CN101681857A - Apparatus and method for assembling display panel - Google Patents

Apparatus and method for assembling display panel Download PDF

Info

Publication number
CN101681857A
CN101681857A CN200880018955A CN200880018955A CN101681857A CN 101681857 A CN101681857 A CN 101681857A CN 200880018955 A CN200880018955 A CN 200880018955A CN 200880018955 A CN200880018955 A CN 200880018955A CN 101681857 A CN101681857 A CN 101681857A
Authority
CN
China
Prior art keywords
mentioned
circuit substrate
dish
display floater
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200880018955A
Other languages
Chinese (zh)
Inventor
山下史雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of CN101681857A publication Critical patent/CN101681857A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0204Mounting supporting structures on the outside of casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • G02F1/13452Conductors connecting driver circuitry and terminals of panels
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/142Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)

Abstract

Provided is an apparatus for assembling a display panel wherein a circuit board is mounted on the side section of a display panel (W). The apparatus is provided with a panel supply unit (2) for supplying the display panel; a tray loader unit (3) having a tray wherein a plurality of kinds of circuit boards are stored; an adhering unit (4) for adhering an adhesive tape on the plurality of kinds of circuit boards taken out from the tray of the tray loader unit; and a mounting unit (5) for mounting the circuit boards, on which the adhesive tape is adhered by the adhering unit, onto the side portion of the display panel supplied from the panel supply unit.

Description

Display floater apparatus for assembling and assemble method
Technical field
The present invention relates to install the display floater apparatus for assembling and the assemble method of multiple circuit substrate in the side portion of display floater.
Background technology
Display floaters such as display panels constitute: being combined in its side portion by outer lead, TAB as electronic unit (Tape Automated Bonding: band automatically in conjunction with) parts are installed is TCP, and become the display floater that has TCP, then on the TCP of this display floater, circuit substrate is installed.Recently, along with the maximization and the high performance of display floater, and carry out diverse multiple circuit substrate being installed in the side portion of display floater.
The display floater apparatus for assembling that circuit substrate is installed on display floater has dish loading machine unit.On this dish loading machine unit, be provided with dish, in this dish, accommodating circuit substrate.And,, then this circuit substrate is installed on the other end of the TCP that at one end is connected with display floater via above-mentioned adhesive tape if take out circuit substrate and pasted the adhesive tape of anisotropic conductive material etc. from dish.
In the past, when the side portion of display floater is installed multiple circuit substrate, possess a plurality of dish loading machines unit, this a plurality of dish loading machines unit has the dish of accommodating different types of circuit substrate respectively.
Disclose a kind of electronic component mounting apparatus in patent documentation 1, it possesses: the first chip supply unit (being equivalent to the first dish loading machine unit) with the dish of accommodating first chip (being equivalent to first circuit substrate); With the second chip supply unit with the dish of accommodating second chip (being equivalent to the second circuit substrate) (being equivalent to the second dish loading machine unit); Its will be in the dish of each chip supply unit set different kinds of chips be installed to the side portion of 1 substrate.
Patent documentation 1: Japanese kokai publication hei 9-148789 communique
Yet, when using patent documentation 1 disclosed technology that substrate is installed multiple circuit substrate, need with the corresponding dish loading machine of the species number of circuit substrate unit.But, according to using the formation of a plurality of dish loading machines unit, need bigger space for a plurality of dish loading machine unit are set, so the situation that exists device to maximize for multiple circuit substrate is installed.
And dish loading machine unit is than higher price, so when using a plurality of dish loading machines unit accordingly with the species number of circuit substrate, the situation that also exists the cost of device to rise.
And because the configuration of a plurality of dish loading machines unit plane earth, the extracting position that therefore takes out circuit substrate from the dish of each dish loading machine unit is different to the distance of installation site.Therefore, with circuit substrate from the dish conveyance of the dish loading machine unit that is in the position far away spended time during to the installation site, so produce the situation that productivity ratio reduces from the installation site.
Summary of the invention
The invention provides a kind of display floater apparatus for assembling and assemble method,, also make dish loading machine unit be 1 and get final product even install in the side portion of substrate under the situation of multiple circuit substrate.
In order to address the above problem, the invention provides a kind of display floater apparatus for assembling, in the side portion of display floater circuit substrate is installed, it is characterized in that possessing: the panel feed unit, supply with above-mentioned display floater; Dish loading machine unit has the dish that contains multiple circuit substrate; Paste the unit, with adhesive tape sticking on the multiple circuit substrate that from the dish of this dish loading machine unit, takes out; And installation unit, will paste the unit by this and paste the side portion that the multiple circuit substrate of adhesive tape is installed in the above-mentioned display floater of supplying with from above-mentioned panel feed unit.
And, the invention provides a kind of display floater assemble method, in the side portion of display floater circuit substrate is installed, it is characterized in that possessing: the operation of supplying with above-mentioned display floater; Take out the operation of different types of circuit substrate successively from the dish that contains multiple circuit substrate; The operation of Continuous pressing device for stereo-pattern on the multiple circuit substrate that takes out from above-mentioned dish; And the multiple circuit substrate that will paste adhesive tape is installed in the operation of the side portion of above-mentioned display floater.
Description of drawings
Fig. 1 is the skeleton diagram of the display floater apparatus for assembling of expression an embodiment of the invention.
Fig. 2 is the pie graph that expression is supplied to the mounting table that puts display floater.
Fig. 3 is arranged on the vertical view of the dish in the dish loading machine unit.
Fig. 4 is the end view that the state of circuit substrate has been installed on display floater.
Fig. 5 is the vertical view of the details of indicating panel loading machine unit.
Fig. 6 is the front view of dish loading machine unit shown in Figure 5.
Fig. 7 A is the key diagram that circuit substrate is installed in first operation on the display floater.
Fig. 7 B is the key diagram that circuit substrate is installed in second operation on the display floater.
Fig. 7 C is the key diagram that circuit substrate is installed in the 3rd operation on the display floater.
Fig. 7 D is the key diagram that circuit substrate is installed in the 4th operation on the display floater.
Fig. 7 E is the key diagram that circuit substrate is installed in the 5th operation on the display floater.
Fig. 7 F is the key diagram that circuit substrate is installed in the 6th operation on the display floater.
Fig. 7 G is the key diagram that circuit substrate is installed in the 7th operation on the display floater.
Fig. 8 A is the key diagram that 2 kinds of circuit substrates have been installed at a side of display floater.
Fig. 8 B is the key diagram that circuit substrate has been installed respectively at 2 sides of display floater.
Embodiment
Fig. 1 is the skeleton diagram of display floater apparatus for assembling of the present invention, and this apparatus for assembling possesses apparatus main body 1.Side lower end in this apparatus main body 1 is provided with panel feed unit 2, and the side above the becoming in Fig. 1 of this panel feed unit 2 is provided with dish loading machine unit 3.And, the opposite side in apparatus main body 1, the horizontal side in above-mentioned dish loading machine unit 3 is provided with and pastes unit 4; Side below this stickup unit 4, the horizontal side at above-mentioned panel feed unit 2 is provided with installation unit 5.
That is, dispose above-mentioned installation unit 5 in the side of above-mentioned panel feed unit 2, dispose above-mentioned stickup unit 4 in the side of above-mentioned dish loading machine unit 3 and in the side of above-mentioned installation unit 5.That is, 4 unit 2~5 are configured to adjacent state mutually on apparatus main body 1.
Above-mentioned panel feed unit 2 is provided with mounting table shown in Figure 26.This mounting table 6 is driven to X, Y, Z and θ direction by driving mechanism 7.That is, driving mechanism 7 has base 8, is provided with above the base 8 by the X platform 11 that drives to directions X along pair of tracks 9 at this.
On above-mentioned X platform 11, Y platform 13 is set to and can drives along the Y direction with the directions X quadrature by pair of tracks 12 (only illustrating).Be provided with Z θ platform 14 on this Y platform 13, this Z θ platform 14 is along with respect to being that the θ direction of rotation is driven by the Z direction of directions X and the formed planar quadrature of Y direction and with the Z direction.And, on this Z θ platform 14, be provided with above-mentioned mounting table 6.Therefore, mounting table 6 can drive to X, Y, Z and θ direction.
On above-mentioned mounting table 6, supply with the display floater W put display panels for example etc.In the side portion of this display floater W, as shown in Figure 4, be provided with a plurality of TCP15 (only illustrating 1) with predetermined distance as electronic unit by first adhesive tape 16 that constitutes by anisotropic conductive material with connecting an end.
As shown in Figure 5 and Figure 6, on above-mentioned dish loading machine unit 3, the pair of guide rails 30 driven Y platforms 29 that are provided with driven along the vertical direction dish lift 28 and are provided with on the direction of in above-mentioned figure, representing by Y.
Above-mentioned dish lift 28 is top opening, portion within it, as shown in Figure 6, a plurality of dishes 31 make along the Width both ends of Y direction and can engage removably, and on above-below direction with the stacked maintenance of predetermined distance.
Be formed with a plurality of housing recess 32 at each dish side by side in 31, in each housing recess 32, alternately with equal number contain multiple, be 2 kinds circuit substrate P1 and P2 in the present embodiment; This circuit substrate P1 is mounted on the other end of the TCP15 that at one end is connected with the side of above-mentioned display floater W with P2.In the present embodiment, in 1 dish 31, contain 4 circuit substrate P1 and P2 respectively.That is, in a dish 31, be provided with circuit substrate P1 and P2 that on 1 display floater W, install, the difference integral multiple.
The dish 31 of the superiors of above-mentioned dish loading machine unit 28, conveyance puts on above-mentioned Y platform 29 by not shown transfer mechanism.By the conveyance member 34 that drives on the directions X represented with arrow in Fig. 5,6 by XZ drive source 33 and the Z direction as above-below direction, circuit substrate P1 and P2 are supplied to above-mentioned stickup unit 4 dish on supplying to Y platform 29 31.
In addition, when the dish 31 of dish lift 28 maintenance of accommodating became sky and detects this situation, new dish 31 was fed into above-mentioned dish lift 28.
As shown in Figure 6, above-mentioned conveyance member 34 is, on base portion 35, make axis along the Z direction be provided with a plurality of adsorption sections 36.And base portion 35 is provided with detecting sensor 37 and judges transducer 38.
Above-mentioned detecting sensor 37 is, when above-mentioned Y platform 29 is positioned on the assigned position of Y direction, for example detects in the above-mentioned dish 31 of transfer to the Y platform 29 whether have circuit substrate P1 or P2 optically.That is, detect in the housing recess 32 of the locational above-mentioned dish 31 of Y be positioned in regulation whether deposited circuit substrate P1 or P2.
Judging that transducer 38 is, when detecting above-mentioned adsorption section 36 and whether being adsorbed with circuit substrate P1 or P2, is that P1 or P2 judge to the circuit substrate of adsorbed maintenance.That is, judge the kind of transducer 38 decision circuitry substrates.
Above-mentioned judgement transducer 38 is that according to the difform mark that is provided with corresponding to its kind on circuit substrate P1, P2 or the mark of different color etc., the decision circuitry substrate is P1 or P2.Thus, can not make a mistake circuit substrate P1, P2 kind be installed on the display floater W.
Foregoing circuit substrate P 1, P2 are positioned on the Y direction by Y platform 29.The circuit substrate P1 or the P2 that are positioned on the Y direction are adsorbed by the adsorption section 36 of conveyance member 34, paste unit 4 and supply to.
Before by above-mentioned adsorption section 36 absorption circuit substrate P1 or P2, detecting sensor 38 judge the Y position of the regulation of the dish 31 that is positioned with respect to the Y direction, promptly with the housing recess 32 of conveyance member 34 corresponding Y positions in, whether deposited circuit substrate P1 or P2.
Do not deposit under the situation of circuit substrate P1 or P2 in the housing recess 32 of above-mentioned Y position, above-mentioned Y platform 29 is driven to the Y direction, and the housing recess 32 that the next one is deposited circuit substrate P1 or P2 is positioned on the Y position of regulation.
Further specify, when conveyance member 34 will take out circuit substrate P1, when not deposited circuit substrate P1 in the housing recess 32 that detects in the Y position of dish 31 regulation, position according to 29 pairs of above-mentioned dishes 31 of this detection signal Y platform, so that deposit the Y position that the housing recess 32 of the next Y direction of circuit substrate P1 becomes regulation.
Thus, though in dish a plurality of housing recess 32 of 31 for example in 1, deposit under the situation of circuit substrate P1 or P2 for a certain reason and not, also can interruptedly not continue installation exercise.
According to above-mentioned formation, when circuit substrate P1 or P2 are passed to conveyance member 34, Y platform 29 only on the Y direction positioning instant can, only positioning instant can on directions X for conveyance member 34.Therefore, the positioning control of Y platform 29 and conveyance member 34 only gets final product on a plane direction respectively, so its positioning control becomes easily, and can realize the shortening of productive temp time and the raising of positioning accuracy.
Circuit substrate P1 and circuit substrate P2 respectively are provided with integral multiple respectively in above-mentioned dish 31.Therefore, when 1 display floater W is respectively installed 1 circuit substrate P1 and circuit substrate P2 respectively, can not appear in the installation process from coiling 31 situations that do not have circuit substrate P1 or a circuit substrate P2.
Thus, can not cause in installation process, must interrupting installing and new dish 31 is supplied to the situation of Y platform 29 from dish lift 28, so can carry out installation exercise efficiently.
In addition, when from the dish 31 that supplies to Y platform 29, having taken out whole circuit substrate P1, P2, remove this dish 31 from Y platform 29, and supply with new dish 31 to this Y platform 29 from dish lift 28 by not shown output mechanism.
Circuit substrate P1 that takes out the dish 31 from Y platform 29 or a certain side, for example circuit substrate P1 of P2, as mentioned above, by 34 conveyances of conveyance member to above-mentioned stickup unit 4.Shown in Fig. 7 A, Fig. 7 B, paste unit 4 have push temporarily with support 19 and be arranged on this push temporarily with the top of support 19 and on above-below direction driven usefulness instrument 21 of temporarily pushing.
Shown in Fig. 7 A, an end of foregoing circuit substrate P 1 put and remain on above-mentioned push temporarily with support 19 top on.Then, after the upper edge, an end of circuit substrate P1 had been supplied with second adhesive tape 22 endlong, shown in Fig. 7 B, this second adhesive tape 22 was by pasting along driven above-mentioned the pushing with instrument 21 pressurizations of descent direction indicated by the arrow temporarily.
After the circuit substrate P1 of second adhesive tape 22 that has been stuck is kept by 23 absorption of the pick-up shown in Fig. 7 C, shown in Fig. 7 D, make its rising and conveyance to above-mentioned installation unit 5.Shown in Fig. 7 E~7G, installation unit 5 has formally to be pushed with supporting 24.This is formally pushed with supporting 24 has adsorption section 24a, and this adsorption section 24a is driven up and down by cylinder 24b.
Shown in Fig. 7 E, push with supporting the 19 circuit substrate P1 that take out from above-mentioned by above-mentioned pick-up 23 temporarily, shown in Fig. 7 F, be passed to above-mentioned adsorption section 24a.That is, circuit substrate P1, is kept by this adsorption section 24a absorption from one of above-mentioned adsorption section 24a side-prominent state with the end that is pasted with second adhesive tape 22.
Be supplied to the supporting an of end that is pasted with adhesive tape 22 of the circuit substrate P1 that remains to adsorption section 24a below by supporting tool 24c.Shown in Fig. 7 G, above supporting tool 24c, be provided with driven along the vertical direction formally pushing with instrument 25.
When foregoing circuit substrate P 1 is formally pushed the adsorption section 24a absorption maintenance of using support 24, put the above-mentioned display floater W on above-mentioned mounting table 6, be positioned in the top of second adhesive tape of the end of this circuit substrate P1 pasting 22 by above-mentioned driving mechanism 7.
Promptly, above-mentioned mounting table 6 is urged to above-mentioned installation unit 5 by above-mentioned driving mechanism 7 from above-mentioned panel feed unit 2, and an end is secured at the other end of TCP15 of the sidepiece of the display floater W that above-mentioned mounting table 6 kept, be positioned at the top of second adhesive tape 22 of foregoing circuit substrate P 1.
Then, above-mentioned formally pushing with instrument 25 driven to descent direction indicated by the arrow, and the other end of the TCP15 overlap on the end of circuit substrate P1 via second adhesive tape 22 on is pressurizeed.Thus, as shown in Figure 4, circuit substrate P1 is installed in length direction one distolateral of the sidepiece of display floater W by second adhesive tape 22.
If so circuit substrate P1 is installed on the end of length direction of a sidepiece of display floater W, then next from the dish 31 of above-mentioned dish loading machine unit 3, take out different types of circuit substrate P2, and it is distolateral this circuit substrate P2 to be installed in another of length direction of a sidepiece of above-mentioned display floater W according to said sequence.That is, shown in Fig. 8 A, diverse 2 circuit substrate P1, P2 are installed at the sidepiece of display floater W.
Then, the display floater W of circuit substrate P1, P2 has been installed, has taken out from above-mentioned mounting table 6 by not shown robot etc. and pass to next operation.
Like this, display floater apparatus for assembling according to above-mentioned formation, since in the dish 31 of dish loading machine unit 3, accommodated multiple, be 2 kinds circuit substrate P1, P2 in the present embodiment, therefore by 1 dish loading machine unit 3 is set, just can 2 kinds of circuit substrate P1, P2 be installed on apparatus main body 1 in the side portion of display floater W.
Therefore, need not on apparatus main body 1 the dish loading machine unit 3 of configuration and the corresponding quantity of kind of circuit substrate P1, P2, therefore compare, can make apparatus main body 1 miniaturization with the situation of a plurality of dish loading machines of configuration unit 3.
And, need not plane earth and dispose a plurality of dish loading machines unit 3, therefore with circuit substrate P1, P2 conveyance to the time of pasting unit 4 can be and difference becomes the identical time according to the kind of circuit substrate P1, P2, therefore can make the shortening of productive temp time, promptly boost productivity.
Dispose above-mentioned installation unit 5 in the side of above-mentioned panel feed unit 2, dispose above-mentioned stickup unit 4 in the side of above-mentioned dish loading machine unit 3 and in the side of above-mentioned installation unit 5, therefore each unit 2~5 is closely disposed.
Therefore, the display floater W conveyance that panel feed unit 2 is supplied with is to installation unit 5, and the side of installation circuit substrate P1, the P2 of this display floater W is positioned the needed time with respect to the supporting tool 24c of installation unit 5 can shorten.
And, can shorten from dish loading machine unit 3 to pasting unit 4 conveyance circuit substrate P1, needed time of P2, and can shorten and will paste the circuit substrate P1 of second adhesive tape 22 or P2 conveyance to the 5 needed times of installation unit by pasting unit 4.
Therefore, also can realize installing the shortening of needed productive temp time, can boost productivity by these situations.
In the dish 31 of dish loading machine unit 3, be provided with the circuit substrate P1 and the P2 that install to 1 display floater W respectively each integral multiple.Therefore, to installing respectively under the situation of each 1 circuit substrate P1, P2 on 1 display floater W, can not appear at the situation that does not have circuit substrate P1 or P2 in the installation process mid-game 31.
Therefore therefore, in installation process, do not need to interrupt installing and the dish on the Y platform 29 31 is exchanged for new dish to get final product, can also prevent that interruption owing to installation exercise from causing the reduction of productivity ratio.
Above-mentioned conveyance member 34 is provided with whether deposit the detecting sensor 38 that circuit substrate P1 or P2 detect in the housing recess 32 of dish 31.Thus, in housing recess 32, do not deposit under the situation of circuit substrate P1 or P2, Y platform 29 is driven to the Y direction, and will coil 31 next housing recess 32 and be positioned on the Y position of regulation according to the detection signal of detecting sensor 38.
Therefore,, prevent that also installation exercise from interrupting thus, therefore can prevent to cause the reduction of productivity ratio owing to this situation even among dish a plurality of housing recess 32 of 31, for example deposited circuit substrate P1 or P2 for a certain reason and not in 1.
In an above-mentioned execution mode, the situation that 2 kinds of circuit substrate P1, P2 are installed at the sidepiece of display floater W has been described, but also can shown in Fig. 8 B, after the side of display floater W has been installed 2 kinds of circuit substrate P1, P2, other multiple circuit substrate P3 be installed at opposite side.At this moment, accommodating 3 kinds of circuit substrate P1~P3 in advance in the dish 31 of dish loading machine unit 3 gets final product.
In addition, the quantity of the kind of the circuit substrate of installing on the side of display floater is not limited to 3 kinds, also can be 4 kinds or more than it, and the quantity that the side of circuit substrate is installed also can be 1~3 limit any.
Industrial utilization
According to the present invention, owing in the dish of dish loading machine unit, accommodated multiple circuit substrate, therefore Even dish loading machine unit is 1, also can multiple circuit substrate be installed in the side portion of substrate.

Claims (7)

1, a kind of display floater apparatus for assembling is installed circuit substrate in the side portion of display floater, it is characterized in that possessing:
The panel feed unit is supplied with above-mentioned display floater;
Dish loading machine unit has the dish that contains multiple circuit substrate;
Paste the unit, with adhesive tape sticking on the multiple circuit substrate that from the dish of this dish loading machine unit, takes out; And
Installation unit will be pasted the multiple circuit substrate that adhesive tape has been pasted in the unit by this, be installed in from the side portion of the above-mentioned display floater of above-mentioned panel feed unit supply.
2, as the display floater apparatus for assembling of claim 1 record, it is characterized in that,
Be connected with an end of electronic unit in the side portion of above-mentioned display floater, above-mentioned installation unit is installed in the foregoing circuit substrate other end of above-mentioned electronic unit.
3, as the display floater apparatus for assembling of claim 1 record, it is characterized in that,
Above-mentioned installation unit is configured in the side of above-mentioned panel feed unit, and above-mentioned stickup configuration of cells is in the side of above-mentioned dish loading machine unit and in the side of above-mentioned installation unit.
4, as the display floater apparatus for assembling of claim 1 record, it is characterized in that,
In above-mentioned dish, multiple circuit substrate is provided with the quantity of integral multiple respectively.
5, as the display floater apparatus for assembling of claim 1 record, it is characterized in that,
In above-mentioned dish loading machine unit, be provided with: the dish lift, be driven along the vertical direction, keep a plurality of dishes at above-below direction with predetermined distance; With the Y platform, can be driven along a direction on the plane, and the dish of the above-mentioned dish lift of transfer,
The dish of above-mentioned Y platform institute transfer, by along and the driven conveyance member of the direction of an above-mentioned direction quadrature take out, and be supplied to above-mentioned stickup unit.
6, as the display floater apparatus for assembling of claim 5 record, it is characterized in that,
On above-mentioned dish, be formed with the housing recess of depositing circuit substrate;
In being provided with housing recess on the above-mentioned conveyance member, whether deposit the detecting sensor that the foregoing circuit substrate detects at above-mentioned dish.
7, a kind of display floater assemble method is installed circuit substrate in the side portion of display floater, it is characterized in that possessing:
Supply with the operation of above-mentioned display floater;
Take out the operation of different types of circuit substrate successively from the dish that contains multiple circuit substrate;
With the operation of adhesive tape sticking on the multiple circuit substrate that takes out from above-mentioned dish; And
The multiple circuit substrate of having pasted adhesive tape is installed in the operation of the side portion of above-mentioned display floater.
CN200880018955A 2007-07-24 2008-07-16 Apparatus and method for assembling display panel Pending CN101681857A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP192212/2007 2007-07-24
JP2007192212 2007-07-24
PCT/JP2008/062835 WO2009014043A1 (en) 2007-07-24 2008-07-16 Apparatus and method for assembling display panel

Publications (1)

Publication Number Publication Date
CN101681857A true CN101681857A (en) 2010-03-24

Family

ID=40281299

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880018955A Pending CN101681857A (en) 2007-07-24 2008-07-16 Apparatus and method for assembling display panel

Country Status (5)

Country Link
JP (1) JPWO2009014043A1 (en)
KR (1) KR20100007888A (en)
CN (1) CN101681857A (en)
TW (1) TW200945967A (en)
WO (1) WO2009014043A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112013004331T5 (en) 2012-09-04 2015-09-17 Modernfold Inc. Paneeldichtsysteme

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4295713B2 (en) * 2004-11-30 2009-07-15 芝浦メカトロニクス株式会社 Display device assembly apparatus and display device assembly method
JP4518257B2 (en) * 2005-01-19 2010-08-04 株式会社日立ハイテクノロジーズ Semiconductor device mounting equipment
JP2008135660A (en) * 2006-11-29 2008-06-12 Sharp Corp Method of manufacturing display unit and connection device

Also Published As

Publication number Publication date
TW200945967A (en) 2009-11-01
JPWO2009014043A1 (en) 2010-09-30
WO2009014043A1 (en) 2009-01-29
KR20100007888A (en) 2010-01-22

Similar Documents

Publication Publication Date Title
JP4384439B2 (en) Anti-substrate work machine, anti-substrate work system, and work head use preparation processing program for anti-substrate work machine
JP5584789B2 (en) Board work machine
EP3038443B1 (en) Feeder component type determination method and feeder component type determination device
JP4652487B2 (en) Component mounting apparatus and method
CN102348334A (en) Board printing system
CN1802087A (en) Detaching method of lid belt, component supply device and surface mounting machine
JP4887347B2 (en) Board work system
CN104025731A (en) Tape feeder
CN106105419A (en) Component mounter
CN104206047A (en) Tape feeder
CN101681857A (en) Apparatus and method for assembling display panel
TW471243B (en) Manufacturing system with feeder/programming/buffer system
CN109092625B (en) Combined dispensing equipment
KR20060131331A (en) Method of reproduction/manufacture of lcd panel and machine therefor
EP1100303B1 (en) Programmer systems
CN106358368A (en) Automatic reinforcing machine
CN221329259U (en) Automatic production line for micro assembly
JPH09283985A (en) Method and apparatus for feed of circuit board in circuit-board connecting device
KR200147766Y1 (en) Part supplying apparatus
KR101382261B1 (en) Apparatus of cog pre bonding
KR20240092597A (en) Semiconductor manufacturing apparatus, tool mounting method, and semiconductor device manufacturing method
CN102170768A (en) FPD module assembly device
KR20120001415A (en) Tab bonder for tape carrier package
JPH09298390A (en) Electronic parts supplier

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20100324