CN101631432A - 软硬复合电路板及其制作方法 - Google Patents
软硬复合电路板及其制作方法 Download PDFInfo
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- CN101631432A CN101631432A CN200810302724A CN200810302724A CN101631432A CN 101631432 A CN101631432 A CN 101631432A CN 200810302724 A CN200810302724 A CN 200810302724A CN 200810302724 A CN200810302724 A CN 200810302724A CN 101631432 A CN101631432 A CN 101631432A
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Application Number | Priority Date | Filing Date | Title |
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CN2008103027246A CN101631432B (zh) | 2008-07-14 | 2008-07-14 | 软硬复合电路板及其制作方法 |
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CN2008103027246A CN101631432B (zh) | 2008-07-14 | 2008-07-14 | 软硬复合电路板及其制作方法 |
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CN101631432A true CN101631432A (zh) | 2010-01-20 |
CN101631432B CN101631432B (zh) | 2011-07-27 |
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CN2008103027246A Active CN101631432B (zh) | 2008-07-14 | 2008-07-14 | 软硬复合电路板及其制作方法 |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102006725A (zh) * | 2010-11-03 | 2011-04-06 | 鸿富锦精密工业(深圳)有限公司 | 复合电路板 |
CN102378497A (zh) * | 2010-08-10 | 2012-03-14 | 冈业科技(东莞)有限公司 | 电路软板与硬板连结的制作方法及其电路板结构 |
CN102149254B (zh) * | 2010-02-09 | 2012-11-14 | 健鼎(无锡)电子有限公司 | 软硬复合电路板的制造方法 |
CN103209549A (zh) * | 2012-01-11 | 2013-07-17 | 台达电子工业股份有限公司 | 电路板组合 |
CN103313529A (zh) * | 2012-03-07 | 2013-09-18 | 宏恒胜电子科技(淮安)有限公司 | 软硬结合电路板的制作方法 |
CN103402310A (zh) * | 2013-08-06 | 2013-11-20 | 上海美维电子有限公司 | 软硬结合印刷线路板及其制造方法 |
CN104582235A (zh) * | 2013-10-15 | 2015-04-29 | 宏达国际电子股份有限公司 | 复合式电路板 |
US9668353B2 (en) | 2013-09-05 | 2017-05-30 | Murata Manufacturing Co., Ltd. | Electronic component with built-in capacitor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005322878A (ja) * | 2004-04-09 | 2005-11-17 | Dainippon Printing Co Ltd | 印刷配線基板の組付パネル、印刷配線基板の実装用単位シート、リジッド−フレキシブル基板及びこれらの製造方法 |
CN100442956C (zh) * | 2005-03-25 | 2008-12-10 | 华通电脑股份有限公司 | 软硬复合电路板的制造方法 |
CN100563406C (zh) * | 2007-11-21 | 2009-11-25 | 健鼎(无锡)电子有限公司 | 软硬印刷电路板的结合方法 |
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2008
- 2008-07-14 CN CN2008103027246A patent/CN101631432B/zh active Active
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102149254B (zh) * | 2010-02-09 | 2012-11-14 | 健鼎(无锡)电子有限公司 | 软硬复合电路板的制造方法 |
CN102378497A (zh) * | 2010-08-10 | 2012-03-14 | 冈业科技(东莞)有限公司 | 电路软板与硬板连结的制作方法及其电路板结构 |
CN102006725A (zh) * | 2010-11-03 | 2011-04-06 | 鸿富锦精密工业(深圳)有限公司 | 复合电路板 |
CN103209549A (zh) * | 2012-01-11 | 2013-07-17 | 台达电子工业股份有限公司 | 电路板组合 |
CN103209549B (zh) * | 2012-01-11 | 2016-01-20 | 台达电子工业股份有限公司 | 电路板组合 |
CN103313529A (zh) * | 2012-03-07 | 2013-09-18 | 宏恒胜电子科技(淮安)有限公司 | 软硬结合电路板的制作方法 |
CN103313529B (zh) * | 2012-03-07 | 2015-12-16 | 宏恒胜电子科技(淮安)有限公司 | 软硬结合电路板的制作方法 |
CN103402310A (zh) * | 2013-08-06 | 2013-11-20 | 上海美维电子有限公司 | 软硬结合印刷线路板及其制造方法 |
CN103402310B (zh) * | 2013-08-06 | 2016-05-11 | 上海美维电子有限公司 | 软硬结合印刷线路板及其制造方法 |
US9668353B2 (en) | 2013-09-05 | 2017-05-30 | Murata Manufacturing Co., Ltd. | Electronic component with built-in capacitor |
CN104582235A (zh) * | 2013-10-15 | 2015-04-29 | 宏达国际电子股份有限公司 | 复合式电路板 |
Also Published As
Publication number | Publication date |
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CN101631432B (zh) | 2011-07-27 |
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C14 | Grant of patent or utility model | ||
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C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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Effective date of registration: 20170303 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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CP03 | Change of name, title or address |