CN101711435B - 具有由带开口的支撑结构保持的波长转换元件的照明装置 - Google Patents
具有由带开口的支撑结构保持的波长转换元件的照明装置 Download PDFInfo
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- CN101711435B CN101711435B CN2008800175121A CN200880017512A CN101711435B CN 101711435 B CN101711435 B CN 101711435B CN 2008800175121 A CN2008800175121 A CN 2008800175121A CN 200880017512 A CN200880017512 A CN 200880017512A CN 101711435 B CN101711435 B CN 101711435B
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- wavelength changing
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- light
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/754,210 US7700967B2 (en) | 2007-05-25 | 2007-05-25 | Illumination device with a wavelength converting element held by a support structure having an aperture |
US11/754,210 | 2007-05-25 | ||
PCT/IB2008/051999 WO2008146200A1 (en) | 2007-05-25 | 2008-05-21 | Illumination device with a wavelength converting element held by a support structure having an aperture |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101711435A CN101711435A (zh) | 2010-05-19 |
CN101711435B true CN101711435B (zh) | 2011-09-28 |
Family
ID=39761868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008800175121A Active CN101711435B (zh) | 2007-05-25 | 2008-05-21 | 具有由带开口的支撑结构保持的波长转换元件的照明装置 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7700967B2 (zh) |
EP (1) | EP2162925B1 (zh) |
JP (1) | JP5439365B2 (zh) |
KR (1) | KR101477474B1 (zh) |
CN (1) | CN101711435B (zh) |
BR (1) | BRPI0812044B1 (zh) |
RU (1) | RU2470413C2 (zh) |
TW (1) | TWI446592B (zh) |
WO (1) | WO2008146200A1 (zh) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102187485B (zh) * | 2008-10-15 | 2013-07-03 | 株式会社小糸制作所 | 发光模块、发光模块的制造方法及灯具单元 |
DE102009003936B4 (de) * | 2009-01-05 | 2011-02-24 | Siemens Aktiengesellschaft | Licht emittierendes Bauelement mit einer Konverterkeramik und einer Kühleinrichtung |
US20120098017A1 (en) * | 2009-05-15 | 2012-04-26 | Koito Manufacturing Co., Ltd. | Light emitting module, method of producing light-emitting module, and lighting fixture unit |
WO2011007307A2 (en) | 2009-07-14 | 2011-01-20 | Koninklijke Philips Electronics N.V. | Color temperature variable light emitter |
US8936377B2 (en) * | 2010-03-31 | 2015-01-20 | Alcon Research, Ltd. | Apparatus for enhancing brightness of a wavelength converting element |
CN102376842A (zh) * | 2010-08-11 | 2012-03-14 | 亿广科技(上海)有限公司 | 发光二极管封装结构 |
US20120119241A1 (en) * | 2010-11-17 | 2012-05-17 | Luminus Devices, Inc. | Etendue and Light Extraction System and Method |
KR101878270B1 (ko) * | 2011-09-15 | 2018-07-13 | 엘지이노텍 주식회사 | 광여기 판을 포함하는 조명 장치 및 광여기 테이프 |
DE102012005654B4 (de) * | 2011-10-25 | 2021-03-04 | Schott Ag | Optischer Konverter für hohe Leuchtdichten |
DE102012005657B4 (de) * | 2012-03-22 | 2020-06-10 | Schott Ag | Weißlichtbeleuchtungsvorrichtung |
JP6089686B2 (ja) * | 2012-12-25 | 2017-03-08 | 日亜化学工業株式会社 | 発光装置 |
JP6075712B2 (ja) * | 2013-03-25 | 2017-02-08 | ウシオ電機株式会社 | 発光デバイス |
DE102013013296B4 (de) * | 2013-08-12 | 2020-08-06 | Schott Ag | Konverter-Kühlkörperverbund mit metallischer Lotverbindung und Verfahren zu dessen Herstellung |
CN104566229B (zh) * | 2013-10-15 | 2016-06-08 | 深圳市光峰光电技术有限公司 | 波长转换装置的制造方法 |
TWI517450B (zh) * | 2013-10-21 | 2016-01-11 | 隆達電子股份有限公司 | 發光二極體封裝體 |
JP2017518636A (ja) * | 2014-05-15 | 2017-07-06 | スリーエム イノベイティブ プロパティズ カンパニー | 反射基材上のフレキシブル回路 |
JP2016018921A (ja) * | 2014-07-09 | 2016-02-01 | 日本電気硝子株式会社 | 波長変換部材及び発光デバイス |
EP3170203B1 (en) | 2014-07-18 | 2020-05-06 | Lumileds Holding B.V. | Light emitting diodes and reflector |
KR102556681B1 (ko) * | 2015-03-30 | 2023-07-18 | 코닌클리케 필립스 엔.브이. | 고휘도 발광 디바이스들을 위한 주변 히트 싱크 배열 |
JP6332294B2 (ja) * | 2015-11-30 | 2018-05-30 | 日亜化学工業株式会社 | 発光装置 |
JP6955135B2 (ja) | 2016-10-19 | 2021-10-27 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
WO2018199901A1 (en) * | 2017-04-24 | 2018-11-01 | Hewlett-Packard Development Company, L.P. | Micro light-emitting diode display with 3d orifice plating and light filtering |
KR102405589B1 (ko) * | 2017-05-26 | 2022-06-08 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체소자 |
JP2019028096A (ja) * | 2017-07-25 | 2019-02-21 | 日本電気硝子株式会社 | 波長変換部材 |
DE102017129623B4 (de) * | 2017-12-12 | 2024-03-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Licht emittierendes Halbleiterbauelement |
JP6888129B2 (ja) * | 2019-02-21 | 2021-06-16 | シャープ株式会社 | 発光装置 |
JP2020136671A (ja) * | 2019-02-21 | 2020-08-31 | シャープ株式会社 | 発光装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020079837A1 (en) * | 2000-12-19 | 2002-06-27 | Jun Okazaki | Chip-type LED and process of manufacturing the same |
CN1761835A (zh) * | 2003-03-17 | 2006-04-19 | 皇家飞利浦电子股份有限公司 | 包括辐射源和荧光材料的照明系统 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6273560U (zh) * | 1985-10-24 | 1987-05-11 | ||
US6504301B1 (en) * | 1999-09-03 | 2003-01-07 | Lumileds Lighting, U.S., Llc | Non-incandescent lightbulb package using light emitting diodes |
US6357889B1 (en) | 1999-12-01 | 2002-03-19 | General Electric Company | Color tunable light source |
EP1672707B1 (en) * | 2001-04-20 | 2019-07-31 | Nichia Corporation | Light emitting device |
JP2002344029A (ja) * | 2001-05-17 | 2002-11-29 | Rohm Co Ltd | 発光ダイオードの色調調整方法 |
JP2003110146A (ja) * | 2001-07-26 | 2003-04-11 | Matsushita Electric Works Ltd | 発光装置 |
JP4009828B2 (ja) * | 2002-03-22 | 2007-11-21 | 日亜化学工業株式会社 | 窒化物蛍光体及びその製造方法 |
JP3707688B2 (ja) | 2002-05-31 | 2005-10-19 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
JP2004031101A (ja) * | 2002-06-25 | 2004-01-29 | Tdk Corp | 発光素子及び発光パネル |
JP2004349646A (ja) * | 2003-05-26 | 2004-12-09 | Matsushita Electric Works Ltd | 発光装置 |
US7482638B2 (en) | 2003-08-29 | 2009-01-27 | Philips Lumileds Lighting Company, Llc | Package for a semiconductor light emitting device |
US20070262702A1 (en) * | 2004-03-31 | 2007-11-15 | Shunsuke Fujita | Phoshor and Light-Emitting Diode |
US7361938B2 (en) | 2004-06-03 | 2008-04-22 | Philips Lumileds Lighting Company Llc | Luminescent ceramic for a light emitting device |
KR100800207B1 (ko) * | 2004-06-24 | 2008-02-01 | 우베 고산 가부시키가이샤 | 백색 발광 다이오드 장치 |
US20060124953A1 (en) * | 2004-12-14 | 2006-06-15 | Negley Gerald H | Semiconductor light emitting device mounting substrates and packages including cavities and cover plates, and methods of packaging same |
JP4866003B2 (ja) | 2004-12-22 | 2012-02-01 | パナソニック電工株式会社 | 発光装置 |
CN101288342B (zh) * | 2005-04-20 | 2010-05-19 | 皇家飞利浦电子股份有限公司 | 包括陶瓷发光转换器的照明系统 |
JP4894186B2 (ja) | 2005-07-26 | 2012-03-14 | 日本電気硝子株式会社 | 蛍光体及び発光ダイオード |
RU53500U1 (ru) * | 2005-11-22 | 2006-05-10 | Емельян Михайлович Гамарц | Электролюминесцентный излучатель |
US7663152B2 (en) * | 2006-08-09 | 2010-02-16 | Philips Lumileds Lighting Company, Llc | Illumination device including wavelength converting element side holding heat sink |
-
2007
- 2007-05-25 US US11/754,210 patent/US7700967B2/en active Active
-
2008
- 2008-05-19 TW TW097118395A patent/TWI446592B/zh active
- 2008-05-21 JP JP2010508955A patent/JP5439365B2/ja active Active
- 2008-05-21 EP EP08751277.8A patent/EP2162925B1/en active Active
- 2008-05-21 CN CN2008800175121A patent/CN101711435B/zh active Active
- 2008-05-21 KR KR1020097027125A patent/KR101477474B1/ko active IP Right Grant
- 2008-05-21 BR BRPI0812044A patent/BRPI0812044B1/pt active IP Right Grant
- 2008-05-21 WO PCT/IB2008/051999 patent/WO2008146200A1/en active Application Filing
- 2008-05-21 RU RU2009148312/28A patent/RU2470413C2/ru active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020079837A1 (en) * | 2000-12-19 | 2002-06-27 | Jun Okazaki | Chip-type LED and process of manufacturing the same |
CN1761835A (zh) * | 2003-03-17 | 2006-04-19 | 皇家飞利浦电子股份有限公司 | 包括辐射源和荧光材料的照明系统 |
Non-Patent Citations (2)
Title |
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JP特开2006-179684A 2006.07.06 |
JP特开2007-31196A 2007.02.08 |
Also Published As
Publication number | Publication date |
---|---|
US20080290362A1 (en) | 2008-11-27 |
RU2470413C2 (ru) | 2012-12-20 |
EP2162925B1 (en) | 2014-07-16 |
TWI446592B (zh) | 2014-07-21 |
JP5439365B2 (ja) | 2014-03-12 |
KR101477474B1 (ko) | 2014-12-30 |
US7700967B2 (en) | 2010-04-20 |
JP2010528467A (ja) | 2010-08-19 |
KR20100017930A (ko) | 2010-02-16 |
RU2009148312A (ru) | 2011-06-27 |
TW200913319A (en) | 2009-03-16 |
CN101711435A (zh) | 2010-05-19 |
WO2008146200A1 (en) | 2008-12-04 |
BRPI0812044B1 (pt) | 2018-11-13 |
EP2162925A1 (en) | 2010-03-17 |
BRPI0812044A2 (pt) | 2017-03-21 |
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Address after: Eindhoven, Netherlands Co-patentee after: LUMILEDS LLC Patentee after: KONINKLIJKE PHILIPS N.V. Address before: Eindhoven, Netherlands Co-patentee before: Philips Ramildes Lighting Equipment Co.,Ltd. Patentee before: KONINKLIJKE PHILIPS ELECTRONICS N.V. |
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Effective date of registration: 20200831 Address after: Holland Schiphol Patentee after: KONINKLIJKE PHILIPS NV Address before: Eindhoven, Netherlands Co-patentee before: LUMILEDS LLC Patentee before: KONINKLIJKE PHILIPS N.V. |