TWI796448B - Retainer unit with marking wheels and pins - Google Patents
Retainer unit with marking wheels and pins Download PDFInfo
- Publication number
- TWI796448B TWI796448B TW108108007A TW108108007A TWI796448B TW I796448 B TWI796448 B TW I796448B TW 108108007 A TW108108007 A TW 108108007A TW 108108007 A TW108108007 A TW 108108007A TW I796448 B TWI796448 B TW I796448B
- Authority
- TW
- Taiwan
- Prior art keywords
- pin
- scribing wheel
- scribing
- wheel
- concave portion
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/027—Scoring tool holders; Driving mechanisms therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
- B28D7/046—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work the supporting or holding device being of the vacuum type
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/037—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Abstract
本發明提供一種可容易地形成沿保持器單元之掃描方向之刻劃線之保持器單元、以及其劃線輪及銷。 銷70係支持劃線輪60之銷,且具備阻礙劃線輪60在銷70之軸向上相對於銷70而移動之限制部80。The present invention provides a holder unit capable of easily forming a scribed line along a scanning direction of the holder unit, and a scribing wheel and pin thereof. The pin 70 is a pin that supports the scribing wheel 60 , and includes a restricting portion 80 that prevents the scribing wheel 60 from moving relative to the pin 70 in the axial direction of the pin 70 .
Description
本發明係關於一種保持器單元以及其劃線輪及銷。 The present invention relates to a holder unit and its marking wheel and pin.
對於玻璃基板等脆性材料基板之刻劃線之形成係使用劃線裝置。於劃線裝置設置保持器單元、及掃描其之掃描裝置。保持器單元包含保持器本體、銷及劃線輪。保持器本體安裝於掃描裝置。銷支持於保持器本體。劃線輪支持於銷。於專利文獻1中,揭示有作為保持器單元之一例之劃線單元(20)。劃線單元(20)包含劃線輪(60)、將劃線輪(60)可旋轉地支持之銷(32)、及支持銷(32)之支持框體(33)。藉由劃線單元(20)對於脆性材料基板於特定之掃描方向掃描,而於脆性材料基板形成刻劃線。
A scribing device is used to form scribe lines on brittle material substrates such as glass substrates. A holder unit and a scanning device for scanning the holder unit are provided on the scribing device. The holder unit includes a holder body, pins and scoring wheels. The holder body is installed on the scanning device. The pins are supported by the holder body. The marking wheel is supported on a pin.
[專利文獻1]日本專利特開2012-106479號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2012-106479
先前之劃線裝置中,有例如於保持器單元在直線方向掃描之情形 時,非直線狀刻劃線形成於脆性材料基板之情況。於一例中,非直線狀刻劃線包含沿劃線輪之掃描方向之直線部分、及於不同於掃描方向之方向前進之非直線部分。非直線部分形成於刻劃線之1處或幾處之情形時,有刻劃線之大致整體之直線部分與非直線部分交替形成之情況等,非直線狀刻劃線之形狀多種多樣。於提高裂斷後之脆性材料基板之品質之方面而言,較佳為形成沿掃描方向之刻劃線。此不僅於形成直線狀刻劃線之情形時如此,於形成不同於直線之形狀之刻劃線之情形時亦相同。 In the previous scribing device, for example, the case where the holder unit scans in a linear direction In this case, the non-linear scribe line is formed on a brittle material substrate. In one example, the non-linear scribing line includes a linear portion along the scanning direction of the scribing wheel, and a non-linear portion advancing in a direction different from the scanning direction. When the non-linear part is formed at one or several places of the scribed line, there are cases where the linear part and the non-linear part of the substantially entire scribed line are alternately formed, etc. The shape of the non-linear scribed line is various. In terms of improving the quality of the brittle material substrate after fracture, it is preferable to form scribe lines along the scanning direction. This is true not only in the case of forming linear scribed lines, but also in the case of forming scribed lines in shapes other than straight lines.
(1)本發明相關之劃線輪之銷係支持劃線輪者,其具備阻礙上述劃線輪在上述銷之軸向上相對於上述銷而移動之限制部。 (1) The pin of the scribing wheel according to the present invention supports the scribing wheel, and has a restricting portion that prevents the scribing wheel from moving relative to the pin in the axial direction of the pin.
劃線輪之掃描時作用於銷之軸向之反作用力產生於劃線輪之情形時,藉由銷之限制部接收該反作用力。因此,抑制劃線輪在銷之軸向上相對於銷之移動。藉此,可容易形成沿保持器單元之掃描方向之刻劃線。 When the reaction force acting on the axial direction of the pin during the scanning of the scribing wheel is generated in the case of the scribing wheel, the reaction force is received by the restricting portion of the pin. Therefore, movement of the scribing wheel relative to the pin in the axial direction of the pin is suppressed. Thereby, scribe lines along the scanning direction of the holder unit can be easily formed.
(2)較佳例中,於(1)之劃線輪之銷中,上述限制部包含形成於上述銷之外周之凹部。 (2) In a preferred example, in the pin of the scribing wheel of (1), the restricting portion includes a recess formed on the outer periphery of the pin.
因此,限制部之構成簡單。 Therefore, the configuration of the restricting portion is simple.
(3)較佳例中,於(2)之劃線輪之銷中,上述凹部之面係曲面。 (3) In a preferred example, in the pin of the scribing wheel of (2), the surface of the above-mentioned concave portion is a curved surface.
因此,於凹部不易產生應力集中。 Therefore, stress concentration is less likely to occur in the concave portion.
(4)本發明相關之劃線輪係受(1)至(3)中任一項之銷支持之劃線輪, 其具備與上述限制部接觸之被限制部。 (4) The marking wheel system related to the present invention is supported by any one of the pins in (1) to (3), It includes a regulated portion in contact with the above-mentioned regulated portion.
根據上述劃線輪,獲得與(1)之效果相同之效果。 According to the above-mentioned scribing wheel, the same effect as that of (1) is obtained.
(5)較佳例中,(4)之劃線輪係受(2)之銷支持之劃線輪,上述被限制部包含插入至上述凹部之凸部。 (5) In a preferred example, the scribing wheel of (4) is a scribing wheel supported by the pin of (2), and the restricted portion includes a convex portion inserted into the concave portion.
因此,被限制部之構成簡單。 Therefore, the configuration of the restricted portion is simple.
(6)較佳例中,(5)之劃線輪係受(3)之銷支持之劃線輪,上述凸部之面係曲面。 (6) In a preferred example, the scribing wheel of (5) is a scribing wheel supported by the pin of (3), and the surface of the above-mentioned convex part is a curved surface.
因此,於凸部不易產生應力集中。 Therefore, stress concentration is less likely to occur on the convex portion.
(7)本發明相關之保持器單元具備(1)至(3)中任一項之銷、及(4)至(6)中任一項之劃線輪。 (7) The cage unit according to the present invention includes the pin of any one of (1) to (3), and the marking wheel of any one of (4) to (6).
根據上述保持器單元,獲得與(1)之效果相同之效果。 According to the above-mentioned retainer unit, the same effect as that of (1) is obtained.
(8)較佳例中,(7)之保持器單元具備(3)之銷及(6)之劃線輪,上述凹部之曲率半徑大於上述被限制部之曲率半徑。 (8) In a preferred example, the retainer unit of (7) includes the pin of (3) and the scribing wheel of (6), and the radius of curvature of the concave portion is larger than the radius of curvature of the restricted portion.
由於凹部與凸部線接觸,故劃線時之摩擦阻力變小。 Since the concave part and the convex part are in line contact, the frictional resistance during scribing becomes small.
根據本發明相關之保持器單元以及其劃線輪及銷,可容易形成沿保持器單元之掃描方向之刻劃線。 According to the holder unit and its scribing wheel and pins related to the present invention, it is possible to easily form a scribe line along the scanning direction of the holder unit.
1:劃線裝置 1: marking device
10:移動裝置 10:Mobile device
11:移動台 11:Mobile station
12:軌道 12: track
13:旋轉直進轉換裝置 13: Rotary straight conversion device
13A:馬達 13A: Motor
13B:進給螺桿部 13B: Feed screw part
20:平台裝置 20: Platform device
21:平台 21: Platform
22:馬達 22: motor
30:保持機構 30: Hold body
31:橋體 31: bridge body
31A:導向部 31A: guide part
32:支柱 32: Pillar
33:連結部 33: Connecting part
34:劃線頭 34: Scribing head
35:保持器接頭 35: Retainer connector
40:保持器單元 40: Retainer unit
50:保持器 50: retainer
51:槽部 51: Groove
51A:面 51A: surface
51B:面 51B: face
52:支持孔 52: Support hole
60:劃線輪 60:Scribing wheel
61:本體部 61: Body Department
61A:第1側面 61A: 1st side
61B:第2側面 61B: 2nd side
62:刀尖部 62: Knife tip
63:插入孔 63: Insertion hole
70:銷 70: pin
70A:一端部 70A: One end
71:外周面 71: Outer peripheral surface
80:限制部 80: Restricted Department
81:凹部 81: Concave
81A:面 81A: Noodles
81B:頂點 81B: Vertex
90:被限制部 90: Restricted Department
91:凸部 91: convex part
91A:面 91A: surface
91B:頂點 91B: Vertex
180:限制部 180: Restricted Department
181:凸部 181: convex part
181A:面 181A: Surface
190:被限制部 190: restricted department
191A:面 191A: surface
280:限制部 280: Restricted Department
281:凹部 281: Concave
290:被限制部 290: restricted department
291:凸部 291: convex part
DT:厚度方向 DT: thickness direction
GB:脆性材料基板 GB: Brittle material substrate
HA:高度 HA: height
J:旋轉中心軸 J: Center axis of rotation
LA:直線 LA: straight line
LB:直線 LB: straight line
SA:間隙 SA: Clearance
SB:間隙 SB: Gap
XA:深度 XA: Depth
XB:寬度 XB: width
圖1係實施形態之劃線裝置之立體圖。 Fig. 1 is a perspective view of a scribing device according to an embodiment.
圖2係圖1之保持器單元之剖視圖。 FIG. 2 is a cross-sectional view of the retainer unit in FIG. 1 .
圖3係第1變化例之保持器單元之剖視圖。 Fig. 3 is a cross-sectional view of a cage unit according to a first modification.
圖4係第2變化例之保持器單元之剖視圖。 Fig. 4 is a cross-sectional view of a cage unit according to a second modification.
(實施形態) (implementation form)
圖1所示之劃線裝置1係為將例如玻璃基板或陶瓷基板等由脆性材料形成之基板(以下係「脆性材料基板GB」)分斷,而用於在脆性材料基板GB之表面形成刻劃線。脆性材料基板GB之一例係玻璃基板。玻璃基板之一例係無鹼玻璃。無鹼玻璃使用於平板顯示器等。
The
構成劃線裝置1之主要要素係移動裝置10、平台裝置20、保持機構30及保持器單元40。移動裝置10於掃描方向掃描脆性材料基板GB。移動裝置10具備供搭載平台裝置20之移動台11。移動台11載置於一對軌道12上。旋轉直進轉換裝置13使移動台11沿軌道12移動。旋轉直進轉換裝置13之一例係進給螺桿裝置,具備成為驅動源之馬達13A、及連接於馬達13A之輸出軸之進給螺桿部13B。
The main elements constituting the
平台裝置20具備能以旋轉中心軸J為中心旋轉之平台21、及用以使平台21旋轉之馬達22。脆性材料基板GB載置於平台21上,藉由真空吸附機構(省略圖示)吸附於平台21,藉此保持於平台21。馬達22收容於平台21
內。馬達22藉由使平台21旋轉,而規定平台21之旋轉方向上之脆性材料基板GB之位置。
The
保持機構30保持保持器單元40。保持機構30具備以自上方橫跨平台21之方式設置之橋體31、及支持橋體31之一對支柱32。於橋體31設有導向部31A。於導向部31A,經由連結部33可移動地安裝有劃線頭34。連結部33及劃線頭34沿導向部31A移動。連結部33及劃線頭34係經由升降機構(省略圖示)連結。藉由升降機構驅動,而劃線頭34相對於連結部33於上下方向移動。於劃線頭34,經由保持器接頭35可裝卸地安裝有保持器單元40。
The holding
構成圖2所示之保持器單元40之主要要素係保持器50、劃線輪60及劃線輪60之銷70(以下係「銷70」)。由於劃線輪60係消耗品,故定期地更換。於一例中,藉由更換僅劃線輪60或保持器單元40,而進行劃線輪60之更換。
The main elements constituting the
構成保持器50之材料之一例係磁性體金屬。保持器50係大致圓柱形狀或角柱形狀。保持器50具備用以收容劃線輪60之一部分之槽部51、及以連通於槽部51之方式貫通保持器50之支持孔52。槽部51於在劃線頭34(參照圖1)安裝有保持器50之狀態下,向脆性材料基板GB開口。
An example of a material constituting the
銷70支持劃線輪60。銷70插入至支持孔52。銷70之一端部70A係前端變細形狀。支持孔52與銷70之關係可任意選擇。於第1例中,銷70以無
法相對於支持孔52旋轉之方式,固定於支持孔52。固定方法係壓入或接著。第1例之情形時,較佳為支持孔52之最大內徑與銷70之最大外徑實質上相等。於第2例中,銷70以無法相對於支持孔52旋轉之方式,插入至支持孔52。第2例之情形時,支持孔52之最大內徑若干大於銷70之最大外徑。以下,將銷70之中心軸之延伸方向稱為銷軸向。
The
構成劃線輪60之材料之一例係燒結金剛石(Poly Crystalline Diamond)、超硬合金、單晶金剛石及多晶金剛石。其他例中,有將硬質材料塗佈於劃線輪60之情形。硬質材料例如為金剛石。
Examples of materials constituting the
劃線輪60主要分成本體部61及刀尖部62。本體部61為圓板狀,且係劃線輪60中較刀尖部62更靠徑向內側之部分。刀尖部62係剖面V字狀,遍及劃線輪60之外周部之全周而形成。所謂剖面V字狀係以沿劃線輪60之厚度方向(以下稱「厚度方向DT」)之平面切割劃線輪60之剖面中朝劃線輪60之外周緣前端變細之形狀。以下之說明中,將與平行於劃線輪60之徑向之平面正交之剖面稱為正交剖面。於較佳例中,劃線輪60之外徑之一例包含於1mm~7mm之範圍內。於一例中,劃線輪60之外徑為2mm。劃線輪60之厚度之一例為0.64mm。再者,槽部51之厚度方向DT上之長度,即,槽部51之內表面中於厚度方向DT相向之2個面51A、51B之厚度方向DT之間之距離之一例為0.66mm。
The
於本體部61之中心部,形成有於厚度方向DT貫通本體部61之插入孔63。於插入孔63插入有銷70。本體部61具備形成插入孔63之一端之第1側
面61A、及形成插入孔63之另一端之第2側面61B。第1側面61A中收容於槽部51之部分隔著特定之間隙SA與槽部51之面51A對向。第2側面61B中收容於槽部51之部分隔著特定之間隙SB與槽部51之面51B對向。厚度方向DT上之間隙SA之大小與間隙SB之大小之關係可根據下述之限制部80之位置及大小而任意選擇。圖2所示之第1例中,厚度方向DT上之間隙SA之大小與間隙SB之大小相等。於第2例中,厚度方向DT上之間隙SA之大小與間隙SB之大小不同。
An
厚度方向DT上之間隙SA、SB之大小可任意設定。於較佳例中,厚度方向DT上之間隙SA、SB之大小係基於厚度方向DT上之保持器50之槽部51內之劃線輪60之傾斜之抑制容易度、及異物對間隙SA、SB堵塞之難度之關係而決定。異物之一例係因形成刻劃線而產生之脆性材料基板GB之切屑。厚度方向DT上之間隙SA、SB之大小之最大值之一例分別為10μm。間隙SA、SB之大小為10μm以下之情形時,容易抑制厚度方向DT上之保持器50之槽部51內之劃線輪60之傾斜。厚度方向DT上之間隙SA、SB之大小之最小值之一例分別為2μm。間隙SA、SB之大小為2μm以上之情形時,異物不易堵塞間隙SA、SB。進而,劃線輪60與保持器50不易干涉。厚度方向DT上之間隙SA、SB之合計大小之可取範圍之一例為4μm~20μm。
The size of the gaps SA and SB in the thickness direction DT can be set arbitrarily. In a preferred example, the size of the gaps SA, SB in the thickness direction DT is based on the ease of restraining the inclination of the
於脆性材料基板GB形成刻劃線之步驟中,於劃線輪60壓抵於脆性材料基板GB之表面之狀態下,保持器單元40於特定之掃描方向掃描。作為掃描方法,列舉使保持器單元40相對於脆性材料基板GB移動之方法、使
脆性材料基板GB相對於保持器單元40移動之方法、及組合該等方法而成之方法。脆性材料基板GB之劃線時,對於劃線輪60不僅作用有包含作用於掃描方向之相反方向之成分之第1反作用力,亦作用有包含銷軸向之成分之第2反作用力。此主要係因脆性材料基板GB表面之性狀不均勻而產生。表面性狀之不均勻例如係因不均勻地分佈於表面之多個微小凹凸及表面之彎曲等而產生。第2反作用力包含作用於銷軸向之一側即第1銷軸向之反作用力、及作用於銷軸向之另一側即第2軸向之反作用力。由於脆性材料基板GB之表面之凹凸形狀每個部位不同,故作用於劃線輪60之第2反作用力之方向及強度隨著劃線輪60之前進而變化。由於劃線輪60未相對於銷70固定,故隨著第2反作用力作用於劃線輪60,劃線輪60相對於銷70於銷軸向移位。以下之說明中,將劃線輪60相對於銷70向銷軸向之移動稱為「輪軸向移位」。
In the step of forming scribe lines on the brittle material substrate GB, the
輪軸向移位之方向及移位量主要依賴於作用於第1銷軸向之第2反作用力之強度與作用於第2銷軸向之第2反作用力之強度之關係。因產生輪軸向移位而形成非直線狀之刻劃線。藉由抑制該移位而不易形成非直線狀之刻劃線。保持器單元40具備抑制輪軸向移位之移位抑制構造。移位抑制構造包含設置於銷70之限制部80、及設置於劃線輪60之被限制部90。
The direction and amount of displacement of the wheel shaft mainly depend on the relationship between the strength of the second reaction force acting on the first pin shaft and the strength of the second reaction force acting on the second pin shaft. A non-linear scoring line is formed due to axial displacement of the wheel. By suppressing this displacement, it becomes difficult to form a non-linear scribed line. The
限制部80之構成可任意選擇。圖2所示之例中,限制部80包含形成於銷70之外周之凹部81。因此,限制部80之構成簡單。凹部81係以可與被限制部90接觸之方式,例如藉由對銷70之外周部實施研磨加工而形成之部分,不包含銷70之製造時形成之微小凹凸。凹部81繞銷70之外周1周。
銷70之軸向上之凹部81之位置可任意選擇。於一例中,凹部81設置於銷70之軸向上之中央。凹部81之面81A係對於銷70之外周面71朝銷70之中心軸側凹陷之曲面。因此,於凹部81不易產生應力集中。正交剖面上之面81A具有特定之曲率半徑RA。
The configuration of the restricting
銷70之直徑包含於0.4mm~1.1mm之範圍內。凹部81之深度XA包含於0.5μm~3.0μm之範圍內。凹部81之深度XA例如以正交剖面上通過銷70之外周面71之直線LA與凹部81之頂點81B之距離表示。
The diameter of the
銷軸向上之凹部81之寬度XB與劃線輪60之厚度相等。凹部81之寬度XB以於正交剖面上通過外周面71之直線LA上之凹部81之一緣與另一緣之距離表示。凹部81之寬度與劃線輪60之厚度相等,或大於劃線輪60之厚度。凹部81之寬度含在0.4mm~1.2mm之範圍內。
The width XB of the
被限制部90包含插入至凹部81之凸部91。因此,被限制部90之構成簡單。凸部91之面91A係於厚度方向DT上形成於第1側面61A與第2側面61B間、且由特定之曲率半徑RB規定之曲面。因此,於凸部91不易產生應力集中。凹部81之曲率半徑RA與凸部91之曲率半徑RB之關係可任意選擇。圖2所示之第1例中,凹部81之曲率半徑RA大於凸部91之曲率半徑RB。第1例之情形時,由於凹部81之面81A與凸部91之面91A線接觸,故劃線時之摩擦阻力變小。於第2例中,凹部81之曲率半徑RA與凸部91之曲率半徑RB相等,或小於凸部91之曲率半徑RB。凸部91之高度HA包含於0.1μm~1.0μm之範圍內,凸部91之高度HA包含於0.1μm~0.5μm之範
圍內。凸部91之高度HA以通過本體部61之側面61A、61B與面91A之邊界之直線LB與凸部91之頂點91B之距離表示。劃線輪60之插入孔63之凸部91之最小內徑若干大於銷70之最大外徑。
The restricted
針對保持器單元40之作用及效果進行說明。在劃線輪60壓抵於脆性材料基板GB且未掃描之狀態下,於正交剖面上劃線輪60之被限制部90之頂點91B與銷70之限制部80接觸。實際上,被限制部90之一定範圍與限制部80線接觸。被限制部90承受自限制部80向壓抵方向作用之反作用力。隨著劃線輪60之掃描因而第2反作用力作用於劃線輪60之情形時,藉由銷70之限制部80接收欲使被限制部90於銷軸向移動之第2反作用力。因此,劃線輪60之輪軸向移位受阻,劃線輪60沿掃描方向前進,於脆性材料基板GB形成直線狀之刻劃線。因此,可容易形成沿保持器單元40之掃描方向之刻劃線。
The function and effect of the
(變化例) (variation example)
上述實施形態係本發明相關之保持器單元以及其劃線輪及銷可採取之形態之例示,非意圖限制其形態。本發明相關之保持器單元以及其劃線輪及銷可採取與實施形態例示之形態不同之形態。其一例係置換、變更或省略實施形態之構成之一部分之形態,或對實施形態附加新構成之形態。以下,表示實施形態之變化例之一例。 The above-mentioned embodiment is an illustration of the form which the holder unit related to this invention and its scribing wheel and pin can take, and is not intended to limit the form. The retainer unit, its scribing wheel, and the pins according to the present invention may take different forms from those illustrated in the embodiments. One example is a form in which a part of the configuration of the embodiment is replaced, changed, or omitted, or a new configuration is added to the embodiment. An example of a modification example of the embodiment is shown below.
‧限制部80及被限制部90之構成可任意變更。圖3表示包含第1變化例之限制部180及被限制部190之保持器單元40之構成。限制部180包含形
成於銷70之外周之凸部181。凸部181係以可與被限制部190接觸之方式自銷70之外周面71突出之部分。凸部181遍及銷70之外周面71中之與劃線輪60之插入孔63對向之位置整體設置。銷70之軸向上之設置凸部181之位置可任意選擇。於一例中,凹部181設置於槽部51之軸向上之中央。凸部181之面181A係藉由特定之曲率半徑RA規定之曲面。被限制部190包含供插入凸部181之凹部191。凹部191係例如藉由對插入孔63實施研磨加工而形成之部分,不包含劃線輪60之製造時形成之微小凹凸。凹部191之面191A係形成於厚度方向DT上第1側面61A與第2側面61B間且由特定之曲率半徑RB規定之曲面。再者,第1變化例中,並非以一體之構件形成保持器50,而是設為以包含槽部51之面51A之部分及包含面51B之部分分割之構件,藉此可容易組裝保持器單元40。
‧The structure of the restricting
面181A之曲率半徑RA與面191A之曲率半徑RB之關係可任意選擇。圖3所示之第1例中,面181A之曲率半徑RA小於面191A之曲率半徑RB。第1例之情形時,由於面181A與面191A線接觸,故劃線時之摩擦阻力變小。於第2例中,面181A之曲率半徑RA與面191A之曲率半徑RB相等,或小於面191A之曲率半徑RB。
The relationship between the curvature radius RA of the
圖4表示具備第2變化例之限制部280及被限制部290之保持器單元40之構成。限制部280包含形成於銷70之外周面71之凹部281。凹部281係以可與被限制部290接觸之方式,例如藉由對銷70之外周面71實施研磨加工而形成之部分,不包含銷70之製造時形成之微小凹凸。凹部281遍及銷70之外周面71中之與劃線輪60之插入孔63對向之位置整體設置。銷70之軸
向上之設置凹部281之位置可任意選擇。於一例中,凹部281設置於銷70之軸向上之中央。凹部281係包含角之槽。圖4所示之例中,凹部281係V字狀之槽。被限制部290包含插入至凹部281之凸部291。凸部291形成於厚度方向DT上第1側面61A與第2側面61B之間。凸部291係包含角之突起。圖4所示之例中,凸部291係V字狀之突起。劃線輪60之插入孔63之凸部291之最小內徑稍大於銷70之最大外徑。
FIG. 4 shows the configuration of a
‧保持器單元40之構成可任意變更。於一例中,保持器單元40省略被限制部90。該情形時,較佳為限制部80之寬度大於劃線輪60之寬度,小於槽部51之寬度。又,限制部80及被限制部90之形狀亦並非限定於上述實施形態所揭示之構成,例如亦可設為一部分具有平坦部之形狀。又,凸部91之形狀與凹部81之形狀亦可不一致。該情形時,較佳為凹部81之寬度大於凸部91之寬度。
‧The configuration of the
40‧‧‧保持器單元 40‧‧‧Retainer unit
50‧‧‧保持器 50‧‧‧Retainer
51‧‧‧槽部 51‧‧‧groove
51A、51B‧‧‧面 51A, 51B‧‧‧face
52‧‧‧支持孔 52‧‧‧Support hole
60‧‧‧劃線輪 60‧‧‧Scribing wheel
61‧‧‧本體部 61‧‧‧Body Department
61A‧‧‧第1側面 61A‧‧‧1st side
61B‧‧‧第2側面 61B‧‧‧2nd side
62‧‧‧刀尖部 62‧‧‧Tool tip
63‧‧‧插入孔 63‧‧‧Insertion hole
70‧‧‧銷 70‧‧‧Pin
70A‧‧‧一端部 70A‧‧‧one end
71‧‧‧外周面 71‧‧‧outer peripheral surface
80‧‧‧限制部 80‧‧‧Restricted Department
81‧‧‧凹部 81‧‧‧Concave
81A‧‧‧面 81A‧‧‧face
81B‧‧‧頂點 81B‧‧‧Apex
90‧‧‧被限制部 90‧‧‧restricted part
91‧‧‧凸部 91‧‧‧convex part
91A‧‧‧面 91A‧‧‧face
91B‧‧‧頂點 91B‧‧‧Apex
DT‧‧‧厚度方向 DT‧‧‧thickness direction
GB‧‧‧脆性材料基板 GB‧‧‧brittle material substrate
HA‧‧‧高度 HA‧‧‧Height
LA‧‧‧直線 LA‧‧‧straight line
LB‧‧‧直線 LB‧‧‧straight line
SA‧‧‧間隙 SA‧‧‧Gap
SB‧‧‧間隙 SB‧‧‧Gap
XA‧‧‧深度 XA‧‧‧depth
XB‧‧‧寬度 XB‧‧‧width
Claims (6)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018066004A JP7053013B2 (en) | 2018-03-29 | 2018-03-29 | Holder unit and its scribing wheels and pins |
JP2018-066004 | 2018-03-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201941892A TW201941892A (en) | 2019-11-01 |
TWI796448B true TWI796448B (en) | 2023-03-21 |
Family
ID=68113030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108108007A TWI796448B (en) | 2018-03-29 | 2019-03-11 | Retainer unit with marking wheels and pins |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7053013B2 (en) |
KR (1) | KR20190114800A (en) |
CN (1) | CN110315648B (en) |
TW (1) | TWI796448B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023039779A1 (en) * | 2021-09-16 | 2023-03-23 | 深圳市摆渡微电子有限公司 | Wear-resistant cutter wheel |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11263631A (en) * | 1998-03-16 | 1999-09-28 | Beldex:Kk | Scribing device |
JP2003137575A (en) * | 2001-10-25 | 2003-05-14 | Toyo Sangyo Kk | Supporting device for glass cutter wheel and glass cutter |
JP2005281007A (en) * | 2004-03-03 | 2005-10-13 | Shiraitekku:Kk | Cutter holder for glass cutting machine |
TWI457301B (en) * | 2008-01-23 | 2014-10-21 | Asahi Glass Co Ltd | Cutter device for glass cutting machine |
CN105314833A (en) * | 2014-05-30 | 2016-02-10 | 三星钻石工业股份有限公司 | Scribe head and scribe apparatus |
CN107686235A (en) * | 2016-08-05 | 2018-02-13 | 丰泰科技股份有限公司 | Scribe head and the chalker for possessing it |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1424625A (en) * | 1922-01-14 | 1922-08-01 | Carl F Doerr | Rotary glass cutter |
JP5538090B2 (en) * | 2010-06-23 | 2014-07-02 | 株式会社ジャパンディスプレイ | Glass cutter |
JP5195982B2 (en) | 2010-10-18 | 2013-05-15 | 三星ダイヤモンド工業株式会社 | Scribe head and scribing device |
TW201412665A (en) * | 2012-09-26 | 2014-04-01 | Mitsuboshi Diamond Ind Co Ltd | Cutter wheel holder unit |
JP2015000497A (en) * | 2013-06-14 | 2015-01-05 | 三星ダイヤモンド工業株式会社 | Tip holder unit, tip holder, pin, wheel tip, and substrate processing device |
JP2015047718A (en) * | 2013-08-30 | 2015-03-16 | 三星ダイヤモンド工業株式会社 | Holder unit, scribe device, and holder |
JP6405717B2 (en) * | 2014-06-03 | 2018-10-17 | 三星ダイヤモンド工業株式会社 | Holder, holder unit and scribing device |
JP2015229302A (en) * | 2014-06-05 | 2015-12-21 | 三星ダイヤモンド工業株式会社 | Holder, holder unit and scribe device |
JP6424652B2 (en) * | 2015-02-02 | 2018-11-21 | 三星ダイヤモンド工業株式会社 | Holder, holder unit and scribing device |
CN104772784B (en) * | 2015-04-20 | 2016-09-28 | 张新兴 | A kind of cloth cutting machine is with simply installing cutter mechanism |
-
2018
- 2018-03-29 JP JP2018066004A patent/JP7053013B2/en active Active
-
2019
- 2019-03-11 TW TW108108007A patent/TWI796448B/en active
- 2019-03-21 CN CN201910216368.4A patent/CN110315648B/en active Active
- 2019-03-22 KR KR1020190032891A patent/KR20190114800A/en active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11263631A (en) * | 1998-03-16 | 1999-09-28 | Beldex:Kk | Scribing device |
JP2003137575A (en) * | 2001-10-25 | 2003-05-14 | Toyo Sangyo Kk | Supporting device for glass cutter wheel and glass cutter |
JP2005281007A (en) * | 2004-03-03 | 2005-10-13 | Shiraitekku:Kk | Cutter holder for glass cutting machine |
TWI457301B (en) * | 2008-01-23 | 2014-10-21 | Asahi Glass Co Ltd | Cutter device for glass cutting machine |
CN105314833A (en) * | 2014-05-30 | 2016-02-10 | 三星钻石工业股份有限公司 | Scribe head and scribe apparatus |
CN107686235A (en) * | 2016-08-05 | 2018-02-13 | 丰泰科技股份有限公司 | Scribe head and the chalker for possessing it |
Also Published As
Publication number | Publication date |
---|---|
JP2019171823A (en) | 2019-10-10 |
TW201941892A (en) | 2019-11-01 |
CN110315648A (en) | 2019-10-11 |
KR20190114800A (en) | 2019-10-10 |
CN110315648B (en) | 2022-09-06 |
JP7053013B2 (en) | 2022-04-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5390572B2 (en) | Scribing wheel for brittle material and scribing method, scribing apparatus and scribing tool using the same | |
JP4842015B2 (en) | Cutter wheel tip holder for brittle materials | |
TWI703102B (en) | Scribing wheel and manufacturing method of scribing wheel | |
KR20020013756A (en) | A cutter wheel for the substrate made of brittle materials and a scriber equipped with the same | |
CN105565654B (en) | Method for scribing thick plate glass and scribing wheel for scribing thick plate glass | |
JP2007152936A (en) | Wheel cutter for brittle material | |
KR20150026794A (en) | Scribing wheel, holder unit and scribing apparatus | |
KR102516664B1 (en) | Cutter wheel | |
TWI796448B (en) | Retainer unit with marking wheels and pins | |
KR20190125202A (en) | Holder unit and pin | |
CN109849196B (en) | Scribing wheel, cutter point support and supporting pin | |
KR101579817B1 (en) | Scribing wheel | |
TW201808569A (en) | Cutter wheel | |
CN112008890B (en) | Holder unit and pin | |
JP6182334B2 (en) | Manufacturing method of scribing wheel | |
JP7474475B2 (en) | Holder Unit and Pin | |
JP5075185B2 (en) | Scribing wheel | |
JP2011093190A (en) | Scribing wheel | |
CN108698903B (en) | Method for manufacturing plate-shaped glass | |
JP2019043124A (en) | Scribing wheel, method for producing the same, scribe method, and holder unit | |
KR102381646B1 (en) | Scribing wheel and method for manufacturing the same | |
JP2011104852A (en) | Scribing wheel | |
JP6344582B2 (en) | Scribing wheel, scribing device and dividing method | |
JP2020037194A (en) | Holder unit and scribe device | |
JP2020037193A (en) | Holder unit and scribe device |