CN101707230B - 一种大功率白光led制造方法 - Google Patents
一种大功率白光led制造方法 Download PDFInfo
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- CN101707230B CN101707230B CN2009101451765A CN200910145176A CN101707230B CN 101707230 B CN101707230 B CN 101707230B CN 2009101451765 A CN2009101451765 A CN 2009101451765A CN 200910145176 A CN200910145176 A CN 200910145176A CN 101707230 B CN101707230 B CN 101707230B
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- silica gel
- ceramic substrate
- white light
- light led
- power white
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000000741 silica gel Substances 0.000 claims abstract description 35
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000000919 ceramic Substances 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims abstract description 6
- 229910052709 silver Inorganic materials 0.000 claims abstract description 6
- 239000004332 silver Substances 0.000 claims abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000013078 crystal Substances 0.000 claims abstract description 4
- 229960001866 silicon dioxide Drugs 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 19
- 235000012431 wafers Nutrition 0.000 claims description 19
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 241000218202 Coptis Species 0.000 claims description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 4
- 229910017083 AlN Inorganic materials 0.000 claims description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 239000008187 granular material Substances 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 230000005855 radiation Effects 0.000 abstract description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 239000011148 porous material Substances 0.000 abstract 2
- 238000005520 cutting process Methods 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Abstract
Description
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101451765A CN101707230B (zh) | 2009-10-13 | 2009-10-13 | 一种大功率白光led制造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101451765A CN101707230B (zh) | 2009-10-13 | 2009-10-13 | 一种大功率白光led制造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101707230A CN101707230A (zh) | 2010-05-12 |
| CN101707230B true CN101707230B (zh) | 2011-03-16 |
Family
ID=42377438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101451765A Active CN101707230B (zh) | 2009-10-13 | 2009-10-13 | 一种大功率白光led制造方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101707230B (zh) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102157665A (zh) * | 2011-03-22 | 2011-08-17 | 湘能华磊光电股份有限公司 | 一种led芯片封装结构及其封装方法 |
| CN102738317A (zh) * | 2011-04-12 | 2012-10-17 | 上海矽卓电子科技有限公司 | 一种led日光灯用光源的封装方法及光源 |
| CN102185050A (zh) * | 2011-04-22 | 2011-09-14 | 江苏苏能光电科技有限责任公司 | 适用于交流直驱led光源的陶瓷基板模组封装方法 |
| CN102214777A (zh) * | 2011-05-09 | 2011-10-12 | 厦门市英诺尔电子科技有限公司 | 一种大功率led封装基板及其制成方法 |
| CN102809137A (zh) * | 2011-06-01 | 2012-12-05 | 弘凯光电股份有限公司 | 灯具散热结构制造方法及灯具组件制造方法 |
| CN102222739B (zh) * | 2011-06-27 | 2012-12-19 | 中外合资江苏稳润光电有限公司 | 白光led显示模块的封装方法 |
| CN103857956B (zh) * | 2012-06-01 | 2016-03-30 | 东莞华明灯具有限公司 | Led灯带通过灌胶改变出光角度的方法 |
| CN103022326B (zh) * | 2012-12-26 | 2015-05-13 | 常州银河世纪微电子有限公司 | Led发光二极管的集约封装方法 |
| CN103090227B (zh) * | 2012-12-29 | 2017-07-11 | 瑞安市亿星新能源有限公司 | Led发光板及其制造方法 |
| CN106784261B (zh) * | 2016-11-30 | 2020-06-09 | 深圳市聚飞光电股份有限公司 | 一种分层型量子点led背光源的制作方法 |
| CN106848038A (zh) * | 2017-01-18 | 2017-06-13 | 东洋工业照明（广东）有限公司 | 一种led荧光粉的涂覆方法 |
| CN109256448A (zh) * | 2018-08-07 | 2019-01-22 | 广州市巨宏光电有限公司 | 一种led灯成型工艺 |
-
2009
- 2009-10-13 CN CN2009101451765A patent/CN101707230B/zh active Active
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| Publication number | Publication date |
|---|---|
| CN101707230A (zh) | 2010-05-12 |
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Denomination of invention: Method for manufacturing high-power white light LED Effective date of registration: 20190520 Granted publication date: 20110316 Pledgee: The Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch of science and technology Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: 2019990000450 |
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Denomination of invention: A manufacturing method of high power white LED Effective date of registration: 20210706 Granted publication date: 20110316 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: Y2021320000116 |
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Denomination of invention: A Manufacturing Method for High Power White LED Effective date of registration: 20230807 Granted publication date: 20110316 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: Y2023980051059 |