CN101745990A - Cutter wheel for cutting brittle material and processing method thereof - Google Patents

Cutter wheel for cutting brittle material and processing method thereof Download PDF

Info

Publication number
CN101745990A
CN101745990A CN200810180553A CN200810180553A CN101745990A CN 101745990 A CN101745990 A CN 101745990A CN 200810180553 A CN200810180553 A CN 200810180553A CN 200810180553 A CN200810180553 A CN 200810180553A CN 101745990 A CN101745990 A CN 101745990A
Authority
CN
China
Prior art keywords
break bar
cutting edge
cutting
wire casing
brittle material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200810180553A
Other languages
Chinese (zh)
Inventor
孙春雨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SUN CHUNYV
Original Assignee
SUN CHUNYV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SUN CHUNYV filed Critical SUN CHUNYV
Priority to CN200810180553A priority Critical patent/CN101745990A/en
Priority to PCT/CN2009/001241 priority patent/WO2010063161A1/en
Publication of CN101745990A publication Critical patent/CN101745990A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • C03B33/105Details of cutting or scoring means, e.g. tips
    • C03B33/107Wheel design, e.g. materials, construction, shape
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006Cutting members therefor
    • B26D2001/006Cutting members therefor the cutting blade having a special shape, e.g. a special outline, serrations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/18Perforating by slitting, i.e. forming cuts closed at their ends without removal of material
    • B26F1/20Perforating by slitting, i.e. forming cuts closed at their ends without removal of material with tools carried by a rotating drum or similar support

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

The invention discloses a cutter wheel for cutting a brittle material and a processing method thereof. The cutter wheel is provided with a V-shaped cutting blade part (1), a disc surface (2) and an axle hole (3), wherein the periphery of the chine line l at the external edge of the V-shaped cutting blade part (1) is provided with cutting blades (4) and recess structures (5), which are alternately-distributed; each cutting blade (4) comprises curved surfaces (Part a1 and Part a2), four side surfaces (a3, a4, a5 and a6) and V-shaped cutting edges (V-shaped cutting edge 1, V-shaped cutting edge 2 and V-shaped cutting edge 3)of which the included angles are respectively psi1, psi2 and psi3; and the disc surface (2) and the axle hole are provided with grid-line grooves (6), and the cutting blades (4), the recess structures (5) and the grid-line grooves (6) are obtained by the processing in a laser scanning mode. The cutter wheel with the new structure can avoid or reduce the condition that the cutter wheel is blocked when the cutter wheel with other structures cuts the material, and can prevent the material from producing radial cracks, thereby prolonging the service life of the cutter wheel and simultaneously obtaining the high-grade cutting sections. Besides, the inner walls of the grid-line grooves (6) are coated with solid lubricant, thereby well solving the lubrication problem.

Description

A kind of break bar of cutting brittle material and processing method thereof
Technical field
The present invention relates to a kind of fragile material and comprise glass, pottery, silicon chip and semi-conductive cut-out and brisement break bar and processing method thereof, particularly a kind of break bar and processing method thereof that is used for glass-cutting.
Technical background
Along with the fast development of scientific and technological level, many fields require the thin thickness of fragile materials, and hardness is big, and require for the cut quality of fragile material also more and more higher, glass industry especially, below just be that example describes with the glass material.
Being used for carrying out the common trait that the discal blade wheel of glass-cutting has is: include the axis hole that cutting edge portion, break bar card and break bar center are used for installing cutter shaft.Wherein cutting edge portion is V-shaped, is convenient to cut glass, and the break bar material mainly is diamond, glomerocryst or polycrystalline diamond, Hardmetal materials, perhaps the composite of this different materials.
Present glass, especially the thickness of the used glass of LCD is more and more thinner from 2mm to 0.1mm, hardness is increasing, quality requirement to the glass plane of rupture is also higher simultaneously, requirement such as the pressure when making cutting, incision technology, brisement efficient and required precision are also all higher, give that cutting tool---the research and development of break bar have proposed very big challenge.
Patent ZL01124992.7 and CN200680003956.0, and the patent ZL200410104603.2 of the applicant application etc. proposed several micro-structurals in cutting edge portion processing, specifically referring to Fig. 6,8 and shown in Figure 9.These several micro-structurals all make cutting edge portion produce periodic tongue and groove respectively, when wherein break bar vertically being placed on horizontal plane, can see the break bar card for facing.Component among each figure (a) is respectively front view, (b) is respectively the partial enlarged drawing of front view cutting edge portion, (c) is the side view of break bar, and (d) figure is the part amplification of side view blade.The principle of cutting brittle material is: apply certain pressure to break bar when cutting, make the part incision glass inside of blade projection, and sunk part can not be cut glass inside, has then formed the periodicity cut channel that is interrupted.Adjacent cut channel can crack under the stress effect, and is connected by crackle, makes glass be cut open and brisement.
For the break bar of first kind of structure, as shown in Figure 6, the break bar blade is depression 61 structures and protruding 62 structures of circular arc and similar circular arc.But this structure mainly is the cutting problem that causes at the sliding cutter that solves in the cutting.Position 63 shown in the figure can not form cutting edge, can irregularly push glass when carrying out glass-cutting, makes glass produce multidirectional stress, and finally causes radial crack as shown in Figure 7, as shown in Figure 7, glass-cutting is caused serious destruction.
For the break bar of second kind of structure, as shown in Figure 8, the break bar blade is rectangular depression 81 and rectangular preiection 82 structures.This structure is when glass-cutting, and the glass micropowder that produces when rectangular depression 81 can be cut is filled, and results in blockage, and causes cutting incision to occur and has some setbacks.
For the break bar of the third structure, as shown in Figure 9, the break bar blade is the trapezoidal recess 91 and trapezoidal protruding 92 structures of falling, and can see this trapezoidal recess 91 and fall acute angle gamma of trapezoidal protruding 92 formation from vertical view.Similar to second kind of structure break bar, this structure is when glass-cutting, and the glass micropowder that produces when trapezoidal recess 91 also can be cut is filled, and results in blockage.
For the processing method of break bar, the method that proposes among the patent ZL200410104603.2 of the applicant's application and the other patent CN200680003956.0 with Laser Processing, the direction of laser beam is vertical with respect to the break bar card.When the processing micro structure of break bar outward flange crest line position, laser beam must run through material to cut off material in other words and could form micro-structural, and the laser beam that proposes among the patent CN200680003956.0 is a closure or inc curve with respect to the running orbit of break bar card, must get off the whole excision of break bar material that is included in the curve during Laser Processing, reach the purpose of separating with former break bar.The method can not be removed a zone with certain depth on material.
When break bar carries out work in addition, fixedly can high-speed friction between the knife rest of break bar and break bar card and cutter shaft and the break bar axis hole and need lubricatedly, use liquid lubricant can cause glass to pollute, thus break bar lubricated also be urgent problem.
At above-mentioned these problems, the invention provides a kind of above-mentioned radial crack of can either avoiding occurring, can not result in blockage break bar that is used for glass-cutting and other fragile material and processing method thereof that long service life and cut quality are high again.
Summary of the invention:
An object of the present invention is to provide a kind of break bar of cutting brittle material, particularly can the high-quality glass-cutting and improve the break bar in service life.
To achieve these goals, by the following technical solutions: a kind of break bar of cutting brittle material comprises by curved surface a 1, a 2And the angle that outward flange crest line l forms is ψ 1V-arrangement cutting edge portion 1, circular card 2 and central shaft hole 3, one week of outward flange crest line l of V-arrangement cutting edge portion 1 has alternatively distributed cutting edge 4 and sunk structure 5, each described cutting edge 4 comprises curved surface a 1And a 2Local and four side a 3, a 4, a 5And a 6, curved surface a 1Part and a 2Local intersecting lens is one section l of break bar outward flange crest line l 1, side a 3And a 4Intersecting lens be l 2, side a 5And a 6Intersecting lens be l 3, its mean camber a 1Local, a 2Part and their intersecting lens l 1Form V-arrangement cutting edge one, side a 3, a 4With intersection l 2Form V-arrangement cutting edge two, side a 5, a 6With intersection l 3Form V-arrangement cutting edge three.
According to the present invention, the angle of the described V-arrangement cutting edge one in the described cutting edge 4 is ψ 1, ψ 1Angular range be 70 the degree-170 the degree, the angle of described V-arrangement cutting edge two is ψ 2, ψ 2Angular range be 30 the degree-179.99 the degree, the angle of described V-arrangement cutting edge three is ψ 3, ψ 3Angular range also be 30 the degree-179.99 the degree, l 1Length range be 5um-2000um, l 2Length range be 0.5um-300um, l 3Length range also be 0.5um-300um.
According to the present invention, the side a of described cutting edge 4 3, a 4, a 5And a 6Can be that the plane also can be a curved surface.
According to the present invention, the profile and the angle of described alternatively distributed cutting edge 4 can be the same or different.
According to the present invention, the bottom of described sunk structure 5 can be plane or curved surface, can be that cave in or protruding.
According to the present invention, the bottom of described sunk structure 5 also can be by bottom surface a 7And a 8The angle that constitutes is ψ 4V-arrangement cutting edge four, the bottom surface a of V-arrangement cutting edge four wherein 7And a 8Intersecting lens be l 4
According to the present invention, four sides that the side also is a sunk structure 5 between adjacent two described cutting edges 4, described sunk structure 5 is the depressions with arbitrary shape of these four sides.
According to the present invention, described sunk structure 5 is away from crest line l 1The position can have side a 9, also can be bottom surface and curved surface a 1, a 2Rounding off.
According to the present invention, the number range of described cutting edge 4 and described sunk structure 5 is 30-3600, adjacent cutting edge 4 or sunk structure 5 are 0.1 degree-12 degree with respect to the angular range of the angle β at break bar card center, and the angle of each adjacent cutting edge 4 or sunk structure 5 pairing angle β can be the same or different.
According to the present invention, described card 2 has grid wire casing 6.
According to the present invention, described axis hole 3 has grid wire casing 6 '.
According to the present invention, the grid wire casing 6,6 ' that described card 2 and described axis hole 3 have can be straight line wire casing or curve wire casing, can be the parallel wire casing or the wire casing that intersects.
According to the present invention, the width range of every wire casing is 1um-800um in the described grid wire casing 6,6 ', and depth bounds is 1um-300um, and the interval of adjacent wire casing is 20um-800um.
According to the present invention, described break bar is a plate-like, and diameter range is 1mm-25mm, and the break bar material is diamond, glomerocryst or polycrystalline diamond, Hardmetal materials, perhaps the composite of this different materials.
A kind of processing method of break bar of cutting brittle material is ablated in the mode of break bar V-arrangement cutting edge portion 1 usefulness laser scanning and to be removed processing and obtain described cutting edge 4 and sunk structure 5, and laser beam 7 directions of break bar top are parallel to the break bar card.Comprise following procedure of processing:
1. the shape that needs processing is set, and sweep span d is set;
2. break bar is fixed on the cutter shaft 11 on the workbench 12, makes laser beam 7 directions of break bar top be parallel to the break bar card, and make laser beam 7 focus on V-arrangement cutting edge portion 1 edge;
3. by adjusting laser parameter and controlling the above-mentioned shape of laser beam 7 running orbits scanning, be removed by the certain thickness material at laser beam 7 irradiation positions near making the blade edge, process described sunk structure 5;
4. being axle perpendicular to break bar card and the straight line that passes the break bar geometric center, break bar is turned an angle, and 2. and 3. repeating step obtain second sunk structure 5, wherein do not have processed part to become the cutting edges 4 of realizing cutting brittle material in the middle of two adjacent recessed structures 5;
5. repeating above-mentioned steps obtains being alternately distributed at cutting edge portion 1 edge crest line l 1The cutting edge 4 in one week and sunk structure 5.
According to the present invention, also be included in the step of processing grid wire casing 6 on the card 2:
1. the pattern of planning grid wire casing 6, width and at interval, and sweep span d is set;
2. the break bar card is lain on the workbench, make laser beam 7 directions perpendicular to the break bar card;
3. focussed laser beam 7 is in break bar card surface;
4. and with the laser scanning ablation remove processing, obtain having the card 2 of grid wire casing 6, wherein the degree of depth of grid wire casing 6 can be controlled by adjusting laser parameter.
According to the present invention, also be included in the step of processing grid wire casing 6 in the axis hole 3:
1. setting has the cross spider or the parallel lines of certain width and certain intervals, and sweep span d is set;
2. break bar is tilted and fixing break bar, make laser beam 7 optical axises and card have certain angle, angular range is that 15 degree-45 are spent;
3. laser beam 7 is focused on the inwall of break bar axis hole, and a certain section of inclined-plane, inwall place is in laser beam 7 sweep limits and laser beam 7 focal depth ranges;
4. also rotate break bar simultaneously with the laser scanning grid, final processing obtains the axis hole 3 that one week of inwall has grid wire casing 6.
According to the present invention, when processing cutting edge 4 and sunk structure 5, the direction of laser beam also can with break bar card shape in an angle, be-89 degree spend to 89 the scope of this angle.
According to the present invention, used Wavelength of Laser scope is 157nm-2500nm, and the power bracket of laser is 0.01W-2000W, and the sweep speed scope of laser scanning is 0.01mm/s-1000mm/s.
According to the present invention, the mode of laser scanning mainly comprises simple scanning, shuttle-scanning and revolving scanning pattern, and the scope of the spacing d of adjacent scanning lines is 0.1um-300um in the laser scanning pattern.
The break bar of cutting brittle material of the present invention and the advantage of processing method thereof are:
The processing mode with laser scanning that this patent proposes can be removed the degree of depth of appointment by adjusting laser parameter and machined parameters at the arbitrary region of break bar material.
The break bar of the new construction that this patent proposes is at cutting brittle material, particularly during glass, when the cutting edge 4 at break bar blade 1 edge is cut fragile materials 8 inside, form the cut channel 9 of cycle shape (referring to accompanying drawing 5 being cut material surface, Fig. 5 (a) is that the break bar of being processed cuts schematic diagram on glass material, and Fig. 5 (b) is the partial enlarged drawing of border circular areas A5 among Fig. 5 (a)).The ψ that angle is 2V-arrangement cutting edge two and angle be ψ 3V-arrangement cutting edge three have the cutting power similar to cutting edge 4, its existence, not only reduced the required applied pressure of incision fragile material, the material that 9 break bar sunk structure 5 bottoms of adjacent cut channel are not reached is cut stress and splits, form crackle 10, crackle 10 is direct join parallel with cut channel (referring to the schematic diagram of accompanying drawing 5 (c) cutting back glass surface cut channel and crackle) very, make fragile material reach incision, and the purpose of high-quality brisement, can guarantee the high-quality cutting of glass material, and can avoid break bar to stop up and avoid glass to produce radial crack, and can prolong break bar service life and improve cutting efficiency and separate and to access high-quality glass-cutting section simultaneously.
Processing on the card 2 with grid wire casing 6 and axis hole 3 inwalls are coated with kollag, can solve lubrication problem well.
Description of drawings
Fig. 1 (a) is the break bar front view;
Fig. 1 (b) is the partial enlarged drawing of border circular areas A1 among Fig. 1 (a);
Fig. 1 (c) is the back side of Fig. 1 (b);
Fig. 2 (a) is the side view of break bar;
Fig. 2 (b) is that amplify the part of regional A2 among Fig. 2 (a);
Fig. 3 (a) is the cutaway view of break bar;
Fig. 3 (b) is that amplify the part of regional A3 among Fig. 3 (a);
Fig. 4 (a) is the cutting edge of break bar and the laser processing schematic diagram of sunk structure;
Fig. 4 (b) is unidirectional laser scanning manufacturing pattern
Fig. 4 (c) is reciprocal laser scanning manufacturing pattern
Fig. 4 (d) is revolution laser scanning manufacturing pattern
Fig. 5 (a) is that the break bar of being processed cuts schematic diagram on glass material;
Fig. 5 (b) is the partial enlarged drawing of border circular areas A5 among Fig. 5 (a);
Fig. 5 (c) is the schematic diagram of cutting back glass surface cut channel and crackle;
Fig. 6 (a) is the front view of circular-arc break bar;
Fig. 6 (b) is the partial enlarged drawing of border circular areas A6 among Fig. 6 (a);
Fig. 6 (c) is the side view of the circular-arc break bar of Fig. 6 (a);
Fig. 6 (d) is the partial enlarged drawing of border circular areas B6 among Fig. 6 (c);
Fig. 7 (a) is circular-arc break bar cutting and cutting result schematic diagram;
Fig. 7 (b) is the partial enlarged drawing of border circular areas A7 among Fig. 7 (a);
Fig. 7 (c) is cutting back material surface cut channel and crackle schematic diagram
Fig. 8 (a) is the front view of rectangular-shaped break bar;
Fig. 8 (b) is the partial enlarged drawing of border circular areas A8 among Fig. 8 (a);
Fig. 8 (c) is rectangular-shaped break bar side view;
Fig. 8 (d) is the partial enlarged drawing of border circular areas B8 among Fig. 8 (c);
Fig. 9 (a) is the front view of trapezoidal shape break bar;
Fig. 9 (b) is that amplify the part of border circular areas A9 among Fig. 9 (a);
Fig. 9 (c) is the side view of trapezoidal shape break bar;
Fig. 9 (d) is the partial enlarged drawing of border circular areas B9 among Fig. 9 (c).
Fig. 9 (e) is the profile of trapezoidal shape break bar;
Fig. 9 (f) is the partial enlarged drawing of border circular areas C9 among Fig. 9 (e);
The specific embodiment
Describe the break bar and the processing method thereof of a kind of cutting brittle material that proposes according to the present invention in detail below in conjunction with Fig. 1 to Fig. 5.
Of the present invention a kind of can cutting brittle material, particularly can cut the plate-like break bar of the thick glass material of 0.1mm-2mm, mainly be the break bar of a kind of new construction of obtaining in the break bar V-arrangement cutting edge position special micro-structural of processing of usefulness usually.
Wherein the break bar material is glomerocryst or polycrystalline diamond, also can be diamond, Hardmetal materials, perhaps the composite of this different materials; The thickness range of break bar is 0.3mm-5mm, and its typical thickness is 0.7mm; The diameter range of break bar is 1mm-25mm, and wherein representative diameter is 2.5mm; The diameter range of central shaft hole is 0.2mm-20mm, and wherein representative diameter is 0.8mm; The angle ψ of V-arrangement cutting edge portion 1 1The angular range of (referring to Fig. 2 (a)) can be 70 degree-170 degree, and its typical angle is 120 degree.
Referring to Fig. 1 to shown in Figure 3, break bar of the present invention mainly be V-arrangement cutting edge portion 1 edge crest line l be distributed with cutting edge 4 and sunk structure 5 week, break bar card 2 and break bar center are used for fixing the axis hole 3 of break bar up and down.
At first design V-arrangement cutting edge portion 1 one all alternatively distributed cutting edges 4 and sunk structures 5, the number range of cutting edge 4 and described sunk structure 5 is 30-3600, and adjacent cutting edge 4 or sunk structure 5 are 0.1 degree-12 degree with respect to the angular range of the angle β (referring to Fig. 1 (a)) at break bar card center.The size of each adjacent cutting edge 4 or sunk structure 5 and the angle of pairing angle β can be the same or different.
Each cutting edge 4 comprises curved surface a 1And a 2Local and four side a 3, a 4, a 5And a 6, side a 3, a 4, a 5And a 6Also be the side of sunk structure 5 simultaneously, these four faces can be that the plane also can be a curved surface.Its mean camber a 1Part and a 2Local intersecting lens is a section of crest line l, i.e. l 1, side a 3And a 4Intersection be l 2, side a 5And a 6Intersection be l 3L wherein 1Length range be 5um-2000um, l 2Length range be 0.5um-300um, l 3Length range also be 0.5um-300um.Each cutting edge 4 mean camber a 1Part and a 2One section-the l of part and their intersecting lens crest line l 1The formation angle is ψ 1V-arrangement cutting edge one (this V-arrangement cutting edge one is the part of former V-arrangement cutting edge portion 1), side a 3And a 4And intersection-l 2The formation angle is ψ 2V-arrangement cutting edge two, side a 5And a 6And intersection-l 3The formation angle is ψ 3V-arrangement cutting edge three, referring to Fig. 2 (b), wherein ψ 1Angular range be 70 degree-170 degree, ψ wherein 2Angular range be 30 degree-179.99 degree, ψ wherein 3Angular range also be 30 the degree-179.99 the degree.
Four sides that the side is a sunk structure 5 between adjacent two cutting edges 4, sunk structure 5 is the depressions with arbitrary shape of these four sides, its bottom is by bottom surface a 7And a 8The angle that constitutes is ψ 4V-arrangement cutting edge four, the bottom surface a of V-arrangement cutting edge four wherein 7And a 8Constitute crest line l 4Angle ψ 4Angular range be 30 the degree-180 the degree, crest line l 4Length range be 3um-2000um.The bottom of sunk structure 5 also can be the curved surface of plane or other shapes.
Sunk structure 5 is except having above-mentioned four sides and bottom surface, away from crest line l 1The position can have side a 9, also can be bottom surface and curved surface a 1, a 2Rounding off.
Break bar card 2 and axis hole 3 can have the grid wire casing 6,6 ' of lubricate up and down, grid wire casing 6,6 ' can be straight line wire casing or curve wire casing, can be the parallel wire casing or the wire casing that intersects, the width range of every wire casing is 1um-800um, depth bounds is 1um-300um, the interval of adjacent wire casing is 20um-800um, is coated with in grid wire casing 6 with kollag and can solves lubrication problem well.
It is processing object that present embodiment selects the polycrystalline diamond break bar, and all parameters are all selected its representative value for use.
Break bar typical sizes parameter: diameter is 2.5mm, and thickness is 0.7mm, and the diameter of axis hole is 0.8mm, angle
Figure G2008101805534D0000091
Angle be 120 the degree.
Select for use cutting edge 4 identical with the angle of sunk structure 5 pairing angle β, be representative value 7.2 degree, then number respectively is 50.
Shown in accompanying drawing 1-3, the crest line l of the V-arrangement cutting edge one of present embodiment design cutting edge 4 1Be 90um, four sides are the plane, and highly identical; The angle and the crest line of design V-arrangement cutting edge two and V-arrangement cutting edge three are representative value, angle ψ 2, ψ 3Be 100 degree, crest line l 2And l 3Parallel and be 40um; The bottom surface of design sunk structure 5 is a curved surface, the angle ψ of V-arrangement cutting edge four 4Be 120 degree, crest line l 4Correspondingly be 67um, and bottom surface a 7And a 8Be parallel to corresponding curved surface a respectively 1And a 2The part, l 2And l 3Respectively perpendicular to l 4The tangent line of intersection point; Design sunk structure 5 is away from crest line l 1End also has two side a 9, and be parallel to crest line l respectively 2, l 3And l 4The face at place, the spacing between these two sides is designed to 150um.
Grid wire casing 6 is a cross linear in design break bar card 2 and the axis hole 3, and the width of wire casing is 40um, and the degree of depth is 40um, and the interval of adjacent wire casing is 100um.
The processing method of the new construction break bar that relates among the present invention is characterized in that: in the break bar on cutting edge 4 and sunk structure 5 and the break bar card 2 and the grid wire casing 6 in the break bar axis hole 3 be to ablate with the mode of laser scanning to remove processing break bar material and obtain.Used Wavelength of Laser scope is 157nm-2500nm, and the power bracket of laser is 0.01W-2000W.The mode of laser scanning mainly comprises simple scanning, shuttle-scanning and revolving scanning pattern.Its wavelength of the laser instrument of selecting for use in the present embodiment is the laser of 1064nm, and peak power is 30W, and the laser scanning methods of employing is the shuttle-scanning pattern.
When processing cutting edge 4 and sunk structure 5, the direction of the laser beam 7 of break bar top also can with break bar card shape in an angle, be-89 degree spend to 89 the scope of this angle, it is parallel with the break bar card that present embodiment is got laser beam, its processing comprises the steps:
1. the shape that needs processing is set, and sweep span d is set, the scope of spacing d is 0.1um-300um, gets representative value 5um here;
2. break bar is fixed on the cutter shaft 11 on the workbench 12, makes laser beam 7 directions of break bar top be parallel to the break bar card, and make laser beam 7 focus on V-arrangement cutting edge portion 1 edge;
3. by adjusting laser parameter and controlling the above-mentioned shape of laser beam 7 running orbits scanning, be removed by the certain thickness material at laser beam 7 irradiation positions near making the blade edge, process described sunk structure 5;
4. being axle perpendicular to break bar card and the straight line that passes the break bar geometric center, make break bar rotate above-mentioned angle 7.2 degree, and 3. repeating step obtain second sunk structure 5, wherein do not have processed part to become the cutting edges 4 of realizing cutting brittle material in the middle of two adjacent recessed structures 5;
5. repeat above-mentioned steps and obtain being alternately distributed cutting edge 4 and sunk structure 5 in 1 one week of edge crest line l of cutting edge portion.
When processing cutting edge 4 and sunk structure 5, the sweep speed scope of laser scanning is 0.01mm/s-1000mm/s, and present embodiment is got its representative value 10mm/s.
The processing of the grid wire casing 6 on the break bar card 2 comprises following procedure of processing:
1. press pattern, width and the interval of the described planning grid wire casing 6 of above-mentioned present embodiment, and sweep span d is set, the scope of spacing d is 0.1um-300um, and its value is 5um in the present embodiment;
2. the break bar card is lain on the workbench, make laser beam 7 directions perpendicular to the break bar card;
3. focussed laser beam 7 is in break bar card surface;
4. and with the laser scanning ablation remove processing, obtain having the card 2 of grid wire casing 6, wherein the degree of depth of grid wire casing 6 can be controlled by adjusting laser parameter.
The processing of the grid wire casing 6 in the break bar axis hole 3 comprises following procedure of processing:
1. pattern, width and the interval of grid wire casing 6 are set, and the sweep span d of laser is set, the scope of spacing d is 0.1um-300um, and its value still is 5um in the present embodiment;
2. break bar is tilted and fixing break bar, make laser beam 7 optical axises and card have certain angle, angular range is 15 degree-45 degree, and its angle is 25 to spend in the present embodiment;
3. laser beam 7 is focused on the inwall of break bar axis hole, and a certain section of inclined-plane, inwall place is in laser beam 7 sweep limits and laser beam 7 focal depth ranges;
4. also rotate break bar simultaneously with the laser scanning grid, final processing obtains the axis hole 3 that one week of inwall has grid wire casing 6.
When processing grid wire casing 6, the sweep speed scope of laser scanning is 0.01mm/s-1000mm/s, and present embodiment is got its representative value 50mm/s.
With the break bar of above-mentioned conceptual design and the new construction that processes at cutting brittle material, particularly during glass, when the cutting edge 4 at break bar blade 1 edge is cut fragile materials 8 inside, form the cut channel 9 of cycle shape (referring to accompanying drawing 5 being cut material surface, Fig. 5 (a) is that the break bar of being processed cuts schematic diagram on glass material, and Fig. 5 (b) is the partial enlarged drawing of border circular areas A5 among Fig. 5 (a)).The ψ that angle is 2V-arrangement cutting edge two and angle be ψ 3V-arrangement cutting edge three have the cutting power similar to cutting edge 4, its existence, not only reduced the required applied pressure of incision fragile material, the material that 9 break bar sunk structure 5 bottoms of adjacent cut channel are not reached is cut stress and splits, form crackle 10, crackle 10 is direct join parallel with cut channel (referring to the schematic diagram of accompanying drawing 5 (c) cutting back glass surface cut channel and crackle) very, make fragile material reach incision, and the purpose of high-quality brisement, can guarantee the high-quality cutting of glass material, and can avoid break bar to stop up and avoid glass to produce radial crack, and can prolong break bar service life and improve cutting efficiency and separate and to access high-quality glass-cutting section simultaneously.
Processing on the card 2 with grid wire casing 6 and axis hole 3 inwalls are coated with kollag, can solve lubrication problem well.

Claims (20)

1. the break bar of a cutting brittle material comprises by curved surface a 1, a 2And the angle that outward flange crest line l forms is ψ 1V-arrangement cutting edge portion (1), circular card (2) and central shaft hole (3), one week of outward flange crest line l of V-arrangement cutting edge portion (1) has alternatively distributed cutting edge (4) and sunk structure (5), it is characterized in that: each described cutting edge (4) comprises curved surface a 1And a 2Local and four side a 3, a 4, a 5And a 6, curved surface a 1Part and a 2Local intersecting lens is one section l of break bar outward flange crest line l 1, side a 3And a 4Intersecting lens be l 2, side a 5And a 6Intersecting lens be l 3, its mean camber a 1Local, a 2Part and their intersecting lens l 1Form V-arrangement cutting edge one, side a 3, a 4With intersection l 2Form V-arrangement cutting edge two, side a 5, a 6With intersection l 3Form V-arrangement cutting edge three.
2. the break bar of a kind of cutting brittle material according to claim 1, it is characterized in that: the angle of the described V-arrangement cutting edge one in the described cutting edge (4) is ψ 1, ψ 1Angular range be 70 the degree-170 the degree, the angle of described V-arrangement cutting edge two is ψ 2, ψ 2Angular range be 30 the degree-179.99 the degree, the angle of described V-arrangement cutting edge three is ψ 3, ψ 3Angular range also be 30 the degree-179.99 the degree, l 1Length range be 5um-2000um, l 2Length range be 0.5um-300um, l 3Length range also be 0.5um-300um.
3. according to the break bar of the described a kind of cutting brittle material of claim 1 to 3, it is characterized in that: the side a of described cutting edge (4) 3, a 4, a 5And a 6Can be that the plane also can be a curved surface.
4. according to the break bar of the described a kind of cutting brittle material of claim 1 to 3, it is characterized in that: the profile and the angle of described alternatively distributed cutting edge (4) can be the same or different.
5. the break bar of a kind of cutting brittle material according to claim 1, it is characterized in that: the bottom of described sunk structure (5) can be plane or curved surface, can be depression or projection.
6. the break bar of a kind of cutting brittle material according to claim 1, it is characterized in that: the bottom of described sunk structure (5) also can be by bottom surface a 7And a 8The angle that constitutes is ψ 4V-arrangement cutting edge four, the bottom surface a of V-arrangement cutting edge four wherein 7And a 8Intersecting lens be l 4
7. the break bar of a kind of cutting brittle material according to claim 1, it is characterized in that: four sides between adjacent two described cutting edges (4) also are the sides of a sunk structure (5), and described sunk structure (5) is the depression with arbitrary shape of these four sides.
8. according to the break bar of claim 1 or 7 described a kind of cutting brittle materials, it is characterized in that: described sunk structure (5) is away from crest line l 1The position can have side a 9,, also can be bottom surface and curved surface a 1, a 2Rounding off.
9. the break bar of a kind of cutting brittle material according to claim 1, it is characterized in that: the number range of described cutting edge (4) and described sunk structure (5) is 30-3600, adjacent cutting edge (4) or sunk structure (5) are 0.1 degree-12 degree with respect to the angular range of the angle β at break bar card center, and the angle of each adjacent cutting edge (4) or the pairing angle β of sunk structure (5) can be the same or different.
10. the break bar of a kind of cutting brittle material according to claim 1, it is characterized in that: described card (2) has grid wire casing (6).
11. the break bar of a kind of cutting brittle material according to claim 1 is characterized in that: described axis hole (3) has grid wire casing (6 ').
12. break bar according to claim 1 or 10 or 11 described a kind of cutting brittle materials, it is characterized in that: the grid wire casing (6,6 ') that described card (2) and described axis hole (3) have can be straight line wire casing or curve wire casing, can be the parallel wire casing or the wire casing that intersects.
13. break bar according to claim 1 or 10 or 11 described a kind of cutting brittle materials, it is characterized in that: the width range of every wire casing is 1um-800um in the described grid wire casing (6,6 '), depth bounds is 1um-300um, and the interval of adjacent wire casing is 20um-800um.
14. the break bar of a kind of cutting brittle material according to claim 1, it is characterized in that: described break bar is a plate-like, diameter range is 1mm-25mm, and the break bar material is diamond, glomerocryst or polycrystalline diamond, Hardmetal materials, perhaps the composite of this different materials.
15. the processing method of the break bar of a cutting brittle material, it is characterized in that: ablating to remove to process with the mode of laser scanning at break bar V-arrangement cutting edge portion (1) obtains described cutting edge (4) and sunk structure (5), and laser beam (7) direction of break bar top is parallel to the break bar card.Comprise following procedure of processing:
1. the shape that needs processing is set, and sweep span d is set;
2. break bar is fixed on the cutter shaft (11) on the workbench (12), makes laser beam (7) direction of break bar top be parallel to the break bar card, and make laser beam (7) focus on V-arrangement cutting edge portion (1) edge;
3. by adjusting laser parameter and controlling the above-mentioned shape of laser beam (7) running orbit scanning, be removed by the certain thickness material at laser beam (7) irradiation position near making the blade edge, process described sunk structure (5);
4. being axle perpendicular to break bar card and the straight line that passes the break bar geometric center, break bar is turned an angle, and 2. and 3. repeating step obtain second sunk structure (5), wherein do not have processed part to become the cutting edge (4) of realizing cutting brittle material in the middle of two adjacent recessed structures (5);
5. repeating above-mentioned steps obtains being alternately distributed at cutting edge portion (1) edge crest line l 1Cutting edge in one week (4) and sunk structure (5).
16. the processing method of the break bar of a kind of cutting brittle material according to claim 15 is characterized in that: also be included in the step that card (2) goes up processing grid wire casing (6):
1. the pattern of planning grid wire casing (6), width and at interval, and sweep span d is set;
2. the break bar card is lain on the workbench, make laser beam (7) direction perpendicular to the break bar card;
3. focussed laser beam (7) is in break bar card surface;
4. and with the laser scanning ablation remove processing, obtain having the card (2) of grid wire casing (6), wherein the degree of depth of grid wire casing (6) can be controlled by adjusting laser parameter.
17. the processing method of the break bar of a kind of cutting brittle material according to claim 15 is characterized in that: the step that also is included in processing grid wire casing (6) in the axis hole (3):
1. setting has the cross spider or the parallel lines of certain width and certain intervals, and sweep span d is set;
2. break bar is tilted and fixing break bar, make laser beam (7) optical axis and card have certain angle, angular range is that 15 degree-45 are spent;
3. laser beam (7) is focused on the inwall of break bar axis hole, and a certain section of inclined-plane, inwall place is in laser beam (7) sweep limits and laser beam (7) focal depth range;
4. also rotate break bar simultaneously with the laser scanning grid, final processing obtains having in one week of inwall the axis hole (3) of grid wire casing (6).
18. the processing method of the break bar of a kind of cutting brittle material according to claim 15, it is characterized in that: when processing cutting edge (4) and sunk structure (5), the direction of laser beam also can with break bar card shape in an angle, the scope of this angle be-89 the degree to 89 the degree.
19. processing method according to the break bar of the described a kind of cutting brittle material of claim 15-17, it is characterized in that: used Wavelength of Laser scope is 157nm-2500nm, the power bracket of laser is 0.01W-2000W, and the sweep speed scope of laser scanning is 0.01mm/s-1000mm/s.
20. processing method according to the break bar of the described a kind of cutting brittle material of claim 15-17, it is characterized in that: the mode of laser scanning mainly comprises simple scanning, shuttle-scanning and revolving scanning pattern, the scope of the spacing d of adjacent scanning lines is 0.1um-300um in the laser scanning pattern.
CN200810180553A 2008-12-01 2008-12-01 Cutter wheel for cutting brittle material and processing method thereof Pending CN101745990A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200810180553A CN101745990A (en) 2008-12-01 2008-12-01 Cutter wheel for cutting brittle material and processing method thereof
PCT/CN2009/001241 WO2010063161A1 (en) 2008-12-01 2009-11-09 Cutter wheel for cutting fragile material and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200810180553A CN101745990A (en) 2008-12-01 2008-12-01 Cutter wheel for cutting brittle material and processing method thereof

Publications (1)

Publication Number Publication Date
CN101745990A true CN101745990A (en) 2010-06-23

Family

ID=42232865

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810180553A Pending CN101745990A (en) 2008-12-01 2008-12-01 Cutter wheel for cutting brittle material and processing method thereof

Country Status (2)

Country Link
CN (1) CN101745990A (en)
WO (1) WO2010063161A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012075666A1 (en) * 2010-12-07 2012-06-14 Sun Chunyu Cutter wheel for cutting glass material
US20150175470A1 (en) * 2012-07-27 2015-06-25 Ehwa Diamond Industrial Co., Ltd. Scribing wheel having fine structure recess
CN105149790A (en) * 2015-07-10 2015-12-16 西安交通大学 Deep machining method and system for annular diamond cutter of millimeter and submillimeter size
CN105365058A (en) * 2014-05-26 2016-03-02 孙春雨 A cutting knife wheel for fragile materials
CN106041321A (en) * 2016-07-19 2016-10-26 北京沃尔德金刚石工具股份有限公司 Cutter wheel repair method
CN107140820A (en) * 2017-06-20 2017-09-08 嘉兴沃尔德金刚石工具有限公司 A kind of break bar for carrying chip-removal hole battle array
CN107311440A (en) * 2016-04-26 2017-11-03 三星钻石工业股份有限公司 Delineate head unit
CN107414321A (en) * 2017-09-27 2017-12-01 杨沁玥 A kind of teeth groove laser cutting parameter
CN107555774A (en) * 2017-09-18 2018-01-09 嘉兴沃尔德金刚石工具有限公司 Break bar with cutting edge groove
CN109849197A (en) * 2017-11-30 2019-06-07 三星钻石工业股份有限公司 Stitch marker
CN110802752A (en) * 2019-10-12 2020-02-18 深圳市金武科技有限公司 Glass cutter and processing method thereof
CN112374257A (en) * 2020-10-28 2021-02-19 惠州市巨星科技有限公司 Slitting mechanism for lithium battery

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102179635B (en) * 2011-04-26 2014-07-16 哈尔滨工业大学 Processing method and device for carrying out microwave cutting on brittle material
CN104480255B (en) * 2014-12-22 2017-04-05 中山市奥美森工业有限公司 A kind of manufacture craft of disintegrating machine moving knife
DE102017104154A1 (en) * 2017-02-28 2018-08-30 Wink Stanzwerkzeuge Gmbh & Co. Kg Method for producing a stamped sheet
CN107176784B (en) * 2017-07-13 2023-07-18 嘉兴沃尔德金刚石工具有限公司 Hole-free knife wheel
CN108341589B (en) * 2018-04-19 2024-01-23 嘉兴沃尔德金刚石工具有限公司 Knife wheel with platform
JP2022038435A (en) * 2020-08-26 2022-03-10 ファインテック株式会社 Scribing wheel for brittle material substrate and method for producing the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005072926A1 (en) * 2004-02-02 2005-08-11 Mitsuboshi Diamond Industrial Co., Ltd. Cutter wheel, scribing method and cutting method for fragile material substrate using the cutter wheel, and method of manufacturing cutter wheel
KR20050095733A (en) * 2004-03-27 2005-09-30 엘지.필립스 엘시디 주식회사 Cutting wheel of glass and method for fabricating liquid crystal display device using the same
TW200609191A (en) * 2004-09-07 2006-03-16 Tzujan Dev Inst The rotary knife of a glasscutter and its manufacturing method
TWI380868B (en) * 2005-02-02 2013-01-01 Mitsuboshi Diamond Ind Co Ltdl Fine processing method of sintered diamond using laser, cutter wheel for brittle material substrate, and method of manufacturing the same
JP2007194469A (en) * 2006-01-20 2007-08-02 Renesas Technology Corp Method for manufacturing semiconductor device
CN200991967Y (en) * 2006-12-19 2007-12-19 劲钻科技股份有限公司 Cutter wheel for fragile board material

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102531373A (en) * 2010-12-07 2012-07-04 孙春雨 Cutter wheel for cutting glass material
CN102531373B (en) * 2010-12-07 2016-01-06 孙春雨 A kind of break bar of glass-cutting material
WO2012075666A1 (en) * 2010-12-07 2012-06-14 Sun Chunyu Cutter wheel for cutting glass material
CN108481580A (en) * 2012-07-27 2018-09-04 二和钻石工业股份有限公司 Stitch marker with fine structure groove
US20150175470A1 (en) * 2012-07-27 2015-06-25 Ehwa Diamond Industrial Co., Ltd. Scribing wheel having fine structure recess
CN108481580B (en) * 2012-07-27 2020-10-23 二和钻石工业股份有限公司 Scribing wheel with precise structure groove
US10358375B2 (en) * 2012-07-27 2019-07-23 Ehwa Diamond Industrial Co., Ltd. Scribing wheel having fine structure recess
CN105365058A (en) * 2014-05-26 2016-03-02 孙春雨 A cutting knife wheel for fragile materials
CN105149790A (en) * 2015-07-10 2015-12-16 西安交通大学 Deep machining method and system for annular diamond cutter of millimeter and submillimeter size
CN107311440A (en) * 2016-04-26 2017-11-03 三星钻石工业股份有限公司 Delineate head unit
CN107311440B (en) * 2016-04-26 2021-12-17 三星钻石工业股份有限公司 Scribe head unit
CN106041321A (en) * 2016-07-19 2016-10-26 北京沃尔德金刚石工具股份有限公司 Cutter wheel repair method
CN106041321B (en) * 2016-07-19 2018-02-06 嘉兴沃尔德金刚石工具有限公司 A kind of method of break bar reparation
CN107140820B (en) * 2017-06-20 2023-10-27 嘉兴沃尔德金刚石工具有限公司 Cutter wheel with chip removal hole array
CN107140820A (en) * 2017-06-20 2017-09-08 嘉兴沃尔德金刚石工具有限公司 A kind of break bar for carrying chip-removal hole battle array
CN107555774A (en) * 2017-09-18 2018-01-09 嘉兴沃尔德金刚石工具有限公司 Break bar with cutting edge groove
CN107414321A (en) * 2017-09-27 2017-12-01 杨沁玥 A kind of teeth groove laser cutting parameter
CN109849197A (en) * 2017-11-30 2019-06-07 三星钻石工业股份有限公司 Stitch marker
CN110802752A (en) * 2019-10-12 2020-02-18 深圳市金武科技有限公司 Glass cutter and processing method thereof
CN112374257A (en) * 2020-10-28 2021-02-19 惠州市巨星科技有限公司 Slitting mechanism for lithium battery

Also Published As

Publication number Publication date
WO2010063161A1 (en) 2010-06-10

Similar Documents

Publication Publication Date Title
CN101745990A (en) Cutter wheel for cutting brittle material and processing method thereof
JP4709202B2 (en) Laser processing method for sintered diamond, cutter wheel for brittle material substrate, and manufacturing method thereof
EP2121260B1 (en) Cutting disk for forming a scribed line and method of manufacturing the same
CN102050568B (en) Cutter wheel for cutting glass materials and processing method thereof
KR20100019435A (en) Scribing apparatus and method
JP2007152936A (en) Wheel cutter for brittle material
JP2006205351A (en) Electrical discharge machining method for turbine blade, and electrical discharge machining device for turbine blade used therein
TW201313637A (en) Scribing wheel
JP2014188729A (en) Scribing wheel, scribing device, and method of manufacturing scribing wheel
CN103785885A (en) End mill and method of manufacturing the same
KR101347994B1 (en) Scribing wheel
KR20130098200A (en) Scribing wheel, scribing apparatus, and method for manufacturing scribing wheel
KR20060017058A (en) Scribing wheel cutter
JP5357580B2 (en) Grooving tool and method of grooving thin film solar cell using the same
JP6182334B2 (en) Manufacturing method of scribing wheel
JP5983364B2 (en) End mill
JP6458372B2 (en) Multipoint diamond tool and method of manufacturing multipoint diamond tool
TWI477375B (en) Cutting wheel of brittle material and its processing method
JP5369011B2 (en) Grooving tool and method for grooving thin film solar cell using the same
JP4582774B2 (en) Cutter wheel for glass cutting
JP6344582B2 (en) Scribing wheel, scribing device and dividing method
JP2019098605A (en) Scribing wheel
KR101824529B1 (en) Scribing wheel
KR200428373Y1 (en) Scribing wheel cutter
JP2021006374A (en) Scribing wheel

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1144411

Country of ref document: HK

C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20100623

REG Reference to a national code

Ref country code: HK

Ref legal event code: WD

Ref document number: 1144411

Country of ref document: HK