CN105789105A - Auxiliary tool used for realizing manual positioning of wafer through lithography gluing technology and positioning method thereof - Google Patents
Auxiliary tool used for realizing manual positioning of wafer through lithography gluing technology and positioning method thereof Download PDFInfo
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- CN105789105A CN105789105A CN201610192007.7A CN201610192007A CN105789105A CN 105789105 A CN105789105 A CN 105789105A CN 201610192007 A CN201610192007 A CN 201610192007A CN 105789105 A CN105789105 A CN 105789105A
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- slide holder
- wafer
- aid
- cambered surface
- table top
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
Abstract
The invention provides an auxiliary tool used for realizing manual positioning of a wafer through the lithography gluing technology and a positioning method thereof. A repeated aligning adjustment and confirmation process required by manual alignment in the gluing technology process can be omitted. The auxiliary tool comprises a bending structure, the bending structure mainly comprises a basic vertical face, a basic table top and a vertical limit cambered surface which are sequentially bent, the integral horizontal projection shape from the basic vertical face to the vertical limit cambered surface is a fan ring, a horizontal distance from the vertical limit cambered surface to the fan ring center is equal to the radius of the wafer, shapes and dimensions of the basic vertical face and the basic table top can satisfy that the basic vertical face and the basic table top can respectively laminate with a slide holder supporting part and a slide holder lower surface, and the limit cambered surface is in adaption contact with an edge of the wafer.
Description
Technical field
The present invention relates to a kind of wafer positioner.
Background technology
Photoetching coating technique is to be placed on by wafer on the slide holder of photoetching glue spreader, and liquid photoresist drops in crystal circle center, and slide holder drives wafer high speed rotating, and photoresist relies on centrifugal force outward expansion, the technique being uniformly coated on crystal column surface.Crystal circle center and slide holder center must highly overlap, to guarantee the photoresist thickness uniformity of crystal column surface, it does not have phenomenons such as haloing comets tails, thus ensureing that figure can accurately shift.
At present, when the wafer of 6 cun and 6 cun diameter above of operation, photoetching glue spreader is both designed as full-automatic gluing, mainly through the technological means such as coordinate or infrared detection, completed crystal circle center and the alignment at slide holder center by mechanical arm, operation 2 cun, 3 cun, 4 cun of diameter wafers time, for cost consideration, photoetching glue spreader is both designed as manual operation, crystal circle center and slide holder center needs manual alignment.In production process when adopting manual alignment crystal circle center and slide holder center, it is difficult to ensure that being completely superposed of Liang Ge center, thus have impact on the uniformity of coated photoresist thickness, technology stability cannot ensure, and manual alignment process needs repeatedly to adjust wafer position, being confirmed whether alignment, consuming time relatively of a specified duration, work efficiency is relatively low.
Summary of the invention
The present invention devises a positioning auxiliaring tool, and eliminating manual alignment in coating technique process needs the process that alignment adjusts and confirms repeatedly.
Technical scheme is as follows:
A kind of aid manualling locate wafer for photoetching coating technique, this aid has bending structure；Described bending structure is mainly bent successively constituted by a basic facade, a basic table top and a vertical spacing cambered surface, wherein, being fan annular from the integral level projection of shape of basis facade to vertical spacing cambered surface, vertical spacing cambered surface is equal with the radius of described wafer to the horizontal range at Shan Huan center；The shape and size of described basis facade and basis table top meet fits with slide holder support portion and slide holder lower surface respectively simultaneously, and crystal round fringes adaptation is contacted by spacing cambered surface simultaneously.
Here " facade " and " table top " is not definitely limited to straight face；Such as, if the support platform lower surface of slide holder is special irregular, then the face that the present invention corresponding " table top " just should be designed as with its male-female engagement fits both meeting.
On the basis of above scheme, the present invention has also made following important optimization further:
The agent structure of this aid is the step of two-stage fan annular, wherein the shape and size of the facade of the facade of footing step and table top and secondary step meet respectively simultaneously with slide holder support portion and slide holder lower surface and the laminating of slide holder side, and the table top of secondary step is without departing from the work surface of slide holder；Described vertical spacing cambered surface is arranged at the table top outward flange of secondary step.
Here secondary step can also omit, and directly the facade of footing step and slide holder tray supporting devices is close to, and vertical spacing cambered surface is to the difference that horizontal range is wafer radius and tray support radius of footing step facade.
The table top of secondary step is lower than the work surface 1～2mm of slide holder.
Also form third level step based on described vertical spacing cambered surface, and the table top outward flange of third level step is provided with projection, in order to operation of manually taking.
Corresponding wafer positioning and mounting structure (installation in position fixing process coordinates), including slide holder, wafer and above-mentioned aid, this aid is close to slide holder support portion and slide holder lower surface, spacing cambered surface in aid is concentric with slide holder, spacing cambered surface is equal with described wafer radius to the horizontal range at slide holder center so that crystal round fringes adaptation is contacted by spacing cambered surface.
A kind of method adopting above-mentioned aid to realize photoetching coating technique manual positioning wafer, comprises the following steps:
1) described aid is close to the outline corresponding site of slide holder；
2) wafer is placed on slide holder, makes the spacing cambered surface of described aid fully in contact with crystal round fringes；
3) wafer vacuum is adsorbed on slide holder upper surface by option program, removes described aid；
4) option program is by slide holder automatic rotation, observes wafer in rotary course, if there is the out-of-alignment phenomenon of crystal circle center and slide holder center；
5), after confirming that crystal circle center and slide holder center alignment are normally, stop the rotation of slide holder, start photoresist and drip the glue technical process at crystal column surface.
The technique effect of the present invention is as follows:
Designing this aid according to slide holder and wafer size, only need to once be directed at and once confirm, can completing crystal circle center and the alignment at slide holder center, it is ensured that the uniformity that photoresist is good, dimension of picture is accurately shifted, and improves yield rate.
This aid makes simple, easy to use, it is not necessary to change equipment design, both ensure that the stability of photoetching coating technique, and had shortened again the time-consuming process that manual alignment repeatedly adjusts and confirms, improve production efficiency.
Accompanying drawing explanation
Fig. 1 is the basic structure schematic diagram of slide holder.
Fig. 2, Fig. 3 are the first embodiment of the present invention；Wherein, Fig. 3 is the section in Fig. 2 along A～B direction；
Fig. 4 is the schematic diagram that wafer installs position fixing process.
Fig. 5, Fig. 6 are the second embodiment of the present invention；Wherein, Fig. 6 is the section in Fig. 5 along A～B direction.
Description of reference numerals:
11-slide holder support portion；12-slide holder lower surface；13-slide holder upper surface；14-slide holder side；
Size 1 is the diameter of slide holder support portion；Size 2 is the size that the diameter of slide holder supporting part deducts support portion diameter；Size 3 is the thickness of slide holder supporting part；Size 4 is the radius of wafer；
Size 5 is the thickness that size 3 deducts 1～2mm, and when being used for ensureing wafer alignment, positioning auxiliaring tool will not touch wafer rear and cause wafer tilt (embodiment one)；
Size 6 is aligning surface height, and this size is greater than size 3, it is ensured that on time, and the spacing cambered surface adaptation that crystal round fringes can be vertical with this contacts (embodiment two).
Detailed description of the invention
Embodiment one:
As shown in Figure 2,3, the agent structure of positioning auxiliaring tool is the step of two-stage fan annular, wherein the shape and size of the facade of the facade of footing step and table top and secondary step meet respectively simultaneously with slide holder support portion and slide holder lower surface and the laminating of slide holder side, and the table top of secondary step is without departing from the work surface of slide holder；The table top outward flange of secondary step arranges vertical spacing cambered surface, also forms third level step at spacing cambered surface top, and the table top outward flange of third level step is provided with projection, in order to operation of manually taking.Concrete positioning action step is as follows:
1. first positioning auxiliaring tool and slide holder are fitted: the facade of footing step and table top and the secondary facade of step being fitted successively with the outline of slide holder, the table top of secondary step is lower than the work surface of slide holder；
2. being placed on slide holder by wafer, crystal round fringes is close to the spacing cambered surface of positioning auxiliaring tool simultaneously；
3. wafer vacuum is adsorbed on slide holder surface by option program, removes positioning auxiliaring tool；
4. option program is by slide holder automatic rotation, observes wafer in rotary course, if there is the out-of-alignment phenomenon of crystal circle center and slide holder center；
5., after confirming that crystal circle center and slide holder center alignment are normally, stop the rotation of slide holder, start photoresist and drip the glue technical process at crystal column surface.
Embodiment two:
As shown in Figure 5, Figure 6, this embodiment mainly eliminates second level step compared to embodiment one, only considers positioning auxiliaring tool and slide holder support portion and the laminating of slide holder lower surface, is left out fitting with slide holder side.Concrete positioning action step is as follows:
1. first positioning auxiliaring tool and slide holder are fitted: the outline of the facade of footing step and table top and slide holder is fitted successively；
2. being placed on slide holder by wafer, crystal round fringes is close to the spacing cambered surface of positioning auxiliaring tool simultaneously；
3. wafer vacuum is adsorbed on slide holder surface by option program, removes positioning auxiliaring tool；
4. option program is by slide holder automatic rotation, observes wafer in rotary course, if there is the out-of-alignment phenomenon of crystal circle center and slide holder center；
5., after confirming that crystal circle center and slide holder center alignment are normally, stop the rotation of slide holder, start photoresist and drip the glue technical process at crystal column surface.
Claims (6)
1. the aid for photoetching coating technique manual positioning wafer, it is characterised in that: this aid has bending structure；Described bending structure is mainly bent successively constituted by a basic facade, a basic table top and a vertical spacing cambered surface, wherein, being fan annular from the integral level projection of shape of basis facade to vertical spacing cambered surface, vertical spacing cambered surface is equal with the radius of described wafer to the horizontal range at Shan Huan center；The shape and size of described basis facade and basis table top meet fits with slide holder support portion and slide holder lower surface respectively simultaneously, and crystal round fringes adaptation is contacted by spacing cambered surface simultaneously.
2. the aid manualling locate wafer for photoetching coating technique according to claim 1, it is characterized in that: the agent structure of this aid is the step of two-stage fan annular, wherein the shape and size of the facade of the facade of footing step and table top and secondary step meet respectively simultaneously with slide holder support portion and slide holder lower surface and the laminating of slide holder side, and the table top of secondary step is without departing from the work surface of slide holder；Described vertical spacing cambered surface is arranged at the table top outward flange of secondary step.
3. the aid manualling locate wafer for photoetching coating technique according to claim 2, it is characterised in that: the table top of secondary step is lower than the work surface 1～2mm of slide holder.
4. the aid manualling locate wafer for photoetching coating technique according to claim 2, it is characterized in that: also form third level step based on described vertical spacing cambered surface, and the table top outward flange of third level step is provided with projection, in order to operation of manually taking.
5. the wafer positioning and mounting structure for photoetching coating technique, including slide holder and wafer, it is characterized in that: also include the aid described in claim 1, this aid is close to slide holder support portion and slide holder lower surface, spacing cambered surface in aid is concentric with slide holder, spacing cambered surface is equal with described wafer radius to the horizontal range at slide holder center so that crystal round fringes adaptation is contacted by spacing cambered surface.
6. the method adopting aid described in claim 1 to realize photoetching coating technique manual positioning wafer, comprises the following steps:
1) described aid is close to the outline corresponding site of slide holder；
2) wafer is placed on slide holder, makes the spacing cambered surface of described aid fully in contact with crystal round fringes；
3) wafer vacuum is adsorbed on slide holder upper surface by option program, removes described aid；
4) option program is by slide holder automatic rotation, observes wafer in rotary course, if there is the out-of-alignment phenomenon of crystal circle center and slide holder center；
5), after confirming that crystal circle center and slide holder center alignment are normally, stop the rotation of slide holder, start photoresist and drip the glue technical process at crystal column surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610192007.7A CN105789105B (en) | 2016-03-30 | 2016-03-30 | A kind of auxiliary tool and its localization method for photoetching coating technique manual positioning wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610192007.7A CN105789105B (en) | 2016-03-30 | 2016-03-30 | A kind of auxiliary tool and its localization method for photoetching coating technique manual positioning wafer |
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| CN105789105A true CN105789105A (en) | 2016-07-20 |
| CN105789105B CN105789105B (en) | 2018-05-08 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828357A (en) * | 2019-11-21 | 2020-02-21 | 江苏索尔思通信科技有限公司 | Manual glazing and film feeding carrier |
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| CN201084721Y (en) * | 2007-07-20 | 2008-07-09 | 中芯国际集成电路制造(上海)有限公司 | A wafer positioning mechanism |
| CN101807537A (en) * | 2009-02-12 | 2010-08-18 | 株式会社迪思科 | Position registration mechanism, processing unit (plant) and position alignment method |
| US20110131803A1 (en) * | 2009-12-03 | 2011-06-09 | Chin-Chi Yang | Method of manufacturing a hollow surface mount type electronic component |
| CN102294314A (en) * | 2010-06-25 | 2011-12-28 | 上海微电子装备有限公司 | Wafer spreading machine and method |
| CN205508799U (en) * | 2016-03-30 | 2016-08-24 | 西安立芯光电科技有限公司 | A appurtenance for photoetching glue coating process manual positioning wafer and mounting structure thereof |
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2016
- 2016-03-30 CN CN201610192007.7A patent/CN105789105B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201084721Y (en) * | 2007-07-20 | 2008-07-09 | 中芯国际集成电路制造(上海)有限公司 | A wafer positioning mechanism |
| CN101807537A (en) * | 2009-02-12 | 2010-08-18 | 株式会社迪思科 | Position registration mechanism, processing unit (plant) and position alignment method |
| US20110131803A1 (en) * | 2009-12-03 | 2011-06-09 | Chin-Chi Yang | Method of manufacturing a hollow surface mount type electronic component |
| CN102294314A (en) * | 2010-06-25 | 2011-12-28 | 上海微电子装备有限公司 | Wafer spreading machine and method |
| CN205508799U (en) * | 2016-03-30 | 2016-08-24 | 西安立芯光电科技有限公司 | A appurtenance for photoetching glue coating process manual positioning wafer and mounting structure thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110828357A (en) * | 2019-11-21 | 2020-02-21 | 江苏索尔思通信科技有限公司 | Manual glazing and film feeding carrier |
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