CN105789105B - A kind of auxiliary tool and its localization method for photoetching coating technique manual positioning wafer - Google Patents
A kind of auxiliary tool and its localization method for photoetching coating technique manual positioning wafer Download PDFInfo
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- CN105789105B CN105789105B CN201610192007.7A CN201610192007A CN105789105B CN 105789105 B CN105789105 B CN 105789105B CN 201610192007 A CN201610192007 A CN 201610192007A CN 105789105 B CN105789105 B CN 105789105B
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- slide holder
- wafer
- auxiliary tool
- cambered surface
- table top
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The present invention provides a kind of auxiliary tool and its localization method for photoetching coating technique manual positioning wafer, eliminating the manual alignment during coating technique needs to be directed at the process of adjustment and confirmation repeatedly.The auxiliary tool has bending structure；The bending structure is mainly bent formed successively by a basic facade, a basic table top and a vertical spacing cambered surface, wherein, it is fan annular from basic facade to the integral level projection of shape of vertical spacing cambered surface, the horizontal distance at vertical spacing cambered surface to fan ring center is equal with the radius of the wafer；The shape and size of the basis facade and basic table top meet to be bonded with slide holder supporting part and slide holder lower surface at the same time respectively, while spacing cambered surface is adapted to crystal round fringes and contacts.
Description
Technical field
The present invention relates to a kind of wafer positioner.
Background technology
Photoetching coating technique is placed on wafer on the slide holder of photoetching glue spreader, and liquid photoresist is dropped in wafer
The heart, slide holder drive wafer to rotate at a high speed, and photoresist relies on centrifugal force to external expansion, the technique for being uniformly coated on crystal column surface.
Crystal circle center and slide holder center must highly overlap, to ensure the photoresist thickness uniformity of crystal column surface, without haloing
Phenomena such as comets tail, so as to ensure that figure can be shifted accurately.
At present, in the wafer of 6 cun and 6 cun diameter above of operation, photoetching glue spreader is both designed as full-automatic gluing, mainly
By technological means such as coordinate or infrared detections, the alignment at crystal circle center and slide holder center is completed by mechanical arm, in operation 2
It is very little, 3 cun, 4 cun of diameter wafers when, for cost consideration, photoetching glue spreader is both designed as being manually operated, crystal circle center and slide holder
Center needs manual alignment.In production process when using manual alignment crystal circle center and slide holder center, it is difficult to ensure that two
Center is completely superposed, so as to have impact on the uniformity of coated photoresist thickness, technology stability can not ensure, and hand
Dynamic alignment procedures need to adjust wafer position repeatedly, are confirmed whether to be aligned, and take relatively long, work efficiency is relatively low.
The content of the invention
The present invention devises a positioning auxiliaring tool, eliminate the manual alignment during coating technique need repeatedly it is right
Quasi- adjustment and the process confirmed.
Technical scheme is as follows：
A kind of auxiliary tool for photoetching coating technique manual positioning wafer, the auxiliary tool have bending structure；Institute
Bending structure is stated mainly to be bent formed successively by a basic facade, a basic table top and a vertical spacing cambered surface, its
In, the integral level projection of shape from basic facade to vertical spacing cambered surface is annular for fan, vertical spacing cambered surface to fan ring
The horizontal distance at center is equal with the radius of the wafer；The shape and size of the basis facade and basic table top meet difference
It is bonded at the same time with slide holder supporting part and slide holder lower surface, while spacing cambered surface is adapted to crystal round fringes and contacts.
Here " facade " and " table top " is not definitely limited to straight face；For example, the support platform lower surface of slide holder
If the face of special out-of-flatness, then " table top " should be just designed as with the face of its male-female engagement to meet the present invention accordingly
Both fit.
On the basis of above scheme, the present invention has also further made following important optimization：
The agent structure of the auxiliary tool is the step of two-stage fan annular, the wherein facade of footing step and table top and secondary
Level step facade shape and size meet respectively and meanwhile with slide holder supporting part and slide holder lower surface and slide holder side
Side is bonded, and the table top of secondary step is without departing from the working face of slide holder；The vertical spacing cambered surface is arranged at secondary step
Table top outer edge.
Here secondary step can also omit, directly that the facade of footing step and slide holder tray supporting devices is tight
Patch, the horizontal distance of vertical spacing cambered surface to footing step facade is wafer radius and the difference of tray support radius.
The table top of secondary step is less than 1~2mm of working face of slide holder.
Third level step is also formed based on the vertical spacing cambered surface, and is set in the table top outer edge of third level step
There is projection, in order to operation of taking manually.
Corresponding wafer positioning and mounting structure (installation in position fixing process coordinates), including slide holder, wafer and above-mentioned
Auxiliary tool, the auxiliary tool are close to slide holder supporting part and slide holder lower surface, spacing cambered surface and slide glass in auxiliary tool
Platform is concentric, and the horizontal distance of spacing cambered surface to slide holder center is equal with the wafer radius so that spacing cambered surface is to wafer side
Edge adaptation contact.
A kind of method that photoetching coating technique manual positioning wafer is realized using above-mentioned auxiliary tool, is comprised the following steps：
1) auxiliary tool is close to the outer contour corresponding site of slide holder；
2) wafer is placed on slide holder, the spacing cambered surface of the auxiliary tool is completely attached to crystal round fringes；
3) option program adsorbs wafer vacuum in slide holder upper surface, removes the auxiliary tool；
4) option program rotates automatically by slide holder, and observation wafer is in rotary course, if there are crystal circle center and load
The phenomenon of piece platform center misalignment；
5) after confirming that crystal circle center and the alignment of slide holder center are normal, stop the rotation of slide holder, start photoresist drop glue
In the technical process of crystal column surface.
The technique effect of the present invention is as follows：
The auxiliary tool is designed according to slide holder and wafer size, only need to once be aligned and once confirm, you can completes wafer
Center and the alignment at slide holder center, ensure that the good uniformity of photoresist, and dimension of picture is accurately shifted, and improves finished product
Rate.
The auxiliary tool makes simply, easy to use, it is not necessary to changes equipment design, both ensure that photoetching coating technique
Stability, and the time-consuming process that manual alignment is adjusted and confirmed repeatedly is shortened, improve production efficiency.
Brief description of the drawings
Fig. 1 is the basic structure schematic diagram of slide holder.
Fig. 2, Fig. 3 are the first embodiment of the present invention；Wherein, Fig. 3 is along the section in A~B directions in Fig. 2；
Fig. 4 is the schematic diagram that wafer installs position fixing process.
Fig. 5, Fig. 6 are the second embodiment of the present invention；Wherein, Fig. 6 is along the section in A~B directions in Fig. 5.
Description of reference numerals：
11- slide holder supporting parts；12- slide holders lower surface；13- slide holders upper surface；14- slide holders side；
Size 1 is the diameter of slide holder supporting part；Size 2 subtracts the ruler of supporting part diameter for the diameter of slide holder supporting part
It is very little；Size 3 is the thickness of slide holder supporting part；Size 4 is the radius of wafer；
Size 5 subtracts the thickness of 1~2mm for size 3, and during for ensureing wafer alignment, positioning auxiliaring tool will not touch
Wafer rear causes wafer tilt (embodiment one)；
Size 6 is aligning surface height, which is greater than size 3, it is ensured that during alignment, crystal round fringes can be vertical with this
Spacing cambered surface adaptation contact (embodiment two).
Embodiment
Embodiment one：
As shown in Figure 2,3, the agent structure of positioning auxiliaring tool is the step of two-stage fan annular, and wherein footing step is vertical
The shape and size of the facade of face and table top and secondary step meet respectively and meanwhile with slide holder supporting part and slide holder following table
Face and the fitting of slide holder side, and the table top of secondary step is without departing from the working face of slide holder；Outside the table top of secondary step
Edge sets vertical spacing cambered surface, and third level step is also formed at the top of spacing cambered surface, and outside the table top of third level step
Edge is provided with projection, in order to operation of taking manually.Specific positioning action step is as follows：
1. first positioning auxiliaring tool and slide holder are bonded：By the vertical of the facade of footing step and table top and secondary step
Face is bonded successively with the outer contour of slide holder, and the table top of secondary step is less than the working face of slide holder；
2. wafer is placed on slide holder, while crystal round fringes are close to the spacing cambered surface of positioning auxiliaring tool；
3. option program adsorbs wafer vacuum on slide holder surface, positioning auxiliaring tool is removed；
4. option program rotates automatically by slide holder, observation wafer is in rotary course, if there are crystal circle center and load
The phenomenon of piece platform center misalignment；
5. after confirming that crystal circle center and the alignment of slide holder center are normal, stop the rotation of slide holder, start photoresist drop glue
In the technical process of crystal column surface.
Embodiment two：
As shown in Figure 5, Figure 6, which mainly eliminates second level step compared to embodiment one, only considers that positioning is auxiliary
Assistant engineer's tool is bonded with slide holder supporting part and slide holder lower surface, is bonded without considering with slide holder side.Specific positioning action step
It is rapid as follows：
1. first positioning auxiliaring tool and slide holder are bonded：By the facade of footing step and the outer contour of table top and slide holder
It is bonded successively；
2. wafer is placed on slide holder, while crystal round fringes are close to the spacing cambered surface of positioning auxiliaring tool；
3. option program adsorbs wafer vacuum on slide holder surface, positioning auxiliaring tool is removed；
4. option program rotates automatically by slide holder, observation wafer is in rotary course, if there are crystal circle center and load
The phenomenon of piece platform center misalignment；
5. after confirming that crystal circle center and the alignment of slide holder center are normal, stop the rotation of slide holder, start photoresist drop glue
In the technical process of crystal column surface.
Claims (6)
- A kind of 1. auxiliary tool for photoetching coating technique manual positioning wafer, it is characterised in that：The auxiliary tool has curved Folded structure；The bending structure is mainly curved successively by a basic facade, a basic table top and a vertical spacing cambered surface Folding composition, wherein, from basic facade to the integral level projection of shape of the vertical spacing cambered surface spacing arc annular, vertical for fan The horizontal distance at face to fan ring center is equal with the radius of the wafer；The shape and size of the basis facade and basic table top Meet to be bonded with slide holder supporting part and slide holder lower surface at the same time respectively, while spacing cambered surface is adapted to crystal round fringes and contacts.
- 2. the auxiliary tool according to claim 1 for photoetching coating technique manual positioning wafer, it is characterised in that：Should The agent structure of auxiliary tool is the step of two-stage fan annular, and wherein the facade of footing step and table top and secondary step is vertical The shape and size in face meet to be bonded with slide holder supporting part and slide holder lower surface and slide holder side at the same time respectively, and secondary Working face of the table top of level step without departing from slide holder；The vertical spacing cambered surface is arranged at outside the table top of secondary step Edge.
- 3. the auxiliary tool according to claim 2 for photoetching coating technique manual positioning wafer, it is characterised in that：It is secondary The table top of level step is less than 1~2mm of working face of slide holder.
- 4. the auxiliary tool according to claim 2 for photoetching coating technique manual positioning wafer, it is characterised in that：Base Third level step is also formed in the vertical spacing cambered surface, and the table top outer edge of third level step is provided with projection, with Easy to operation of taking manually.
- 5. a kind of wafer positioning and mounting structure for photoetching coating technique, including slide holder and wafer, it is characterised in that：Also wrap The auxiliary tool described in claim 1 is included, which is close to slide holder supporting part and slide holder lower surface, in auxiliary tool Spacing cambered surface and slide holder it is concentric, the horizontal distance of spacing cambered surface to slide holder center is equal with the wafer radius so that Spacing cambered surface is adapted to crystal round fringes and contacts.
- 6. a kind of method that photoetching coating technique manual positioning wafer is realized using auxiliary tool described in claim 1, including with Lower step：1) auxiliary tool is close to the outer contour corresponding site of slide holder；2) wafer is placed on slide holder, the spacing cambered surface of the auxiliary tool is completely attached to crystal round fringes；3) option program adsorbs wafer vacuum in slide holder upper surface, removes the auxiliary tool；4) option program rotates automatically by slide holder, and observation wafer is in rotary course, if there are crystal circle center and slide holder The phenomenon of center misalignment；5) after confirming that crystal circle center and the alignment of slide holder center are normal, stop the rotation of slide holder, start photoresist and drip glue in crystalline substance The technical process of circular surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610192007.7A CN105789105B (en) | 2016-03-30 | 2016-03-30 | A kind of auxiliary tool and its localization method for photoetching coating technique manual positioning wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610192007.7A CN105789105B (en) | 2016-03-30 | 2016-03-30 | A kind of auxiliary tool and its localization method for photoetching coating technique manual positioning wafer |
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| Publication Number | Publication Date |
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| CN105789105A CN105789105A (en) | 2016-07-20 |
| CN105789105B true CN105789105B (en) | 2018-05-08 |
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| CN201610192007.7A Active CN105789105B (en) | 2016-03-30 | 2016-03-30 | A kind of auxiliary tool and its localization method for photoetching coating technique manual positioning wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110828357A (en) * | 2019-11-21 | 2020-02-21 | 江苏索尔思通信科技有限公司 | Manual glazing and film feeding carrier |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201084721Y (en) * | 2007-07-20 | 2008-07-09 | 中芯国际集成电路制造(上海)有限公司 | A wafer positioning mechanism |
| CN101807537A (en) * | 2009-02-12 | 2010-08-18 | 株式会社迪思科 | Position registration mechanism, processing unit (plant) and position alignment method |
| CN102294314A (en) * | 2010-06-25 | 2011-12-28 | 上海微电子装备有限公司 | Wafer spreading machine and method |
| CN205508799U (en) * | 2016-03-30 | 2016-08-24 | 西安立芯光电科技有限公司 | A appurtenance for photoetching glue coating process manual positioning wafer and mounting structure thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8844123B2 (en) * | 2009-12-03 | 2014-09-30 | Chin-Chi Yang | Method of manufacturing a hollow surface mount type electronic component |
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2016
- 2016-03-30 CN CN201610192007.7A patent/CN105789105B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201084721Y (en) * | 2007-07-20 | 2008-07-09 | 中芯国际集成电路制造(上海)有限公司 | A wafer positioning mechanism |
| CN101807537A (en) * | 2009-02-12 | 2010-08-18 | 株式会社迪思科 | Position registration mechanism, processing unit (plant) and position alignment method |
| CN102294314A (en) * | 2010-06-25 | 2011-12-28 | 上海微电子装备有限公司 | Wafer spreading machine and method |
| CN205508799U (en) * | 2016-03-30 | 2016-08-24 | 西安立芯光电科技有限公司 | A appurtenance for photoetching glue coating process manual positioning wafer and mounting structure thereof |
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| CN105789105A (en) | 2016-07-20 |
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