CN101641210A - 基于金属纳米粒子组合物的屏蔽及其装置和方法 - Google Patents

基于金属纳米粒子组合物的屏蔽及其装置和方法 Download PDF

Info

Publication number
CN101641210A
CN101641210A CN200880006867A CN200880006867A CN101641210A CN 101641210 A CN101641210 A CN 101641210A CN 200880006867 A CN200880006867 A CN 200880006867A CN 200880006867 A CN200880006867 A CN 200880006867A CN 101641210 A CN101641210 A CN 101641210A
Authority
CN
China
Prior art keywords
oxide
cohesion
shield structure
metallic shield
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200880006867A
Other languages
English (en)
Chinese (zh)
Inventor
格雷戈里·A·雅布隆斯基
迈克尔·A·马斯特罗彼得罗
克里斯多佛·J·瓦贡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
PChem Associates Inc
Original Assignee
PChem Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by PChem Associates Inc filed Critical PChem Associates Inc
Publication of CN101641210A publication Critical patent/CN101641210A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0254After-treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/22Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2601/00Inorganic fillers
    • B05D2601/20Inorganic fillers used for non-pigmentation effect
    • B05D2601/28Metals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00Supplementary information concerning processes or compositions relating to powder metallurgy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00Technologies related to metal processing
    • Y02P10/25Process efficiency
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12014All metal or with adjacent metals having metal particles
    • Y10T428/12153Interconnected void structure [e.g., permeable, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12542More than one such component
    • Y10T428/12549Adjacent to each other
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31678Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Powder Metallurgy (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Non-Insulated Conductors (AREA)
CN200880006867A 2007-03-01 2008-02-29 基于金属纳米粒子组合物的屏蔽及其装置和方法 Pending CN101641210A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89240707P 2007-03-01 2007-03-01
US60/892,407 2007-03-01

Publications (1)

Publication Number Publication Date
CN101641210A true CN101641210A (zh) 2010-02-03

Family

ID=39733293

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880006867A Pending CN101641210A (zh) 2007-03-01 2008-02-29 基于金属纳米粒子组合物的屏蔽及其装置和方法

Country Status (8)

Country Link
US (1) US7763362B2 (https=)
EP (1) EP2131979A4 (https=)
JP (1) JP2010520626A (https=)
KR (1) KR20090117827A (https=)
CN (1) CN101641210A (https=)
AU (1) AU2008229178B2 (https=)
CA (1) CA2680201A1 (https=)
WO (1) WO2008115681A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102984929A (zh) * 2011-09-07 2013-03-20 港易有限公司 用于电子装置的防辐射叠层板及将该叠层板嵌入外壳的方法
CN107864604A (zh) * 2017-11-10 2018-03-30 中国科学院西安光学精密机械研究所 一种电磁辐射屏蔽结构

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7927948B2 (en) 2005-07-20 2011-04-19 Micron Technology, Inc. Devices with nanocrystals and methods of formation
US7989290B2 (en) 2005-08-04 2011-08-02 Micron Technology, Inc. Methods for forming rhodium-based charge traps and apparatus including rhodium-based charge traps
US20070144305A1 (en) * 2005-12-20 2007-06-28 Jablonski Gregory A Synthesis of Metallic Nanoparticle Dispersions
US20100015462A1 (en) * 2008-02-29 2010-01-21 Gregory Jablonski Metallic nanoparticle shielding structure and methods thereof
US20110236672A1 (en) * 2008-12-01 2011-09-29 Toyota Jidosha Kabushiki Kaisha Decorative film and method for forming the same
SG181565A1 (en) * 2009-12-07 2012-07-30 Univ Duke Compositions and methods for growing copper nanowires
EP2638584B1 (en) * 2010-11-09 2017-05-03 Cornell University Sulfur containing nanoporous materials, nanoparticles, methods and applications
KR20140023328A (ko) 2011-03-28 2014-02-26 코닝 인코포레이티드 유리 표면 및 내구성 코팅에 Cu, CuO 및 Cu2O 나노입자의 항균성 작용
TWI488280B (zh) * 2012-11-21 2015-06-11 Ind Tech Res Inst 電磁波屏蔽結構及其製造方法
EP3134369A1 (en) 2014-04-23 2017-03-01 Corning Incorporated Antimicrobial articles with silver-containing alkali silicate coating and methods of making thereof
US9803065B2 (en) * 2015-03-12 2017-10-31 King Abdulaziz University Microwave shielding effectiveness based on polyvinyl alcohol/silver hybrid nanocomposites
US10354773B2 (en) 2016-04-08 2019-07-16 Duke University Noble metal-coated nanostructures and related methods
CN107507823B (zh) 2016-06-14 2022-12-20 三星电子株式会社 半导体封装和用于制造半导体封装的方法
CA3070125A1 (en) 2017-07-25 2019-01-31 Magnomer Llc Methods and compositions for magnetizable plastics
WO2020160260A1 (en) 2019-01-30 2020-08-06 Magnomer Llc Methods and compositions for magnetizable plastics
CA3199923A1 (en) * 2020-11-25 2022-06-02 Maher F. El-Kady Metallic based electromagnetic interference shielding materials, devices, and methods of manufacture thereof
CN114650721B (zh) * 2021-02-09 2025-06-03 广州方邦电子股份有限公司 电磁屏蔽膜及线路板

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692387A (en) * 1984-10-02 1987-09-08 E. I. Du Pont De Nemours And Company Sintering of metal interlayers within organic polymeric films
US4599277A (en) 1984-10-09 1986-07-08 International Business Machines Corp. Control of the sintering of powdered metals
US5338507A (en) 1987-03-30 1994-08-16 Hewlett-Packard Company Silver additives for ceramic superconductors
US5071826A (en) 1987-03-30 1991-12-10 Hewlett-Packard Company Organometallic silver additives for ceramic superconductors
US5332646A (en) 1992-10-21 1994-07-26 Minnesota Mining And Manufacturing Company Method of making a colloidal palladium and/or platinum metal dispersion
US5455749A (en) 1993-05-28 1995-10-03 Ferber; Andrew R. Light, audio and current related assemblies, attachments and devices with conductive compositions
US20060034731A1 (en) * 1995-03-27 2006-02-16 California Institute Of Technology Sensor arrays for detecting analytes in fluids
US5882722A (en) 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US5973420A (en) 1996-10-03 1999-10-26 Colortronics Technologies L.L.C. Electrical system having a clear conductive composition
US6103868A (en) 1996-12-27 2000-08-15 The Regents Of The University Of California Organically-functionalized monodisperse nanocrystals of metals
US6379745B1 (en) 1997-02-20 2002-04-30 Parelec, Inc. Low temperature method and compositions for producing electrical conductors
MXPA01001907A (es) 1998-08-21 2003-05-15 Stanford Res Inst Int Impresion de circuitos y componentes electronicos.
WO2000029829A1 (en) * 1998-11-16 2000-05-25 California Institute Of Technology Simultaneous determination of equilibrium and kinetic properties
AU2000225122A1 (en) 2000-01-21 2001-07-31 Midwest Research Institute Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles
US6773926B1 (en) 2000-09-25 2004-08-10 California Institute Of Technology Nanoparticle-based sensors for detecting analytes in fluids
WO2002035554A1 (en) * 2000-10-25 2002-05-02 Harima Chemicals, Inc. Electroconductive metal paste and method for production thereof
ATE502296T1 (de) * 2000-12-12 2011-04-15 Sony Deutschland Gmbh Selektive chemische sensoren, basierend auf verketteten nanopartikel-ansammlungen
US7115218B2 (en) 2001-06-28 2006-10-03 Parelec, Inc. Low temperature method and composition for producing electrical conductors
US6645444B2 (en) 2001-06-29 2003-11-11 Nanospin Solutions Metal nanocrystals and synthesis thereof
US20060001726A1 (en) 2001-10-05 2006-01-05 Cabot Corporation Printable conductive features and processes for making same
US6951666B2 (en) 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
EP1468054A1 (en) 2001-11-01 2004-10-20 Yissum Research Development Company of the Hebrew University of Jerusalem Ink-jet inks containing metal nanoparticles
US6872645B2 (en) 2002-04-02 2005-03-29 Nanosys, Inc. Methods of positioning and/or orienting nanostructures
JP2003309337A (ja) 2002-04-16 2003-10-31 Fujikura Ltd プリント回路基板
JP2003309352A (ja) 2002-04-16 2003-10-31 Fujikura Ltd 導電性接着剤およびこれを用いた電子部品実装構造
JP3961334B2 (ja) 2002-04-17 2007-08-22 株式会社フジクラ Icカードおよびその製造方法
EP2154212A1 (en) * 2002-06-13 2010-02-17 Cima Nano Tech Israel Ltd A method for the production of conductive and transparent nano-coatings
US6878184B1 (en) 2002-08-09 2005-04-12 Kovio, Inc. Nanoparticle synthesis and the formation of inks therefrom
US8071168B2 (en) * 2002-08-26 2011-12-06 Nanoink, Inc. Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
US20050126338A1 (en) 2003-02-24 2005-06-16 Nanoproducts Corporation Zinc comprising nanoparticles and related nanotechnology
US7645397B2 (en) 2004-01-15 2010-01-12 Nanosys, Inc. Nanocrystal doped matrixes
US20060044382A1 (en) 2004-08-24 2006-03-02 Yimin Guan Metal colloid dispersions and their aqueous metal inks
US20060163744A1 (en) 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
TW200640596A (en) 2005-01-14 2006-12-01 Cabot Corp Production of metal nanoparticles
KR101300442B1 (ko) * 2005-06-10 2013-08-27 시마 나노 테크 이스라엘 리미티드 강화 투명 전도성 코팅 및 이의 제조 방법
US20070154634A1 (en) * 2005-12-15 2007-07-05 Optomec Design Company Method and Apparatus for Low-Temperature Plasma Sintering
JP5082357B2 (ja) * 2006-09-22 2012-11-28 東レ株式会社 網目状金属微粒子積層基板の製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102984929A (zh) * 2011-09-07 2013-03-20 港易有限公司 用于电子装置的防辐射叠层板及将该叠层板嵌入外壳的方法
CN102984929B (zh) * 2011-09-07 2015-07-08 港易有限公司 用于电子装置的防辐射叠层板及将该叠层板嵌入外壳的方法
CN107864604A (zh) * 2017-11-10 2018-03-30 中国科学院西安光学精密机械研究所 一种电磁辐射屏蔽结构

Also Published As

Publication number Publication date
AU2008229178A1 (en) 2008-09-25
JP2010520626A (ja) 2010-06-10
EP2131979A4 (en) 2013-03-06
EP2131979A2 (en) 2009-12-16
WO2008115681A2 (en) 2008-09-25
CA2680201A1 (en) 2008-09-25
WO2008115681A3 (en) 2008-11-20
US7763362B2 (en) 2010-07-27
AU2008229178B2 (en) 2012-02-23
KR20090117827A (ko) 2009-11-12
US20080213609A1 (en) 2008-09-04

Similar Documents

Publication Publication Date Title
CN101641210A (zh) 基于金属纳米粒子组合物的屏蔽及其装置和方法
JP5394749B2 (ja) 金属ナノ粒子分散物の合成
CN101529532B (zh) 导电层形成用银浆料
CN1671805B (zh) 烧结温度低的导电纳米油墨及其制备方法
JP2010520626A5 (https=)
US8673049B2 (en) Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same
JP5505695B2 (ja) 導電膜形成のための金属ペースト
JP6616287B2 (ja) 強磁性金属ナノワイヤー分散液およびその製造方法
WO2018228407A1 (zh) 一种石墨烯/金属纳米带复合导电油墨及其制备方法和应用
CN103379973A (zh) 银包铜粉及其制造方法、含有该银包铜粉的导电性膏、导电性粘接剂、导电性膜和电气回路
WO2016151858A1 (ja) 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート
TW201424887A (zh) 混銀銅粉及其製造法、含有該混銀銅粉之導電性糊料、導電性接著劑、導電性膜、及電路
CN101781520A (zh) 一种用于多孔墙板的水性导电高分子/金属复合纳米涂料及其制备方法
US20100015462A1 (en) Metallic nanoparticle shielding structure and methods thereof
JP6782409B2 (ja) キャパシタ及びその製造方法
Kim et al. Surface modification of oleylamine-capped Ag–Cu nanoparticles to fabricate low-temperature-sinterable Ag–Cu nanoink
JP5446097B2 (ja) 導電性基板及びその製造方法
Park et al. Metallic fusion of nanocrystal thin films for flexible and high-performance electromagnetic interference shielding materials
Wang et al. Fabrication of micron-SiO 2@ nano-Ag based conductive line patterns through silk-screen printing
JP6181367B2 (ja) 被覆繊維状銅微粒子集合体
JP6076249B2 (ja) 被覆繊維状銅微粒子、並びに該被覆繊維状銅微粒子を含む導電性コーティング剤および導電性フィルム
KR20120028126A (ko) 도전성 피막의 제조방법, 및 이를 위한 프라이머 조성물
TR2022011654A2 (tr) Karbon bazli bi̇r i̇letken mürekkep formülasyonu ve söz konusu mürekkebi̇ üretme yöntemi̇
JP2015069750A (ja) 導電性ペースト、金属薄膜の製造方法並びに金属薄膜
JP2012231171A (ja) 太陽電池の電極の形成方法及び該形成方法により得られた電極を用いた太陽電池

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20100203