CN101641210A - 基于金属纳米粒子组合物的屏蔽及其装置和方法 - Google Patents
基于金属纳米粒子组合物的屏蔽及其装置和方法 Download PDFInfo
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- CN101641210A CN101641210A CN200880006867A CN200880006867A CN101641210A CN 101641210 A CN101641210 A CN 101641210A CN 200880006867 A CN200880006867 A CN 200880006867A CN 200880006867 A CN200880006867 A CN 200880006867A CN 101641210 A CN101641210 A CN 101641210A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/02—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
- B05D7/04—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/22—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces for producing castings from a slip
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2601/00—Inorganic fillers
- B05D2601/20—Inorganic fillers used for non-pigmentation effect
- B05D2601/28—Metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12014—All metal or with adjacent metals having metal particles
- Y10T428/12153—Interconnected void structure [e.g., permeable, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12542—More than one such component
- Y10T428/12549—Adjacent to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Powder Metallurgy (AREA)
- Conductive Materials (AREA)
- Manufacturing Of Electric Cables (AREA)
- Non-Insulated Conductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US89240707P | 2007-03-01 | 2007-03-01 | |
| US60/892,407 | 2007-03-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101641210A true CN101641210A (zh) | 2010-02-03 |
Family
ID=39733293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880006867A Pending CN101641210A (zh) | 2007-03-01 | 2008-02-29 | 基于金属纳米粒子组合物的屏蔽及其装置和方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7763362B2 (https=) |
| EP (1) | EP2131979A4 (https=) |
| JP (1) | JP2010520626A (https=) |
| KR (1) | KR20090117827A (https=) |
| CN (1) | CN101641210A (https=) |
| AU (1) | AU2008229178B2 (https=) |
| CA (1) | CA2680201A1 (https=) |
| WO (1) | WO2008115681A2 (https=) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102984929A (zh) * | 2011-09-07 | 2013-03-20 | 港易有限公司 | 用于电子装置的防辐射叠层板及将该叠层板嵌入外壳的方法 |
| CN107864604A (zh) * | 2017-11-10 | 2018-03-30 | 中国科学院西安光学精密机械研究所 | 一种电磁辐射屏蔽结构 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7927948B2 (en) | 2005-07-20 | 2011-04-19 | Micron Technology, Inc. | Devices with nanocrystals and methods of formation |
| US7989290B2 (en) | 2005-08-04 | 2011-08-02 | Micron Technology, Inc. | Methods for forming rhodium-based charge traps and apparatus including rhodium-based charge traps |
| US20070144305A1 (en) * | 2005-12-20 | 2007-06-28 | Jablonski Gregory A | Synthesis of Metallic Nanoparticle Dispersions |
| US20100015462A1 (en) * | 2008-02-29 | 2010-01-21 | Gregory Jablonski | Metallic nanoparticle shielding structure and methods thereof |
| US20110236672A1 (en) * | 2008-12-01 | 2011-09-29 | Toyota Jidosha Kabushiki Kaisha | Decorative film and method for forming the same |
| SG181565A1 (en) * | 2009-12-07 | 2012-07-30 | Univ Duke | Compositions and methods for growing copper nanowires |
| EP2638584B1 (en) * | 2010-11-09 | 2017-05-03 | Cornell University | Sulfur containing nanoporous materials, nanoparticles, methods and applications |
| KR20140023328A (ko) | 2011-03-28 | 2014-02-26 | 코닝 인코포레이티드 | 유리 표면 및 내구성 코팅에 Cu, CuO 및 Cu2O 나노입자의 항균성 작용 |
| TWI488280B (zh) * | 2012-11-21 | 2015-06-11 | Ind Tech Res Inst | 電磁波屏蔽結構及其製造方法 |
| EP3134369A1 (en) | 2014-04-23 | 2017-03-01 | Corning Incorporated | Antimicrobial articles with silver-containing alkali silicate coating and methods of making thereof |
| US9803065B2 (en) * | 2015-03-12 | 2017-10-31 | King Abdulaziz University | Microwave shielding effectiveness based on polyvinyl alcohol/silver hybrid nanocomposites |
| US10354773B2 (en) | 2016-04-08 | 2019-07-16 | Duke University | Noble metal-coated nanostructures and related methods |
| CN107507823B (zh) | 2016-06-14 | 2022-12-20 | 三星电子株式会社 | 半导体封装和用于制造半导体封装的方法 |
| CA3070125A1 (en) | 2017-07-25 | 2019-01-31 | Magnomer Llc | Methods and compositions for magnetizable plastics |
| WO2020160260A1 (en) | 2019-01-30 | 2020-08-06 | Magnomer Llc | Methods and compositions for magnetizable plastics |
| CA3199923A1 (en) * | 2020-11-25 | 2022-06-02 | Maher F. El-Kady | Metallic based electromagnetic interference shielding materials, devices, and methods of manufacture thereof |
| CN114650721B (zh) * | 2021-02-09 | 2025-06-03 | 广州方邦电子股份有限公司 | 电磁屏蔽膜及线路板 |
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| US4692387A (en) * | 1984-10-02 | 1987-09-08 | E. I. Du Pont De Nemours And Company | Sintering of metal interlayers within organic polymeric films |
| US4599277A (en) | 1984-10-09 | 1986-07-08 | International Business Machines Corp. | Control of the sintering of powdered metals |
| US5338507A (en) | 1987-03-30 | 1994-08-16 | Hewlett-Packard Company | Silver additives for ceramic superconductors |
| US5071826A (en) | 1987-03-30 | 1991-12-10 | Hewlett-Packard Company | Organometallic silver additives for ceramic superconductors |
| US5332646A (en) | 1992-10-21 | 1994-07-26 | Minnesota Mining And Manufacturing Company | Method of making a colloidal palladium and/or platinum metal dispersion |
| US5455749A (en) | 1993-05-28 | 1995-10-03 | Ferber; Andrew R. | Light, audio and current related assemblies, attachments and devices with conductive compositions |
| US20060034731A1 (en) * | 1995-03-27 | 2006-02-16 | California Institute Of Technology | Sensor arrays for detecting analytes in fluids |
| US5882722A (en) | 1995-07-12 | 1999-03-16 | Partnerships Limited, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds |
| US5973420A (en) | 1996-10-03 | 1999-10-26 | Colortronics Technologies L.L.C. | Electrical system having a clear conductive composition |
| US6103868A (en) | 1996-12-27 | 2000-08-15 | The Regents Of The University Of California | Organically-functionalized monodisperse nanocrystals of metals |
| US6379745B1 (en) | 1997-02-20 | 2002-04-30 | Parelec, Inc. | Low temperature method and compositions for producing electrical conductors |
| MXPA01001907A (es) | 1998-08-21 | 2003-05-15 | Stanford Res Inst Int | Impresion de circuitos y componentes electronicos. |
| WO2000029829A1 (en) * | 1998-11-16 | 2000-05-25 | California Institute Of Technology | Simultaneous determination of equilibrium and kinetic properties |
| AU2000225122A1 (en) | 2000-01-21 | 2001-07-31 | Midwest Research Institute | Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles |
| US6773926B1 (en) | 2000-09-25 | 2004-08-10 | California Institute Of Technology | Nanoparticle-based sensors for detecting analytes in fluids |
| WO2002035554A1 (en) * | 2000-10-25 | 2002-05-02 | Harima Chemicals, Inc. | Electroconductive metal paste and method for production thereof |
| ATE502296T1 (de) * | 2000-12-12 | 2011-04-15 | Sony Deutschland Gmbh | Selektive chemische sensoren, basierend auf verketteten nanopartikel-ansammlungen |
| US7115218B2 (en) | 2001-06-28 | 2006-10-03 | Parelec, Inc. | Low temperature method and composition for producing electrical conductors |
| US6645444B2 (en) | 2001-06-29 | 2003-11-11 | Nanospin Solutions | Metal nanocrystals and synthesis thereof |
| US20060001726A1 (en) | 2001-10-05 | 2006-01-05 | Cabot Corporation | Printable conductive features and processes for making same |
| US6951666B2 (en) | 2001-10-05 | 2005-10-04 | Cabot Corporation | Precursor compositions for the deposition of electrically conductive features |
| EP1468054A1 (en) | 2001-11-01 | 2004-10-20 | Yissum Research Development Company of the Hebrew University of Jerusalem | Ink-jet inks containing metal nanoparticles |
| US6872645B2 (en) | 2002-04-02 | 2005-03-29 | Nanosys, Inc. | Methods of positioning and/or orienting nanostructures |
| JP2003309337A (ja) | 2002-04-16 | 2003-10-31 | Fujikura Ltd | プリント回路基板 |
| JP2003309352A (ja) | 2002-04-16 | 2003-10-31 | Fujikura Ltd | 導電性接着剤およびこれを用いた電子部品実装構造 |
| JP3961334B2 (ja) | 2002-04-17 | 2007-08-22 | 株式会社フジクラ | Icカードおよびその製造方法 |
| EP2154212A1 (en) * | 2002-06-13 | 2010-02-17 | Cima Nano Tech Israel Ltd | A method for the production of conductive and transparent nano-coatings |
| US6878184B1 (en) | 2002-08-09 | 2005-04-12 | Kovio, Inc. | Nanoparticle synthesis and the formation of inks therefrom |
| US8071168B2 (en) * | 2002-08-26 | 2011-12-06 | Nanoink, Inc. | Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair |
| US20050126338A1 (en) | 2003-02-24 | 2005-06-16 | Nanoproducts Corporation | Zinc comprising nanoparticles and related nanotechnology |
| US7645397B2 (en) | 2004-01-15 | 2010-01-12 | Nanosys, Inc. | Nanocrystal doped matrixes |
| US20060044382A1 (en) | 2004-08-24 | 2006-03-02 | Yimin Guan | Metal colloid dispersions and their aqueous metal inks |
| US20060163744A1 (en) | 2005-01-14 | 2006-07-27 | Cabot Corporation | Printable electrical conductors |
| TW200640596A (en) | 2005-01-14 | 2006-12-01 | Cabot Corp | Production of metal nanoparticles |
| KR101300442B1 (ko) * | 2005-06-10 | 2013-08-27 | 시마 나노 테크 이스라엘 리미티드 | 강화 투명 전도성 코팅 및 이의 제조 방법 |
| US20070154634A1 (en) * | 2005-12-15 | 2007-07-05 | Optomec Design Company | Method and Apparatus for Low-Temperature Plasma Sintering |
| JP5082357B2 (ja) * | 2006-09-22 | 2012-11-28 | 東レ株式会社 | 網目状金属微粒子積層基板の製造方法 |
-
2008
- 2008-02-29 WO PCT/US2008/055446 patent/WO2008115681A2/en not_active Ceased
- 2008-02-29 AU AU2008229178A patent/AU2008229178B2/en not_active Ceased
- 2008-02-29 US US12/039,896 patent/US7763362B2/en not_active Expired - Fee Related
- 2008-02-29 CN CN200880006867A patent/CN101641210A/zh active Pending
- 2008-02-29 JP JP2009552014A patent/JP2010520626A/ja active Pending
- 2008-02-29 KR KR1020097020479A patent/KR20090117827A/ko not_active Ceased
- 2008-02-29 EP EP08799605A patent/EP2131979A4/en not_active Withdrawn
- 2008-02-29 CA CA002680201A patent/CA2680201A1/en not_active Abandoned
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102984929A (zh) * | 2011-09-07 | 2013-03-20 | 港易有限公司 | 用于电子装置的防辐射叠层板及将该叠层板嵌入外壳的方法 |
| CN102984929B (zh) * | 2011-09-07 | 2015-07-08 | 港易有限公司 | 用于电子装置的防辐射叠层板及将该叠层板嵌入外壳的方法 |
| CN107864604A (zh) * | 2017-11-10 | 2018-03-30 | 中国科学院西安光学精密机械研究所 | 一种电磁辐射屏蔽结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2008229178A1 (en) | 2008-09-25 |
| JP2010520626A (ja) | 2010-06-10 |
| EP2131979A4 (en) | 2013-03-06 |
| EP2131979A2 (en) | 2009-12-16 |
| WO2008115681A2 (en) | 2008-09-25 |
| CA2680201A1 (en) | 2008-09-25 |
| WO2008115681A3 (en) | 2008-11-20 |
| US7763362B2 (en) | 2010-07-27 |
| AU2008229178B2 (en) | 2012-02-23 |
| KR20090117827A (ko) | 2009-11-12 |
| US20080213609A1 (en) | 2008-09-04 |
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