CN101621907B - 散热装置 - Google Patents

散热装置 Download PDF

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CN101621907B
CN101621907B CN200810068321.XA CN200810068321A CN101621907B CN 101621907 B CN101621907 B CN 101621907B CN 200810068321 A CN200810068321 A CN 200810068321A CN 101621907 B CN101621907 B CN 101621907B
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CN101621907A (zh
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郑东波
符猛
陈俊吉
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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Abstract

一种散热装置，包括一用于发热元件贴合的基座及穿置于该基座的穿置杆，该穿置杆具有一位于该基座一侧的一头部、位于该基座另一侧的一锁合部，该穿置杆上套设一阻挡于该头部和基座之间的弹性元件，该基座开设一螺纹孔，一供该穿置杆穿置的套筒螺合于该螺纹孔，该弹性元件阻挡于该头部和该套筒之间，该弹性元件的压缩程度通过调节套筒与螺纹孔的螺合长度而调节，从而使该弹性元件对上述基座产生不同的扣合力，使该散热装置适用不同发热元件或同一发热元件在不同状况下对扣合力的需求。

Description

散热装置
技术领域
本发明涉及一种散热装置，特别是涉及一种用于电子元件散热的散热装置。
背景技术
随着电子元件运算速度的提升及消耗功率的增大，相应产生的热量亦随之剧增，为了使电子元件能在正常工作温度下运行，常需一散热装置为其散热，通常该散热装置包括一贴设在电子元件表面的散热器来及时排出其产生的热量，及一扣具使散热器固定于电路板上与电子元件紧密贴合以达到良好的散热效果。
常用的散热装置的散热器包括一基座，该基座设有一穿孔。所述扣具为一杆状体，其包括一较大的头部、从该头部一体延伸的杆部及位于该杆部末段的螺纹部，该杆部上套设一弹簧。使用时，该扣具穿置于所述基座穿孔及安装电子元件的电路板，且螺纹部螺锁于电路板或位于电路板一侧的背板上，该弹簧压缩于该基座和扣具头部之间，从而该弹簧向该基座施力而使该散热器紧贴电子元件为其散热。然而，不同电子元件的承载力不同，故当扣具将散热器固定至电子元件时，扣具需根据电子元件的承载力产生相应的扣合力，而上述扣具较难产生不同扣合力以适应不同电子元件或同一电子元件在不同状况下的需求，故上述散热装置需进一步改进。
发明内容
有鉴于此，有必要提供一种能产生不同扣合力的散热装置。
一种散热装置，包括一用于发热元件贴合的基座及穿置于该基座的穿置杆，该穿置杆具有一位于该基座一侧的一头部、位于该基座另一侧的一锁合部，该穿置杆上套设一阻挡于该头部和基座之间的弹性元件，该基座开设一螺纹孔，一供该穿置杆穿置的套筒螺合于该螺纹孔，该弹性元件阻挡于该头部和该套筒之间，该弹性元件的压缩程度通过调节套筒与螺纹孔的螺合长度而调节。
与现有技术相比，上述散热装置通过调节套筒与螺纹孔的螺合长度而调节弹性元件的压缩程度，从而使该弹性元件对上述基座产生不同的扣合力，使该散热装置适用不同发热元件或同一发热元件在不同状况下对扣合力的需求。
附图说明
图1是本发明散热装置的立体分解图。
图2是图1中扣具的立体图。
图3是图1中散热装置的部分组装图。
图4是图3中散热装置的组装图。
图5是图4的侧视图。
图6是图3中散热装置组装后的另一侧视图。
具体实施方式
请参阅图1，本发明散热装置包括一散热器10，及二扣具20将该散热器10固定于电路板(图未示)上且与该电路板上的发热电子元件(图未示)贴设。
请同时参阅图3，所述散热器10包括一板状基座11、贴设于该基座11顶面的鳍片组15及连接该基座11和鳍片组15的四热管18。该基座11的相对两侧的中心位置分别开设一螺纹孔112。该基座11的上表面开设四条开槽118以收容热管18。该基座11位于该相对两侧之间的另一侧的中心位置对应该开槽118的端部处开设一切口115。该鳍片组15包括若干平行鳍片151。每一鳍片151的上下边缘分别垂直延伸一折边，这些折边对应相接形成鳍片组15的上、下表面，该下表面为一平面。该鳍片组15对应基座11的螺纹孔112位置处开设一缺口153，以避免在散热装置装置于电子元件过程中产生干涉。该鳍片组15开设四条容槽158以收容所述热管18。该四条容槽158均穿过每一鳍片151。该四条容槽158在该鳍片组15上由下向上呈放射状延伸，且容槽158的底部于鳍片组15的下表面开口而对应于基座11的开槽118。每一热管18呈U形，其包括一蒸发段(未标示)、一平行于该蒸发段的冷凝段(未标示)及连接该蒸发段和冷凝段的连接段。该蒸发段收容于基座11的开槽118及容槽158底部。该冷凝段收容于容槽158顶部。该连接段对应基座11的切口115而位于该鳍片组15的侧部。
请同时参阅图2，所述扣具20包括一穿置杆21、套置于穿置杆21上的弹簧23、一供穿置杆21穿置抵压弹簧23的套筒25。该穿置杆21包括一杆体210及形成于该杆体210两端的较大的头部212和一较小的锁合部218。该头部212的顶面设有一供工具作用而螺锁该穿置杆21的沟槽(未标示)。该杆体210靠近锁合部218的位置开设一周向卡槽后而形成一卡持部214，以供一卡环27卡持。该卡持部214与该锁合部218之间具有一定距离。在本实施例中，该卡持部214的横截面为圆形，在其他实施例中，该卡持部214的横截面可为其他形状。该锁合部218的外围攻设有螺纹。所述套筒25呈柱状，其包括一螺纹部255及与该螺纹部255共轴一体延伸的较大的抵接部250。该套筒25具有一穿孔258贯穿该抵接部250和螺纹部255，以供所述杆体210穿置。该螺纹部255的横切面呈圆环形，其外周围攻设有螺纹，以与所述散热器10基座11的螺纹孔112螺合。该抵接部250呈正六棱柱形，其上表面为平面。该抵接部250相对于该螺纹部255向外扩展。
请同时参阅图3至图5，所述散热装置在装配时，所述散热器10置于电子元件上，使散热器10基座11的螺纹孔112对应电路板上的固定孔。所述套筒25通过其螺纹部255螺合于基座11的螺纹孔112，所述套筒25的抵接部250位于基座11的上方。所述扣具20穿置杆21的锁合部218穿过套筒25的穿孔258，穿置杆21的卡持部214凸伸出螺纹孔112而将卡环27卡持于该卡持部214。按压穿置杆21并使其锁合部218螺锁于电路板上对应的固定孔或位于该电路板一侧的背板(图未示)。所述扣具20的弹簧23抵接该套筒25的抵接部250且压缩于该抵接部250和穿置杆21的头部212之间，而使散热器10的基座11紧贴电子元件。
如图6所示，当电子元件的承载力较小而其需要较小的扣合力时，作用于上述套筒25的抵接部250而拧转套筒25，使套筒25的螺纹部255向散热器10基座11的螺纹孔112内移动而使二者之间的螺合长度增加，使压缩在穿置杆21的头部211和抵接部250之间的弹簧23伸展，而减小对抵接部250的弹性抵压力，从而减小电子元件承受的扣合力。反之，扭转套筒25使其进一步向弹簧23方向移动，减小螺纹部255与螺纹孔112之间的螺合长度，而进一步压缩弹簧23，从而使弹簧23向散热器10产生更大的弹性抵压力，而增加电子元件承受的扣合力。
与现有技术相比，本发明散热装置通过作用于螺合在散热器10基座11的螺纹孔112上的套筒25，而改变螺纹孔112与套筒25之间的螺合长度，而使位于该套筒25与穿置杆21头部212之间的弹簧23进一步压缩或伸展，从而使弹簧23对散热器10产生较大或较小的弹性抵压力，在不更换弹簧23或穿置杆21的前提下，使散热装置适用不同的电子元件或同一电子元件在不同情况下的对不同扣合力的需求。

Claims (10)

1. 一种散热装置，包括一用于发热元件贴合的基座及穿置于该基座的穿置杆，该穿置杆具有一位于该基座一侧的一头部、位于该基座另一侧的一锁合部，该穿置杆上套设一阻挡于该头部和基座之间的弹性元件，其特征在于：所述基座开设一螺纹孔，一供所述穿置杆穿置的套筒螺合于该螺纹孔，所述弹性元件阻挡于所述头部和该套筒之间，所述弹性元件的压缩程度通过调节套筒与螺纹孔的螺合长度而调节。
2. 如权利要求1所述的散热装置，其特征在于：所述套筒包括一螺纹部和抵接部，该螺纹部与所述基座的螺纹孔螺合。
3. 如权利要求2所述的散热装置，其特征在于：所述抵接部位于所述基座的一侧，所述弹性元件位于该抵接部和所述头部之间。
4. 如权利要求1所述的散热装置，其特征在于：所述穿置杆包括一卡持部，该卡持部位于所述基座的另一侧，该卡持部卡持一阻挡于该基座另一侧的卡环。
5. 如权利要求1至4中任一项所述的散热装置，其特征在于：所述弹性元件为一弹簧。
6. 如权利要求1至4中任一项所述的散热装置，其特征在于：还包括一位于该基座上的鳍片组。
7. 如权利要求6所述的散热装置，其特征在于：所述鳍片组对应所述螺纹孔位置处设有一缺口。
8. 如权利要求6所述的散热装置，其特征在于：所述鳍片组设有若干容槽，该若干容槽从所述基座向远离基座方向呈辐射状。
9. 如权利要求8所述的散热装置，其特征在于：还包括若干收容于所述容槽内的热管，每一热管包括一位于所述容槽底部的蒸发段及位于该容槽顶部的冷凝段。
10. 如权利要求9所述的散热装置，其特征在于：所述每一热管还包括一连接所述蒸发段和所述冷凝段的连接段，所述基座对应该连接段设有一切口。
CN200810068321.XA 2008-07-04 2008-07-04 散热装置 Expired - Fee Related CN101621907B (zh)

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CN101888765A (zh) * 2009-05-15 2010-11-17 鸿富锦精密工业（深圳）有限公司 散热装置
US20110214842A1 (en) * 2010-03-05 2011-09-08 Lea-Min Technologies Co., Ltd. Heat sink
JP5401419B2 (ja) * 2010-08-31 2014-01-29 株式会社日立製作所 鉄道車両用電力変換装置
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