CN101552262B - 多晶粒封装单元及其制造方法 - Google Patents
多晶粒封装单元及其制造方法 Download PDFInfo
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- CN101552262B CN101552262B CN 200810089419 CN200810089419A CN101552262B CN 101552262 B CN101552262 B CN 101552262B CN 200810089419 CN200810089419 CN 200810089419 CN 200810089419 A CN200810089419 A CN 200810089419A CN 101552262 B CN101552262 B CN 101552262B
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200810089419 CN101552262B (zh) | 2008-03-31 | 2008-03-31 | 多晶粒封装单元及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200810089419 CN101552262B (zh) | 2008-03-31 | 2008-03-31 | 多晶粒封装单元及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101552262A CN101552262A (zh) | 2009-10-07 |
CN101552262B true CN101552262B (zh) | 2012-02-29 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200810089419 Expired - Fee Related CN101552262B (zh) | 2008-03-31 | 2008-03-31 | 多晶粒封装单元及其制造方法 |
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Country | Link |
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CN (1) | CN101552262B (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102201395B (zh) * | 2010-03-25 | 2013-05-08 | 方伟光 | 具防突波功能的多层式半导体组件封装结构及其制作方法 |
CN102738324B (zh) * | 2012-04-25 | 2013-07-10 | 江苏汉莱科技有限公司 | 一种led cob封装技术及其应用 |
CN102820406B (zh) * | 2012-07-23 | 2015-06-24 | 厦门市朗星节能照明股份有限公司 | Led封装结构的制造方法 |
CN102800788B (zh) * | 2012-07-23 | 2015-05-27 | 厦门市朗星节能照明股份有限公司 | Led封装结构及其镀银基板 |
CN105679738B (zh) * | 2016-03-24 | 2019-09-06 | 禾邦电子(中国)有限公司 | 片式整流元件及其生产工艺 |
JP6673268B2 (ja) * | 2017-03-14 | 2020-03-25 | オムロン株式会社 | 管理装置、管理装置の制御方法、情報処理プログラム、および記録媒体 |
CN110473944A (zh) * | 2018-05-09 | 2019-11-19 | 深圳市聚飞光电股份有限公司 | 多功能led支架及led |
CN109084192A (zh) * | 2018-08-01 | 2018-12-25 | 浙江睦田装备科技有限公司 | 一种led集成光源 |
CN110107830A (zh) * | 2019-05-22 | 2019-08-09 | 深圳市广明光电科技有限公司 | 一种柔性线性发光的led灯条灯带 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006086282A (ja) * | 2004-09-15 | 2006-03-30 | Sharp Corp | 中空プラスチックパッケージおよびその製造方法並びにこれを用いた電子機器 |
WO2007039892A2 (en) * | 2005-10-06 | 2007-04-12 | Micro Components Ltd. | Microelectronic intercionnect substrate and packaging techniques |
CN201252100Y (zh) * | 2008-03-31 | 2009-06-03 | 黄一峰 | 多晶封装单元 |
-
2008
- 2008-03-31 CN CN 200810089419 patent/CN101552262B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006086282A (ja) * | 2004-09-15 | 2006-03-30 | Sharp Corp | 中空プラスチックパッケージおよびその製造方法並びにこれを用いた電子機器 |
WO2007039892A2 (en) * | 2005-10-06 | 2007-04-12 | Micro Components Ltd. | Microelectronic intercionnect substrate and packaging techniques |
CN201252100Y (zh) * | 2008-03-31 | 2009-06-03 | 黄一峰 | 多晶封装单元 |
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Publication number | Publication date |
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CN101552262A (zh) | 2009-10-07 |
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GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: HUANG YIJUN Free format text: FORMER OWNER: HUANG YIFENG Effective date: 20120808 Free format text: FORMER OWNER: SHEN CHANGJUN Effective date: 20120808 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120808 Address after: Chinese Taiwan New Taipei City Patentee after: Huang Yijun Address before: Taiwan County, Taipei, China Patentee before: Huang Yifeng Patentee before: Shen Changjun |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210407 Address after: 910-2, 149 xiangeli, Siming District, Xiamen City, Fujian Province Patentee after: XIAMEN LIGHT TREND OPTOELECTRONICS TECHNOLOGY Co.,Ltd. Address before: Chinese Taiwan New Taipei City Patentee before: Huang Yijun |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120229 |
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CF01 | Termination of patent right due to non-payment of annual fee |