CN101740409B - 一种二极管引线烧焊方法及二极管 - Google Patents
一种二极管引线烧焊方法及二极管 Download PDFInfo
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- CN101740409B CN101740409B CN 200810305402 CN200810305402A CN101740409B CN 101740409 B CN101740409 B CN 101740409B CN 200810305402 CN200810305402 CN 200810305402 CN 200810305402 A CN200810305402 A CN 200810305402A CN 101740409 B CN101740409 B CN 101740409B
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- diode
- chip
- welding
- lead
- base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200810305402 CN101740409B (zh) | 2008-11-06 | 2008-11-06 | 一种二极管引线烧焊方法及二极管 |
Applications Claiming Priority (1)
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CN 200810305402 CN101740409B (zh) | 2008-11-06 | 2008-11-06 | 一种二极管引线烧焊方法及二极管 |
Publications (2)
Publication Number | Publication Date |
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CN101740409A CN101740409A (zh) | 2010-06-16 |
CN101740409B true CN101740409B (zh) | 2012-02-15 |
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CN 200810305402 Active CN101740409B (zh) | 2008-11-06 | 2008-11-06 | 一种二极管引线烧焊方法及二极管 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102581410B (zh) * | 2012-02-29 | 2016-04-27 | 扬州虹扬科技发展有限公司 | 一种二极管芯片的焊接工艺 |
CN104269349A (zh) * | 2014-09-30 | 2015-01-07 | 如皋市大昌电子有限公司 | 一种桥堆清洗工艺 |
CN109817599B (zh) * | 2019-03-14 | 2024-05-10 | 山东省半导体研究所 | 一种带有新型镀镍引线框架的二极管及其碱洗工艺 |
CN113895915B (zh) * | 2021-09-30 | 2023-02-03 | 江西德尔诚半导体有限公司 | 一种二极管自动上料装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2518220Y (zh) * | 2001-12-27 | 2002-10-23 | 杨雅祥 | 免氩焊压接式硅元件 |
CN2817069Y (zh) * | 2005-06-28 | 2006-09-13 | 范涛 | 瓷壳功率二极管 |
CN100373566C (zh) * | 2006-03-22 | 2008-03-05 | 常州久和电子有限公司 | 贴片二极管的加工方法 |
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2008
- 2008-11-06 CN CN 200810305402 patent/CN101740409B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2518220Y (zh) * | 2001-12-27 | 2002-10-23 | 杨雅祥 | 免氩焊压接式硅元件 |
CN2817069Y (zh) * | 2005-06-28 | 2006-09-13 | 范涛 | 瓷壳功率二极管 |
CN100373566C (zh) * | 2006-03-22 | 2008-03-05 | 常州久和电子有限公司 | 贴片二极管的加工方法 |
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Publication number | Publication date |
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CN101740409A (zh) | 2010-06-16 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Method for welding lead of diode and diode Effective date of registration: 20170116 Granted publication date: 20120215 Pledgee: Bank of Guiyang Limited by Share Ltd high tech branch Pledgor: Guizhou Yaguang Electronic Technology Co.,Ltd. Registration number: 2017990000037 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20200317 Granted publication date: 20120215 Pledgee: Bank of Guiyang Limited by Share Ltd high tech branch Pledgor: GUIZHOU YAGUANG ELECTRONICS TECHNOLOGY Co.,Ltd. Registration number: 2017990000037 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |