KR101382261B1 - Apparatus of cog pre bonding - Google Patents

Abstract

The present invention is a pattern of the panel prior to the COG main compression in the COG (Chip On Glass, hereinafter referred to as "COG") process, such as to attach a chip with a built-in drive IC to the source side and the gate side of the panel The present invention relates to a COG pressurization device for press-fitting the chip after alignment is performed so that the pattern electrode of the chip having the driving IC embedded therein is aligned. More specifically, an anisotropic conductive film (ACF) A panel feed handler for transferring two panels attached to the stage, a panel feed handler for transferring two panels press-fitted with a chip having a driving IC to a source side on the stage, and It has a panel discharge handler for discharging two panels pressurized with a chip with a built-in driver IC on the source side and the gate side located on the stage and transferring them to the COG main compression device. Tact time can be reduced, and the chip alignment camera performs a non-contact alignment of the chip alignment camera before the chip carrier sucks the chip containing the driving IC from the chip tray and supplies it to the pressing part. The present invention relates to a COG pressurization device that does not damage chips.

Description

CIOJI pressure bonding device {APPARATUS OF COG PRE BONDING}

The present invention is a pattern of the panel prior to the COG main compression in the COG (Chip On Glass, hereinafter referred to as "COG") process, such as to attach a chip with a built-in drive IC to the source side and the gate side of the panel The present invention relates to a COG pressurization device for press-fitting the chip after alignment is performed so that the pattern electrode of the chip having the driving IC embedded therein is aligned. More specifically, an anisotropic conductive film (ACF) A panel feed handler for transferring two panels attached to the stage, a panel feed handler for transferring two panels press-fitted with a chip having a driving IC to a source side on the stage, and A panel discharge handler for discharging two panels press-fitted with a chip with a drive IC located on a source side and a gate side located on a stage and transferring them to a COG main compression device is provided to reduce logistics movement. Tact time can be reduced, and the chip alignment camera performs a non-contact alignment of the chip alignment camera before vacuum-adsorbing the chip containing the driver IC in the chip tray and supplying it to the pressing part. The present invention relates to a COG pressurization device that does not damage chips.

(LCD), a plasma display panel (PDP), an organic EL display (OLED) device, and the like have become popular in recent years as a number of products demanding portability, mobility, and space are required, such as flat televisions such as portable computers, PDAs, And the like.

Referring to FIG. 1, the entire system of the automation device of the module process for manufacturing the display panel is described with reference to FIG. 1. Panel loader device 100 for loading a panel, a buffer (not shown) for correcting the position of the panel supplied from the panel loader device 100 to facilitate operation, and a panel cleaning device for cleaning the working surface of the panel. And labeler equipment 300 for performing a labeling process for attaching a label containing information of the panel to a specific surface of the panel cleaned from the panel cleaner 200, and a COG (Chip) for the panel. In order to perform the On Glass) process, the label-completed panel is moved horizontally and supplied to the COG process equipment 400 to attach the semiconductor chip to the source and gate sides of the panel. In order to perform the COG process and to perform the FOG process with respect to the panel, the panel on which the labeling is completed is moved horizontally and supplied to the FOG (Film on Glass) process equipment 500 to complete the semiconductor chip panel. FOG process, such as attaching a flexible printed circuit (FPC) film to the substrate.

The COG process equipment 400 includes a COG ACF attachment device 410 for attaching an anisotropic conductive film (ACF) before attaching a semiconductor chip to a working side (source side and gate side) of the panel, and a pattern electrode of the panel. COG pressing device 420 which press-fits the semiconductor chip after performing alignment operation to align the pattern electrode of the semiconductor chip through an alignment vision program, and the semiconductor chip press-bonded to the panel. COG main compression device 430 and the like to press the predetermined pressure again at a predetermined temperature to completely attach.

The FOG process equipment 500 includes a FOG ACF attachment device 510 for attaching an ACF (anisotropic conductive film) before attaching an FPC film to a work side (source side) of the panel, and the work of the panel to which the ACF is attached. An FOG press bonding device 520 for pressing the FPC film after performing alignment by using an alignment vision program to electrically connect the electrode of the panel to the side and the FPC film, and the press bonding The FPC film includes a FOG crimping apparatus 530 or the like that presses the FPC film at a predetermined temperature again to a predetermined pressure to completely adhere the FPC film to the glass panel. (B) The panel having completed the FOG process operation is discharged and moved to the next process.

Conventionally, in the COG pressurization device, a chip carrier for transferring a chip with a built-in drive IC from a chip supply device to a COG process sucks a chip with a single drive IC from a chip tray in a vacuum and supplies it to a pressurized head. The first alignment of the chip containing the driver IC was mechanically performed by the chip alignment device by rotating it 90 degrees counterclockwise, but the alignment is made by directly contacting the chip containing the driver IC. As a result, there is a problem that the chip embedded with the driving IC is often broken or damaged.

In addition, conventionally, in the COG pressurization apparatus, the ACF is attached to the work side by a handler in order to shorten the working time when performing the COG press bonding process for pressing the semiconductor chip to the work side (source side and gate side) of the panel. Two panels are simultaneously supplied to the stage to proceed with the COG crimping process, and the two panels of the COG crimping process are completed to the next COG main crimping process.

The conventional COG pressing device includes four pressing heads, and the pressing head presses a part of a chip in which a driving IC is embedded in a source side or a gate side of the panel when the panel is large or medium or larger. As a good and different pressing head to press the chip containing the remaining drive IC to complete the pressing process, there is a problem that the logistics movement is complicated and the working time is long.

The present invention is to solve the problems of the prior art as described above, four sets of pressing parts for pressing-bonding a chip with a drive IC embedded in the panel, four stages, and two panels with ACF to the stage A panel feed handler for transferring a panel, a panel transfer handler for transferring two panels in which a chip with a built-in driving IC is pressed on a source side positioned on the stage, and a driving IC on a source side and a gate side positioned on the stage. Equipped with a panel discharge handler for discharging two panels with embedded chips and transferring them to the COG main compression device, it provides a COG compression device that can reduce the movement time by shortening logistics movement. There is a purpose.

In addition, the present invention does not damage the chip containing the driver IC by performing a non-contact alignment of the chip alignment camera before the chip carrier vacuum suction the chip containing the driver IC in the chip tray and supply it to the pressing portion. Another object is to provide a COG pressurization apparatus.

COG pressurization apparatus according to the present invention for achieving the above object, the stage is a four-compression unit for pressing the chip with a drive IC is built into the panel, four stages, and two panels with the ACF is the stage A panel feed handler for transferring a panel, a panel feed handler for transferring two panels with a chip having a driving IC embedded in a source side positioned on the stage, and a driver IC mounted on a source side and a gate side positioned on the stage. Is equipped with a panel discharge handler for discharging the two panels pressurized chip is transferred to the COG main compression device, each of the two of the four sets of the pressing unit to be attached to the source side of the panel Are the pressing parts that press-fit all the chips with integrated IC at the same time, and each of the other two presses all the chips with the integrated drive IC to be attached to the gate side of the panel at the same time. The chip carrier for supplying the chip in which the driving IC is embedded in the pressing portion is picked up from the chip tray and rotated by 180 degrees to a position of the chip alignment camera located at an upper portion thereof. Characterized by the location of the chip.

In addition, the present invention has a plurality of indexing device that rotates by mounting a chip with a drive IC supplied from the chip carrier each set of the pressing portion and a plurality of pressing head for pressing the chip with the drive IC embedded in the panel Characterized in that composed of dogs.

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In addition, the present invention is an alignment device for the chip carrier to transfer the chip to the working position of the pressing portion, and the alignment of the pressing head in the pressing portion when the position of the chip is recognized by the chip alignment camera It is characterized in that the pressing head is moved to the T-axis to correct.

In addition, the present invention is characterized in that the chip carrier is installed on each of the left and right sides to supply different kinds of chips to the pressing portion.

In addition, the present invention is characterized in that the chip carriers provided on both the left and right sides are respectively provided with a chip to be attached to the source side and a chip to be supplied to the gate side to the pressing portion.

The COG pressurization apparatus according to the present invention includes four press fitting parts for pressing the chip in which a drive IC is built into the panel, four stages, and a panel supply handler for transferring two panels with an ACF to the stage, A panel transfer handler for transferring two panels on which a chip with a built-in drive IC is pressed on a source side positioned on a stage; and a chip on which a chip with a built-in drive IC is pressed on a source side and a gate side placed on the stage. It is equipped with a panel discharge handler for discharging two panels and transferring them to the COG main compression device, thereby reducing the logistics movement and reducing the work time (Tact Time).

In addition, the present invention does not damage the chip containing the driver IC by performing a non-contact alignment of the chip alignment camera before the chip carrier vacuum suction the chip containing the driver IC in the chip tray and supply it to the pressing portion. It is effective.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an overall system diagram of an embodiment of an automated apparatus for modular processes for manufacturing a display panel
2 is a view illustrating a process of attaching a chip with a driving IC to a panel in a COG pressurization apparatus according to the present invention.
3 is a conceptual view of pressing the chip with a drive IC built in the panel in the COG pressing device according to the present invention
4 and 5 is a process of pressing the chip in which the drive IC is built in the panel in the COG pressurization apparatus according to the present invention (FIG. 4 (a)-(d), Figure 5 (e)-(g)) Drawing in order
6 is a plan view for explaining a chip supply process with a built-in driving IC in the COG pressurization apparatus according to the present invention
7 is a front view as viewed from the chip carrier direction in FIG.

Hereinafter, with reference to the accompanying drawings for the COG pressurization apparatus according to the present invention will be described in detail.

As shown in FIG. 3, the COG pressurization apparatus according to the present invention press-fits four pairs 21, 22, 23, and 24 of the press-fitting portions 13 and 14, which are integrated with the driving IC in the panel 10. [The first press fitting parts 21 to the fourth pressing parts 24], the four stages 31, 32, 33, and 34 (the first stages 31 to the fourth stage 34), and the ACF On the panel supply handler 40 for transporting the two attached panels 10 to the first stage 31 and the second stage 32, respectively, on the first stage 31 and the second stage 32. Pressing of the chip 13 in which the driving IC is built into the source side 11 of the panel 10 by the first pressing part 21 and the second pressing part 22 with respect to the panel 10 located in the panel 10. A panel transfer handler 50 for transferring the completed two panels 10 (the panel in the state (b) of FIG. 2) to the third stage 33 and the fourth stage 34, respectively, and the third stage. To the two panels 10 respectively conveyed on the 33 and the fourth stage 34. The two panels 10 in which the pressure bonding of the chip 14 in which the driving IC is built in the gate side 12 of the panel 10 is completed by the third pressing portion 23 and the fourth pressing portion 24. (C) the panel is discharged, and the panel discharge handler 60 is fed to the COG main compression apparatus.

The four presses 21, 22, 23, 24 (the first presses 21 to the fourth press 24) have the same structure, and one set of the presses 21 is For example, the specific configuration will be described. The driving IC is mounted on the panel 10 and the indexing device 21b which seats and rotates the chips 13 and 14 in which the driving ICs supplied from the chip carriers 74 and 75 are embedded. A plurality of pressing heads 21a for pressing the chips 13 and 14 with built-in chips are formed (see FIGS. 5 and 6).

Among the four pressing units 21, 22, 23, and 24, the first pressing unit 21 and the second pressing unit 22 each have a driving IC to be attached to the source side 11 of the panel 10. The integrated chip 13 is pressed together at the same time, and the remaining third pressing part 23 and the fourth pressing part 24 are each a driving IC to be attached to the gate side 12 of the panel 10. Are all press-bonded chip 14 at the same time.

When the panel 10 is large or medium or larger, chips 13 and 14 in which a relatively large number of driving ICs are embedded in the source side 11 and / or gate side 12 of the panel 10 as compared to the small panel. In the present invention, all the chips 13 or 14 to be attached to the source side 11 or the gate side 12 of the panel 10 are treated in one pressing unit for two panels. While working at the same time, there is an advantage that the logistics movement is shortened.

The COG pressurization device according to the present invention relates to a device for pressing and pressing two panels 10 at the same time. In the COG pressurization device according to the present invention, chips 13 and 14 having a driving IC built into the panel 10 are included. Referring to (a) to (d) in Figure 4 (e) to (g) in Figure 4 as described with reference to the process of [[4] (a) to (d) and FIG. e) to (g) are different series of drawings, but are a continuous series of operations.

FIG. 4A is a preliminary step for pressing and attaching the chips 13 and 14 in which the driving IC is built into the panel, and the panel supply handler 40 selects each of the two panels 10 to which the ACF is attached. The transfer to the stage 31 and the second stage 32 is shown. At this time, the third stage 33 and the fourth stage 34 are in a work standby state with no panel mounted thereon.

 Next, as shown in (b) of FIG. 4, the first pressing portion 21, which is a pressing position, is respectively in the state where the first stage 31 and the second stage 32 are mounted on the panel. When moving to the position of the second pressing part 22, the first pressing part 21 and the second pressing part 22 are each a pattern of the chip 13 in which the driving IC is built into the pattern electrode of the panel 10. After the electrodes are aligned, the chips 13 are press-bonded by the number of chips 13 to be attached to the source side 11 of the panel 10. For example, as shown in FIG. 2B, when the six chips 13 are pressed onto the source side 11 of the panel 10, the chips 13 supplied from the chip carriers 74 and 75 may be used. In the seating and rotating indexing device 21b, the pressing head 21a vacuum-sucks the chip 13, descends to a predetermined position of the panel 10, and presses it, and then rotates clockwise or counterclockwise. While the next pressing head 21a repeatedly presses the chip 13 to the panel 10, the six chips 13 can be pressed onto the source side 11 of the panel 10. .

Next, as shown in (c) of FIG. 4, a chip having a driving IC built into the source side 11 of the panel 10 by the first pressing part 21 and the second pressing part 22. The panel transfer handler 50 transfers the first stage 31 and the second stage 32 on which the two panels 10 (the panel in the state (b) of FIG. 2) on which the pressure bonding of the 13 is completed are mounted. Move to a position that is easy to do.

Next, as shown in FIG. 4D, a chip in which a driving IC is embedded in the source side 11 of the panel 10 mounted on the first stage 31 and the second stage 32 is shown. The panel transfer handler 50 transfers the two panels 10 (the panel in the state (b) of FIG. 2), in which the pressure bonding of the 13 is completed, to the third stage 33 and the fourth stage 34, respectively. do.

Next, as shown in (e) of FIG. 5, the third press-fitting portion that is the next press-fitting working position, respectively, in the state where the third stage 33 and the fourth stage 34 are mounted with the panel 10, respectively. Moving to the position of the 23 and the fourth pressing part 24, the third pressing part 23 and the fourth pressing part 24 respectively align the chip 14 to be pressed, and then the panel 10. Presses the chip 14 as many times as the number of chips 14 to be attached to the gate side 12 of the panel (Panel in the state (c) of FIG. 2), and at the same time, the first stage 31 and the second The stage 32 moves to a position where the panel supply handler 40 is easy to transport the panel 10 so as to receive the next working panel 10.

Next, as shown in FIG. 5F, the third stage 33 and the fourth stage 34 are mounted on the third stage 33 and the fourth stage 34. In the panel discharge handler 60, the panel discharge handler 60 uses two panels 10 (the panel in the state (c) of FIG. 10) to a position where it can be easily discharged, and at the same time, the panel supply handler 40 moves each of the two panels 10 to which the ACF is attached to the first stage 31 and the second stage 32. Transfer to.

Next, as shown in (g) of FIG. 5, the first pressing portion 21 which is a pressing operation position, respectively, in the state where the first stage 31 and the second stage 32 are mounted on the panel. When moving to the position of the second pressing part 22, the first pressing part 21 and the second pressing part 22 respectively align the chip 13 to be pressed, and then the source side of the panel 10 ( 11 is press-bonded to the chip 13 by the number of chips 13 to be attached, and at the same time the gate side of the panel 10 by the third presser 23 and the fourth presser 24. The COG main compression process in which the panel discharge handler 60 is the next step for the two panels 10 (the panel in the state (c) of FIG. 2) where the pressure bonding of the chip 14 in which the drive IC is built-in is completed is completed. To the device.

After that, (c) → (d) → (e) → (f) → (g) of FIG. 5 are repeated.

On the other hand, in the COG pressing device according to the present invention will be described with reference to Figures 6 and 7 the operation process of supplying the chip (13, 14) with a built-in drive IC to the pressing portion (21, 22, 23, 24) Is as follows.

In the COG pressurization device according to the present invention, a plurality of chips 13 or 14 with a built-in drive IC are provided to provide the chips 13 or 14 with the built-in drive IC to the pressed parts 21, 22, 23, and 24. The tray box 71 which accommodates the chip tray 72 mounted is provided. As shown in FIG. 5, the tray box 71 includes a chip tray 72 in which a left tray box 71 is mounted with a plurality of chips 13 attached to, for example, the source side 11 of the panel 10. And the right tray box 71 can accommodate the chip tray 72 mounted with a plurality of chips 14 attached to the gate side 12 of the panel 10. In this manner, the two chip trays 72 may accommodate different types of chips 13 and 14 and supply them to the pressing parts 21, 22, 23, and 24.

Each tray box 71 is provided with two chip trays 72, one for the chip tray 72 for supplying the chip tray 72 (the tray box inward in FIG. 7) and the other. One leads to a chip tray holder (outside the tray box in FIG. 7) for recovering the used chip tray 72.

The chip tray 72 accommodated in the chip tray holder of the tray box 71 is transferred to the working position by the tray carrier 73, and the chip carriers 74 and 75 are transferred when the chip tray 72 is moved to the working position. Picks the chip 13 or 14 from the chip tray 72 and rotates the chip 13 or 14 while moving the chip 13 or 14 to a position that can be recognized by the chip alignment camera 76 located above. The camera 76 allows the position of the chip to be recognized.

The chip carriers 74 and 75 may be provided on both left and right sides, respectively, to supply different kinds of chips 13 and 14 to the pressing parts 21, 22, 23, and 24, respectively. Furthermore, when the chips 13 and 14 are attached to the source side 11 and the gate side 12 of the panel 10 at the same time, the chip carriers 74 and 75 provided on both the left and right sides are attached to the source side 11, respectively. The chip 13 and the chip 14 to be supplied to the gate side 12 may be selected to be supplied to the pressing parts 21, 22, 23, and 24.

When the position of the chip is recognized by the chip alignment camera 76, the chip carriers 74 and 75 move the chips 13 and 14 to the working positions of the pressing parts 21, 22, 23, and 24. An aligning device (not shown) for transferring and aligning the pressing head 21a at the pressing parts 21, 22, 23, and 24 moves the pressing head 21 a to the T axis θ. The chip 13 or 14 is calibrated parallel to the panel 10.

As described above, the non-contact alignment is performed by an alignment device (not shown) that aligns the pressing head 21a to directly correct the positions of the chips 13 and 14, as compared to the chips 13 and 14. There is an advantage of not being damaged.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined in the appended claims. It can be understood that it is possible.

10: Panel 11: source side
12: gate side 13, 14: chip
21: first pressing part 21a: pressing head
21b: index device 22: second pressing portion
23: third pressing part 24: fourth pressing part
31: first stage 32: second stage
33: third stage 34: fourth stage
40: panel feed handler 50: panel feed handler
60: panel discharge handler 71: tray box
72: chip tray 73: tray carrier
74, 75: chip carrier 76: chip alignment camera

Claims (7)

4 sets of press-fitting parts for press-fitting a chip with a drive IC embedded in the panel, 4 stages, a panel supply handler for transferring two panels with an ACF to the stage, and a drive IC at a source side located on the stage. A panel transfer handler for transferring two panels on which the chip with integrated chip is pressed, and two panels on which the chip with the driving IC are pressed on the source and gate sides of the stage are discharged. It includes a panel discharge handler for transferring to
Each of the two sets of four pressing parts is a pressing part which simultaneously press-bonds all the chips in which the driving IC is to be attached to the source side of the panel, and each of the other two should be attached to the gate side of the panel. Press-fitting parts that press-fit all of the chips with a built-in driver IC at the same time,
A chip carrier for supplying a chip with a built-in driving IC to the pressing unit may pick up a chip from a chip tray, rotate the chip 180 degrees, and move the chip to a chip alignment camera position located at an upper portion thereof. Recognition
COG pressing device characterized in that.
The method of claim 1,
Each pair of the pressing parts includes an indexing device that rotates by mounting a chip with a driving IC supplied from a chip carrier, and a plurality of pressing heads that press-fit a chip with the driving IC on the panel.
COG pressing device characterized in that.
delete delete The method of claim 1,
When the position of the chip is recognized by the chip alignment camera, the chip carrier transfers the chip to the working position of the pressing part, and the aligning device for aligning the pressing head at the pressing part includes the pressing head. For moving to the T axis to compensate
COG pressing device characterized in that.
The method of claim 1,
The chip carriers are respectively installed on both left and right sides to supply different kinds of chips to the pressing portion.
COG pressing device characterized in that.
The method according to claim 6,
The chip carriers provided at both the left and right sides supply the chips to be attached to the source side and the chips to be supplied to the gate side, respectively.
COG pressing device characterized in that.

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