 1 has: move into and take out of unit 4, it is except the semiconductor wafer W before will processing is moved into, and the semiconductor wafer W after also will processing is taken out of; Wafer process unit 5, it is to carrying out grinding from moving into the back side of taking out of the semiconductor wafer W of moving into unit 4.Move into and take out of unit 4 and have rectangular-shaped pedestal 11, be used for the mode that a pair of box mounting portion 12,13 of mounting box 2,3 forwards protrudes with the front surface 11a from pedestal 11 and be arranged at pedestal 11.
Move into and take out of arm 14 and have: more piece linkage 21, its drive area is very wide; And absorption maintaining part 22, the end that it is arranged at more piece linkage 21 is used for absorption and keeps semiconductor wafer W.Move into and take out of 14 pairs of more piece linkages 21 of arm and drive, thereby will be accommodated in semiconductor wafer W mounting in the box 2 of moving into side, in addition semiconductor wafer W is received in the box 3 of taking out of side from rotation cleaning part 16 in interim mounting portion 15.
As shown in Figure 2, interim mounting portion 15 has: interim mounting workbench 23, semiconductor wafer W by move into take out of arm 14 and by interim mounting in this interim mounting workbench 23; And image mechanism 24, it is made a video recording in the semiconductor wafer W of interim mounting workbench 23 to interim mounting.Translucent materials such as interim mounting workbench 23 usefulness glass form discoid, and it is bigger than the diameter of semiconductor wafer W to form the diameter of interim mounting workbench 23.Be formed with the adsorption plane 25 of absorption semiconductor wafer W at the upper surface of interim mounting workbench 23.
Be formed with at adsorption plane 25: a plurality of endless groove 25a, they are configured to concentric circles; A plurality of straight-line groove 25b, they extend along the radiation direction from the center of adsorption plane 25; And a plurality of not shown adsorption holes, they are disposed at the intersection point place of a plurality of endless groove 25a and a plurality of straight-line groove 25b.A plurality of adsorption holes run through interim mounting workbench 23 and are connected with not shown attraction source, and by this attraction that attracts the source, semiconductor wafer W is adsorbed on adsorption plane 25.
Specifically, by attracting the attraction in source, in a plurality of endless groove 25a and a plurality of straight-line groove 25b, produce negative pressure through a plurality of adsorption holes, semiconductor wafer W is pulled to adsorption plane 25, thereby a plurality of endless groove 25a and a plurality of straight-line groove 25b are closed by this negative pressure.At this moment because the diameter of adsorption plane 25 is bigger than the diameter of semiconductor wafer W, so the part of endless groove 25a and straight-line groove 25b to atmosphere opening, but this adsorption plane 25 still has the absorption affinity of the degree of the warpage that is enough to correct semiconductor wafer W.By being formed at the groove structure of such adsorption plane 25, can the semiconductor wafer different make interim mounting workbench 23 general with respect to diameter.
In addition, interim mounting workbench 23 is connected with not shown rotary drive mechanism, and constitutes and can rotate by the driving of rotary drive mechanism.By the driving of this rotary drive mechanism, come semiconductor wafer W is adjusted at the camera position that makes progress in week.
For the semiconductor wafer W of interim mounting,, and utilize image mechanism 24 to make a video recording so that the mode that the part of its outer peripheral edges portion is contained in the image pickup scope is carried out the position adjustment to this semiconductor wafer W in interim mounting workbench 23.Till carrying out this shooting action externally circumference having carried out shooting on by the complete cycle of image mechanism 24 in semiconductor wafer W, will export control part 19 to by the view data that this image mechanism 24 photographs.
In addition, wafer supply unit 17 Be Controlled portions 19 drive controlling come rotation axis 31 is adjusted at the stroke of amount of movement, amount of spin and the telescopic arm 32 of the amount of movement of above-below direction, fore-and-aft direction by control part 19.In addition, the control of wafer supply unit 17 Be Controlled portions 19, and keep semiconductor wafer W and lift from interim mounting workbench 23 absorption, and this semiconductor wafer W is supplied to chuck table 52.At this moment, carry out position alignment as follows: make the center of semiconductor wafer W consistent with the center of the maintenance face 56 of the chuck table 52 of wafer process unit 5 and make semiconductor wafer W towards with chuck table 52 towards unanimity.
Wafer recoverer 18 except the diameter that will adsorb maintaining part 37 form the big this point of diameter than the absorption maintaining part 33 of wafer supply unit 17, have the structure roughly the same with wafer supply unit 17.19 controls of wafer recoverer 18 Be Controlled portions, and keep semiconductor wafer W to reclaim from chuck table 52 absorption, and with the rotation cleaning platform 41 of this semiconductor wafer W mounting in rotation cleaning part 16.At this moment, carry out position alignment as follows: the center that makes semiconductor wafer W consistent with the center of the mounting surface 42 of the rotation cleaning platform 41 of rotation cleaning part 16 and make semiconductor wafer W towards with rotation cleaning platform 41 towards unanimity.
Return Fig. 1, rotation cleaning part 16 has the rotation cleaning platform 41 of the semiconductor wafer W after the mounting processing.Rotation cleaning platform 41 is discoid, and is formed with the mounting surface 42 of mounting semiconductor wafer W.At the middle body of mounting surface 42, be formed with adsorption plane 42a by porous ceramic film material.Adsorption plane 42a forms with the outer shape of overlooking observed semiconductor wafer W and conforms to, and this adsorption plane 42a forms round-shaped except that the part corresponding with the recess 82 of semiconductor wafer W.By the part corresponding with the recess 82 of this semiconductor wafer W towards stipulate to rotate cleaning platform 41 towards.Adsorption plane 42a is connected with not shown attraction source in being configured in pedestal 11, is used for absorption maintenance semiconductor wafer W.
When the semiconductor wafer W after the processing by mounting during in rotation cleaning platform 41, this semiconductor wafer W by the decline of rotation cleaning platform 41 in peristome 43 is accommodated in pedestal 11.Then, make the semiconductor wafer W high speed rotating that is accommodated in the pedestal 11, and the liquid of jet cleaning simultaneously cleans.Then, under the state that makes the semiconductor wafer W high speed rotating, stop the injection of cleaning fluid, make the semiconductor wafer W drying.
In addition, about control part 19, be assembled in its inner CPU (Central Processing Unit: central processing unit) according to ROM (Read Only Memory: read-only memory) Nei various programs such as control program to RAM (Random Access Memory: random access memory) Nei data are carried out computing, and with move into the each several part of taking out of unit 4 and cooperate and carry out each and handle.In addition, about the position data at the center of expression semiconductor wafer W and expression semiconductor wafer W towards the computing of angle-data and the detailed content handled with respect to the position alignment of chuck table 52 and rotation cleaning platform 41 of semiconductor wafer W, will narrate in the back.
Rotary table 53 forms large diameter discoid, and the surface disposes three chuck tables 52 along circumferentially spaced 120 degree compartment of terrains thereon.In addition, rotary table 53 is connected with not shown rotary drive mechanism, and by rotary drive mechanism to the D1 direction with the intermittently rotation at interval of 120 degree.Thus, three chuck tables 52 are changing a year position, are roughly grinding to cut between position and the fine ginding position and move, wherein, above-mentioned change carry the position be and wafer supply unit 17 and wafer recoverer 18 between the position of handing-over semiconductor wafer W, it is to make semiconductor wafer W and corase grind cut 45 opposed positions, unit that above-mentioned corase grind is cut the position, and above-mentioned fine ginding position is to make semiconductor wafer W and 46 opposed positions, fine ginding unit.
Chuck table 52 is discoid, and is formed with the maintenance face 56 (with reference to Fig. 2) that keeps semiconductor wafer W.At the middle body of maintenance face 56, be formed with adsorption plane 56a by porous ceramic film material.Adsorption plane 56a forms with the outer shape of overlooking observed semiconductor wafer W and conforms to.Adsorption plane 56a forms circle except the part corresponding with the recess 82 of semiconductor wafer W.By the part corresponding with the recess 82 of this semiconductor wafer W towards come regulation chuck table 52 towards.
In addition, chuck table 52 is connected with not shown attraction source in being configured in pedestal 51, and chuck table 52 is used for absorption maintenance semiconductor wafer W.Chuck table 52 is connected with not shown rotary drive mechanism, and rotates under the state that semiconductor wafer W is remained in maintenance face 56 by rotary drive mechanism.
At the upper surface of pedestal 51, the corase grind of rotary table 53 cut position and fine ginding position near be provided with touch sensor 58.This touch sensor 58 has 61,62, one contacts 61 of two contacts and contacts with the upper surface of semiconductor wafer W, and another contact 62 contacts with the upper surface of chuck table 52.In addition, control grinding depth according to the difference in height of two contacts 61,62.
Corase grind is cut unit 45 and is had grinding grinding tool 73, and this grinding grinding tool 73 is installed on the lower end of not shown main shaft in the mode that can freely load and unload.Grinding grinding tool 73 is made of diamond abrasive tool, and this diamond abrasive tool utilizes bonds such as metal binding agent or resin adhesive to make diamond abrasive grain fixed and constitute.In addition, grinding grinding tool 73 forms slim cylindric, and has the grinding face of ring-type.In addition, fine ginding unit 46 has with corase grind cuts the identical structure in unit 45, but has been to use the thinner grinding tool of granularity to be used as grinding grinding tool 74.
In addition, cut unit 45 about corase grind, come grinding grinding tool 73 is adjusted in the position of radial direction with respect to semiconductor wafer W by grinding cell moving mechanism 64, and when monitoring, carry out grinding and feeding in Z-direction by 58 pairs of stock removals of touch sensor.In addition, when cut at corase grind unit 45 carried out the corase grind cut after, carry out fine ginding in fine ginding unit 46 by same action.
With reference to Fig. 3, the shooting processing to semiconductor wafer describes to image mechanism.Fig. 3 is the key diagram that image mechanism is handled the shooting of semiconductor wafer.In addition, in the following description, for convenience of explanation, adopted the semiconductor wafer that contains warpage in the outer peripheral edges portion of semiconductor wafer.
Shown in Fig. 3 (a), mounting is not under the initial condition of interim mounting workbench 23 in semiconductor wafer W, and image pickup part 28 is positioned at the retreating position of the radial outside of interim mounting workbench 23.From this state, shown in Fig. 3 (b), move into the interim mounting of the semiconductor wafer W of taking out of arm 14 in the upper surface of interim mounting workbench 23 with remaining in.At this moment, by moving into the absorption of the absorption maintaining part 22 of taking out of arm 14, the interim mounting of semiconductor wafer W quilt under the state of the warpage of having corrected outer peripheral edges portions.Then, take out of arm 14 when interim mounting workbench 23 is backed out when moving into, shown in Fig. 3 (c), semiconductor wafer W is adsorbed on the adsorption plane 25 of interim mounting workbench 23.At this moment, when the absorption of moving into the absorption maintaining part 22 of taking out of arm 14 is disengaged or before being disengaged, semiconductor wafer is adsorbed on adsorption plane 25, make that the warpage of outer peripheral edges portion of semiconductor wafer W is corrected.
When the warpage of the outer peripheral edges portion of semiconductor wafer W was corrected, image pickup part 28 moved to the camera position that the peripheral part of semiconductor wafer W is made a video recording, and shown in Fig. 3 (d), the outer peripheral edges portion of semiconductor wafer W is contained in the image pickup scope of image pickup part 28.Then, shown in Fig. 3 (e), utilize irradiation portion 27 semiconductor wafer W to be shone, and utilize image pickup part 28 to read to have seen through the transmitted light of interim mounting workbench 23 and semiconductor wafer W from the downside of interim mounting workbench 23.When the shooting of the outer peripheral edges portion that has finished semiconductor wafer W at a place, rotate interim mounting workbench 23, on the complete cycle of the outer peripheral edges portion of semiconductor wafer W, make a video recording.The view data of utilizing image pickup part 28 to photograph is output to control part 19.When the shooting that utilizes image pickup part 28 to carry out was finished, image pickup part 28 moved to retreating position and becomes initial condition.
With reference to Fig. 4, the position data at center that control part is carried out, the expression semiconductor wafer and expression semiconductor wafer towards the computing of angle-data describe.Fig. 4 is the figure that expression utilizes the view data that image pickup part photographs.
The view data of utilizing 19 pairs of control parts to export control part 19 to is carried out edge detection process, thereby obtains the curve of the outer peripheral edges portion of expression semiconductor wafer W.When the curve of the outer peripheral edges portion that has obtained semiconductor wafer W, from the curve of outer peripheral edges portion, at random extract the coordinate that A point, B point, C are ordered.At this moment, both can from the view data that the action of the shooting by once obtains, extract the coordinate of three points, also extract the coordinate of three points a plurality of view data that can obtain from the shooting action by repeatedly.
Then, calculate the intersection point of the perpendicular bisector of the line segment that the perpendicular bisector that links the line segment that A point and B order and binding B point and C order, be used as the centre coordinate P1 of semiconductor wafer W.When calculating the centre coordinate P1 of semiconductor wafer W, calculate by the reference axis L1 of this centre coordinate P1 and the straight line L2 angulation R at the center that links centre coordinate P1 and recess 82.At this moment, reference axis L1 and chuck table 52 become the wafer transfer time benchmark towards corresponding, by make chuck table 52 from as this benchmark towards anglec of rotation R, can the semiconductor wafer W mounting make during in chuck table 52 this semiconductor wafer W towards aim at chuck table 52 towards.
Like this, under the state owing to the warpage of in shooting is handled, having corrected semiconductor wafer W, calculate the center of semiconductor wafer W, so can calculate the center of semiconductor wafer W accurately.For example, in Fig. 5, the centre coordinate P1 that will calculate, compare, produced position deviation with centre coordinate P2 that view data according to the semiconductor wafer W that does not contain warpage shown in the single-point line calculates according to the view data of the semiconductor wafer W that contains warpage shown in the solid line.
In addition, in the present embodiment, behind the curve of the outer peripheral edges portion that detects semiconductor wafer W, detected three points, but also can be do not detect semiconductor wafer W outer peripheral edges portion curve and directly detect the structure of three points.Thus, thus can reduce and detect treating capacity and improve computational speed.
With reference to Fig. 6, the position alignment processing with respect to chuck table describes to semiconductor wafer.Fig. 6 is the key diagram of semiconductor wafer with respect to the position alignment of chuck table.In addition, under initial condition, chuck table is towards the Y-axis positive direction.
As shown in Figure 6, control part 19 has the plane right-angle coordinate that is made of X-axis and Y-axis, is set with in this plane right-angle coordinate: in advance the centre coordinate P1 of the centre coordinate P3 of Cun Chu chuck table 52, the semiconductor wafer W that calculates and expression semiconductor wafer W towards angle R.At first, by control part 19, poor according to the centre coordinate P1 of the centre coordinate P3 of chuck table 52 and semiconductor wafer W, calculate the amount of movement of fore-and-aft direction of rotation axis 31 of wafer supply unit 17 and the stroke of amount of spin and telescopic arm 32, and according to the expression semiconductor wafer W towards angle R, calculate the rotation amount of chuck table 52.
Then, wafer supply unit 17 moves down rotation axis 31 from the state of the top that is positioned at interim mounting workbench 23, keeps semiconductor wafer W and moves up by 33 absorption of absorption maintaining part.Then, the amount of movement and the amount of spin of the fore-and-aft direction of the rotation axis 31 that calculated of wafer supply unit 17 and control part 19 drive rotation axis 31 accordingly.Then, wafer supply unit 17 drives telescopic arm 32 accordingly with the stroke of the telescopic arm 32 that control part 19 is calculated, and makes semiconductor wafer W be positioned at the top of chuck table 52.At this constantly, the center of semiconductor wafer W is consistent with the center of the maintenance face 56 of chuck table 52.
Then, chuck table 52 is from the initial condition anglec of rotation R towards the Y-axis positive direction, make chuck table 52 towards with semiconductor wafer W towards consistent.Then, wafer supply unit 17 moves down rotation axis 31, and removes the absorption of absorption maintaining part 33.Like this, the center of the maintenance face 56 of chuck table 52 is aimed in the center of semiconductor wafer W, and semiconductor wafer W towards aim at chuck table 52 towards.In addition, semiconductor wafer W is handled also with respect to the position alignment of rotation cleaning platform 41 and is undertaken by handling identical processing with above-mentioned position alignment.
Like this, since semiconductor wafer W towards with chuck table 52 under consistent state, semiconductor wafer W is carried out position alignment with respect to chuck table 52, thus semiconductor wafer W with the mode mounting of coincideing with the adsorption plane 56a of chuck table 52 in adsorption plane 56a.Therefore, what be formed at the recess 82 of semiconductor wafer W and adsorption plane 56a is consistent with the corresponding part of recess 82, thereby the absorption affinity that has prevented adsorption plane 56a is owing to the position deviation between this semiconductor wafer W and the adsorption plane 56a reduces.
Next, with reference to Fig. 7, the flow process based on the molar behavior of the position alignment of processing unit (plant) is described.Fig. 7 is based on the molar behavior flow process of the position alignment processing of processing unit (plant).Following motion flow is implemented by the control program that makes processing unit (plant) execution in step S01～step S04.
As shown in Figure 7, utilize to move into and take out of the semiconductor wafer W that arm 14 takes out before processing from box 2, and interim mounting is in interim mounting workbench 23 (step S01).At this moment, correct the warpage of the outer peripheral edges portion of semiconductor wafer W by the adsorption plane 25 of interim mounting workbench 23.Then, under the state of the warpage of the outer peripheral edges portion of having corrected semiconductor wafer W, utilize 24 pairs of semiconductor wafer W of image mechanism to make a video recording, and export the view data that photographs to control part 19 (step S02).Then, utilize control part 19, according to the view data of being imported, calculate semiconductor wafer W centre coordinate P1 and the expression semiconductor wafer W towards angle R (step S03).Then, according to the centre coordinate P1 and the angle R of the semiconductor wafer W that calculates, make semiconductor wafer W towards aim at chuck table 52 towards, and the center of semiconductor wafer W is aimed at the center (step S04) of chuck table 52.
As mentioned above, the position registration mechanism related according to present embodiment, even contain in semiconductor wafer W under the situation of warpage, also the portion of outer peripheral edges at least of semiconductor wafer W can be adsorbed in the adsorption plane 25 of interim mounting workbench 23, thereby correct the warpage of semiconductor wafer W.Thus, can under the state of the warpage of having corrected semiconductor wafer W, make a video recording, therefore can correctly calculate the position data at the center of semiconductor wafer W, can make the center of semiconductor wafer W aim at the center of chuck table 52 accurately.In addition, on interim mounting workbench 23, do not need to utilize the butt of a plurality of pins and the location of carrying out, can prevent the breakage when position alignment of slim semiconductor wafer W.
In addition, in the above-described embodiment, the adsorption plane 25 of interim mounting workbench 23 constitutes the structure of semiconductor wafer W being carried out whole absorption, but is not limited to this structure.As long as in interim mounting workbench 23, in the scope of the warpage that can correct semiconductor wafer W, be formed with adsorption plane 25, for example, also can be the structure that only is formed with adsorption plane in the position of the outer peripheral edges portion that can adsorb semiconductor wafer W.
In addition, in the above-described embodiment, as the regulation semiconductor wafer W towards labeling section, example illustrates recess 82 and is illustrated, but is not limited to this structure.So long as can determine in the outer peripheral edges portion of semiconductor wafer W semiconductor wafer W towards structure get final product, also can adopt directional plane (orientation flat) to replace recess 82.
In addition, in the above-described embodiment, have such structure: interim mounting workbench 23 integral body are formed by translucent material, but are not limited to this structure.So long as can get final product in the structure that the portion of outer peripheral edges at least of the semiconductor wafer W of interim mounting workbench 23 makes a video recording to mounting, for example, also can be such structure: only the position that can make a video recording to the outer peripheral edges portion of semiconductor wafer W is formed by translucent material.
In addition, in the above-described embodiment, have such structure: interim mounting workbench 23 is formed by translucent material, and the transmitted light that utilizes 28 pairs of image pickup parts to see through interim mounting workbench 23 and semiconductor wafer W reads, and still is not limited to this structure.So long as can the structure that semiconductor wafer W is made a video recording be got final product, for example, shown in Fig. 8 (a), can be such structure: the part at interim mounting workbench 94 forms opening, utilize 93 pairs of transmitted lights that seen through semiconductor wafer W through this opening 95 of image pickup part to read, shown in Fig. 8 (b), also can be such structure perhaps: interim mounting workbench 96 is carried out mirror finish, and utilize image pickup part 97 to read by the reverberation of interim mounting workbench 96 reflections.
In addition, in the above-described embodiment, has such structure: the center that makes the center aligning chuck table 52 of semiconductor wafer W, and make semiconductor wafer W towards aim at chuck table 52 towards, but also can be the structure that only makes the center of semiconductor wafer W aim at the center of chuck table 52.
In addition, in the above-described embodiment, has such structure: calculate the center of semiconductor wafer W by image processing, but be not limited to this structure.So long as can the structure that the outer peripheral edges portion of semiconductor wafer W is detected be got final product, for example, the structure that also can be to use reflective photoelectric sensor that the outer peripheral edges portion of semiconductor wafer W is detected.
In addition, in the above-described embodiment, has such structure: the mobile of wafer supply unit 17 controlled, thereby made the center of semiconductor wafer W aim at the center of chuck table 52, but be not limited to this structure.Thereby so long as can calculate the center of semiconductor wafer W its structure of aiming at the center of chuck table 52 being got final product, for example, also can be on interim mounting workbench 23 or the structure of chuck table 52 enterprising line positions alignings.
In addition, in the above-described embodiment, have such structure: thus when carrying out position alignment to the rotation amount of chuck table 52 control make semiconductor wafer W towards aim at chuck table 52 towards, but be not limited to this structure.So long as can make semiconductor wafer W towards aim at chuck table 52 towards structure get final product, for example also can be to make structure towards aligning in interim mounting workbench 23 or wafer supply unit 33 sides.
In addition, in the above-described embodiment, have such structure: thus any three points that utilize control part 19 to detect the outer peripheral edges portion of semiconductor wafer W calculate the center of semiconductor wafer W, but be not limited to this structure.As long as can calculate the center of semiconductor wafer W, can adopt computational methods arbitrarily.For example, also can from the curve of the outer peripheral edges portion that is obtained from view data, detect two points respectively, and will from these two points with respect to the intersection point of each normal to a curve center as semiconductor wafer W.
In addition, this time all the elements of disclosed execution mode are illustration, are not limited to this execution mode.Scope of the present invention is not the explanation of only above-mentioned execution mode being carried out, but passes through the content that claims disclose, and that is to say that scope of the present invention comprises and the meaning of claims equalization and all changes in the scope.
Utilizability on the industry
As described above, the present invention has not to be made the semiconductor wafer breakage that contains warpage and can make this semiconductor wafer and chuck table carry out accurately the effect of position alignment, particularly, for the position registration mechanism, processing unit (plant) and the position aligning method that carry out the position adjustment of semiconductor wafer when the grinding of semiconductor wafer practicality is arranged.
Claims (5)
1. a position registration mechanism is characterized in that,
Above-mentioned position registration mechanism comprises:
Workpiece support, it is bigger than the external diameter of workpiece that it forms diameter, and have the adsorption plane that the portion of outer peripheral edges at least of above-mentioned workpiece is adsorbed;
The position data acquisition unit, it is used to obtain the position data of the outer peripheral edges portion of the above-mentioned workpiece that is adsorbed in above-mentioned adsorption plane;
The position data calculating part, it calculates the position data at the center of above-mentioned workpiece according to the position data of the outer peripheral edges portion of above-mentioned workpiece; And
Position alignment portion, it makes the center of above-mentioned workpiece carry out under the state of position alignment with respect to the center of the maintenance face of the maintenance workbench that keeps above-mentioned workpiece in the position data according to the center of above-mentioned workpiece, with above-mentioned workpiece mounting in above-mentioned maintenance face.
2. position registration mechanism according to claim 1 is characterized in that,
The outer peripheral edges portion of above-mentioned workpiece be formed with the above-mentioned workpiece of expression towards labeling section,
Above-mentioned position data calculating part calculates the position data at the center of above-mentioned workpiece according to the position data of the outer peripheral edges portion of above-mentioned workpiece, and above-mentioned position data calculating part according to above-mentioned labeling section calculate the above-mentioned workpiece of expression towards angle-data,
Above-mentioned position alignment portion makes the center of above-mentioned workpiece carry out position alignment with respect to the center of above-mentioned maintenance face according to the position data and the above-mentioned angle-data at the center of above-mentioned workpiece, and make above-mentioned workpiece towards aim at above-mentioned maintenance face towards.
3. position registration mechanism according to claim 1 and 2 is characterized in that,
Above-mentioned workpiece support has makes the light transmissive transmittance section of irradiation to the outer peripheral edges portion of above-mentioned workpiece at least, and above-mentioned workpiece support constitute can around with the axle rotation of above-mentioned adsorption plane quadrature,
Above-mentioned position data acquisition unit is an image mechanism, and this image mechanism has: irradiation portion, and its outer peripheral edges portion to above-mentioned workpiece shines; And image pickup part, it reads the transmitted light that has seen through above-mentioned workpiece through above-mentioned transmittance section, and above-mentioned image mechanism is used to obtain the view data of the outer peripheral edges portion of above-mentioned workpiece.
4. a processing unit (plant) is characterized in that,
Above-mentioned processing unit (plant) has:
The described position registration mechanism of in the claim 1 to 3 each; And
Organisation of working, its center at the center of above-mentioned workpiece and above-mentioned maintenance workbench have carried out under the state of position alignment above-mentioned workpiece being processed.
5. a position alignment method is characterized in that,
Above-mentioned position alignment method has following steps:
With the step of workpiece mounting in workpiece support, wherein, it is bigger than the external diameter of above-mentioned workpiece that above-mentioned workpiece support forms diameter, and above-mentioned workpiece support has the adsorption plane that the portion of outer peripheral edges at least of above-mentioned workpiece is adsorbed;
Obtain the step of position data of the outer peripheral edges portion of the above-mentioned workpiece that is adsorbed in above-mentioned workpiece support;
Calculate the step of position data of workpiece centre at the center of the above-mentioned workpiece of expression according to the position data of the outer peripheral edges portion of above-mentioned workpiece; And
In position data according to the center of above-mentioned workpiece, the center of above-mentioned workpiece has been carried out under the state of position alignment with respect to the center of the maintenance face of the maintenance workbench that keeps above-mentioned workpiece, with above-mentioned workpiece mounting in the step of above-mentioned maintenance face.
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| JP2009029853A JP2010186863A (en) | 2009-02-12 | 2009-02-12 | Aligning mechanism, working device and aligning method |
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| CN101807537B (en) | 2014-05-07 |
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