CN101632027B - 用于电路板测试的测试夹具及方法 - Google Patents
用于电路板测试的测试夹具及方法 Download PDFInfo
- Publication number
- CN101632027B CN101632027B CN2008800060490A CN200880006049A CN101632027B CN 101632027 B CN101632027 B CN 101632027B CN 2008800060490 A CN2008800060490 A CN 2008800060490A CN 200880006049 A CN200880006049 A CN 200880006049A CN 101632027 B CN101632027 B CN 101632027B
- Authority
- CN
- China
- Prior art keywords
- pcb
- test
- deflection sensor
- deflection
- baffle plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012360 testing method Methods 0.000 title claims abstract description 185
- 238000000034 method Methods 0.000 title claims description 45
- 239000000523 sample Substances 0.000 claims abstract description 70
- 239000000758 substrate Substances 0.000 claims description 16
- 238000005259 measurement Methods 0.000 claims description 5
- DCMURXAZTZQAFB-UHFFFAOYSA-N 1,4-dichloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=CC=CC=2)Cl)=C1 DCMURXAZTZQAFB-UHFFFAOYSA-N 0.000 abstract description 23
- 230000001788 irregular Effects 0.000 abstract description 4
- 238000012544 monitoring process Methods 0.000 abstract description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 241000220317 Rosa Species 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07328—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support for testing printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/710,020 US7400135B1 (en) | 2007-02-23 | 2007-02-23 | Test fixture and method for circuit board testing |
US11/710,020 | 2007-02-23 | ||
PCT/US2008/054180 WO2008103619A2 (en) | 2007-02-23 | 2008-02-15 | Test fixture and method for circuit board testing |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101632027A CN101632027A (zh) | 2010-01-20 |
CN101632027B true CN101632027B (zh) | 2011-12-07 |
Family
ID=39596684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2008800060490A Expired - Fee Related CN101632027B (zh) | 2007-02-23 | 2008-02-15 | 用于电路板测试的测试夹具及方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7400135B1 (zh) |
CN (1) | CN101632027B (zh) |
WO (1) | WO2008103619A2 (zh) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200813450A (en) * | 2006-09-05 | 2008-03-16 | Inventec Appliances Corp | PC board inspection device |
EP1995602B1 (en) * | 2007-05-23 | 2013-08-14 | RRo Holding B.V. | Probe board, test fixture, method for making a probe board, and method for testing a printed circuit board |
EP2131204B1 (en) * | 2008-06-06 | 2012-11-14 | Texas Instruments France | A method and system for testing a semiconductor package |
US7973551B2 (en) * | 2009-10-09 | 2011-07-05 | Research In Motion Limited | Test fixture for printed circuit board |
EP2330428A1 (en) | 2009-10-09 | 2011-06-08 | Research In Motion Limited | Test fixture for printed circuit board |
US9007084B2 (en) | 2010-06-15 | 2015-04-14 | International Business Machines Corporation | Support structure for installation of a component assembly housed in a rotating, translating carriage chassis |
CN102121961B (zh) * | 2010-12-20 | 2014-05-07 | 梅州市志浩电子科技有限公司 | 耐高压测试装置及采用该装置的耐高压测试方法 |
CN102076173B (zh) * | 2011-01-17 | 2012-05-23 | 伟创力电子技术(苏州)有限公司 | 一种用于印刷电路板的夹具 |
FR2983969B1 (fr) | 2011-12-07 | 2014-12-05 | Larisys Ind | Dispositif de controle de cartes electroniques. |
US9916992B2 (en) * | 2012-02-20 | 2018-03-13 | Dynamics Inc. | Systems and methods for flexible components for powered cards and devices |
CN102768293B (zh) * | 2012-07-24 | 2015-03-25 | 上海交通大学 | 一种有机电致发光器件测量夹具 |
CN103728547A (zh) * | 2012-10-12 | 2014-04-16 | 技嘉科技股份有限公司 | 用于测试电路板的测试系统及漏电流测试方法 |
JP6221358B2 (ja) * | 2013-06-04 | 2017-11-01 | 日本電産リード株式会社 | 基板検査方法、及び基板検査装置 |
US9726718B2 (en) * | 2014-05-30 | 2017-08-08 | Skyworks Solutions, Inc. | Modular test fixture |
CN105222990B (zh) * | 2015-10-13 | 2018-07-31 | 广州万孚生物技术股份有限公司 | 发光元件测试治具 |
JP6737002B2 (ja) * | 2016-06-17 | 2020-08-05 | オムロン株式会社 | プローブピン |
DE102016114142A1 (de) * | 2016-08-01 | 2018-02-01 | Endress+Hauser Flowtec Ag | Leiterplatte mit Kontaktierungsanordnung |
CN106324480B (zh) * | 2016-08-23 | 2022-05-03 | 黄河科技学院 | 多功能综合电路调试仪 |
JP6881354B2 (ja) * | 2018-03-07 | 2021-06-02 | オムロン株式会社 | 検査ユニットおよび検査装置 |
US10739382B2 (en) * | 2018-09-18 | 2020-08-11 | Keysight Technologies, Inc. | Testing apparatus having a configurable probe fixture |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5894225A (en) * | 1996-10-31 | 1999-04-13 | Coffin; Harry S. | Test fixture |
US6650135B1 (en) * | 2000-06-29 | 2003-11-18 | Motorola, Inc. | Measurement chuck having piezoelectric elements and method |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2918648A (en) * | 1956-06-15 | 1959-12-22 | Philco Corp | Testing apparatus |
US4357062A (en) * | 1979-12-10 | 1982-11-02 | John Fluke Mfg. Co., Inc. | Universal circuit board test fixture |
US4506184A (en) * | 1984-01-10 | 1985-03-19 | Varian Associates, Inc. | Deformable chuck driven by piezoelectric means |
US5270641A (en) * | 1992-01-22 | 1993-12-14 | Everett Charles Technologies, Inc. | Dual side access test fixture |
US5311120A (en) | 1993-01-06 | 1994-05-10 | Bartholomew Mark R | Test fixture with test function feature |
US5572144A (en) * | 1993-02-22 | 1996-11-05 | Seagate Technology | Test jig and method for probing a printed circuit board |
US5574668A (en) * | 1995-02-22 | 1996-11-12 | Beaty; Elwin M. | Apparatus and method for measuring ball grid arrays |
KR0177219B1 (ko) * | 1995-06-30 | 1999-04-01 | 배순훈 | 고밀도실장 인서키트 검사장치 |
US6084422A (en) | 1997-11-10 | 2000-07-04 | Bartholomew; Mark | Printed circuit board testing device |
US6307386B1 (en) * | 1998-05-29 | 2001-10-23 | Agilent Technologies, Inc. | Modular mechanical fixturing and automated handling of printed circuit assemblies on automated test equipment |
US6667628B2 (en) * | 2002-04-02 | 2003-12-23 | Agilent Technologies, Inc. | Method and apparatus for the management of forces in a wireless fixture |
TW587703U (en) * | 2002-10-18 | 2004-05-11 | Hon Hai Prec Ind Co Ltd | Motherboard test fixture |
-
2007
- 2007-02-23 US US11/710,020 patent/US7400135B1/en not_active Expired - Fee Related
-
2008
- 2008-02-15 WO PCT/US2008/054180 patent/WO2008103619A2/en active Application Filing
- 2008-02-15 CN CN2008800060490A patent/CN101632027B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5894225A (en) * | 1996-10-31 | 1999-04-13 | Coffin; Harry S. | Test fixture |
US6650135B1 (en) * | 2000-06-29 | 2003-11-18 | Motorola, Inc. | Measurement chuck having piezoelectric elements and method |
Also Published As
Publication number | Publication date |
---|---|
US7400135B1 (en) | 2008-07-15 |
WO2008103619A3 (en) | 2008-10-16 |
CN101632027A (zh) | 2010-01-20 |
WO2008103619A2 (en) | 2008-08-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: LIU YAOMING Free format text: FORMER OWNER: QUALITY ONE TEST FIXTURING INC. Effective date: 20120724 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20120724 Address after: New territories, Hongkong, China Patentee after: Liu Yaoming Address before: Floor third, Taiping Industrial Centre, 53 Ting Ting Road, Tai Po, New Territories, Hongkong, China Patentee before: Quality One Test Fixturing Inc. (HK) |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111207 Termination date: 20190215 |