CN101681857A - 显示面板组装装置及组装方法 - Google Patents

显示面板组装装置及组装方法 Download PDF

Info

Publication number
CN101681857A
CN101681857A CN200880018955A CN200880018955A CN101681857A CN 101681857 A CN101681857 A CN 101681857A CN 200880018955 A CN200880018955 A CN 200880018955A CN 200880018955 A CN200880018955 A CN 200880018955A CN 101681857 A CN101681857 A CN 101681857A
Authority
CN
China
Prior art keywords
mentioned
circuit substrate
dish
display floater
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200880018955A
Other languages
English (en)
Chinese (zh)
Inventor
山下史雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN101681857A publication Critical patent/CN101681857A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0204—Mounting supporting structures on the outside of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
CN200880018955A 2007-07-24 2008-07-16 显示面板组装装置及组装方法 Pending CN101681857A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007192212 2007-07-24
JP192212/2007 2007-07-24
PCT/JP2008/062835 WO2009014043A1 (ja) 2007-07-24 2008-07-16 表示パネルの組立て装置及び組立て方法

Publications (1)

Publication Number Publication Date
CN101681857A true CN101681857A (zh) 2010-03-24

Family

ID=40281299

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880018955A Pending CN101681857A (zh) 2007-07-24 2008-07-16 显示面板组装装置及组装方法

Country Status (5)

Country Link
JP (1) JPWO2009014043A1 (ja)
KR (1) KR20100007888A (ja)
CN (1) CN101681857A (ja)
TW (1) TW200945967A (ja)
WO (1) WO2009014043A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2883408C (en) 2012-09-04 2021-08-31 Modernfold Inc. Panel seal systems

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4295713B2 (ja) * 2004-11-30 2009-07-15 芝浦メカトロニクス株式会社 表示装置の組み立て装置及び表示装置の組み立て方法
JP4518257B2 (ja) * 2005-01-19 2010-08-04 株式会社日立ハイテクノロジーズ 半導体装置実装装置
JP2008135660A (ja) * 2006-11-29 2008-06-12 Sharp Corp 表示装置の製造方法及び接続装置

Also Published As

Publication number Publication date
KR20100007888A (ko) 2010-01-22
JPWO2009014043A1 (ja) 2010-09-30
TW200945967A (en) 2009-11-01
WO2009014043A1 (ja) 2009-01-29

Similar Documents

Publication Publication Date Title
JP4384439B2 (ja) 対基板作業機、対基板作業システムおよび対基板作業機用作業ヘッド使用準備処理プログラム
JP4782210B2 (ja) 対基板作業機
JPWO2015025383A1 (ja) フィーダ部品種決定方法およびフィーダ部品種決定装置
CN102348334A (zh) 基板印刷系统
CN1802087A (zh) 盖带的剥离方法、元件供给装置及表面安装机
JP4887347B2 (ja) 対基板作業システム
JP4652487B2 (ja) 部品実装装置及びその方法
CN106105419A (zh) 元件安装机
CN104206047A (zh) 带式供料器
CN101683027B (zh) 在基板上装配电气元件和/或光学元件的自动装配机
CN102348373A (zh) 部件安装装置
CN101681857A (zh) 显示面板组装装置及组装方法
CN109092625B (zh) 一种组合式点胶设备
CN101814407A (zh) 显示面板组装装置及方法及处理作业装置及基板输送装置
KR100963270B1 (ko) 부품 실장기용 테이프 피더
KR100682277B1 (ko) 엘씨디 패널 재생/제조 방법 및 그 장치
EP1100303B1 (en) Programmer systems
CN221329259U (zh) 一种微组装自动化生产线
JPH08197356A (ja) 組立・加工方法
JPH09283985A (ja) 回路基板接続装置における回路基板供給方法及び装置
KR200147766Y1 (ko) 부품 공급장치
KR101382261B1 (ko) 씨오지 가압착 장치
KR20240092597A (ko) 반도체 제조 장치, 치공구 실장 방법 및 반도체 장치의 제조 방법
JP2021174950A (ja) 搬送システム
CN102170768A (zh) Fpd模块组装装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20100324