CN101730616B - For the formation of the chopping disk of groove - Google Patents
For the formation of the chopping disk of groove Download PDFInfo
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- CN101730616B CN101730616B CN200880002650.2A CN200880002650A CN101730616B CN 101730616 B CN101730616 B CN 101730616B CN 200880002650 A CN200880002650 A CN 200880002650A CN 101730616 B CN101730616 B CN 101730616B
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- chopping disk
- groove
- cutting element
- chopping
- tapered surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
- C03B33/107—Wheel design, e.g. materials, construction, shape
Abstract
A kind of chopping disk forming groove on the surface in main body or object is provided.Described chopping disk comprises the disc body (10) with peripheral part, described peripheral part have assemble radially outwardly first circumference extend tapered surface (18) and second week to extension tapered surface (20).Described peripheral part limits scribing edge (22), and described scribing edge (22) has adjacent protruding cutting element (30) and the recessed cutting element (26) of circumference extension.Be formed with multiple outward extending groove (24) in described first tapered surface (18) and described second tapered surface (20), and the outer end alignment of relative groove (24) in corresponding tapered surface (18,20) is to limit the female cutting element (26) betwixt.Therefore, the scribing edge (22) limited by described chopping disk is the edge that the continuous print of the cutting element with projection (30) alternately and recessed (26) is sharp keen, and the cutting element of described projection (30) and recessed (26) is circumferentially in alignment with each other.Described chopping disk can by the diamond particles sintered or glue together or other hard material manufacture.Also disclose a kind of equipment for the manufacture of described chopping disk and method.
Description
Background technology
The present invention relates to a kind of stitch marker or chopping disk, described stitch marker or chopping disk can be used in depicting groove on the surface of the main bodys such as such as glass body, semiconductor, jewel, crystalline material main body or ceramic main body or object.
Chopping disk or tosecan are supported by the main shaft of one end or axle that are rotatably installed on handle or another supporting member usually.Make the edge of dish and surface contact to be rule and mobile relative to described surface, chopping disk rolled on said surface, thus leaves line on said surface, wherein object or main body can along described line neat rupture.
By applying suitable power via handle or supporting arrangement, the cut edge of tosecan or limit sword is impelled to produce crack or groove from the teeth outwards.
This chopping disk can be used in the glasswares such as such as plate glass, glass pane, bottle or jar.A kind of special application of this kind of chopping disk can mark groove on the flat glass plate in television screen, computer monitor and large other little display.And they can be used for ruling on other crystalline material of the wafer of semi-conducting material or pottery, jewel or jasper and such as sapphire and other hardening oxidation thing etc.
Comparatively early for the chopping disk of ruling to glass, there is continuous limit sword, make to have in glass surface continuously, very neat crack, below the line in glass of described crack, there is the quite shallow degree of depth.For thin glass plate, this kind of dish remains the most widely used scoring tool.For thicker plate, the crack formed may be dark not, and thus disruptive force may be excessive, and surface can present excessively cracked, or glass may accurately along line fracture.In these all situations, this will cause excessive output loss and need to carry out large adjustment to be avoided the interruption of production process.
EP1092686 describes a kind of glass-cutting dish or cutting wheel, and described glass-cutting dish or cutting wheel on its one-tenth inclined-plane, periphery place, thus limit the circumferential ridge being wherein formed with tooth or projection, have recess or cavity between wherein said tooth.When pulling stitch marker on the glass surface, described tooth sequentially contacts with glass surface, thus contact point place forms the pressure of enhancing and forms crack in darker what is called before breaking on the glass surface.
Recess between tooth or projection or cavity also limit sharp keen intersection surface, and therefore they do not help the line of glass.In fact, the bottom of these recesses and cavity in scratching process usually not with glass contact.In this regard, should be noted that chopping disk usually only penetrate several microns, glass and cavity be generally 10 microns dark.
Because under any circumstance some teeth pierce into the fact of glass in time, form the crack of expansion in glass from a tooth to next tooth, thus form continuous crack along the lines limited by chopping disk rolling path on the glass surface.Can hundreds of micron in deep enough glass by line action and the vee crack that formed by chopping disk applied pressure.But crack presents the pattern (bottom of cavity has moved to the position above glass surface) in typical pure lines crack and to present outside removing crack glass by region that tooth is pushed open.Around these regions, glass also presents the undesirably phenomenon of the lateral crevasse from the border extended pushing region open.Therefore, after fracture, the edge of the glass plate formed may need grinding to remove crack area.And, there are some less desirable cracked around these regions, and the initial crack expanded between tooth is always not straight, or not only single line crack but comprise multi-thread crack sometimes, and once fracture propagation is to the degree of depth of glass, the skew in crack may be caused.
The object of this invention is to provide a kind of alternative chopping disk or tosecan, its at least solve the problem in a part.
Summary of the invention
According to the present invention, a kind of chopping disk forming groove on the surface in main body or object is provided, described chopping disk comprises roughly disk-shaped body, described body has peripheral part, described peripheral part comprise assemble radially outwardly first circumference extend tapered surface and second week to extend tapered surface, described peripheral part limits scribing edge, described scribing edge has the adjacent protruding cutting element of circumference extension and recessed cutting element, wherein, multiple outward extending groove type is formed in described first tapered surface and described second tapered surface, the outer end alignment of the relative groove in corresponding tapered surface is to limit the female cutting element betwixt.
Therefore, the described scribing edge limited by described chopping disk has the sharp keen edge of the continuous print of protruding cutting element alternately and recessed cutting element, and described protruding cutting element and the female cutting element are circumferentially in alignment with each other.
Such as, described main body or object can be glass body, semiconductor, jewel, crystalline material main body or ceramic main body.
Described outward extending groove radially can align or can relative to the radius deflection of described chopping disk.
Described groove can have equal width and the degree of depth, or can the vicissitudinous width of tool and/or the degree of depth.
Interval between adjacent groove can be regular or irregular.
Preferably, the degree of depth of described groove radially increases towards the direction of the periphery of described chopping disk, makes described groove have depth capacity at contiguous recessed cut edge place.
The width of described groove can be invariable along its length direction, or can change.
In a rear embodiment, preferably, optionally remove the material of the contrary tapered surface at the periphery place of described dish, thus limit the cut edge with the projection of crooked outline, make the whole scribing edge of described chopping disk have sinuous outline.
Described sinuous outline can correspond to sinusoidal wave or another periodic shapes.
Described chopping disk can comprise the one in multiple hard material, comprises the diamond particles of sintering or gummed.Such as, in the previous case, cobalt can be used as adhesive, and in the later case, SiC (carborundum) can be used as adhesive.
When described chopping disk comprises diamond particles, described particle preferably has the size being less than 3 microns, more preferably less than 1.5 microns, is most preferably less than 0.8 micron further more preferably less than 1 micron.
Described chopping disk can comprise other hard material, includes, but is not limited to single-crystal diamond or polycrystalline diamond.
Further, according to the present invention, provide a kind of equipment for the manufacture of chopping disk, described chopping disk forms groove on the surface in main body or object, and described equipment comprises:
Supporting member, it is for supporting dish type blank, and described blank has peripheral part, described peripheral part comprise assemble radially outwardly first circumference extend tapered surface and second week to extend tapered surface;
Lasing light emitter, it is set to the focused beam that projects;
Mask, it is configured as and limits predetermined cutting pattern;
Concentrating element, it is configured such that focused beam focuses on described blank via described mask; And
Translating device, it can operate and described blank and described focused beam relative to each other be moved, in described first tapered surface and described second tapered surface, multiple outward extending groove is formed to impel described light beam, the outer end alignment of the relative groove in corresponding tapered surface is to limit recessed cutting element betwixt, between wherein said recessed cutting element, there is protruding cutting element, the peripheral part of described chopping disk is limited there is the adjacent protruding cutting element of circumference extension and the scribing edge of recessed cutting element.
Again further, according to the present invention, provide a kind of method manufacturing chopping disk, described chopping disk forms groove on the surface in main body or object, and described method comprises:
Supporting dish type blank, described blank has peripheral part, and described peripheral part comprises tapered surface and second week that the first circumference of assembling radially outwardly extends to the tapered surface extended;
Self-excitation light source produces focused beam;
Described light beam is covered according to predetermined cutting pattern;
Described light beam is focused on described blank; And
Described blank and described light beam are relative to each other moved, in described first tapered surface and described second tapered surface, multiple outward extending groove is formed to impel described light beam, the outer end alignment of the relative groove in corresponding tapered surface is to limit recessed cutting element betwixt, between wherein said recessed cutting element, there is protruding cutting element, the peripheral part of described chopping disk is limited there is the adjacent protruding cutting element of circumference extension and the scribing edge of recessed cutting element.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the first embodiment according to chopping disk of the present invention;
Fig. 2 and Fig. 3 is partial side view and the stereogram of the chopping disk of Fig. 1 respectively;
Fig. 4 and Fig. 5 is partial side view and the stereogram of the second embodiment of chopping disk respectively;
Fig. 6 and Fig. 7 is partial side view and the stereogram of the 3rd embodiment of chopping disk respectively;
Fig. 8 and Fig. 9 is partial side view and the stereogram of the 4th embodiment of chopping disk respectively;
Figure 10, Figure 11 and Figure 12 are the partial side view of the 5th embodiment of chopping disk, stereogram and end-view respectively; And
Figure 13 is the schematic diagram of the equipment for the manufacture of chopping disk.
Detailed description of the invention
Fig. 1 to Fig. 3, Fig. 4 and Fig. 5, Fig. 6 and Fig. 7, Fig. 8 and Fig. 9 and Figure 10, Figure 11 and Figure 12 show according to five kinds of chopping disk of the present invention (also referred to as stitch marker) different embodiments.Prototype chopping disk is by the sintered diamond particles manufacture using cobalt binder to sinter.This material is sometimes referred to as cobalt gummed diamond.The another kind of preferred material used in some embodiments is the use of the gummed diamond of SiC (carborundum) adhesive.Those of ordinary skill in the art are to be understood that, chopping disk can by other known materials manufacture, comprise single-crystal diamond (natural or artificial), such as CVD (chemical vapour deposition (CVD)) generates the polycrystalline diamond of polycrystalline diamond etc., cubic boron nitride, tungsten carbide, sapphire or other hard crystal and gummed and agglomerated material.
First with reference to Fig. 1, Fig. 2 and Fig. 3, the first embodiment of chopping disk comprises the disc-shaped diamond body 10 with centre bore 12, and described centre bore 12 can accommodate bolster or main shaft.Chopping disk has contrary planar end 14 and 16.Be formed with the first taper convergent or inclined surface 18 and the second taper convergent or inclined surface 20 at the peripheral part of dish, described surperficial 18 and 20 assemble radially outwardly towards scribing edge 22.The mode that scribing edge 22 is formed is described hereinafter in further detail.
The diameter of chopping disk is in the scope of 1 to 20 millimeter usually, and thickness is in the scope of 0.4 to 5 millimeter, and the convergent angle between the first tapered surface 18 and the second tapered surface 20 is in 80 to 160 scopes spent.
Fig. 2 and Fig. 3 is part sectioned view and the stereogram of the peripheral part of the chopping disk of Fig. 1 respectively, more clearly illustrates scribing edge 22.
Be formed with multiple groove 24 at the outermost portion of tapered surface 18 and 20, described groove 24 extends to scribing edge 22 radially outwardly.Corresponding recesses 24 in tapered surface 18 and 20 is alignment and limits recessed cutting element 26 at their intersecting lens place, and described cutting element 26 has recessed curvature.In other embodiments, the recessed cutting element being defined in intersecting lens can be that (or more sophisticated) is bending projectedly, or they can be straight.Be rib 28 between groove 24, described rib 28 extends equally radially outwardly and intersects and limit protruding cutting element 30, and described cutting element 30 has the curvature slightly protruded of the circumferential curvature corresponding to lib 10.Equally, the shape of protruding cutting element 30 in other embodiments can be different.Groove and rib replace as shown in figure, make scribing edge 22 comprise a series of projection replaced and recessed cutting element, thus define the scribing edge of continuous print circumference extension.
Fig. 4 and Fig. 5 shows the modification of the embodiment of Fig. 1 to 3, and wherein, the interval between adjacent groove 24 is unequal or erratic.As Fig. 4 institute the best is seen, the interval of the circumferencial direction along chopping disk between groove 24.1 and 24.2 is greater than the interval between groove 24.2 and 24.3.Consequently, the length of protruding cutting element 30.1 is correspondingly greater than the length of protruding cutting element 30.2.
As shown in the embodiment of Fig. 4 and Fig. 5, the interval between groove can be staggered, and wherein, the interval replaced is larger or less, or can adopt the more complicated pattern such as with periodicity, class periodicity or pseudo-random characteristics.
In the situation (such as there is between groove the situation of less or larger distance alternately) that its groove interval has short-period chopping disk, relative to the chopping disk of prior art and according to the chopping disk with equal groove interval of the present invention, the application that this chopping disk is used for different line operations improves.For the chopping disk with equal groove interval, usually the different chopping disk with different line setting is used for object or the main body of dissimilar and thickness to be rule.Such as, be used for by about score pressure, line speed and the service life of scriber, the requirement of procedure quality and usually output specific settings the glass plate of the thickness with 0.5 millimeter carry out the chopping disk of ruling not by identical setting, service life and procedure quality and output for the plate be made up of identical glass of the thickness with 0.4 millimeter.Owing to depending on different depth and the shape of the impression of the distance between groove, the above-mentioned embodiment with non-equidistant groove makes to realize optimization to more type of glass or thickness in a chopping disk simultaneously.
(when its groove interval has macrocyclic chopping disk such as there is constant distance in the half of its cutter ribs and but there is chopping disk that is different still constant distance on the second half, or there is its cycle chopping disk of being similar to the groove distance of sinusoidal variations equal with the circumference of chopping disk), the middle crack formed has the equal different depth of the circumference (in given example, the circumference of the chopping disk of 2 mm dias is approximately 6.3 millimeters) of cycle and chopping disk.Such as, when ruling to glass plate, and for the specific settings of score pressure with line speed, this allows crack in acquisition, the degree of depth in described middle crack makes in relatively dark region, middle crack, the crack of the expansion formed extends through the thickness of glass completely or almost entirely, and in relatively shallow other region, middle crack, and the crack of expansion does not still extend through or close to contrary surface.
Therefore, the point of the first embodiment is: by having the chopping disk of isolated groove unequally, do not need very accurately to control expansion depth, and this chopping disk for prior art and be required for the chopping disk with equally isolated groove of the present invention.But, for the chopping disk with non-equidistant groove, normal change in process only works in larger or less region, wherein, crack has extended to opposed surface or has extended near opposed surface, but, contrast prior art chopping disk and according to the chopping disk with equally isolated groove of the present invention, in the larger window of line setting, the precise breakage after line is possible.
The 3rd embodiment according to chopping disk of the present invention is shown in Fig. 6 and Fig. 7.In this embodiment, groove 24 has the outer end of the recessed element 26 of the inner 32 and restriction scribing edge 22.
Between adjacent groove 24 and rib 34, the either side of the radial extension line at center is cut sth. askew to its outermost end 36 or is excised thus limit the ridge of sinusoidal shape.The outermost end of excision rib, makes protruding cutting element 30 have the shape of sinus-curve, thus limits the raised brim of sharp keen circumference extension, and described raised brim is connected with adjacent recessed cutting element 26.Therefore, the scribing edge limited by this embodiment of chopping disk have fluctuation, roughly in the profile of sinusoidal or " wave " shape, but described scribing edge is continuous print, and be sharpened edge shape at the lowermost part of the summit of protruding cutting element and adjacent recessed cutting element.
Outermost end 36 place of the rib 34 between groove 24, the width of rib is to the some convergent in the plane of tapered surface 18 and 20.
The shape of the scribing edge of fluctuation or " wave " can be real sinusoidal, similar sine or sinusoidal segment, or can have such as complicated periodicity or the periodic shape of class.This shape is subject to the impact of the shaping of interval between adjacent groove 24 and protruding cutting element itself.
Fig. 8 and Fig. 9 shows the 4th embodiment according to chopping disk of the present invention.In this embodiment, groove 24 has the width slightly increased towards the periphery of chopping disk, and has the recessed curvature of the circumferencial direction along chopping disk, and this corresponds to the concavely bending shape of the recessed cutting element 26 at scribing edge 22 place of chopping disk.Be the radial ridge 38 extended between adjacent groove 24, described ridge 38 has the curvature of protrusion at its summit place, and this corresponds to the shape bending projectedly of the protruding cutting element 30 at scribing edge 22 place.Should be appreciated that the curvature of adjacent groove and ridge defines the curvature of the corresponding recessed of the scribing edge place of chopping disk and protruding cutting element, be wherein positioned at groove in contrary tapered surface 18 and 20 and ridge meets at described scribing edge place.
Figure 10, Figure 11 and Figure 12 show the another kind of modification of the embodiment of Fig. 1 to 3, and wherein, scribing edge or cutter ribs are arranged between contrary planar end 14 and 16 asymmetrically.Be formed with the first taper convergent or inclined surface 18 and the second taper convergent or inclined surface 20 at the peripheral part of dish, described surperficial 18 and 20 assemble radially outwardly towards scribing edge 22.In this embodiment, taper convergent or inclined surface 18 are circles with the intersection of plane surface 14, and the radius of this circle is greater than the radius of the circle limited with the intersection of plane surface 16 by convergent or inclined surface 20.Taper tapered surface 18 and 20 and through their intersection plane respective angle roughly equal.Therefore, scribing edge 22 is towards the planar offset of planar end 14 from centre between contrary end face 14 and 16.
As in the first embodiment shown in Fig. 1 to 3, multiple groove 24 is formed in the outermost portion of tapered surface 18 and 20, and it extends to scribing edge 22 radially outwardly.Corresponding groove 24 in tapered surface 18 and 20 is alignment and limits the recessed cutting element 26 with recessed curvature at its intersecting lens place.In other embodiments, the recessed cutting element being defined in intersecting lens can be that (or more sophisticated) is bending projectedly, or they can be straight.Be rib 28 between groove 24, described rib 28 extends equally radially outwardly and intersects and limit protruding cutting element 30, and described protruding cutting element 30 has the curvature slightly protruded of the circumferential curvature corresponding to lib 10.Groove and rib replace as shown in figure, make scribing edge 22 comprise a series of projection replaced and recessed cutting element, thus define the scribing edge of continuous print circumference extension.
This embodiment can be used in such as ruling on the wafer or easy broken base wafer of the multiple semiconductor device of carrying thus being separated described device.Compare the chopping disk of the symmetry by having similar integral thickness, this is needs for the sufficient intensity of chopping disk, and the possibility that scribing edge 22 makes to depict more close to the groove of wafer or on-chip structure or feature towards the asymmetric localization of the one side of chopping disk is larger.
When using the cutting wheel of prior art, find that it is debatable for obtaining high-quality cutting plate when delineating bending groove.In JP2000-219527, disclose a kind of dish type chopping disk or stitch marker, described dish type chopping disk or stitch marker solve this problem relative to the axial centre direction of wheel with the groove of specified angle deflection by being formed at the blade edge crestal line place of wheel.But, find when groove bending by chopping disk delineation according to the present invention, continuous scribing edge due to this dish and the mitigation by the material of the cutting element of these dishes launch, and significantly reduce the problem found in line before JP2000-219527.Especially, when using chopping disk or the stitch marker of the of the present invention 3rd or the 4th embodiment, the lateral crevasse occurred when using the chopping disk of prior art occurs hardly, wherein, the scribing edge wriggled makes it possible to easily carry out bending line and after breakable material, realize high edge quality.For larger radius of curvature, first, second described in literary composition produces high-quality curved edge equally with the 5th embodiment after fracture.
The method for optimizing manufacturing chopping disk of the present invention relates to by making groove by laser projection to the tapered surface of chopping disk at the convergent peripheral part of chopping disk via mask, wherein, the direction of propagation of light be basically perpendicular to cutting wheel axis and radially.Reach predetermined angular by rotating cutting wheel around the axis of cutting wheel and then again cutting wheel be exposed to laser beam, periodicity or the class periodic patterns of groove can be realized in tapered portion.In one embodiment, the projection of mask on cutting wheel keeps static, and in other embodiments, mask projection scans in tapered surface, therefore achieve the profile in groove, described profile can have change in the degree of depth, this be exposed to the time correlation of laser beam.Preferably, the laser used in this method is UV (ultraviolet) laser in the plane of mask with substantially straight intensity profile, and preferably via mask propagate light be projected through lens to realize, described Lens Design is that the conical section downscaled images of mask being projected to chopping disk remains on the plane of delineation wherein.Projected by design its image in once the mask of the field of illumination be shaped equally simultaneously on some cutting wheels, and this method provides small lot working ability.
Prototype cutting wheel of the present invention uses sintered diamond particles manufacture.By using, there is the diamond of very little particulate, " cutting out " effect can be reduced, and improve accuracy of shape---particularly for the accuracy of shape of cut edge with little radius of curvature.Therefore improve the service life of sintered diamond chopping disk.Preferably, a kind of newly developed gummed diamond be made up of the diamond particles glued together with SiC is for cutting wheel, it has the advantage that space between diamond particle is filled by almost equally hard with diamond material, therefore, between diamond and adhesive, the difference of hardness is far smaller than traditional gummed diamond.Which results in these cutting wheels, than the sintering of prior art or gummed diamond cut off wheel, there is the wearability of more increasing further.
In manufacture prototype chopping disk of the present invention, but be configured as being manufactured by small particle diamond particles in some cases or using SiC adhesive to be used as blank to the chopping disk of the higher wearability developing these materials of the dish being similar to prior art.The feature of the chopping disk of this prior art is, becomes the flat-disk of inclination or the tapered portion having centre bore and intersect at ridge place, periphery, thus defines cut edge or the scribing edge of the chopping disk of prior art.All surfaces, comprise the surface of centre bore, can be polishings or can be polishings, thus formed root-mean-square value be substantially less than 10 microns and be in most of the cases substantially less than the roughness of 1 micron.Certainly, the cut edge that the intersection due to sloping portion must form the good restriction with the radius being less than 3 microns is designing requirement, and sloping portion presents low roughness, has the root-mean-square value being usually less than 1 micron.
The equipment that Figure 13 shows for the manufacture of above-mentioned chopping disk with simplified schematic form is arranged.Described equipment comprises rotating gantry 50, and described rotating gantry 50 comprises the stepper motor be combined with reduction box, thus can realize stepping with the accuracy and repeatability that are less than 0.01 degree.Alternatively, the DC (direct current) with encoder be such as combined with gearbox or syncmotor can be used.Axle 52 can be mounted on rotating gantry, and then cutting wheel blank is arranged on axle, and described axle is through the centre bore of described cutting wheel blank.
Be provided with UV laser workstation, it comprises KrF (KrF) laser instrument 54, and described KrF laser instrument 54 can with the repetitive rate up to 250 pulses per second by the pulse UV radiation of approximate apical cap type intensity distribution generation up to 248 nanometers of 400,000,000 Jiao.Light from laser instrument 54 is directed into mask 56 by beam shaping system, and described beam shaping system comprises mirror, lens and other alternative beam shaping optics of schematically being represented by mirror 58 in fig. 13.Subsequently, via mask transmission light by particular design projecting lens 60 and be projected on chopping disk, described projecting lens 60 realizes about 20 times of mask images reduced on chopping disk.By different projecting lens, can realize reducing value between 10 times to 30 times.Usual fluence on the plane of delineation of projecting lens between 1 to 5 joule/square centimeter, the pulse of the duration of (nanosecond) level in 10-20ns.Keep the rotating gantry of chopping disk to be arranged in working support platform 62, the height of described working support platform 62 in the XY plane in the direction perpendicular to incident ray and position can control by digital computer.
Carrying out chemically cleaning with after removing dust and residual dirt from its surface, chopping disk blank 64 is mounted on the axle of rotating gantry.Then, by repeatedly chopping disk blank being exposed to the laser beam via mask transmission and then making rotating gantry step to reposition and manufacture cutting wheel, thus form groove 24 and at where applicable, the end 36 of protruding cutting element 30 be shaped.
When chopping disk is exposed to laser beam, mask images is along the direction projection alignd with the radius of chopping disk blank to the inclination of chopping disk or tapered portion.In some cases, the whole area coincidence of mask images and groove, and the number of laser pulse that the degree of depth of groove is then exposed to by these sloping portions is determined.
In other cases, working support platform moves in a linear fashion in XY plane, thus track to be exposed in the inclination of chopping disk or tapered surface and again to form groove, the partial-depth of described groove is determined by the speed of the pulse energy of laser, the pulse recurrence rate of laser, the shape of mask and scanning motion.The degree of depth due to groove is not determined relative to the narrow tolerance of the location of chopping disk by laser or processing unit (plant), but is determined by the duration being exposed to laser beam, and therefore the major advantage of this method is the simple alignment of chopping disk in work station.Because the position of groove is determined simply by the accurate rotating gantry of moderate, what therefore the position of groove neither be crucial.
In some cases, by a sequential manner some chopping disk blanks to be mounted on single axle and the sloping portion of chopping disk blank to be exposed to laser and sequentially to produce chopping disk in a step and repetitive process.Equally, except roughly finding the mid-plane of in blank and except the average thickness of measurement dish, not needing to carry out any alignment between the chopping disk blank that exposure is different.And the little change (being generally 10 to 20 micron orders) of the diameter of dish is unimportant and do not need as the again alignment required when the chopping disk of production prior art.
In other cases, use the mask of the sloping portion multiple identical image being projected to some chopping disks, described chopping disk is arranged on single axle equally, thus chopping disk blank is exposed to laser beam simultaneously and generates groove simultaneously.This makes it possible to realize small lot working ability, wherein, similarly make use of the low requirement of alignment aspect thus adapts to the appearance and size of chopping disk and the individuality change of position.
Alternatively, use simultaneously by multiple image projection to the mask on one or more dish, thus groove more than one on each chopping disk can be processed simultaneously.This makes it possible to process the difformity of different groove or the different depth of each independent groove, or, make can have different interval between adjacent grooves simply.The latter can also be realized by the step size changing rotating gantry.
In the prior art method, it is very difficult for producing the chopping disk with the feature of the size of the focus being far smaller than laser or the thickness of emery wheel.By described mask projection laser means, easily can make with the accuracy of the appearance and size being less than 10 microns and the degree of depth that is better than 1 micron the feature be positioned on cut edge, wherein, snapping tolerance is not crucial equally.
By changing the condition of UV exposure, the groove be differently shaped can be made.Therefore in the mode be combined with the repetitive rate of pulse UV laser to the sweep speed of the shape and XY saddle that change mask, thus the scribing edge having and be sinusoidally shaped and the chopping disk with U-shaped, triangle or rectangular recess can be obtained.Changed the size and dimension of mask by the mode be combined with the angle step size of the coefficient of reduction and rotating gantry with projecting lens, easily can change the number of groove.
In addition, by current method, the number of the laser beam pulse be exposed to by regulating chopping disk blank simply, can change the degree of depth of groove and shape independently and asynchronously change its width.This demonstrate the free degree of the optimum performance in order to obtain line that current method provides in the design of chopping disk.Glass is rule, the optimum performance of line can depend on multiple Different factor, such as type of glass, thickness of glass, line load, line speed, the processing amount of expectation, reliability and other factors many known to those of ordinary skill in the art.
Therefore, knownly make the chopping disk be differently shaped, when using the line of described chopping disk and break glass sheets, they demonstrate the line performance of improvement.In height there is sinusoidal variations by scribing edge and the dish that overlaps with the initial circumferential ridge of blank of the top of sine, achieve optimum performance.For glass line, the groove delineated shows the lateral crevasse of minimizing, and after making glass breakage, sees that the scope of stressed zone seen by the microscope by having crossed polarizer is less and has less stress.Also find, reduce in the antemarginal roughness of fracture and produce less glass powder.For the line of other material in addition to glass, have also discovered similar improvement.
Then, penetrate the mode discovery of the surface of glass object, the main body of semi-conducting material, jewel, crystalline material main body or ceramic main body from chopping disk scratching process, launched more lenitively to be the reason that performance is improved by the material of ruling compared with the chopping disk being provided with the tooth with non-cutting cavity therebetween of prior art.Another is that cut edge extends in recess region or recess area for the helpful factor of line performance improved, this does not have help, because they do not limit sharp keen cut edge in the sunk part of perimeter ridge to line in the chopping disk of prior art.
Although the chopping disk being sinusoidal variations by the height of cut edge achieves optimum performance, but owing to being extended to recess region by the expansion more relaxed of material of ruling and cut edge, the i.e. setting of continuous cut edge, so simple groove formula chopping disk shows well equally, and be better than the chopping disk of prior art.Can make and there is circle or oval cross section, or there is the groove of the more complicated shape such as such as triangle.In addition, can manufacture such groove type dish, wherein, the distance between the periphery upper groove of chopping disk is variable.
According to application and the size of chopping disk, the number of groove easily can be changed and chopping disk is made for the groove number having and change between 100 to 200 grooves.For some application, likely need the groove of more or less number.
Come from different sintering or glue together diamond and manufacture dissimilar chopping disk.Cobalt sintered diamond material is in prior art; but find; can obtain by using in agglomerated material very meticulous sub-micron diamond particles particulate the wearability improved, this is the smaller szie of volume between the diamond particle owing to being filled with metal-to-metal adhesive and the smaller szie of diamond particle.If this particulate is cut from gummed matrix by the wearing and tearing of adhesive or the excessive local power that acts on particulate, then compare the situation using sintered diamond with larger particulate, the space formed has much smaller impact for formed drawn line quality.Therefore find, similarly for the chopping disk be shaped according to prior art, when using the diamond particles of smaller szie, the improvement of substantial wearability can be obtained, the size of described diamond particles is preferably less than 3 microns and more preferably less than 1.5 microns, is most preferably less than 0.8 micron further more preferably less than 1 micron.These preferred sizes are also applicable to according to chopping disk of the present invention, and reason is obtain optimum performance by the particle of minimum dimension.
Also finding, the remarkable improvement of the wearability of chopping disk can be obtained by using harder, more wear-resisting adhesive.With utilize traditional metal-to-metal adhesive and there is the sintering of the particle of similar size or glue together compared with diamond, for for prior art or the chopping disk that is shaped according to shape of the present invention, when have employed the gummed diamond of the SiC adhesive that use is such as produced by the ElementSix Co., Ltd of South Africa Spring this (Springs), obtain the wearability of improvement.
Embodiment
1. use the chopping disk with 110 grooves and sharp keen cut edge of the sintered diamond of the cobalt binder of fine gtinding
Use the preparation of the sintered diamond of fine gtinding, cobalt binder according to prior art shaping, the chopping disk blank with continuous perimeter ridge.The size of the diamond particles used is less than 1 micron substantially.First by the thickness of the plate of this material polishing to 0.6 millimeter, then, electric discharge machine processing is used to cut out the cylinder with centre bore, subsequently, on each in these cylinders, the both sides intersecting at perimeter ridge polish convergent or inclination taper region that total angle is 125 °.The radius of curvature of intersection is less than 1 micron substantially.Chopping disk blank has the diameter of the centre bore of 0.8 millimeter and 2.0+/-0.02 millimeter.Carry out clean with the dust and the pollutant that remove adhesion to five in these dishes be shaped according to prior art, subsequently, these five dishes are arranged on the diameter with 0.78 millimeter and are positioned on the axle in rotating gantry.By searching the cut edge of telophragma and making this cut edge realize alignment between two parties and simply relative to UV laser image.The mask with sinusoidal opening to be positioned in the opticpath of UV laser beam and UV laser beam is projected on the sloping portion of chopping disk, making incident ray be basically perpendicular to the axis direction of rotating gantry axle.Laser fluence on chopping disk surface is approximately 2 joules/square centimeter, and wherein pulse recurrence rate is 50 pulses per second.Use 15 times of objective lens reduced by the image projection of mask on chopping disk.While laser beam is incident on chopping disk, it is made in the distance of about 0.3 millimeter, to carry out translation thus the groove of acquisition 0.32 millimeters long with the velocity along parallel of about 4 mm/min in the direction of rotating gantry axis.After making groove, cut off laser radiation and make rotating gantry stepping cross the angle of about 3.27 °.Subsequently, make another groove, but repeat this process until make the reeded chopping disk of tool on its whole taper region.In this approach, whole five chopping disks are processed.The cut edge formed has sinusoidal shape, described sinusoidal shape has the cycle of about 57 microns, and it is in these chopping disks, poor by measuring height between peak on the cut edge of 7.5+/-0.5 micron of the object lens microscopes of 100 times and calibration digital camera and minimum point.Similar value is found for other all chopping disks.These dishes are subsequently for test, be cutting performance on the glass plate of 0.6 millimeter at thickness to assess it, and relative to the cutting performance of prior art on these plates, observe substantive reduce lateral crevasse, the glacing flatness of intermediate cracking of improvement, the reproducible penetration of fracture and reduction the chip of glass plate edge.
2. use the chopping disk with groove that 110 uniform intervals open and sharp keen cut edge of the sintered diamond of the cobalt binder of fine gtinding
Use the preparation of the sintered diamond of fine gtinding, cobalt binder according to prior art shaping, the chopping disk blank with continuous perimeter ridge.The size of the diamond particles used is less than 1 micron substantially.First by the thickness of the plate of this material polishing to 0.65 millimeter, then, electric discharge machine processing is used to cut out the cylinder with centre bore, subsequently, on each in these cylinders, the both sides intersecting at perimeter ridge polish the inclination taper region that total angle is 125 °.The radius of curvature of intersection is less than 1 micron substantially.Chopping disk has the diameter of the centre bore of 0.8 millimeter and 2.0+/-0.02 millimeter.Carry out clean with the dust and the pollutant that remove adhesion to four in these dishes be shaped according to prior art, subsequently, these five dishes are arranged on the diameter with 0.78 millimeter and are positioned on the axle in rotating gantry.By searching the cut edge of the first dish and making this cut edge realize alignment between two parties and simply relative to UV laser image.The mask with circular open to be positioned in the opticpath of UV laser beam and UV laser beam is projected on the sloping portion of chopping disk, making incident ray be basically perpendicular to the axis direction of rotating gantry axle.Laser fluence on chopping disk surface is approximately 4 joules/square centimeter, and wherein pulse recurrence rate is 100 pulses per second.Use 20 times of objective lens reduced by the image projection of mask on chopping disk.While laser beam is incident on chopping disk, it is made in the distance of about 0.3 millimeter, to carry out translation thus the groove of acquisition 0.32 millimeters long with the velocity along parallel of about 6 mm/min in the direction of rotating gantry axis.After making groove, cut off laser radiation and make rotating gantry stepping cross the angle of about 3.27 °.Subsequently, make another groove, but repeat this process until make the reeded chopping disk of tool on its whole taper region.In this approach, whole four chopping disks are processed.The cut edge formed has round-shaped, and wherein the groove distance of center to center is approximately 57 microns.Recess width is 34 microns.For in these chopping disks, poor by measuring height between peak on the cut edge of 8.7+/-0.5 micron of the object lens microscopes of 100 times and calibration digital camera and minimum point.Chopping disk for other finds similar value.These dishes are subsequently for test, be cutting performance on the glass plate of 0.6 millimeter at thickness to assess it, and relative to the cutting performance of prior art on these plates, observe substantive reduce lateral crevasse, the glacing flatness of intermediate cracking of improvement, the reproducible penetration of fracture and reduction glass plate edge cracked.
3. use the chopping disk with groove that 110 non-uniform spacings open and sharp keen cut edge of the sintered diamond of the cobalt binder of fine gtinding
Use the preparation of the sintered diamond of fine gtinding, cobalt binder according to prior art shaping, the chopping disk blank with continuous perimeter ridge.The size of the diamond particles used is less than 1 micron substantially.First by the thickness of the plate of this material polishing to 0.65 millimeter, then, laser cutting is used to cut out the cylinder with centre bore, subsequently, on each in these cylinders, the both sides intersecting at perimeter ridge polish the inclination taper region that total angle is 125 °.The radius of curvature of intersection is less than 1 micron substantially.Chopping disk has the diameter of the centre bore of 0.8 millimeter and 2.0+/-0.02 millimeter.Carry out clean with the dust and the pollutant that remove adhesion to four in these dishes be shaped according to prior art, subsequently, these five dishes are arranged on the diameter with 0.78 millimeter and are positioned on the axle in rotating gantry.By searching the cut edge of the first dish and making this cut edge realize alignment between two parties and simply relative to UV laser image.The mask with two adjacent circular opens to be positioned in the opticpath of UV laser beam and UV laser beam is projected on the sloping portion of chopping disk, making incident ray be basically perpendicular to the axis direction of rotating gantry axle.Laser fluence on chopping disk surface is approximately 4 joules/square centimeter, and wherein pulse recurrence rate is 100 pulses per second.Use 20 times of objective lens reduced by the image projection of mask on chopping disk.While laser beam is incident on chopping disk, it is made in the distance of about 0.3 millimeter, to carry out translation thus the groove of acquisition 0.32 millimeters long with the velocity along parallel of about 4 mm/min in the direction of rotating gantry axis.After making a dual-cavity, cut off laser radiation and make rotating gantry stepping cross the angle of about 6.55 °.Subsequently, make another to groove, but repeat this process until make the reeded chopping disk of tool on its whole taper region.In this approach, whole four chopping disks are processed.The cut edge formed has elliptical shape, and wherein the cycle is that about 114 microns and the groove distance of center to center alternately change between 53 and 61 microns.Recess width is 34 microns.For in these chopping disks, poor by measuring height between peak on the cut edge of 13.5+/-1 micron of the object lens microscopes of 100 times and calibration digital camera and minimum point.Chopping disk for other finds similar value.These dishes are subsequently for test, be cutting performance on the glass plate of 0.6 millimeter at thickness to assess it, and relative to the cutting performance of prior art on these plates, observe substantive reduce lateral crevasse, the glacing flatness of intermediate cracking of improvement, the reproducible penetration of fracture and reduction glass plate edge cracked.
4. use the chopping disk with groove that 140 uniform intervals open and sharp keen cut edge of the sintered diamond of the cobalt binder of fine gtinding
Use the preparation of the sintered diamond of fine gtinding, cobalt binder according to prior art shaping, the chopping disk blank with continuous perimeter ridge.The size of the diamond particles used is less than 1 micron substantially.First by the thickness of the plate of this material polishing to 0.65 millimeter, then, electric discharge machine processing is used to cut out the cylinder with centre bore, subsequently, on each in these cylinders, the both sides intersecting at perimeter ridge polish the inclination taper region that total angle is 115 °.The radius of curvature of intersection is less than 1 micron substantially.Chopping disk has the diameter of the centre bore of 0.8 millimeter and 2.2+/-0.02 millimeter.Carry out clean with the dust and the pollutant that remove adhesion to three in these dishes be shaped according to prior art, subsequently, these five dishes are arranged on the diameter with 0.78 millimeter and are positioned on the axle in rotating gantry.By search telophragma cut edge, focus on thereon and relative to UV laser image make this cut edge realize between two parties and simply alignment.The mask with round shape opening to be positioned in the opticpath of UV laser beam and UV laser beam is projected on the sloping portion of chopping disk, making to penetrate the axis direction that light is basically perpendicular to rotating gantry axle.Laser fluence on chopping disk surface is approximately 4 joules/square centimeter, and wherein pulse recurrence rate is 70 pulses per second.Use 20 times of objective lens reduced by the image projection of mask on chopping disk.While laser beam is incident on chopping disk, it is made in the distance of about 0.2 millimeter, to carry out translation thus the groove of acquisition 0.22 millimeters long with the velocity along parallel of about 6 mm/min in the direction of rotating gantry axis.After making groove, cut off laser radiation and make rotating gantry stepping cross the angle of about 2.43 °.Subsequently, make another groove, but repeat this process until make the reeded chopping disk of tool on its whole taper region.In this approach, whole three chopping disks are processed.The cut edge formed has round-shaped, and wherein the groove distance of center to center is approximately 49 microns and recess width is 28 microns.For in these chopping disks, poor by measuring height between peak on the cut edge of 5.8+/-0.4 micron of the object lens microscopes of 100 times and calibration digital camera and minimum point.Chopping disk for other finds similar value.These dishes are subsequently for test, be cutting performance on the glass plate of 0.5 millimeter at thickness to assess it, and relative to the cutting performance of prior art on these plates, observe substantive reduce lateral crevasse, the glacing flatness of intermediate cracking of improvement, the reproducible penetration of fracture and reduction glass plate edge cracked.
5. use the chopping disk with groove that 170 uniform intervals open and sharp keen cut edge of the sintered diamond of the cobalt binder of fine gtinding
Use the preparation of the sintered diamond of fine gtinding, cobalt binder according to prior art shaping, the chopping disk blank with continuous perimeter ridge.The size of the diamond particles used is less than 1 micron substantially.First by the thickness of the plate of this material polishing to 0.5 millimeter, then, laser cutting is used to cut out the cylinder with centre bore, subsequently, on each in these cylinders, the both sides intersecting at perimeter ridge polish the inclination taper region that total angle is 95 °.The radius of curvature of intersection is less than 1 micron substantially.Chopping disk has the diameter of the centre bore of 0.8 millimeter and 1.7+/-0.02 millimeter.Carry out clean with the dust and the pollutant that remove adhesion to four in these dishes be shaped according to prior art, subsequently, these five dishes are arranged on the diameter with 0.78 millimeter and are positioned on the axle in rotating gantry.By searching the cut edge of the first dish and making this cut edge realize alignment between two parties and simply relative to UV laser image.The mask with rectangular aperture to be positioned in the opticpath of UV laser beam and UV laser beam is projected on the sloping portion of chopping disk, making incident ray be basically perpendicular to the axis direction of rotating gantry axle.Laser fluence on chopping disk surface is approximately 4 joules/square centimeter, and wherein pulse recurrence rate is 100 pulses per second.Use 25 times of objective lens reduced by the image projection of mask on chopping disk.While laser beam is incident on chopping disk, chopping disk keeps static, thus obtains the rectangular recess that length is 0.27 millimeter.After making groove, cut off laser radiation and make rotating gantry stepping cross the angle of about 2.12 °.Subsequently, make another groove, but repeat this process until make the reeded chopping disk of tool on its whole taper region.In this approach, whole four chopping disks are processed.The cut edge formed has rectangular shape, and wherein the groove distance of center to center is approximately 31 microns.Recess width is 19 microns.For in these chopping disks, poor by measuring height between peak on the cut edge of 3.8+/-0.3 micron of the object lens microscopes of 100 times and calibration digital camera and minimum point.Chopping disk for other finds similar value.These dishes are subsequently for test, be cutting performance on the glass plate of 0.4 millimeter at thickness to assess it, and relative to the cutting performance of prior art on these plates, observe substantive reduce lateral crevasse, the glacing flatness of intermediate cracking of improvement, the reproducible penetration of fracture and reduction glass plate edge cracked.
6. use the chopping disk with groove that 110 uniform intervals open and round as a ball cut edge of the sintered diamond of the cobalt binder of coarse grinding
Use coarse grinding, the sintered diamond preparation of cobalt binder is shaped according to prior art, has the chopping disk blank of continuous perimeter ridge.The size of the diamond particles used is between 2 to 3 microns.First by the thickness of the plate of this material polishing to 0.68 millimeter, then, laser cutting is used to cut out the cylinder with centre bore, subsequently, on each in these cylinders, the both sides intersecting at perimeter ridge are ground out the inclination taper region that total angle is 130 °.The radius of curvature of intersection is less than 3 microns substantially.Chopping disk has the diameter of the centre bore of 0.8 millimeter and 2.0+/-0.02 millimeter.Carry out clean with the dust and the pollutant that remove adhesion to three in these dishes be shaped according to prior art, subsequently, these five dishes are arranged on the diameter with 0.78 millimeter and are positioned on the axle in rotating gantry.By searching the cut edge of telophragma and making this cut edge realize alignment between two parties and simply relative to UV laser image.The mask with three circular opens to be positioned in the opticpath of UV laser beam and UV laser beam to be projected on the sloping portion of three chopping disks simultaneously, making incident ray be basically perpendicular to the axis direction of rotating gantry axle.Laser fluence on chopping disk surface is approximately 4 joules/square centimeter, and wherein pulse recurrence rate is 100 pulses per second.Use 15 times of objective lens reduced by the image projection of mask on chopping disk.While laser beam is incident on chopping disk, it is made in the distance of about 0.3 millimeter, to carry out translation thus the groove of acquisition 0.32 millimeters long with the velocity along parallel of about 6 mm/min in the direction of the axis of rotating gantry axle.After making one group of groove, cut off laser radiation and make rotating gantry stepping cross the angle of about 3.27 °.Subsequently, make another group groove, but repeat this process until make reeded three chopping disks of tool on its whole taper region.In this approach, process carried out to three chopping disks simultaneously and complete simultaneously.The cut edge formed has round-shaped, and wherein the groove distance of center to center is approximately 57 microns.Recess width is 32 microns.For in these chopping disks, poor by measuring height between peak on the cut edge of 9.5+/-0.8 micron of the object lens microscopes of 100 times and calibration digital camera and minimum point.Chopping disk for other finds similar value.These dishes are subsequently for test, be cutting performance on the glass plate of 0.6 millimeter at thickness to assess it, and relative to the cutting performance of prior art on these plates, observe substantive reduce lateral crevasse, the glacing flatness of intermediate cracking of improvement, the reproducible penetration of fracture and reduction glass plate edge cracked.
7. use the chopping disk with groove that 110 uniform intervals open and round as a ball cut edge of the sintered diamond of the cobalt binder of coarse grinding
Use the preparation of the sintered diamond of fine gtinding, cobalt binder according to prior art shaping, the chopping disk blank with continuous perimeter ridge.The size of the diamond particles used is between 2 to 3 microns.First by the thickness of the plate of this material polishing to 0.68 millimeter, then, electric discharge machine processing is used to cut out the cylinder with centre bore, subsequently, on each in these cylinders, the both sides intersecting at perimeter ridge are ground out the inclination taper region that total angle is 130 °.The radius of curvature of intersection is less than 3 microns substantially.Chopping disk has the diameter of the centre bore of 0.8 millimeter and 2.0+/-0.02 millimeter.Carry out clean with the dust and the pollutant that remove adhesion to three in these dishes be shaped according to prior art, subsequently, these five dishes are arranged on the diameter with 0.78 millimeter and are positioned on the axle in rotating gantry.By searching the cut edge of telophragma and making this cut edge realize alignment between two parties and simply relative to UV laser image.The mask with three prismatic openings to be positioned in the opticpath of UV laser beam and UV laser beam to be projected on the sloping portion of three chopping disks simultaneously, making incident ray be basically perpendicular to the axis direction of rotating gantry axle.Laser fluence on chopping disk surface is approximately 4 joules/square centimeter, and wherein pulse recurrence rate is 100 pulses per second.Use 15 times of objective lens reduced by the image projection of mask on chopping disk.While laser beam is incident on chopping disk, it is made in the distance of about 0.3 millimeter, to carry out translation thus the groove of acquisition 0.32 millimeters long with the velocity along parallel of about 6 mm/min in the direction of the axis of rotating gantry axle.After making one group of groove, cut off laser radiation and make rotating gantry stepping cross the angle of about 3.27 °.Subsequently, make another group groove, but repeat this process until make reeded three chopping disks of tool on its whole taper region.In this approach, process carried out to three chopping disks simultaneously and complete simultaneously.The cut edge formed has triangular shaped, and wherein the groove distance of center to center is approximately 57 microns.Recess width is 40 microns.For in these chopping disks, poor by measuring height between peak on the cut edge of 12+/-1 micron of the object lens microscopes of 100 times and calibration digital camera and minimum point.Chopping disk for other finds similar value.These dishes are subsequently for test, be cutting performance on the glass plate of 0.6 millimeter at thickness to assess it, and relative to the cutting performance of prior art on these plates, observe substantive reduce lateral crevasse, the glacing flatness of intermediate cracking of improvement, the reproducible penetration of fracture and reduction glass plate edge cracked.
8. use the adamantine chopping disk with groove that 110 uniform intervals open and sharp keen cut edge of the gummed of the carborundum of fine gtinding bonding
Use the gummed diamond preparation of carborundum bonding according to prior art shaping, the chopping disk blank with continuous perimeter ridge.First by the thickness of the plate of this material polishing to 0.6 millimeter, then, laser cutting is used to cut out the cylinder with centre bore, subsequently, on each in these cylinders, the both sides intersecting at perimeter ridge polish the inclination taper region that total angle is 120 °.The radius of curvature of intersection is less than 1 micron substantially.Chopping disk has the diameter of the centre bore of 0.8 millimeter and 1.8+/-0.02 millimeter.Carry out clean with the dust and the pollutant that remove adhesion to three in these dishes be shaped according to prior art, subsequently, these five dishes are arranged on the diameter with 0.78 millimeter and are positioned on the axle in rotating gantry.By searching the cut edge of the first dish and making this cut edge realize alignment between two parties and simply relative to UV laser image.The mask with circular open to be positioned in the opticpath of UV laser beam and UV laser beam is projected on the sloping portion of chopping disk, making incident ray be basically perpendicular to the axis direction of rotating gantry axle.Laser fluence on chopping disk surface is approximately 5 joules/square centimeter, and wherein pulse recurrence rate is 50 pulses per second.Use 15 times of objective lens reduced by the image projection of mask on chopping disk.While laser beam is incident on chopping disk, it is made in the distance of about 0.2 millimeter, to carry out translation thus the groove of acquisition 0.22 millimeters long with the velocity along parallel of about 2 mm/min in the direction of the axis of rotating gantry axle.After making groove, cut off laser radiation and make rotating gantry stepping cross the angle of about 3.27 °.Subsequently, make another groove, but repeat this process until make the reeded chopping disk of tool on its whole taper region.In this approach, whole three chopping disks are processed.The cut edge formed has round-shaped, and wherein the groove distance of center to center is approximately 51 microns.Recess width is 32 microns.For in these chopping disks, poor by measuring height between peak on the cut edge of 6.5+/-0.5 micron of the object lens microscopes of 100 times and calibration digital camera and minimum point.Chopping disk for other finds similar value.These dishes are subsequently for test, be cutting performance on the glass plate of 0.5 millimeter at thickness to assess it, and relative to the cutting performance of prior art on these plates, observe substantive reduce lateral crevasse, the glacing flatness of intermediate cracking of improvement, the reproducible penetration of fracture and reduction glass plate edge cracked.In the test in service life, in the shape of wheel, only can observe inapparent wearing and tearing, and the cutting performance of taking turns in the long-term line of glass plate is not weakened.
Be similar to and form " bright and clean " line crack by continuous limit sword chopping disk more early, the embodiment of chopping disk as above has the characteristic in desired formation " bright and clean " line crack, still provides enough dark crack simultaneously thus makes can reliably be ruptured after scribing by the main body of ruling or object.The problem of the lateral crevasse that the flute profile chopping disk also reducing prior art according to the embodiment of chopping disk of the present invention has, and decrease the problem of the cracked and non-straight fracture propagation occurred when using the chopping disk of this prior art.This can have the continuous print of the dish of adjacent projection and recessed cutting element, the scribing edge of circumference extension owing to these to a great extent.
The method of above-mentioned production chopping disk has lower requirement to chopping disk blank relative to the accuracy of the alignment of production equipment inherently, thus allows the multiple chopping disk of process and do not ask production equipment to align separately to each independent chopping disk.Described method and apparatus also allows the mode can carry out batch process to a certain degree, namely can manufacture the mode of more than one chopping disk in once, produces chopping disk.
Finally it should be noted that by suitably adjustment be used for manufacture dish preferred sintering or gummed diamond composition, can make according to said method produce chopping disk and prior art chopping disk service life maximize.
Claims (18)
1. one kind for forming the chopping disk of groove on the surface of object, described chopping disk comprises roughly disk-shaped body, described body has peripheral part, described peripheral part comprise assemble radially outwardly first circumference extend tapered surface and second week to extend tapered surface, described peripheral part limits scribing edge, described scribing edge has the adjacent protruding cutting element of circumference extension and recessed cutting element, wherein, multiple outward extending groove type is formed in described first tapered surface and described second tapered surface, the outer end alignment of the relative groove in corresponding tapered surface is to limit the female cutting element betwixt,
Wherein, described scribing edge has the sharp keen edge of the continuous print of protruding cutting element alternately and recessed cutting element, and described protruding cutting element and the female cutting element are circumferentially in alignment with each other.
2. chopping disk as claimed in claim 1, it is suitable for depicting groove on glass body, semiconductor, jewel, crystalline material main body or ceramic main body.
3. chopping disk as claimed in claim 1 or 2, wherein, described outward extending groove radially aligns.
4. chopping disk as claimed in claim 1 or 2, wherein, described outward extending groove is relative to the radius deflection of described chopping disk.
5. chopping disk as claimed in claim 1 or 2, wherein, described groove has equal width and the degree of depth.
6. chopping disk as claimed in claim 1 or 2, wherein, the vicissitudinous width of described groove tool and/or the degree of depth.
7. chopping disk as claimed in claim 1 or 2, wherein, the interval between adjacent groove is regular.
8. chopping disk as claimed in claim 1 or 2, wherein, the interval between adjacent groove is irregular.
9. chopping disk as claimed in claim 1 or 2, wherein, the degree of depth of described groove radially increases towards the direction of the periphery of described chopping disk, makes described groove have depth capacity at contiguous recessed cut edge place.
10. chopping disk as claimed in claim 1 or 2, wherein, the width of described groove is invariable along its length direction.
11. chopping disks as claimed in claim 1 or 2, wherein, the width of described groove changes along its length direction.
12. chopping disks as claimed in claim 11, wherein, optionally remove the material of the contrary tapered surface at the periphery place being positioned at described chopping disk, thus limit the cut edge with the projection of crooked outline, make the whole scribing edge of described chopping disk have sinuous outline.
13. chopping disks as claimed in claim 12, wherein, described sinuous outline corresponds to sinusoidal wave or another periodic shapes in shape.
14. chopping disks as claimed in claim 1 or 2, diamond particles that is that it comprises sintering or that glue together.
15. chopping disks as claimed in claim 14, it comprises the diamond particles that size is less than 3 microns.
16. chopping disks as claimed in claim 1 or 2, it comprises single-crystal diamond.
17. chopping disks as claimed in claim 1 or 2, it comprises polycrystalline diamond.
18. 1 kinds of methods manufacturing chopping disk, described chopping disk for forming groove on the surface of object, and described method comprises:
Supporting dish type blank, described blank has peripheral part, and described peripheral part comprises tapered surface and second week that the first circumference of assembling radially outwardly extends to the tapered surface extended;
Self-excitation light source produces focused beam;
Described light beam is covered according to predetermined cutting pattern;
Described light beam is focused on described blank; And
Described blank and described light beam are relative to each other moved, in described first tapered surface and described second tapered surface, multiple outward extending groove is formed to make described light beam, the outer end alignment of the relative groove in corresponding tapered surface is to limit recessed cutting element betwixt, between wherein said recessed cutting element, there is protruding cutting element, the adjacent protruding cutting element the replaced peripheral part of described chopping disk being limited have circumference to extend and the sharp keen scribing edge of the continuous print of recessed cutting element, described protruding cutting element and the female cutting element are circumferentially in alignment with each other.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ZA2007/00584 | 2007-01-19 | ||
| ZA200700584 | 2007-01-19 | ||
| PCT/IB2008/050204 WO2008087612A1 (en) | 2007-01-19 | 2008-01-21 | Cutting disk for forming a scribed line |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101730616A CN101730616A (en) | 2010-06-09 |
| CN101730616B true CN101730616B (en) | 2015-12-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880002650.2A Active CN101730616B (en) | 2007-01-19 | 2008-01-21 | For the formation of the chopping disk of groove |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP2121260B1 (en) |
| JP (1) | JP5414536B2 (en) |
| KR (1) | KR20090116749A (en) |
| CN (1) | CN101730616B (en) |
| ES (1) | ES2462746T3 (en) |
| WO (1) | WO2008087612A1 (en) |
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| DE202007013306U1 (en) * | 2007-09-22 | 2008-04-24 | Bohle Ag | cutting wheel |
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| DE102009017316B4 (en) * | 2009-04-16 | 2012-08-02 | Bohle Ag | Structured cutting wheel, method for its manufacture and cutting device |
| DE102010017625A1 (en) * | 2010-06-28 | 2011-12-29 | Bohle Ag | Cutting tool, in particular cutting wheel and method for its production |
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| JP5753504B2 (en) * | 2012-02-27 | 2015-07-22 | 三星ダイヤモンド工業株式会社 | A scribing wheel, a scribing device, and a scribing wheel manufacturing method. |
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- 2008-01-21 CN CN200880002650.2A patent/CN101730616B/en active Active
- 2008-01-21 JP JP2009546057A patent/JP5414536B2/en not_active Expired - Fee Related
- 2008-01-21 EP EP08702475.8A patent/EP2121260B1/en active Active
- 2008-01-21 KR KR1020097017327A patent/KR20090116749A/en not_active Application Discontinuation
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2010516481A (en) | 2010-05-20 |
| CN101730616A (en) | 2010-06-09 |
| JP5414536B2 (en) | 2014-02-12 |
| EP2121260B1 (en) | 2014-02-12 |
| WO2008087612A1 (en) | 2008-07-24 |
| KR20090116749A (en) | 2009-11-11 |
| ES2462746T3 (en) | 2014-05-26 |
| EP2121260A1 (en) | 2009-11-25 |
| WO2008087612A8 (en) | 2009-11-26 |
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