CN101769878A - Array tester, method for measuring a point of substrate of the same and method for measuring a position coordinate photographed by a camera assembly - Google Patents
Array tester, method for measuring a point of substrate of the same and method for measuring a position coordinate photographed by a camera assembly Download PDFInfo
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- CN101769878A CN101769878A CN200910250213A CN200910250213A CN101769878A CN 101769878 A CN101769878 A CN 101769878A CN 200910250213 A CN200910250213 A CN 200910250213A CN 200910250213 A CN200910250213 A CN 200910250213A CN 101769878 A CN101769878 A CN 101769878A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2825—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere in household appliances or professional audio/video equipment
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2836—Fault-finding or characterising
- G01R31/2837—Characterising or performance testing, e.g. of frequency response
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Abstract
The invention discloses an array tester, method for measuring a point of substrate of the same and method for measuring a position coordinate photographed by a camera assembly. The array tester comprises a test portion for supporting the substrate to be tested. At least one modulation head is arranged be adjacent to the test portion to detect a defect portion of the substrate arranged on the test portion. The modulation head comprises a fixation block. A camera assembly is coupled with the fixation block and a reference camera and at least one adjacent camera are arranged on the fixation block in preset interval. A cordinate measurement modulation block is detachably coupled with the fixation block between the camera assembly and the substrate. The coordinate measurement modulation block comprises a position indicating portion corresponding with the focus of the camera formed by camera assemblies. The reference position mark photographed by a reference camera and at least one adjacent position mark photographed by the adjacent camera are formed on the position indicating portion.
Description
The cross reference of related application
The application requires the rights and interests of the korean patent application submitted on Dec 30th, 2008 10-2008-0137136 number according to 35U.S.C § 119 (a), and its all disclosures are incorporated by reference to satisfy various purposes.
Technical field
Explanation hereinafter relates to a kind of array detecting device, measure the method that the point of substrate of array detecting device puts and measure method by the captured point coordinate of camera assembly, and more specifically, relate to array detecting device, measure the method that the point of substrate of array detecting device puts and measure method, can utilize a plurality of cameras to detect the electric defective of the electrode that forms on the substrates by the captured point coordinate of camera assembly with a plurality of cameras.
Background technology
Electro-optical device is to utilize the luminous device of electric energy that receives, and comprises for example LCD (LCD), Plasmia indicating panel (PDP) etc.
Generally speaking, such electro-optic device has electroded substrate.For example, thin film transistor (TFT) (TFT)-LCD comprises the TFT substrate, in the face of the TFT substrate and have colored filter and the colored filter substrate of public electrode, the liquid crystal of inserting between TFT substrate and colored filter substrate, and back light unit.
Utilize array detecting device to detect the defective of the electrode that forms on the substrate.Array detecting device has at least one modulation head.Modulation head moves at least one direction with detection defective electrode, and has modulation block and camera.
Modulation block comprises the modulator electrode that forms electric field with respect to the electrode of substrate, and the changes in material properties part that changes material behavior according to electric field intensity.Modulation block is carried out array test on the substrate predetermined portions, move on to next test position then and test with repeat array.
Camera is arranged to relative with substrate, and modulation block is inserted between them, like this to take modulation block and substrate.Because the material behavior of change in physical properties part changes according to electric field, so if having the pixel of defective electrode is photographed by the pixel of camera, the pixel of then taking the defectiveness electrode pixel demonstrates with other pixels of camera different.In this, can find the position of defective electrode according to the coordinate of camera pixel.
But, need camera be installed in each modulation head, therefore this limited the visual field size (FOV) of camera.
Particularly,,, need the camera of very big FOV, but realize that such camera is infeasible for the defective electrode of fast detecting display apparatus substrate at the display size of continuous increase.
In addition, big like this camera needs high power consumption, has in fact increased the manufacturing cost of camera.
Summary of the invention
Therefore, on the one hand, provide a kind of array detecting device, wherein according to the each FOV that takes the camera in a zone of the size adjustment of display device, thus the driving power and the manufacturing cost of reduction array detecting device.
In addition, on the other hand, provide the measuring method of the some position on a kind of substrate of array detecting device, wherein accurately measure the position of defective electrode from the substrate with immediate mode.
In addition, provide a kind of measuring method of the coordinate by the captured point of camera assembly, a plurality of cameras of providing in camera assembly position with the accurate measuring target point of immediate mode can be provided.
A general aspect is, a kind of array detecting device is provided, and it comprises part of detecting and at least one modulation head that supports substrate to be tested, and modulation head and part of detecting vicinity place the defect part of the substrate on the part of detecting with detection.
Modulation head comprises fixed block; Be connected to the camera assembly of fixed block, be provided at predetermined intervals accurate camera of base and at least one adjacent camera on the fixed block; And the measurement of coordinates modulation block, it removably is connected to the fixed block between camera assembly and the substrate, and provides the position indicating device corresponding with each focal length of the camera that constitutes camera assembly.At least one the close position mark that on this position indicating device, forms reference position mark taking by reference camera and will take by adjacent camera.
In another general aspect, the array detecting device that provides a kind of utilization to have claim 1 structure is measured the method that point of substrate is put.This method is carried out the measurement that point of substrate is put as follows.At first, obtain the pixel coordinate of adjacent camera according to the benchmark pixel of reference camera.Adjacent camera on first positive dirction away from reference camera.Afterwards, obtain the coordinate of benchmark pixel according to default substrate reference points.Take the coordinate of the pixel of substrate point according to benchmark pixel being used to of obtaining, add the coordinate of the benchmark pixel that obtains according to default reference point.
In another general aspect, the measuring method of equipment that a kind of utilization has camera assembly, the captured position of intended pixel by adjacent camera is provided, and this camera assembly comprises a reference camera and at least one adjacent camera and finishes at least and moves horizontally.This method is carried out as follows.The reference position mark that to be taken by reference camera is set, and the close position mark.The close position mark will by contiguous camera and on first positive dirction with actual interval away from the reference position mark.Reference position mark and close position mark are taken with reference camera and adjacent camera respectively.Adjacent one another are and do not have separated from one another or when not overlapping each other, obtain base interval when the visual field of camera (FOV), it equals the reference position mark and takes pixel and close position mark and take distance between the pixel.Utilize actual interval and base interval to obtain intended pixel coordinate based on the adjacent camera of the benchmark pixel of reference camera.
According to the present invention, owing to utilize a plurality of cameras to obtain substrate image simultaneously, can once take large-area substrate, compare with conventional system, drive the driving voltage of whole camera assembly and the manufacturing cost of camera assembly and be minimized.
In addition, only the coordinate of the benchmark pixel of the reference camera that obtains according to the predetermined fiducial of substrate by instruction just can obtain the pixel coordinate of adjacent camera, so can measure the precalculated position fast.
In addition, because the intended pixel of adjacent camera does not need to be instructed (teaching) according to the predetermined point of substrate, the mistake that causes because of the instruction operation reduces, and can accurately obtain the position of the intended pixel of adjacent camera.
By detailed description hereinafter, other features are conspicuous to those skilled in the art, and these descriptions disclose one exemplary embodiment of the present invention with accompanying drawing.
Description of drawings
Fig. 1 is the perspective schematic view of example exemplary array proving installation;
Fig. 2 is the backplan in the signal camera assembly shown in Figure 1 visual field (FOV);
Fig. 3 to 8 is concept maps that example is measured the predetermined point coordinate method of being taken by camera assembly, wherein, the process of actual interval between the pixel of the pixel of the reference camera of the view signal acquisition shooting reference position mark of Fig. 3 and the adjacent camera of shooting close position mark, the process of base interval between the pixel that the view signal of Fig. 4 obtains to take the pixel of reference position mark and take the close position mark, the view signal of Fig. 5 obtains the process of first off-set value by the difference between calculating base interval and the actual interval, the view signal of Fig. 6 obtains the process of second off-set value between reference camera and the adjacent camera, the view signal of Fig. 7 is according to the process of the coordinate of the intended pixel of the benchmark pixel acquisition adjacent camera of reference camera, and the view signal of Fig. 8 is according to the process of the coordinate of the intended pixel of the reference point acquisition adjacent camera of substrate; And
Fig. 9 is the process that signal obtains off-set value, wherein uses a plurality of adjacent camera.
Institute's drawings attached and describe in detail is represented element, feature and structure with identical reference number, and for clear convenient for the purpose of, some size of component or the amplification of ratio process.
Embodiment
The following detailed description is with helping method, equipment and/or the system that reader's complete understanding is introduced here.Here various variations, modification and the equivalent of the system of Jie Shaoing, equipment and/or method also can be expected concerning the one skilled in the art.For clear more and convenient, omitted description to known function and structure.
Fig. 1 is the perspective schematic view of example exemplary array proving installation.These array detecting device 10 expressions are used for the device of the electric defective of electrode of test base 2.
Substrate 2 can be the panel that is generally used for panel display board, for example the TFT panel of TFT-LCD.
Loading section 20 has at least two load plate 22.Load plate 22 is arranged to parallel to each other, but is separated from each other and supports substrate to be tested 2.By chuck 70 substrate 2 is transported to part of detecting 30.
Part of detecting 30 is arranged on a side of loading section 20.Be installed on the part of detecting 30 and accept electric defect test along the substrate 2 of load plate 22 carrying.Part of detecting 30 has test board 32 that installs and fixes substrate 2 on it and the part 38 of exerting pressure that voltage is provided to the electrode of substrate 2.
Fixed block 110 is connected to modulation head 100, and along moving with part of detecting 30 directions stand 60 executive levels arranged in a crossed manner.
Measurement of coordinates modulation block 130 is removably to be connected to fixed block 110.Before array test began, measurement of coordinates modulation block 130 was measured the coordinate of adjacent camera 123 pixels according to the benchmark pixel of reference camera 121.That is to say that the pixel coordinate of adjacent camera 123 is not to obtain based on different benchmark pixel, but obtains according to single benchmark pixel.Therefore, can obtain the coordinate corresponding very soon with the pixel of adjacent camera.
Measurement of coordinates modulation block 130 has the position indicating device 140 with the corresponding setting of camera focal length.
Fig. 2 is the backplan in the signal camera assembly shown in Figure 1 visual field (FOV).As shown in Figure 2, on position indicating device 140, form reference position mark 141 to be taken pictures in the FOV of reference camera, and on position indicating device 140, form close position mark 143 to be taken pictures in the FOV of contiguous camera with predetermined space G2 with predetermined space G1.
In addition, form a plurality of length marks 145 on position indicating device 140, each in a plurality of length marks 145 and reference position mark 141 and the close position mark 143 is separated with predetermined space k.The length mark 145 of in each of the FOV of the FOV of reference camera and contiguous camera, taking pictures.To describe the function of reference position mark 141, close position mark 143 and length mark 145 afterwards in detail.
Again with reference to figure 1, obtain to constitute the camera 121 and 123 coordinate of camera assembly 120 according to the benchmark pixel of reference camera 121 after, measurement of coordinates modulation block 130 is separated from fixed block 110.Then, the test modulation block is connected to fixed block to carry out array test.
The test modulation block connects with fixed block moving up and down, and forms electric field with the electrode of substrate.Material behavior, for example brightness and/or saturation degree change according to electric field intensity, can detect the electric defect part of substrate like this.
That is to say, owing to obtained location of pixels based on the camera of the benchmark pixel of reference camera by measurement of coordinates modulation block 130, so have only when away from the instruction of the benchmark pixel of the reference point of substrate 2, could obtain to take the actual coordinate of the pixel of defective electrode based on the reference point of substrate 2 through the test modulation block.
Unloading part 40 is positioned at a side of part of detecting 30, makes like this be moved to the outside through the substrate of testing 2 after by unloading part 40.Unloading part 40 have substrate 2 is installed on it unload support plate 42, unload support plate 42 and be used for when substrate 2 is floated with predetermined space carrying substrate 2.
Can and unload unloading of part 40 on the load plate 22 of loading section 20 and form pore 24 (see figure 1)s on the support plate 42 respectively, substrate is exerted pressure floats substrate 2.
Yet the configuration of array detecting device is not limited to embodiment illustrated in fig. 1.According to another embodiment, substrate 2 can be fixed on the securing supports and test module 50 moves along X-axis and Y direction, whether there to be the defective electrode in the test base 2.According to another embodiment, can limit moving horizontally of test module, and substrate 2 can move along X-axis and Y direction.
Hereinafter, the method for the some position of substrate is measured in following execution.At first, obtain the pixel coordinate of adjacent camera 123 based on the benchmark pixel of reference camera 121.To be added to according to the benchmark pixel coordinate that the preset reference point of substrate obtains the predetermined point that is used to take substrate and the pixel coordinate that obtains based on benchmark pixel P1, thus the coordinate in precalculated position obtained based on the reference point of substrate.
Like this, the pixel coordinate of all cameras of formation camera assembly is based on the benchmark pixel P1 definition of reference camera.Therefore, the camera that constitutes camera assembly has single FOV, that is, camera assembly is as the single camera that has with the measure-alike FOV of total FOV of camera.
In this case, if obtain the coordinates of reference points of benchmark pixel P1, can obtain constituting the location of pixels of all cameras of camera assembly according to the reference point of substrate with respect to substrate.Therefore, do not need to consider one by one the position of all cameras with respect to substrate reference points.
Fig. 3 to 8 is concept maps of the coordinate measuring method of substrate predetermined point in the exemplary arrays proving installation.For illustration purposes, the described adjacent camera of this embodiment and reference camera along and corresponding first of X-axis separate, but following description can be applicable to along first and/or second separated a plurality of adjacent camera.
As shown in Figure 3, by the reference position mark 141 of taking pictures of reference camera 121 (see figure 1)s with FOV (F121), and by the close position mark 143 of taking pictures of adjacent camera 123 (see figure 1)s with FOV (123).Therefore, take the pixel P121 reference position mark of taking pictures, and take the pixel P123 close position mark of taking pictures by the close position mark of adjacent camera by the reference position mark of reference camera.In this case, the interval of predeterminable reference position mark 141 and close position mark 143.
As shown in Figs. 4-6, obtain the pixel coordinate of adjacent camera according to the benchmark pixel of reference camera.Afterwards, with reference to figure 4 to 6 and Fig. 1 the process that obtains the adjacent camera pixel coordinate according to benchmark pixel is described.
As shown in Figure 4,, do not have separated from one another or do not overlap each other, can obtain then that the reference position mark is taken pixel P121 and the neighbor point mark is taken between the pixel P123 along the first axial base interval L if the FOV of camera is adjacent one another are.Then, as shown in Figure 5, can obtain poor between base interval L and the actual interval G1.
Specifically, as shown in Figure 4, can obtain first distance L 1 between reference position mark shooting pixel P121 and the end pixel Pr1, end pixel Pr1 selects, is positioned at first positive dirction end from the interior pixel of FOV (F121); And, can obtain the adjacent position mark and take second distance L2 between pixel P123 and the end pixel Pr2, end pixel Pr2 be that the pixel in the FOV (F123) is selected, be positioned at along the negative direction end opposite with first positive dirction.Afterwards, first distance L 1 adds second distance L2, thereby obtains reference range L.
As shown in Figure 5, can obtain poor between base interval L and the actual interval G1, obtain the first axial first off-set value Os1 like this, thereby and determine whether the FOV (F121) of reference camera and the FOV (F123) of adjacent camera overlap each other, and definite FOV (F121) overlaps each other or degree separated from one another with FOV (F123).
Simultaneously, adjacent camera can depart from along second (representing with Y-axis among the figure) with respect to reference camera.As shown in Figure 6, obtain the second off-set value Os2.The second off-set value Os2 corresponding to adjacent camera with respect to the bias of reference camera along second.
, obtain and reference position mark the 3rd corresponding distance L 3 of distance of taking pictures between pixel P121 and the end pixel Pr3 for this reason, end pixel Pr3 be select from the interior pixel of FOV (F121), be positioned at second positive dirction end.Also obtain taking the 4th corresponding distance L 4 of distance between pixel P123 and the end pixel Pr4 with the close position mark, end pixel Pr4 be select from the interior pixel of FOV (F123), be positioned at second positive dirction end.Obtain difference between the 3rd distance L 3 and the 4th distance L 4 as the second off-set value Os2.
By using The above results,, can obtain the pixel coordinate of adjacent camera based on the benchmark pixel P1 of reference camera.
As shown in Figure 7, if the distance between benchmark pixel P1 and the end pixel Pr5 is L5, this end pixel Pr5 be that the pixel in the FOV (F123) is selected, be positioned at first positive dirction end, and the intended pixel coordinate of adjacent camera is a1 and b1, and then the coordinate of the intended pixel of the adjacent camera that obtains according to the benchmark pixel of reference camera is corresponding to L5+a1-Os1 and b1-Os2.
For example, the FOV (F121) that supposes reference camera overlaps with the FOV (F123) of adjacent camera part, and consequent first off-set value is that 10 and second off-set value is-2, and the distance between benchmark pixel P1 and the end pixel Pr5 is 200.
In this example, the coordinate of the intended pixel of adjacent camera is 50 and 50, and the coordinate of the intended pixel of the adjacent camera that obtains according to benchmark pixel P1 is corresponding to 200+50-10 and 50+2, promptly 240 and 52.
The coordinate of intended pixel can be converted to the actual range with benchmark pixel.Particularly, each coordinate figure of intended pixel multiply by the unit length of each pixel, thereby obtains the physical length of intended pixel.
The pixel of reference camera and the length in pixels of adjacent camera can in all sorts of ways and obtain.For example, if in the unit interval camera movement during follow shot mark at a predetermined velocity, obtain the displacement of camera.If this displacement divided by the pixel quantity of shot mark, can obtain the unit length of pixel.
Different with said method, also can obtain the length of pixel.As shown in Figure 2, on the zone of the position indicating device corresponding, form length mark 145 respectively, and in itself and reference position mark 141 and the close position mark 143 each is separated with reference camera and adjacent camera.In this case, if with distance between reference position mark 141 and the length mark 145 corresponding with reference camera divided by with in the pixel of taking reference position mark 141 with take pixel quantity between the pixel of the corresponding length mark 145 of reference camera, then can obtain the physical length of reference camera pixel.Similarly, if distance between close position mark 143 and the length mark 145 corresponding with adjacent camera divided by the pixel quantity between the pixel of the corresponding length mark 145 of the pixel of taking close position mark 143 and shooting and adjacent camera, then can be obtained the physical length of adjacent camera pixel.
Though do not illustrate in the drawings, replace the measurement of coordinates modulation block with the test modulation block, and carry out array test.Thereby can detect the position of defective electrode.
As shown in Figure 8, (a b) adds that (c, d), the coordinate of pixel Px is to be used for taking the point of substrate and to obtain according to benchmark pixel P1 for the coordinate of pixel Px to the coordinate of the benchmark pixel P1 of the reference camera that obtains according to the preset reference point P0 of substrate.Therefore, accurately measure the position of defect pixel from substrate with plain mode.
Because the pixel coordinate of adjacent camera is provided with according to benchmark pixel P1, thus only need modulation block to carry out such relevant teachings, promptly the coordinate of the benchmark pixel P1 that obtains about reference point P0 based on substrate (a, b).
According to the present invention,, also only need provide the instruction of the benchmark pixel of reference camera, and can obtain the coordinate of all pixels of adjacent camera in this case even place a large amount of cameras.That is to say, because need not carry out the instruction operation separately on each contiguous camera, so the mistake that is caused by instruction reduces and the shortening of array test time.
Simultaneously, said method may be used on not with reference camera but with second adjacent camera of the first adjacent camera direct neighbor.
As shown in Figure 9, at first, obtain the coordinate of pixel P123_a, this pixel P123_a takes the position mark 143a that forms in the FOV of first adjacent camera (F123_a).Afterwards, obtain the coordinate of pixel P123_b according to the benchmark pixel P1 of reference camera, this pixel P123_b takes the position mark 143b of formation among the FOV of second adjacent camera (F123_b).
At last, obtain off-set value Os3 and the Os4 of the close position mark 143b of second adjacent camera with respect to the close position mark 143a of first adjacent camera.Can by with the same procedure of above-described acquisition off-set value Os1 and Os2, obtain off-set value Os3 on second direction of principal axis and the off-set value Os4 on first direction of principal axis.For example, the difference of actual interval G2 and base interval L6+L7 is equivalent to off-set value Os3.Actual interval G2 represent to take first adjacent camera close position mark 143a pixel P123_a and take distance between the pixel P123_b of close position mark 143b of second adjacent camera.
Then, second adjacent camera with respect to the off-set value addition of reference camera, obtains the total drift value of second adjacent camera with respect to reference camera with respect to the off-set value Os3 of first adjacent camera and Os4 and first adjacent camera.
More than describe and be not limited to array detecting device, also may be used on having the device of camera assembly, the camera assembly has reference camera and at least one adjacent camera and finishes at least and moves horizontally.In addition, the method that can be applicable to measure the some position of being taken by the adjacent camera intended pixel is more than described.Because above described the method for measuring the intended pixel position, its detailed description will be omitted.
A plurality of one exemplary embodiment have below been described.But, it should be understood that and to make various modifications.For example, if carry out these methods in differing order, and/or the assembly in described system, structure, device or the circuit makes up by different way and/or replaces or additional other assemblies or its equivalent, can obtain suitable result.Therefore, other embodiments are included in the scope of following claim.
Claims (19)
1. array detecting device, it comprises:
Support the part of detecting of substrate to be tested; And
At least one modulation head, it is arranged to adjacent with described part of detecting, detecting the defect part of the substrate on described part of detecting, be provided with,
Wherein, described modulation head comprises:
Fixed block;
Camera assembly, it connects with described fixed block, and is provided at predetermined intervals reference camera and at least one adjacent camera on this camera assembly; With
The measurement of coordinates modulation block, it removably is connected to the fixed block between described camera assembly and the substrate, and has and constitute the position indicating device of each focal length relative set of the camera of camera assembly,
Wherein, on the indicating device of described position, form the reference position mark that to take by reference camera and will be by the close position mark of described adjacent camera shooting.
2. array detecting device as claimed in claim 1, wherein, on the zone of the position indicating device corresponding, form at least one length mark with row, and this length mark is provided at predetermined intervals with respect in reference position mark and the close position mark each with each camera.
3. array detecting device as claimed in claim 1, also comprise controller, this controller according to benchmark pixel, utilize difference between the actual interval between base interval and reference position mark and close position mark to obtain the pixel coordinate of adjacent camera, this base interval is corresponding to adjacent one another are when the visual field of camera (FOV) and do not separate each other or when not overlapping, and takes the pixel of reference position mark and takes interval between the pixel of reference position mark.
4. array detecting device as claimed in claim 1 also comprises the test modulation block, and it replaces described measurement of coordinates modulation block to be connected to the bottom surface of described fixed block, and moves up and down to carry out the indication to the defective electrode position that forms on the substrate.
5. method that the position of putting on the substrate on the array detecting device of structure with claim 1 is measured, this method comprises:
Obtain the pixel coordinate of adjacent camera according to the benchmark pixel of reference camera;
Obtain the coordinate of benchmark pixel according to the preset reference point of described substrate; And
To obtain and be used to take the coordinate and the benchmark pixel coordinate addition that obtains according to described preset reference point of pixel of the point of described substrate according to benchmark pixel.
6. method as claimed in claim 5, wherein, if at least one contiguous camera on first positive dirction away from described reference camera, the pixel coordinate that obtains reference camera comprises:
Obtain off-set value between described reference position mark and the close position mark, that have first off-set value, wherein first off-set value is marked at poor between first actual interval on the positive dirction corresponding to base interval and described reference position mark and close position, wherein this base interval corresponding to adjacent one another are when the visual field of camera (FOV) and and do not have separated from one another or when not overlapping each other, be used to take the pixel of reference position mark and be used to take interval between the pixel of close position mark; And
According to the benchmark pixel of described reference camera, utilize this off-set value to obtain the coordinate of adjacent camera pixel.
7. method as claimed in claim 6 wherein, obtains base interval and comprises:
Obtain that the reference position mark is taken pixel and the pixel in the FOV of reference camera is selected and first distance between the end pixel at the end of first positive dirction;
Obtain that the close position mark is taken pixel and the pixel in the FOV of adjacent camera is selected and the second distance between the end pixel at the end of the negative direction opposite with first positive dirction; And
With first distance and second distance addition.
8. method as claimed in claim 7, wherein, multiply by from the reference position mark by length and to take pixel selected and be positioned at first positive dirction to the pixel in the FOV of reference camera the pixel quantity of end pixel at end the unit picture element of reference camera, and obtain first distance, and
Multiply by by length and to take pixel from the close position mark and select and be positioned at the pixel quantity of end pixel at end of first negative direction, and obtain second distance to the pixel in the FOV of adjacent camera with the unit picture element of adjacent camera.
9. method as claimed in claim 6 wherein, obtains off-set value and also comprises acquisition second off-set value, and this second off-set value is illustrated in the off-set value of adjacent camera on second direction of principal axis vertical with first, and
Obtaining second off-set value comprises:
Obtain that the close position mark is taken pixel and the pixel in the FOV of adjacent camera is selected and the 3rd distance between the end pixel at the end of second predetermined direction;
Obtain that the reference position mark takes that pixel in the FOV of pixel and reference camera is selected and the 4th distance between the end pixel at the end of second predetermined direction, and
Obtain the 3rd distance and the 4th the distance between poor.
10. method as claimed in claim 5 also comprises the unit picture element length that obtains reference camera and adjacent camera.
11. as the method for claim 10, wherein, on the zone of the position indicating device corresponding with each camera, with at least one length mark of row formation, and this length mark is arranged to and each position mark preset distance interval, and wherein,
By with the distance between reference position mark and the length mark corresponding with reference camera divided by take pixel is taken pixel to the length mark of reference camera pixel quantity from the reference position mark, obtain the length of the unit picture element of described reference camera, and by the distance between close position mark and the length mark corresponding with adjacent camera is taken the pixel quantity of pixel divided by taking pixel from the close position mark to the length mark of adjacent camera, and obtain the length of the unit picture element of described adjacent camera.
12. method as claimed in claim 5 also comprises the test modulation block, it is replaced described measurement of coordinates modulation block and is connected to the bottom surface, and moves up and down to carry out the instruction to the defective electrode position that forms on the substrate, wherein,
Under the measurement of coordinates modulation block is installed in state on the array detecting device, execution obtains the pixel coordinate of adjacent camera according to the benchmark pixel of reference camera, and be installed under the state on the array detecting device in the test modulation block, carry out coordinate according to the preset reference point acquisition benchmark pixel of substrate.
13. a utilization has the method for the measurement device of camera assembly by the position of the intended pixel shooting of adjacent camera, this camera assembly comprises a reference camera and at least one adjacent camera and finishes moving of horizontal direction at least that this method comprises:
The reference position mark that to be taken by reference camera is set, and will by adjacent camera take and on first positive dirction with the close position mark of actual interval away from the reference position mark;
Utilize reference camera and adjacent camera to take reference position mark and close position mark respectively;
When the visual field of camera (FOV) adjacent one another are and and do not have separated from one another or when not overlapping each other, obtain to take the base interval that pixel and close position mark are taken distance between the pixel corresponding to the reference position mark; And
Utilize described actual interval and base interval, obtain the coordinate of the intended pixel of adjacent camera according to the benchmark pixel of described reference camera.
14., wherein, obtain base interval and comprise as the method for claim 13:
Obtain that the reference position mark is taken pixel and the pixel in the FOV of reference camera is selected and first distance between the end pixel at the end of first positive dirction;
Obtain that the close position mark is taken pixel and the pixel in the FOV of adjacent camera is selected and the second distance between the end pixel at the end of the negative direction opposite with first positive dirction; And
With first distance and second distance addition.
15. method as claim 14, wherein, multiply by from the reference position mark by unit picture element length and to take pixel selected and be positioned at first positive dirction to the pixel in the FOV of reference camera the pixel quantity of end pixel at end reference camera, and obtain first distance, and
Multiply by the pixel of taking from the close position mark by unit picture element length and select and be positioned at the pixel quantity of end pixel at end of first negative direction, and obtain second distance to the pixel in the FOV of adjacent camera with adjacent camera.
16. as the method for claim 13, wherein, the coordinate that obtains the intended pixel of adjacent camera comprises:
Acquisition is corresponding to the off-set value of described base interval and actual interval difference; And
Utilize described off-set value, obtain the coordinate of the intended pixel of adjacent camera according to the benchmark pixel of reference camera.
17., also comprise the physical length of the unit picture element of the unit picture element of measuring basis camera and adjacent camera as the method for claim 13.
18., wherein, the reference position mark is set and the close position mark comprises as the method for claim 17:
First length mark that formation will be taken by reference camera, it is to be marked as a line, to be arranged on the zone of position indicating device with the mode of reference position marking path predetermined space with the reference position, and form second length mark that will take by adjacent camera, it with close position be marked as a line, and the mode of close position marking path predetermined space be arranged on the zone of position indicating device; And
By the distance between the reference position mark and first length mark is taken the pixel quantity of pixel divided by take pixel from the reference position mark to first length mark of reference camera, and obtain the effective unit length in pixels of reference camera.
19. the method as claim 13 also comprises, behind the coordinate of the intended pixel that obtains adjacent camera according to benchmark pixel,
Obtain the coordinate of the benchmark pixel of reference camera according to the predetermined fiducial of substrate; And
Will be according to the coordinate of the intended pixel that benchmark pixel obtained and the coordinate addition of the benchmark pixel that obtains according to reference point.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2008-0137136 | 2008-12-30 | ||
| KR1020080137136A KR100911330B1 (en) | 2008-12-30 | 2008-12-30 | Array tester, method for measuring a point of substrate of the same and method for measuring a position cordinate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101769878A true CN101769878A (en) | 2010-07-07 |
| CN101769878B CN101769878B (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009102502139A Expired - Fee Related CN101769878B (en) | 2008-12-30 | 2009-12-08 | Array tester, method for measuring a point of substrate of the same and method for measuring a position coordinate photographed by a camera assembly |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2010156684A (en) |
| KR (1) | KR100911330B1 (en) |
| CN (1) | CN101769878B (en) |
| TW (1) | TW201024724A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103698630A (en) * | 2013-12-12 | 2014-04-02 | 合肥京东方光电科技有限公司 | Electrical array detection equipment |
| CN108107614A (en) * | 2017-12-28 | 2018-06-01 | 深圳市华星光电半导体显示技术有限公司 | Show inspection method and display check device |
| CN109164551A (en) * | 2018-10-25 | 2019-01-08 | 苏州源泽光电科技集团有限公司 | A kind of optical lens detected for showing screen |
| CN109254491A (en) * | 2017-07-13 | 2019-01-22 | 宁波舜宇光电信息有限公司 | Camera module Batch testing apparatus and method |
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| CN102023163B (en) * | 2010-12-28 | 2012-05-23 | 中国计量学院 | System and method for detecting connector based on digital signal processor (DSP) |
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| KR101207029B1 (en) | 2010-12-30 | 2012-11-30 | 주식회사 탑 엔지니어링 | Array test apparatus |
| CN103616776B (en) * | 2013-11-26 | 2016-01-13 | 亚世光电股份有限公司 | The apparatus and method of a kind of machine automatic gauging liquid crystal module and assembling one |
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|---|---|---|---|---|
| JP2006337631A (en) * | 2005-06-01 | 2006-12-14 | Mitsubishi Electric Corp | Inspection method and method for manufacturing liquid crystal display apparatus using same |
| JP4884828B2 (en) * | 2006-05-01 | 2012-02-29 | 株式会社日本マイクロニクス | Processing device for display panel |
| KR101237959B1 (en) * | 2006-05-19 | 2013-02-28 | 황주철 | System and Method for Congratulations and Condolences Management |
| KR100756229B1 (en) * | 2006-10-26 | 2007-09-07 | 주식회사 탑 엔지니어링 | Array tester |
-
2008
- 2008-12-30 KR KR1020080137136A patent/KR100911330B1/en active IP Right Grant
-
2009
- 2009-12-07 TW TW098141790A patent/TW201024724A/en unknown
- 2009-12-07 JP JP2009277911A patent/JP2010156684A/en active Pending
- 2009-12-08 CN CN2009102502139A patent/CN101769878B/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103698630A (en) * | 2013-12-12 | 2014-04-02 | 合肥京东方光电科技有限公司 | Electrical array detection equipment |
| CN103698630B (en) * | 2013-12-12 | 2016-04-06 | 合肥京东方光电科技有限公司 | A kind of electrical array detection equipment |
| CN109254491A (en) * | 2017-07-13 | 2019-01-22 | 宁波舜宇光电信息有限公司 | Camera module Batch testing apparatus and method |
| CN108107614A (en) * | 2017-12-28 | 2018-06-01 | 深圳市华星光电半导体显示技术有限公司 | Show inspection method and display check device |
| CN109164551A (en) * | 2018-10-25 | 2019-01-08 | 苏州源泽光电科技集团有限公司 | A kind of optical lens detected for showing screen |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100911330B1 (en) | 2009-08-07 |
| JP2010156684A (en) | 2010-07-15 |
| TW201024724A (en) | 2010-07-01 |
| CN101769878B (en) | 2012-07-04 |
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