CN105914164A - Machining apparatus - Google Patents
Machining apparatus Download PDFInfo
- Publication number
- CN105914164A CN105914164A CN201610087238.1A CN201610087238A CN105914164A CN 105914164 A CN105914164 A CN 105914164A CN 201610087238 A CN201610087238 A CN 201610087238A CN 105914164 A CN105914164 A CN 105914164A
- Authority
- CN
- China
- Prior art keywords
- wafer
- unit
- box
- workbench
- central authorities
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Abstract
The invention provides a machining apparatus which can reliably hold a wrapped wafer. A position detecting mechanism (124) is provided with a guiding part (124c). The guiding part supports the wafer (W) which exceeds the outer periphery of a central working platform (124a) and corrects the wafer (W) in a projected wrapped shape. Furthermore, on condition that the wafer (W) is corrected to horizontal, the outer peripheral edge (WE) of the wafer (W) is detected through a position detecting sensor (124d), and furthermore the central position of the wafer (W) is calculated according to the detected outer peripheral edge (WE) of the wafer (W) for aligning with the central position of a chuck worktable.
Description
Technical field
The present invention relates to processing unit (plant), particularly to the processing unit (plant) that the wafer of warpage is processed.
Background technology
In response to the requirement of the slimming/miniaturization of electronic product, semiconductor device fabrication is become various shape
Shape.Wherein, the CSP semiconductor device of WL-CSP (Wafer Level CSP: wafer-class encapsulation) this kind,
When wafer, whole is covered by resin molding, and with the electrode with the semiconductor device formed on silicon even
The state of the soldered ball connect proper alignment on the upper surface of which forms (patent documentation 1).Such WL-CSP is cut
Device is cut into the chip (patent documentation 2) of each semiconductor device.
Patent documentation 1: Japanese Unexamined Patent Publication 2001-7135 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2013-74021 publication
Patent documentation 3: No. 4303041 publications of Japanese Patent Publication No.
But, the slimming/miniaturization of WL-CSP in recent years is pushed further into, and wafer is formed the thinnest.
Therefore, the situation with the state warpage significantly of wafer is more, exists because this warpage causes conveyance or keeps becoming difficulty
Such problem.Such as, in position detecting mechanism (patent documentation 3), exist cannot keep warpage wafer and
Cannot detect the such problem in position, above-mentioned position detecting mechanism is for utilizing chuck table to keep taking-up from box
Wafer before detect the position of wafer and by wafer orientation in the position of the regulation of chuck table.
Summary of the invention
Therefore, the present invention completes in view of the foregoing, its object is to offer and can reliably keep warpage
The processing unit (plant) of wafer.
In order to solve above-mentioned problem and reach purpose, wafer is processed by the processing unit (plant) of the present invention, and it has:
Box mounting table, the box having received wafer is loaded by it；Taking out of and move into unit, it is from being positioned in this box mounting table
This box wafer is taken out of and wafer is moved into this box；Chuck table, its keep taking out of by this move into unit and
The wafer taken out of；And machining cell, the wafer being maintained on this chuck table is processed by it, described processing
Device is characterised by, this processing unit (plant) has position detecting mechanism, and the wafer taken out of from this box is moved to the inspection of this position
Surveying mechanism, the position of wafer is detected by this position detecting mechanism, and this position detecting mechanism has: central authorities' workbench,
It utilizes the holding face attracting holding wafer corresponding with the region of the immediate vicinity of wafer；Position detection unit, it is to borrowing
The outer peripheral edge of the wafer helping this central authorities' workbench and keep is detected, and infers the position of wafer；Rotating unit,
It makes this central authorities' workbench rotate；And guide portion, its around this central authorities' workbench to beyond this central authorities' workbench
The wafer of periphery support.
According to the processing unit (plant) of the present invention, owing to having around central authorities' workbench exceeding outside central authorities' workbench
The wafer in week carries out the guide portion supported, therefore, it is possible to by the wafer level of correcting into of warpage.Thereby, it is possible in passing through
Centre workbench reliably attracting holding wafer.
Accompanying drawing explanation
Fig. 1 is the axonometric chart of the structure example illustrating processing unit (plant).
Fig. 2 is the sectional view of the structure example illustrating box carrying mechanism.
Fig. 3 is the top view of the structure example illustrating position detecting mechanism.
Fig. 4 is the flow chart of the action example illustrating position detecting mechanism.
Fig. 5 is the sectional view of the action example (its 1) illustrating position detecting mechanism.
Fig. 6 is the main portion sectional view of the action example (its 2) illustrating position detecting mechanism.
Fig. 7 is the main portion sectional view of the action example (its 3) illustrating position detecting mechanism.
Fig. 8 is the top view of the action example (its 4) illustrating position detecting mechanism.
Label declaration
1: processing unit (plant)；10: chuck table；20: machining cell；40: processing feed unit；50: indexing
Feed unit；60: incision feed unit；70: the 1 transport unit；90: the 2 transport unit；100: take out of
Move into unit；110: box；120: box carrying mechanism；123: driver element；124: position detecting mechanism；124a:
Central authorities' workbench；124b: rotating unit；124c: guide portion；124d: position-detection sensor；124e: keep
Face；124f: guide surface；130: cleaning unit；N: recess；W: wafer；WS: front；WR: the back side；
WE: outer peripheral edge.
Detailed description of the invention
About the mode (embodiment) for implementing the present invention, referring to the drawings while explaining.This
The bright content being not limited to described in following embodiment.Further, described below structural element includes can be easy
The key element that occurs to those skilled in the art or the key element being substantially the same.Additionally, following described structure is permissible
Appropriately combined.Further, it is possible to carry out in without departing from the scope of idea of the invention the various omissions of structure, replacement or
Person changes.
[embodiment]
The processing unit (plant) of embodiment is illustrated.Fig. 1 is the axonometric chart of the structure example illustrating processing unit (plant).Figure
2 is the sectional view of the structure example illustrating box carrying mechanism.Fig. 3 is the top view of the structure example illustrating position detecting mechanism.
Processing unit (plant) 1 is that it cuts wafer W to double cutting machines (facing dual dicer).Processing unit (plant) 1 has
There are chuck table 10, machining cell the 20, the 1st gate frame 30, processing feed unit 40, index feed unit
50, incision feed unit 60.
Wafer W is to be formed with semiconductor device or the semiconductor wafer of optical device or optical device wafer, inorganic material base
The various rapidoprints such as plate, ductility resin material substrate, ceramic substrate or glass plate.Wafer W is formed as discoideus,
Its front WS is formed with the devices such as IC, LSI in being arranged in cancellate multiple region.Wafer W is because of thin
Type etc. and produce warpage.The recess N representing crystal orientation it is provided with in the periphery of wafer W.Alternatively, it is also possible to
Replace recess N and use the directional plane of the shape that is in line by the outer peripheral edge WE otch of wafer W.
Here, X-direction is that the wafer W being maintained on chuck table 10 is processed the direction of feeding.
Y direction is vertical with X-direction and relative to the wafer being maintained on chuck table 10 in same level
W carries out the direction of index feed to index feed unit 50.Z-direction is vertical with X-direction and Y direction
Direction, i.e. vertical.
Chuck table 10 on the upper surface of apparatus main body 2 with can be along the peristome being arranged at X-direction
The mode that 2a moves arranges.Chuck table 10 is formed as discoideus, has holding face 11.Holding face 11 keeps
Wafer W.Holding face 11 is the upper surface of the vertical of chuck table 10, with respect to the horizontal plane level terrain
Become.Holding face 11 is such as made up of porous ceramics etc., and the negative pressure by not shown vacuum attraction source carrys out attracting holding
Wafer W.
The wafer W being maintained on chuck table 10 is processed by machining cell 20.Machining cell 20 is at Y
2 relatively it are equipped on direction of principal axis.Machining cell 20 is via index feed unit 50 and incision feed unit 60
Being fixed on the 1st gate frame 30, the 1st gate frame 30 is with in the Y-axis direction across being arranged at apparatus main body 2
The mode of peristome 2a of upper surface stand up apparatus main body 2.Machining cell 20 have cutting tool 21,
Main shaft 22 and shell 23.Cutting tool 21 is created as very thin discoideus and for ring-type cutting grinding tool.Main
Axle 22 in its front end so that cutting tool 21 can be assembled in the way of loading and unloading.Shell 23 has not shown motor etc.
Driving source, and main shaft 22 is supported as the rotary shaft around Y direction rotatable.Main shaft 22 high-speed rotary is made to transfer
Wafer W is cut by cutting tool 21.
Processing feed unit 40 makes chuck table 10 and machining cell 20 relative movement in the X-axis direction.Example
As, processing feed unit 40 has the not shown ball-screw extended in the X-axis direction and pulse motor etc. and drives
Dynamic source, makes the X-axis of supporting chuck table 10 move base station and moves in the X-axis direction.
Index feed unit 50 makes chuck table 10 and machining cell 20 relative movement in the Y-axis direction.Example
As, index feed unit 50 has the ball-screw 51 extended in the Y-axis direction and pulse motor 52 etc. and drives
Source, makes machining cell 20 move in the Y-axis direction.
Incision feed unit 60 makes machining cell 20 in the vertical Z axis side, holding face 11 with chuck table 10
Move up.Such as, incision feed unit 60 has the ball-screw 61 and pulse electric extended in the Z-axis direction
Machine 62 grade drives source, makes machining cell 20 move in the Z-axis direction.
Processing unit (plant) 1 also has the 1st transport unit the 70, the 2nd gate frame the 80, the 2nd transport unit 90, removes
Go out to move into unit 100, box 110, box carrying mechanism 120, cleaning unit 130 and control unit 140.
1st transport unit 70 is moved into unit 100 and is accepted wafer W and this wafer W is transported to chuck work from taking out of
Station 10, this takes out of moves into unit 100 wafer W is taken out of relative to box 110, moved into.1st transport unit 70
Being disposed in the 2nd gate frame 80, the 2nd gate frame 80 is with in the Y-axis direction across the opening of apparatus main body 2
The mode of portion 2a stands up apparatus main body 2.1st transport unit 70 have straight-moving mechanism 71, support 72,
Telescoping mechanism 73 and adsorption section 74.Straight-moving mechanism 71 such as utilizes ball-screw or rotating band etc. to drive slide block,
One end of its 2nd gate frame 80 from Y direction arranges central part.Support 72 is formed as L-shaped
Shape, its one end is fixed on the slide block 71a of straight-moving mechanism 71, and the other end is equipped with telescoping mechanism 73.Telescoping mechanism 73
Fix adsorption section 74 in its front end, make adsorption section 74 move in the Z-axis direction.Telescoping mechanism 73 is e.g. at Z
Air actuator flexible on direction of principal axis, makes adsorption section 74 from the wafer W being maintained at chuck table 10 just
The position of face WS moves to the height of regulation.Adsorption section 74 is by the not shown absorption layer front to wafer W
WS carries out adsorbing and keeping wafer W.
Wafer W after 2nd transport unit 90 will be positioned in the processing of chuck table 10 is transported to cleaning unit
130.Further, the wafer W after the 2nd transport unit 90 will be cleaned by cleaning unit 130 is transported to box 110.2nd
Transport unit 90 is disposed in the 2nd gate frame 80, have straight-moving mechanism 91, support 92, telescoping mechanism 93 with
And adsorption section 94.Straight-moving mechanism 91 such as utilizes ball-screw or rotating band etc. to drive slide block, and it is from Y direction
On one end of the 2nd gate frame 80 arrange the other end.Support 92 is formed as L-shaped shape, and its one end is fixed
In the not shown slide block of straight-moving mechanism 91, the other end is equipped with telescoping mechanism 93.Telescoping mechanism 93 is in its front end
It is fixed with adsorption section 94, makes adsorption section 94 move in the Z-axis direction.Telescoping mechanism 93 is e.g. in Z-direction
Upper flexible air actuator, makes the adsorption section 94 front WS from the wafer W being positioned in chuck table 10
Position move to regulation height.The front WS of wafer W is carried out by adsorption section 94 by not shown absorption layer
Adsorb and keep wafer W.
Take out of and move into unit 100 and from box 110, take out of wafer W and wafer W is moved to box 110.Such as,
Take out of and move into unit 100 and be formed as two trouble shapes, there is the holding hands 101 and in the Y-axis direction keeping wafer W
The not shown ball-screw extended and pulse motor etc. drive source, make holding hands 101 move in the Y-axis direction.
Multiple wafer W received by box 110.As in figure 2 it is shown, box 110 has takes out of peristome 111 He moved into
Accepting rack 112.In accepting rack 112, supporting wafer W support plate 112a from relative sidewall along X-direction
Being protrudedly formed multiple, support plate 112a the most equally spaced arranges.Support plate 112a in Z-direction
Interval bigger than the thickness of wafer W.In the X-axis direction relative to a pair support plate 112a flatly support wafer
W。
Box carrying mechanism 120 is disposed in the front of the 2nd gate frame 80, and loads box 110.Box carrying mechanism 120
Make box 110 lift in the Z-axis direction, and decision box 110 moves into unit 100 in the Z-axis direction relative to taking out of
Position.Box carrying mechanism 120 has framework 121, supporting parts 122 and driver element 123.Framework 121
Upper surface formed for loading box mounting table 121a of box 110.Box mounting table 121a is formed as the end than box 110
Face is big, and loads the box 110 of storage wafer W.Supporting parts 122 supporting frame 121, has supporting frame 121
Supporting station 122a and the arm that extends towards driver element 123 from supporting station 122a and engage with driver element 123
122b.Driver element 123 makes the framework 121 supported by supporting parts 122 lift in the Z-axis direction.Driver element
123 have: the ball-screw 123a that arranges, the not shown guide rail extended in the Z-axis direction and guide rail parallel
Screw togather with ball-screw 123a and be fixed on the not shown nut of the arm 122b supporting parts 122 and make ball wire
The not shown pulse motor that thick stick 123a rotates.Driver element 123 is by making ball-screw by pulse motor
123a rotates and makes the supporting parts 122 being fixed on nut move in the Z-axis direction.
Box carrying mechanism 120 also has position detecting mechanism 124, and utilization is taken out of by this position detecting mechanism 124
The recess N of the position and wafer W that enter the wafer W that unit 100 takes out of from box 110 detects.Position testing machine
Structure 124 is disposed in the framework 121 of box carrying mechanism 120, its have central workbench 124a, rotating unit 124b,
Guide portion 124c and position-detection sensor 124d.
Central authorities workbench 124a is formed as discoideus, and its diameter is formed as less than the diameter of wafer W.Central authorities' work
Near the central authorities of the bottom surface 121b that platform 124a is disposed in framework 121 with its holding face 124e state as level.In
Centre workbench 124a rotates by the rotating unit 124b being made up of pulse motor etc..Holding face 124e is such as
It is made up of porous ceramics etc., keeps the immediate vicinity of wafer W by the vacuum suction in not shown vacuum attraction source
Region.
The wafer that periphery from central authorities workbench 124a is exceeded around central authorities workbench 124a by guide portion 124c
W supports.As it is shown on figure 3, guide portion 124c is formed as the shape of word "U" when Z-direction is observed,
Be disposed of remove take out of move into path R that unit 100 moved and around central authorities workbench 124a.Guide portion 124c
The guide surface 124f that wafer W is guided be set as with central authorities workbench 124a holding face 124e identical
Highly.In order to not suppress the slip of the wafer W rotated by central authorities workbench 124a, utilize coefficient of friction little
Guide surface 124f is coated by material such as fluororesin etc..Additionally, there are because wafer W is slided on guide surface 124f
Move and produce the probability of electrostatic.In such a situation it is preferred that neutralize electrostatic by not shown except electrical equipment.
The outer peripheral edge WE of the position-detection sensor 124d wafer W to being kept by central authorities workbench 124a examines
Survey.Position-detection sensor 124d is disposed in can be to the outer peripheral edge of the wafer W kept by central authorities workbench 124a
WE carries out the position detected.Such as, position-detection sensor 124d is in the side on the depth direction of framework 121
The vicinity of face 121c, and it is disposed in the recess 124i removed the local, rear end of guide portion 124c and formed.Position is examined
Survey sensor 124d e.g. optical pickocff, there is illuminating part 124g and light accepting part 124h.Illuminating part 124g and
Light accepting part 124h is to arrange in the way of certain interval is the most relative.Illuminating part 124g is towards light
Portion 124h irradiates light.Light accepting part 124h accepts the light irradiated from illuminating part 124g, and light income is converted into voltage
And export.Wafer W is positioned between illuminating part 124g and light accepting part 124h by position-detection sensor 124d, right
The voltage that light because irradiating from illuminating part 124g is blocked by the outer peripheral edge WE of wafer W and changes detects.
Further, the recess N of the position-detection sensor 124d outer peripheral edge WE to being formed at wafer W detects.
Wafer W after utilizing machining cell 20 processing is carried out and is dried by cleaning unit 130.Clean
Unit 130 has the rotary table 131 keeping wafer W.Cleaning unit 130 is while being maintained at rotation by wafer W
Revolving worktable 131 rotate at high speed, is carried out cleanout fluid such as pure water towards wafer W injection, and
The air (compressed air) etc. of cleaning is sprayed towards wafer W and is dried.
Each structural element of processing unit (plant) 1 is controlled by control unit 140.Such as, control unit 140 with drive
The pulse motor of dynamic processing feed unit 40, index feed unit 50 and incision feed unit 60 not shown
Drive circuit connect, control drive circuit and determine the position in the X-direction of chuck table 10 and processing
Position in the Y direction of unit 20 and Z-direction.
Further, control unit 140 is connected with position detecting mechanism 124, is detected according to position detecting mechanism 124
The outer peripheral edge WE of the wafer W gone out and infer the position of wafer W, control the 1st transport unit 70 and process into
The center of the center alignment chuck table 10 of wafer W is made to unit 40.Further, control unit
140 control the rotating unit 124b of central authorities workbench 124a according to the recess N detected by position detecting mechanism 124,
Make the direction towards alignment regulation of the crystal orientation of wafer W.It addition, control unit 140 and position detection sensing
Device 124d is as position detection unit function.
Then, the action example of processing unit (plant) 1 is illustrated.Fig. 4 is the action example illustrating position detecting mechanism
Flow chart.Fig. 5 is the sectional view of the action example (its 1) illustrating position detecting mechanism.Fig. 6 is to illustrate that position is detected
The main portion sectional view of the action example (its 2) of mechanism.Fig. 7 is the action example (its 3) illustrating position detecting mechanism
Main portion sectional view.Fig. 8 is the top view of the action example (its 4) illustrating position detecting mechanism.
First, from box 110, take out of wafer W (step S1 shown in Fig. 4).Such as, control unit 140 is controlled
The driver element 123 of box carrying mechanism 120 processed, sets the position of regulation in the Z-axis direction by box 110.Such as,
Control unit 140 box 110 is positioned at take out of move into unit 100 keep hands 101 can be by the wafer of processing object
The position that W takes out of.Control unit 140 controls to take out of to move into unit 100, makes holding hands 101 to close to box 110
Direction (Y direction) is mobile and holding hands 101 is positioned at the back side WR of the wafer W of processing object.Now,
Keep existing between hands 101 and the back side WR of wafer W gap slightly, keep hands 101 to be in wafer W
Contactless state.Further, control unit 140 controls the driver element 123 of box carrying mechanism 120, makes box 110 slightly
Micro-decline, protects by keeping the back side WR of absorption layer 101a (with reference to Fig. 6 etc.) the absorption wafer W of hands 101
Hold wafer W, and make this wafer W from accepting rack 112 along away from Z-direction.Further, control unit 140 is controlled
System takes out of moves into unit 100, makes holding hands 101 to direction (Y direction) movement away from box 110 from box 110
Take out of wafer W.
Then, by wafer W move-in position testing agency 124 (step S2).Such as, control unit 140 controls
The driver element 123 of box carrying mechanism 120, makes position detecting mechanism 124 rise and set rule in the Z-axis direction
Fixed position.Such as, position detecting mechanism 124 is positioned within crystalline substance by control unit 140 as shown in Figure 5
The front position keeping hands 101 of sheet W.Control unit 140 controls to take out of to move into unit 100, makes to remain crystalline substance
Sheet W keeps hands 101 mobile to the direction (Y direction) of approximated position testing agency 124, as shown in Figure 6,
The wafer W producing convex warpage is centrally located the top of workbench 124a.Further, control unit 140 controls
The driver element 123 of box carrying mechanism 120, makes position detecting mechanism 124 rise to the position of regulation.Such as such as figure
Shown in 7, control unit 140 makes position detecting mechanism 124 rise to the holding face 124e of central authorities workbench 124a
The height that position is identical with the position of the back side WR of wafer W.Now, in wafer W by keeping hands 101 to keep
Under state, the back side WR near the outer peripheral edge WE of wafer W and the guide surface 124f of position detecting mechanism 124
Abut, rise along with position detecting mechanism 124 and pass through the outer peripheral edge WE of guide surface 124f jack-up wafer W.By
This, correct the warpage of wafer W by guide surface 124f and make wafer W become smooth.At the shape that wafer W is smooth
Under state, the region of the immediate vicinity of central authorities' workbench 124a attracting holding wafer W.Now, as shown in Figure 8, brilliant
The outer peripheral edge WE of sheet W is between the illuminating part 124g and light accepting part 124h of position-detection sensor 124d.Control
Unit 140 processed controls the driver element 123 of box carrying mechanism 120, makes position detecting mechanism 124 slightly increase, and
Release the absorption layer 101a keeping hands 101 absorption of wafer W is kept.
Then, position and the recess N (step S3) of wafer W are detected.Such as, control unit 140 controls central authorities
The rotating unit 124b of workbench 124a, the position detection carried out above at 3 to the outer peripheral edge WE of wafer W.
Such as, the light because irradiating from illuminating part 124g is hindered by position-detection sensor 124d by the outer peripheral edge WE of wafer W
Voltage that is disconnected and that change carries out detecting and exporting control unit 140 as detection voltage.Control unit 140
According to the detection voltage exported from position-detection sensor 124d to the position of the outer peripheral edge WE of wafer W 3 at more than
Detect.Further, control unit 140 obtains each of position of the outer peripheral edge WE detected by trigonometric function
Coordinate, and the center of wafer W is inferred according to this coordinate.
Then, set wafer W crystal orientation towards (step S4).Such as, position-detection sensor 124d
The recess N of the outer peripheral edge WE being formed at wafer W is detected and to control unit 140 output detections signal.
Control unit 140 according to detection signal make central authorities workbench 124a rotate and make the crystal orientation of wafer W towards right
The direction of quasi-regulation.Such as, make to be maintained at wafer W on central authorities workbench 124a crystal orientation towards with guarantor
Hold the wafer W on chuck table 10 crystal orientation be oriented identical direction.
Then, wafer W is transported to chuck table 10 (step S5).Such as, control unit 140 controls box
The driver element 123 of carrying mechanism 120, makes the position detecting mechanism 124 that remain wafer W decline, and makes guarantor
The absorption layer 101a absorption holding hands 101 keeps the back side WR of wafer W.Further, control unit 140 releases central authorities
The attraction of workbench 124a, controls to take out of to move into unit 100, and makes holding hands 101 to separate location testing agency
The direction (Y direction) of 124 is mobile and wafer W is outwards taken out of in framework 121.Control unit 140 is controlled
Make the 1st transport unit 70, kept by the front WS of the wafer W keeping hands 101 to keep by adsorption section 74 absorption
And make wafer W move to the mobile route of chuck table 10 in the Y-axis direction.Now, according to above-mentioned
Official post between center and the center of central authorities workbench 124a of the wafer W calculated in step S3 is brilliant
Sheet W moves in the Y-axis direction.Further, control unit 140 controls processing feed unit 40, makes chuck table
10 lower sections moving to the wafer W being maintained on the adsorption section 74 of the 1st conveyance component 70 in the X-axis direction.This
Time, according to the center of the center of the wafer W calculated in above-mentioned step S3 and central authorities workbench it
Between difference, make chuck table 10 move in the X-axis direction, make center and the chuck table of wafer W
The center of 10 is consistent.Further, control unit 140 controls the 1st transport unit 70, makes telescoping mechanism 73 extend
And make wafer W decline, make wafer W be maintained on chuck table 10.
Then, wafer W is carried out machining (step S6).Such as, control unit 140 controls processing feeding
Unit 40, makes chuck table 10 move to machining position, controls machining cell 20 grade and carries out wafer W
Machining.
Then, wafer W it is carried out and is dried (step S7).At the end of the machining of wafer W,
Control unit 140 controls the 2nd transport unit 90, and the wafer W that will remain on chuck table 10 is transported to clearly
Wash unit 130.Wafer W is maintained at rotary table 131 rotate at high speed by cleaning unit 130, by clearly
Washing liquid cleans wafer W, and makes wafer W be dried after cleaning.
Then, wafer W is accommodated in (step S8) in box 110.Control unit 140 controls the 2nd transport unit
90, will remain in the wafer W on rotary table 131 and be transported to take out of and move into unit 100.Take out of and move into unit
100 by keeping hands 101 to keep wafer W, and wafer W is accommodated in box 110.
As it has been described above, according to the processing unit (plant) 1 of embodiment, have the central authorities beyond position detecting mechanism 124
The wafer W of the periphery of workbench 124a carries out guide portion 124c supported, and the wafer W of convexly warpage is rectified
Just becoming level.Thus, owing to when by central authorities' workbench 124a attracting holding wafer W, wafer W is level,
Therefore the holdings face 124e of central authorities workbench 124a carries out face with the back side WR of wafer W and contacts, therefore, it is possible to lead to
The holding face 124e of mistake reliably attracting holding wafer W.
And, although the position of the outer peripheral edge WE of the wafer W of warpage when top view with actual wafer W
The position of outer peripheral edge WE different, but in the present invention, owing to by the wafer W level of correcting into, therefore overlooking
During observation, it is identical with the position of the outer peripheral edge WE of actual wafer W, it is possible to detect the center of wafer W exactly
Position.Further, it is level owing to wafer W is corrected, also therefore is able to reliably detect the position of recess N.
[shape example]
Guide portion 124c have employed the shape of word "U", but as long as can be to beyond central authorities workbench 124a
The wafer W of periphery carries out the shape supported, it is possible to be any shape.Such as, guide portion 124c can also be
Word " U " or the shape of " C ", it is also possible in the way of utilizing multiple dot point wafer W, arrange multiple guide portion.
Further, position-detection sensor 124d uses the example of optical pickocff be illustrated, but the most also may be used
To be shot the outer peripheral edge WE of wafer W by filming apparatus.In this case, crystalline substance is inferred according to shooting image
The bias of sheet W.
And, although first infer that the center of wafer W detects the position of recess N again but it also may in inspection
The center of wafer W is inferred after surveying the position of recess N.Thereby, it is possible to avoid being detected as by recess N by mistake
Outer peripheral edge WE.
Claims (1)
1. a processing unit (plant), wafer is processed by it, and this processing unit (plant) has: box mounting table, it is to storage
The box of wafer loads；Taking out of and move into unit, wafer is taken out of also by it from this box being positioned in this box mounting table
And wafer is moved into this box；Chuck table, its holding takes out of, by this, the wafer moving into unit and take out of；And add
Work order is first, and the wafer being maintained on this chuck table is processed by it, and described processing unit (plant) is characterised by,
This processing unit (plant) has position detecting mechanism, and the wafer taken out of from this box is moved to this position detecting mechanism, should
The position of wafer is detected by position detecting mechanism,
This position detecting mechanism has:
Central authorities' workbench, it utilizes the holding face attracting holding wafer corresponding with the region of the immediate vicinity of wafer；
Position detection unit, the outer peripheral edge of its wafer to keeping by this central authorities' workbench is detected, and is pushed away
Break and the position of wafer；
Rotating unit, it makes this central authorities' workbench rotate；And
Guide portion, the wafer of the periphery beyond this central authorities' workbench is supported around this central authorities' workbench by it.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015030692A JP6474275B2 (en) | 2015-02-19 | 2015-02-19 | Processing equipment |
| JP2015-030692 | 2015-02-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105914164A true CN105914164A (en) | 2016-08-31 |
| CN105914164B CN105914164B (en) | 2020-07-03 |
Family
ID=56696730
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610087238.1A Active CN105914164B (en) | 2015-02-19 | 2016-02-16 | Processing device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6474275B2 (en) |
| KR (1) | KR102359141B1 (en) |
| CN (1) | CN105914164B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110429043A (en) * | 2018-05-01 | 2019-11-08 | 株式会社迪思科 | Processing unit (plant) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102458660B1 (en) | 2016-08-03 | 2022-10-26 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Display device and electronic device |
| JP2021082654A (en) * | 2019-11-15 | 2021-05-27 | 株式会社ディスコ | Processing device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001092530A (en) * | 1999-09-21 | 2001-04-06 | Olympus Optical Co Ltd | Device for correcting position of substrate |
| JP2002329769A (en) * | 2001-04-27 | 2002-11-15 | Lintec Corp | Alignment equipment |
| CN1422791A (en) * | 2001-12-03 | 2003-06-11 | 日东电工株式会社 | Semiconductor chip transmission method and apparatus for transmitting semiconductor chip using same |
| WO2009011417A1 (en) * | 2007-07-18 | 2009-01-22 | Nikon Corporation | Inspecting apparatus and inspecting method |
| JP2009129944A (en) * | 2007-11-20 | 2009-06-11 | Tatsumo Kk | Aligner apparatus |
| CN101807537A (en) * | 2009-02-12 | 2010-08-18 | 株式会社迪思科 | Position registration mechanism, processing unit (plant) and position alignment method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001007135A (en) | 1999-06-23 | 2001-01-12 | Toshiba Corp | Manufacture of semiconductor device |
| JP5948034B2 (en) | 2011-09-27 | 2016-07-06 | 株式会社ディスコ | Alignment method |
-
2015
- 2015-02-19 JP JP2015030692A patent/JP6474275B2/en active Active
-
2016
- 2016-02-15 KR KR1020160016986A patent/KR102359141B1/en active IP Right Grant
- 2016-02-16 CN CN201610087238.1A patent/CN105914164B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001092530A (en) * | 1999-09-21 | 2001-04-06 | Olympus Optical Co Ltd | Device for correcting position of substrate |
| JP2002329769A (en) * | 2001-04-27 | 2002-11-15 | Lintec Corp | Alignment equipment |
| CN1422791A (en) * | 2001-12-03 | 2003-06-11 | 日东电工株式会社 | Semiconductor chip transmission method and apparatus for transmitting semiconductor chip using same |
| WO2009011417A1 (en) * | 2007-07-18 | 2009-01-22 | Nikon Corporation | Inspecting apparatus and inspecting method |
| JP2009129944A (en) * | 2007-11-20 | 2009-06-11 | Tatsumo Kk | Aligner apparatus |
| CN101807537A (en) * | 2009-02-12 | 2010-08-18 | 株式会社迪思科 | Position registration mechanism, processing unit (plant) and position alignment method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110429043A (en) * | 2018-05-01 | 2019-11-08 | 株式会社迪思科 | Processing unit (plant) |
| CN110429043B (en) * | 2018-05-01 | 2024-02-20 | 株式会社迪思科 | Processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016152394A (en) | 2016-08-22 |
| KR102359141B1 (en) | 2022-02-04 |
| CN105914164B (en) | 2020-07-03 |
| KR20160102118A (en) | 2016-08-29 |
| JP6474275B2 (en) | 2019-02-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101434046B (en) | Grinding device | |
| JP2004207606A (en) | Wafer support plate | |
| CN107452608A (en) | The manufacture method and grinding attachment of device | |
| JP2010186863A (en) | Aligning mechanism, working device and aligning method | |
| US9082712B2 (en) | Device wafer processing method | |
| US20040265100A1 (en) | Semiconductor wafer processing machine | |
| CN105914164A (en) | Machining apparatus | |
| KR20120040104A (en) | Wafer transfer mechanism | |
| JP5101267B2 (en) | Wafer processing method | |
| JP4861061B2 (en) | Method and apparatus for confirming annular reinforcing portion formed on outer periphery of wafer | |
| KR102649912B1 (en) | Bonding module and die bonding apparatus having the same | |
| CN108573889A (en) | The fluctuating detection method and grinding attachment of chip | |
| JP6415349B2 (en) | Wafer alignment method | |
| KR100849589B1 (en) | Cutting machine | |
| JP2011060841A (en) | Grinding device | |
| KR101460626B1 (en) | Supplying Apparatus of Semiconductor Materials | |
| JPWO2019102868A1 (en) | Board transfer device, board processing system, board processing method and computer storage medium | |
| JP2013202704A (en) | Grinding apparatus and grinding method | |
| KR102554989B1 (en) | Grinding method | |
| JP2014154708A (en) | Method and device for detecting crack of wafer | |
| JP2013187493A (en) | Method for carrying out wafer | |
| JP5356803B2 (en) | Wafer processing equipment | |
| CN111146128B (en) | Die transfer module and die bonding apparatus having the same | |
| JP6137796B2 (en) | Processing equipment | |
| JP2013158880A (en) | Grinding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |