CN103208449A - Device, method and system for aligning wafer on support seat - Google Patents
Device, method and system for aligning wafer on support seat Download PDFInfo
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- CN103208449A CN103208449A CN2012100102650A CN201210010265A CN103208449A CN 103208449 A CN103208449 A CN 103208449A CN 2012100102650 A CN2012100102650 A CN 2012100102650A CN 201210010265 A CN201210010265 A CN 201210010265A CN 103208449 A CN103208449 A CN 103208449A
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Abstract
The invention provides a device, a system and a method for arranging a wafer on a rotatable sucker support seat to improve removal width of the wafer photoresist edge and the outline accuracy at different wafer manufacturing stages. According to the device, the system and/or the method, one or more wafer position calculators can be used for calculating an expected position of the wafer and providing the expected position for a wafer delivering arm controller. The wafer delivering arm controller is connected with the wafer position calculators so as to provide information about adjustment of relative positions between the wafer and the support seat according to the expected position of the wafer. A plurality of different sensing detectors, sensing light sources or other mechanisms can be used for sensing the position of the wafer.
Description
Technical field
The invention relates to the technology of semiconductor crystal wafer, and more specifically, be relevant with rotatable sucker supporting seat relative position with semiconductor crystal wafer in technology, remove (EBR) width accuracy to improve crystal round fringes uneven thickness photoresist, and be reduced in photoresist in the semiconductor technology and remove the district in the asymmetry of crystal column surface.
Background technology
Photoresist layer uses widely in integrated circuit technology now.Photoresist layer normally is sprayed at crystal column surface with photoresist when wafer rotates.
Fig. 1 shows the schematic diagram of photoresist spin coating process.Wafer is placed on earlier on the supporting seat of a rotatable sucker.At the initial stage of spin coating process 100, photoresist is sprayed onto crystal column surface when step 101.Photoresist when step 103 because supporting seat (with and on wafer) rotation and scatter at crystal column surface and to come.When step 105, supporting seat and wafer rotate constantly and make the photoresist at crystal column surface become thinner.When step 107, the solvent in the photoresist further is evaporated because of rotation.When step 109, begin to carry out crystal round fringes uneven thickness photoresist and remove (EBR) and back side contamination cleaning.
Fig. 2 shows that wafer 205 is at the schematic diagram that carries out before crystal round fringes uneven thickness photoresist removes (EBR) and back side contamination cleaning.This wafer 205 has a photoresist layer 203 and this spin coating process produces photoresist uneven thickness district 201 at wafer 205 edges.In addition, wafer 205 back sides also can form some photoresist pollutants 207.The uneven photoresist of these edge thickness is caused than big and air turbulence in the wafer limit by the air-flow 250 in the spin coating process.It is that a little photoresist overflows to due to the wafer rear in the process of rotation coating that pollutant 207 is stained with at the back side.
Fig. 3 A shows that tradition removes the schematic diagram of the device 300 of the uneven photoresist (EBR) of edge thickness and back side contamination cleaning.Wafer 305 is placed on the rotating basis 313 with supporting seat 315.The uneven photoresist of edge thickness that lays respectively at rotating basis 313 tops and below removes nozzle 311 and the back side and stains washer jet 309 and be used to remove lateral edge uneven thickness photoresist and back side contaminant.
Fig. 3 B shows that crystal round fringes uneven thickness photoresist removes the enlarged diagram of technology 350.Crystal round fringes uneven thickness photoresist removes the photoresist layer 303 that nozzle 311 is used for removing wafer 305 edges.Technology 350 shows that crystal round fringes uneven thickness photoresist removes nozzle 311 and moves around in the horizontal direction once to remove the photoresist layer 303 at wafer 305 edges.The relative position that this wafer 305 and crystal round fringes uneven thickness photoresist remove 311 at nozzle causes removing at wafer 305 edge photoresists the change of width.
Fig. 4 A and Fig. 4 B show that respectively the edge photoresist removes the schematic top plan view 400,450 of the change of width.Wafer 405 is placed on aligning (in the putting) position of supporting seat expection.As shown in FIG., wafer 405 do not have photoresist 403 remove width 400A, B, C, D roughly equate at crystal round fringes.Therefore, having roughly uniformly on the wafer 405, photoresist 403 distributes.Opposite, wafer 455 is not placed on the aligned position (center is offset a little) of supporting seat expection.As shown in FIG., wafer 405 do not have photoresist 403 remove width 450A, B, C, D are not what equate at wafer 455 edges.Remove width 450A＞B＞C＞D.Therefore, having asymmetric photoresist 453 on the wafer 455 distributes.
Fig. 5 is presented at the vertical view of the change that removes width of crystal round fringes.Figure 501 is presented at crystal round fringes and removes width and be about 0.5mm.Figure 503 and 505 then is presented at the bigger and less width that removes respectively.
Remove the change that many different defect kenels in (EBR) technology can cause the asymmetric distribution of photoresist and remove width at the uneven photoresist of wafer thickness.Fig. 6 A shows possible defective.In the technology of immersion lithography, the defective of wafer lateral edge may be brought to wafer inside by the wafer side in step of exposing, and Fig. 6 B shows that possible defective shifts schematic diagram.Any acceptance rate and performance that all may influence semiconductor technology of these defectives.
In addition, many different schemes are used to solve the problem that particle defects produces, and for example use the coating process crystal edge to clean (BEVEL rinse) scheme, and for difformity in the different levels and profile design.
For example, Fig. 7 A and Fig. 7 B show that respectively traditional lateral edge uneven thickness photoresist removes (EBR) scheme 700 and crystal edge cleans (BEVEL rinse) scheme 750.The uneven photoresist of traditional lateral thickness removes (EBR) scheme 700 and comprises a wafer 705, end anti-reflecting layer (BARC) 704, photoresist layer 703 and top coating layer 702.Use traditional uneven thickness photoresist to remove (EBR) scheme, these levels are removed the back can form stepped profile at crystal round fringes.Crystal edge cleans (BEVEL rinse) scheme 750 and also comprises a wafer 705, end anti-reflecting layer (BARC) 704, photoresist layer 703 and top coating layer 702.And using crystal edge to clean (BEVEL rinse) scheme, these levels are removed the back can form mild curved profile at crystal round fringes.
Fig. 8 shows that the crystal edge of use cleans the schematic diagram of (BEVEL rinse) technology.One first crystal edge cleans (BEVEL rinse) technology 800 and comprises a top coating.Above-mentioned crystal edge cleaning (BEVEL rinse) technology removes (EBR) scheme compared to traditional crystal edge uneven thickness photoresist can reduce the particle defects of half approximately.
Fig. 9 shows that using traditional scheme and crystal round fringes to clean (BEVEL rinse) technology relatively illustrates 900 in the defect concentration distribution that the coating of pushing up and not top coating are arranged.In immersion lithography technology, use the side crystal edge to clean (BEVEL rinse) and reduced significantly than the defect concentration of using traditional scheme, under the situation that top coating or not top coating are arranged, all be identical result no matter be.
At last, Figure 10 A, Figure 10 B and Figure 10 C show that respectively three kinds of crystal round fringes uneven thickness photoresists remove the schematic diagram 1000,1050,1070 of (EBR) scheme.Each scheme all uses specific crystal edge photoresist, end anti-reflecting layer, top coating edge to remove the width design, and its accurate position and profile design can improve acceptance rate and performance.Therefore, crystal round fringes removes the accuracy of width and profile in the wafer manufacturing, just becomes very important when especially the profile in immersion lithography stage and each level forms.
Therefore, need a kind of new scheme to remove the accuracy of width and the profile of wafer in the different phase of wafer manufacturing, to improve crystal round fringes.
Summary of the invention
The invention relates to the device and method of a kind of placement one wafer on a supporting seat.
According to a purpose of the present invention, the device of a kind of placement one wafer on a supporting seat is provided, comprise the device of a kind of placement one wafer on a supporting seat; One sensitive detector is near this supporting seat; Wherein this sensitive detector can be operated with deciding wafer position information.
This device can comprise that also a wafer position calculator communicates by letter with this sensitive detector, and wherein this wafer position calculator can operate to calculate this position of this wafer according to this wafer position information that receives from this sensitive detector.This wafer position calculator also can operate to calculate and adjust the wafer position of an expection according to the coordinate information of this supporting seat.
This device can comprise that also a wafer carrier arm and a wafer carrier arm controller communicate by letter with this wafer position calculator.This wafer carrier arm controller can operate to adjust the relative position of this wafer and this supporting seat.This wafer carrier arm controller also can operate to adjust this wafer carrier arm position makes a centre coordinate of this wafer aim at a centre coordinate of this supporting seat.
This wafer position calculator can provide the wafer position of this expection to this wafer carrier arm controller.And the wafer position of this expection comprises this wafer carrier arm and is adjusted according to the wafer position of this expection.
This induction light source and this sensitive detector are positioned at the opposite side of this rotatable sucker.This induction light source and this sensitive detector are placed in the single sensing unit.
This device can also comprise a reflector element and be positioned at opposite side with relative this rotatable sucker of this single sensing unit, and wherein this reflector element can operate to reflect the light that produced by this induction light source to this sensitive detector.
According to another object of the present invention, the method for a kind of placement one wafer on a supporting seat is provided, comprise from a sensitive detector receiving wafer position information; Determine wafer position according to this wafer position information; Calculate the wafer position of an expection according to the coordinate information of this supporting seat; And wafer position information to the wafer carrier arm controller that this expection is provided can operate to adjust according to the wafer position of this expection the relative position of this wafer and this supporting seat.
The method also comprises provides instruction to make a wafer carrier arm mention this wafer; Provide instruction to make this wafer carrier arm transmit this wafer to the top of this supporting seat; And provide instruction to make this wafer carrier arm place this wafer to this supporting seat.
The method also comprises provides instruction to make this wafer be positioned on the rotating suction disc of this supporting seat; An initial photoresist coating process; An initial crystal round fringes uneven thickness photoresist removes technology; And provide instruction to make this wafer carrier arm that this wafer is shifted out on this supporting seat.
This wafer position calculator can operate to calculate this position of this wafer according to this wafer position information that is received from this sensitive detector.And the wafer position of calculating this expection comprises the expection coordinate of a central shaft that determines this wafer.
Provide the wafer position information of this expection to comprise two-dimentional adjustment information is provided.And should the two dimension adjustment information comprise (X
0, Y
0)-(X
1, Y
1), (X wherein
0, Y
0) represent the two-dimensional coordinate of the central shaft of wafer position, and (X
1, Y
1) represent the two-dimensional coordinate of the central shaft of supporting seat.
According to a further object of the present invention, the system of a kind of placement one wafer on a supporting seat is provided, and this system comprises wafer position that a wafer position calculator can operate to calculate the wafer position of an expection and this expection is provided to a wafer carrier arm controller.This system also comprises a wafer carrier arm controller and communicates by letter with this wafer position calculator, and wherein this wafer carrier arm controller can be used for wafer position according to this expection provides the instruction of the relative position of adjusting this wafer and this supporting seat.
This system can comprise induction light source and a sensitive detector.This sensitive detector one wafer position calculator communication, and provide wafer position information to this wafer position calculator.
This wafer position calculator can be according to this wafer position information that receives from this sensitive detector, and wherein this wafer position calculator can determine this position of this wafer according to this wafer position information, and the wafer position information that wherein offers this expection of this wafer position calculator comprises two-dimentional adjustment information.And should the two dimension adjustment information comprise (X
0, Y
0)-(X
1, Y
1), (X wherein
0, Y
0) represent the two-dimensional coordinate of the central shaft of wafer position, and (X
1, Y
1) represent the two-dimensional coordinate of the central shaft of supporting seat.
Description of drawings
The present invention is defined by claim.These and other objects, feature, and embodiment can be described by the collocation accompanying drawing in the chapters and sections of following execution mode, wherein:
Fig. 1 shows the schematic diagram of photoresist spin coating process.
Fig. 2 shows that wafer is in the schematic diagram that carries out before crystal round fringes uneven thickness photoresist removes (EBR) and back pollution thing cleaning.
Fig. 3 A shows the schematic representation of apparatus that traditional crystal round fringes uneven thickness photoresist removes and back side pollutant cleans.
Fig. 3 B shows that crystal round fringes uneven thickness photoresist removes the enlarged diagram of technology 350.
Fig. 4 A and Fig. 4 B show that respectively crystal round fringes uneven thickness photoresist removes the schematic top plan view of the change of width.
Fig. 5 is presented at the vertical view of the change that removes width of crystal round fringes.
How the crystal round fringes defective transfers to crystal circle center in the defective that Fig. 6 A and Fig. 6 B demonstration crystal round fringes may exist and the immersion lithography technology.
Fig. 7 A and Fig. 7 B show that respectively traditional crystal round fringes uneven thickness photoresist removes (EBR) scheme and crystal edge cleaning program.
Fig. 8 shows the schematic diagram of the employed crystal edge cleaning of Tokyo Electronics Co., Ltd.
Fig. 9 shows that using having of traditional scheme and crystal edge cleaning to push up the defect concentration distribution that is coated with and does not have the top to coat immersion lithography technology relatively illustrates.
Figure 10 A, Figure 10 B and Figure 10 C show that respectively three kinds of crystal round fringes uneven thickness photoresists remove the schematic diagram of (EBR) scheme.
11A and 11B figure show the schematic diagram that the crystal edge photoresist is removed width symmetry whether ability respectively.
Figure 12 shows the schematic diagram of a wafer transfer robot arm.
Figure 13 shows the schematic diagram of a rotation coating module.
Figure 14 shows that a wafer carrier arm supports the generalized section of pin width and wafer width size.
Figure 15 shows that the adjustment wafer places the process chart of rotating suction disc stacker position.
Figure 16 shows that adjusting wafer places rotating suction disc stacker position sucker system control schematic diagram.
Figure 17 demonstration is positioned over the relative position schematic diagram of rotating suction disc stacker position after the adjustment sucker reaches before with wafer.
Figure 18 shows wafer on the transfer robot arm and with respect to the position view of sucker rotating suction disc stacker device.
Figure 19 show with wafer be positioned on the transfer robot arm with rotation coating module sucker supporting seat on emission and the schematic diagram of the position example of induction installation.
[main element symbol description]
201-crystal round fringes uneven thickness photoresist;
The 203-photoresist film;
205,305,405,455-wafer;
Stain at the 207-back side;
250-air-flow pattern;
The device that 300-tradition crystal round fringes uneven thickness photoresist removes and back side contaminant cleans;
303,403,453-photoresist layer;
309-back side washer jet;
311-crystal round fringes uneven thickness photoresist removes nozzle;
313-rotation coating sucker;
The 315-supporting seat;
The 450-photoresist remove width;
The 456-photoresist distributes;
700-crystal round fringes uneven thickness photoresist removes (EBR) scheme;
702-top coating layer;
The 703-photoresist layer;
Anti-reflecting layer at the bottom of the 704-(BARC);
The 705-wafer;
750-crystal edge cleaning program (BEVEL rinse);
1105,1155-rotation coating sucker;
1115,1165-wafer;
1200-wafer transfer robot arm;
1201,1202,1203, the wafer support pin on the 1204-mechanical arm;
The 1220-base part;
1225-pedestal fixing point;
The 1230-platform;
1240-arm support seat;
1300-rotation coating module;
Sucker is inhaled in 1311-rotation coating;
The 1302-wafer is supported pin;
The 1303-photoresist sprays arm;
1304-one solution accumulator tank;
1305-crystal round fringes uneven thickness photoresist removes (EBR) arm;
1306-one crystal round fringes uneven thickness photoresist removes (EBR) solution accumulator tank;
1307-liquid photoresist waste liquid tray;
The generalized section of the wafer support pin on 1400-wafer size and the transmission arm;
1401,1402-transmits the wafer support pin on the arm;
The 1405-wafer;
1501: lift wafer;
1502: transmit wafer;
1503: detecting wafer position and decision crystal circle center coordinate;
1504: adjust wafer position to the wafer position of expection;
1505: after wafer is positioned over rotation coating sucker arm is shifted out;
1506: rotate after rotation coating suction disc vacuum pumping holds wafer;
1507: be coated with photoresist and remove edge photoresist district in uneven thickness (EBR);
1508: wafer spin is changeed the coating sucker shift out the back and shift out rotation coating module;
The 1601-sensitive detector;
1605-responds to light source;
1613-wafer position calculator;
The 1615-memory;
1617-wafer carrier arm controller;
The 1620-wafer carrier arm;
1721-responds to light source;
The 1722-sensitive detector;
1723-rotating suction disc coating sucker;
The 1725-wafer;
1727-induction light signal;
1803-rotation coating sucker;
The 1805-wafer;
The 1820-wafer carrier arm;
The 1821-sensitive detector;
1830-rotation coating module;
1900,1910,1920,1930,1940,1950-sensed position;
1905,1925-wafer;
1921-responds to light source;
The 1922-sensitive detector;
1923-rotation coating sucker;
The 1924-reflection unit;
1927-detector unit.
Embodiment
Some embodiment of the present invention, can be in the chapters and sections of following execution mode the collocation accompanying drawing be described, wherein only show some and be not whole embodiment.Yet various embodiments of the invention can have different kenels and should not be considered as limiting the present invention; But providing of these embodiment is for making disclosing of this specification satisfy the requirement of Patent Law.
See also Figure 11 A and Figure 11 B, show that respectively the crystal round fringes photoresist removes the schematic diagram of width symmetry whether ability.In ideal situation 1100, the center of wafer 1115 is aimed at the center of supporting seat 1105, and wherein supporting seat 1105 can be a rotatable coating sucker supporting seat.When the center of wafer 1115 with for example be the center of supporting seat 1105 of rotation coating sucker supporting seat on time, as shown in FIG., edge A, B, C, the D of symmetry roughly equate.Opposite, in the situation 1150 of reality, center common and supporting seat 1155, the center of wafer 1165 is misalignment.When the center of wafer 1165 was misalignment with the center of supporting seat 1155 usually, as shown in FIG., it was different that the excision of asymmetric photoresist edge causes excise along the limit width A, B, C, D at wafer 1165 edges.
Figure 12 shows the schematic diagram of a wafer carrier arm.This wafer carrier arm 1200 be one movably mechanical arm to transmit and to place on wafer to a supporting seat.This wafer carrier arm 1200 comprises that a base part 1220 is connected with a platform 1230 at a pedestal fixing point 1225 places.This wafer carrier arm 1200 also comprises an arm supporting seat 1240, is used for placing wafer in wafer being sent to a supporting seat process.This arm support seat 1240 comprises that wafer support pin 1201,1202,1203,1204 on the mechanical arm is in order to supporting wafer.
Figure 13 shows the schematic diagram of a supporting seat 1300.This supporting seat can be a rotation coating module, comprises that a rotatable folder sucker 1311, wafer support pin 1302, photoresist sprinkling arm 1303, a solution accumulator tank 1304, crystal round fringes uneven thickness photoresist remove (EBR) nozzle arm 1305, crystal round fringes uneven thickness photoresist (EBR) solution accumulator tank 1306 and liquid photoresist waste liquid tray 1307.This rotatable folder sucker 1311 is elements of rotation coating wafer, can rotation in the process that photoresist coating, crystal round fringes uneven thickness photoresist remove, cleaning is stain at the back side and the cup groove cleans.Wafer supports that pin 1302 is being sent to/supporting wafer in the process of wafer carrier arm.Photoresist sprays arm 1303 moving photoetching glue nozzle to precalculated positions.Solution accumulator tank 1304 is with photoresist and temporary transient lay down location when reducing photoresist use amount control (RRC) nozzle and not using.Has solution in the solution accumulator tank.The solution of evaporation can prevent that photoresist from hardening at nozzle tip.Crystal round fringes uneven thickness photoresist removes (EBR) arm 1305 and supports and crystal round fringes uneven thickness photoresist is removed (EBR) nozzle to move to a precalculated position.Temporary transient lay down location when crystal round fringes uneven thickness photoresist (EBR) solution accumulator tank does not use crystal round fringes uneven thickness photoresist (EBR) nozzle.Liquid photoresist waste liquid tray 1307 is accepted the photoresist that is thrown away by crystal column surface because of centrifugal force in the process of photoresist coating.
Figure 14 shows that a wafer carrier arm supports the generalized section of pin width and wafer width size.Wafer 1405 is positioned over wafer transfer robot arm and supports on the pin 1401,1402.The diameter D1 of wafer is less than the distance B 2 of mechanical arm support pin, and its representative can be put wafer as for any place that supports between mechanical arm between the pin, comprises an asymmetric position.In some technology, the position of wafer can be supported between the pin at mechanical arm to have ± error space of 0.3mm.
Figure 15 shows to adjust the technology 1500 that wafer places rotation coating sucker position.In step 1501, extract a wafer by a wafer transfer robot arm in the unit from waiting for.Because wafer is positioned over the position cause devious on the wafer support pin 1302 of transfer robot arm, the center of wafer is not aim at the center of wafer carrier arm supporting seat.In step 1502, this wafer carrier arm is sent to a supporting seat with wafer.In step 1503, determine the position of this wafer.This step can comprise the position that determines crystal round fringes and the center that determines wafer according to the information of crystal round fringes position.In step 1504, adjust the crystal circle center position and make the center of wafer aim at the center of wafer transfer robot arm supporting seat.The position of this wafer is adjusted by moving slightly on X and Y-axis according to wafer position information.In step 1505, after wafer is placed on the rotatable folder sucker module wafer carrier arm is removed.In step 1506, after rotatable folder sucker module vacuumized to adsorb wafer, begin again rotatable folder sucker is rotated.In step 1507, carry out photoresist coating and crystal round fringes photoresist in uneven thickness when rotated and remove (EBR) technology.At last in step 1508, rotatable sucker stop the rotation the back use wafer carrier arm with wafer since then the supporting seat of rotatable sucker module shift out.
Figure 16 shows that adjusting wafer places rotation coating sucker position system 1600 control schematic diagram suckers.This system comprises that a wafer position calculator 1613 can link up with a memory storage element 1615.This wafer position calculator 1613 also can be linked up with a wafer carrier arm controller 1617.This wafer position calculator 1613 also can be linked up with a sensitive detector 1603.And this wafer carrier arm controller 1617 can be linked up with a wafer carrier arm controller 1620.In one embodiment, induction light source 1605 and sensitive detector 1603 are elements separately, but in other embodiment, induction light source 1605 and sensitive detector 1603 can be placed in the same sensing unit 1601, and collocation reflecting element (not shown) is to determine the positional information of wafer.In alternate embodiment, wafer position calculator 1613, memory storage element 1615 and wafer carrier arm controller 1617 are elements separately, but in other embodiment, they can be placed in the same control unit 1611.In addition, sensing unit 1601 and control unit 1611 also can be placed in the same casing.
This sensitive detector 1603 is used for detecting the positional information of wafer and provides this information to wafer position calculator 1613.This wafer position calculator 1613 is used for calculating desirable wafer position and provides this information to wafer carrier arm controller 1617.This wafer carrier arm controller 1617 is adjusted its position wafer is placed on the appropriate location of the supporting seat of rotatable sucker module according to desirable wafer position in order to indicate wafer carrier arm 1620.
This wafer position calculator 1613 can the self-induction detector 1603 receives the positional information of wafers and determines the position of wafer according to this information.This wafer position calculator 1613 also can be remembered the central shaft relative position information that takes out the supporting seat of rotatable sucker module in the storage unit 1615 certainly.This wafer position calculator 1613 can provide desirable wafer position information to wafer carrier arm controller 1617 in the mode of two-dimentional adjustment information.This two-dimentional adjustment information can comprise (X
0, Y
0)-(X
1, Y
1), (X wherein
0, Y
0) represent the two-dimensional coordinate of the central shaft of wafer position, and (X
1, Y
1) two-dimensional coordinate of central shaft of the rotatable sucker supporting seat of representative.
Be used for calculating desirable wafer position and provide this information to wafer carrier arm controller 1617.This wafer carrier arm controller 1617 is adjusted its position wafer is placed on the appropriate location of the supporting seat of rotatable sucker module according to desirable wafer position in order to indicate wafer carrier arm 1620.
Figure 17 show with wafer 1725 be placed on before the system that adjusts the position of wafer on the supporting seat 1723 of rotatable sucker module 1700 and after 1750 schematic diagram.1700 and afterwards 1750 schematic diagram both comprises side-looking 1705 and the vertical view 1710 of this device before.
This device comprises one or more induction light sources 1721 and one or more sensitive detector 1722.This sensitive detector 1722 decides wafer position information by the induction light signal 1727 that self-induction light source 1721 transmits.This sensitive detector 1722 is linked up with wafer position calculator (not shown), and the wafer position information that receives according to self-induction detector 1722 of this wafer position calculator position of calculating wafer.In one embodiment, the wafer position calculator calculates distance B
X1, D
X2, D
Y1, D
Y2To determine wafer position information.D
X1, D
X2The width size of covering light source to wafer for the directions X sensitive detector please, D
Y1, D
Y2For the Y-direction sensitive detector to the width size that wafer covers light source, work as D
X1With D
X2Represent wafer and supporting seat central shaft when unequal in directions X misalignment still, work as D
Y1With D
Y2Represent wafer and supporting seat central shaft when unequal in Y-direction misalignment still, wafer carrier arm is adjusted then up to D
X1=D
X2And D
Y1=D
Y2, it represents the central shaft coordinate (X of wafer 1725
0, Y
0) with the central shaft coordinate (X of supporting seat 1723
1, Y
1) aim at.
This wafer position calculator calculates the wafer position of an expection according to the central shaft coordinate information of rotatable sucker.This device also can comprise wafer carrier arm and wafer carrier arm controller (not shown).Wafer carrier arm controller and wafer position calculator are linked up.The wafer carrier arm controller can be adjusted the relative position between wafer 1725 and the supporting seat 1723.This wafer carrier arm controller also can via with this arm on X and Y-direction minute movement and with the central shaft coordinate (X of wafer 1725
0, Y
0) with the central shaft coordinate (X of supporting seat 1723
1, Y
1) aim at.The wafer position calculator provides the wafer position information of desiring to the wafer carrier arm controller.Therefore, the wafer position information of desiring can comprise the wafer carrier arm position adjustment according to the desire wafer position.In case after the adjustment of wafer carrier arm position, the central shaft coordinate (X of wafer 1725
0, Y
0) then can with the central shaft coordinate (X of supporting seat 1723
1, Y
1) aim at shown in 1750 among the figure.
Figure 18 is that wafer is on the transfer robot arm and with respect to the position view sucker that rotates coating modular device 1800.This device 1800 comprises wafer carrier arm 1820 and rotary module 1830.This device 1800 comprises that also one or more sensitive detector 1821 are to aim at wafer 1805 with the supporting seat of rotatable sucker.
Figure 19 shows the example sensed position 1900,1910,1920,1930,1940 that installs among the 17th and 18 figure, 1950 schematic diagram.In the position 1900,1920,1930,1940, the position of induction light source is on the supporting seat of wafer 1905 and rotatable sucker 1923.In the position 1910,1950, the position of induction light source is under the supporting seat of wafer 1905 and rotatable sucker 1923.In the position 1920, the position of induction light source 1921 and sensitive detector 1922 is on the supporting seat of wafer 1905 and rotatable sucker 1923.
Therefore, in certain embodiments, the position of induction light source 1921 and sensitive detector 1922 is the opposite sides at the supporting seat of rotatable sucker 1923, and in other embodiment, induction light source 1921 all is on the supporting seat of wafer 1905 and rotatable sucker 1923 with the position of sensitive detector 1922.
In certain embodiments, induction light source and sensitive detector are to be placed among the detector unit 1927 (for example the position 1920).Can comprise also among these embodiment that a reflector element 1924 is placed on for supporting seat and detector unit 1927 opposite sides.This reflector element can be used for reflecting the induction light source and get back to two sensitive detector in the detector unit 1927.
In addition, can rely on the reflection characteristic at wafer 1925 back sides in certain embodiments.Induction light source 1921 can be positioned over the position that is lower than wafer 1925 with sensitive detector 1922 and can use the reflection characteristic at wafer 1925 back sides with the position of decision wafer 1925.
Though the present invention is described with reference to embodiment, the present invention is not subject to its detailed description.Substitute mode and revise pattern and advise in formerly describing, and other substitute modes and modification pattern will can be expected for those skilled in the art.Particularly, all have be same as in fact member of the present invention in conjunction with and reach the technical scheme of identical result in fact with the present invention, do not break away from spiritual category of the present invention.Therefore, all these substitute modes and revise pattern and all drop among the category that claim of the present invention and equivalent thereof define.
Claims (22)
1. place the device of a wafer on a supporting seat for one kind, it is characterized in that, comprise:
One transducer light source be positioned at this supporting seat near;
One sensitive detector is near this supporting seat;
Wherein this sensitive detector operation is with deciding wafer position information.
2. device according to claim 1, it is characterized in that, also comprise a wafer position calculator and communicate by letter with this sensitive detector, wherein this wafer position calculator this position of operating to calculate this wafer according to this wafer position information that receives from this sensitive detector.
3. device according to claim 2, wherein this wafer position calculator also operates to calculate the wafer position of an expection according to the coordinate information of this supporting seat.
4. device according to claim 3 is characterized in that, also comprises:
One wafer carrier arm; And
One wafer carrier arm controller is communicated by letter with this wafer position calculator, and wherein this wafer carrier arm controller function is used for adjusting the relative position of this wafer and this supporting seat.
5. device according to claim 4 is characterized in that, this wafer carrier arm controller function is used for adjusting this wafer carrier arm makes a centre coordinate of this wafer aim at a centre coordinate of this supporting seat.
6. device according to claim 4 is characterized in that, this wafer position calculator provides the wafer position of this expection to this wafer carrier arm controller.
7. device according to claim 6 is characterized in that, the wafer position of this expection comprises this wafer carrier arm and adjusted according to the wafer position of this expection.
8. device according to claim 1 is characterized in that, this induction light source and this sensitive detector are positioned at the opposite side of this supporting seat sucker.
9. device according to claim 1 is characterized in that, this induction light source and this sensitive detector are positioned at the same side of this supporting seat sucker.
10. device according to claim 1, it is characterized in that, this induction light source and this sensitive detector are placed in the single sensing unit, and also comprise a reflector element and be positioned at opposite side with relative this supporting seat of this single sensing unit, wherein this reflector element operation is used for reflecting the light that produced by this induction light source to this sensitive detector.
11. place the method for a wafer on a supporting seat for one kind, it is characterized in that, comprise:
Receive wafer position information from a sensitive detector;
Determine wafer position according to this wafer position information;
Calculate the wafer position of an expection according to the coordinate information of this supporting seat; And
Provide wafer position information to the wafer carrier arm controller function of this expection to be used for wafer position according to this expection to the relative position of adjusting this wafer and this supporting seat.
12. method according to claim 11 is characterized in that, also comprises:
One wafer carrier arm is mentioned this wafer;
This wafer carrier arm transmits this wafer to the top of this supporting seat; And
This wafer carrier arm is placed this wafer to this supporting seat.
13. method according to claim 12 is characterized in that, also comprises:
Place this wafer in this supporting seat;
An initial photoresist coating process;
Technology is soaked in side, an initial edge; And
This wafer is shifted out on this supporting seat.
14. method according to claim 11 is characterized in that, this position that a wafer position calculator operates to calculate this wafer according to this wafer position information that is received from this sensitive detector.
15. method according to claim 11 is characterized in that, the wafer position of calculating this expection comprises the expection coordinate of a central shaft that determines this wafer.
16. method according to claim 11 is characterized in that, provides the wafer position information of this expection to comprise two-dimentional adjustment information is provided.
17. method according to claim 16 is characterized in that, this two dimension adjustment information comprises (X
0, Y
0)-(X
1, Y
1), (X wherein
0, Y
0) represent the two-dimensional coordinate of the central shaft of wafer position, and (X
1, Y
1) represent the two-dimensional coordinate of the central shaft of this supporting seat.
18. place the system of a wafer on a supporting seat for one kind, it is characterized in that this system comprises wafer position that wafer position calculator operation is used for calculating the wafer position of an expection and this expection is provided to a wafer carrier arm controller.
19. system according to claim 18, it is characterized in that, also comprise a wafer carrier arm controller and communicate by letter with this wafer position calculator, wherein this wafer carrier arm controller is used for wafer position according to this expection provides the instruction of the relative position of adjusting this wafer and this supporting seat.
20. system according to claim 19 is characterized in that, also comprises:
One induction light source;
One sensitive detector;
Wherein this sensitive detector is communicated by letter with this wafer position calculator, and wherein this sensitive detector provides wafer position information to this wafer position calculator.
21. system according to claim 18, it is characterized in that, this wafer position calculator is according to this wafer position information that receives from this sensitive detector, and wherein this wafer position calculator determines this position of this wafer according to this wafer position information, and the wafer position information that wherein offers this expection of this wafer position calculator comprises two-dimentional adjustment information.
22. system according to claim 21 is characterized in that, this two dimension adjustment information comprises (X
0, Y
0)-(X
1, Y
1), (X wherein
0, Y
0) represent the two-dimensional coordinate of the central shaft of wafer position, and (X
1, Y
1) represent the two-dimensional coordinate of the central shaft of this supporting seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100102650A CN103208449A (en) | 2012-01-13 | 2012-01-13 | Device, method and system for aligning wafer on support seat |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100102650A CN103208449A (en) | 2012-01-13 | 2012-01-13 | Device, method and system for aligning wafer on support seat |
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| Publication Number | Publication Date |
|---|---|
| CN103208449A true CN103208449A (en) | 2013-07-17 |
Family
ID=48755630
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100102650A Pending CN103208449A (en) | 2012-01-13 | 2012-01-13 | Device, method and system for aligning wafer on support seat |
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| Country | Link |
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| CN (1) | CN103208449A (en) |
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