CN101615569A - Vacuum treatment installation - Google Patents

Vacuum treatment installation Download PDF

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Publication number
CN101615569A
CN101615569A CN200910143330A CN200910143330A CN101615569A CN 101615569 A CN101615569 A CN 101615569A CN 200910143330 A CN200910143330 A CN 200910143330A CN 200910143330 A CN200910143330 A CN 200910143330A CN 101615569 A CN101615569 A CN 101615569A
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CN
China
Prior art keywords
loam cake
unit
mobile unit
lower cover
vacuum treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN200910143330A
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Chinese (zh)
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CN101615569B (en
Inventor
车勋
金亨俊
严用铎
李珠熙
韩在柄
曹生贤
尹大根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lap Yi Cmi Holdings Ltd
Wonik IPS Co Ltd
Original Assignee
Integrated Process Systems Ltd
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Publication date
Priority claimed from KR1020050059031A external-priority patent/KR100682738B1/en
Priority claimed from KR1020050086577A external-priority patent/KR100688954B1/en
Application filed by Integrated Process Systems Ltd filed Critical Integrated Process Systems Ltd
Publication of CN101615569A publication Critical patent/CN101615569A/en
Application granted granted Critical
Publication of CN101615569B publication Critical patent/CN101615569B/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773Conveying cassettes, containers or carriers

Abstract

Herein disclosed is a kind of vacuum treatment installation, it is used for carrying out on substrate etch processes or spraying plating is handled, for example be used for the on glass of LCDs (LCD) panel, on the semiconductor wafer, or the like, it comprises a loam cake and a lower cover, and this loam cake and lower cover are interconnected to form a vacuum treatment space separably; A pair of lower horizontal mobile unit, this lower horizontal mobile unit is installed in each side of lower cover respectively; A pair of upper level mobile unit, this each upper level mobile unit is connected with loam cake on bottom mobile unit separately, moves loam cake with horizontal direction it is separated from lower cover; Lifting unit supports by the lower horizontal mobile unit and is mounted thereto, and lifting unit separates loam cake or by promoting or reducing the upper level mobile unit loam cake is connected with lower cover from lower cover.

Description

Vacuum treatment installation
The application is that application number is the dividing an application once more of divide an application (application number is 200710188367.0) of 200610001041.8 patent of invention.The application of this division according to the auditor for proposing about monistic defective in the notification of examiner's opinion first time of divide an application (application number is 200710188367.0).
The original bill applying date: on January 17th, 2006.
Original bill application number: 200610001041.8.
Original bill denomination of invention: vacuum treatment installation.
Division is submitted day to: on November 20th, 2007.
The number of dividing an application: 200710188367.0.
Division denomination of invention: vacuum treatment installation.
Technical field
The present invention relates to a kind of vacuum treatment installation, relate in particular to the vacuum treatment installation that is used on substrate, carrying out etch processes or spraying plating processing, for example be used for the on glass of LCDs (LCD) panel, on the semiconductor wafer, or the like.
Background technology
Described vacuum treatment installation is a kind of by use physics or chemical reaction under vacuum state, and for example plasma reaction etc. is carried out the device that etch processes or spraying plating are handled on substrate, for example is used for the on glass of liquid crystal display panel, on the semiconductor wafer.
Described vacuum treatment installation comprises a vacuum chamber, is used for carrying out etch processes or spraying plating and handles on substrate; With a transfer chamber, be used for substrate is transferred to vacuum chamber and substrate is transferred to load lock chambers from vacuum chamber from load lock chambers.
Simultaneously, the vacuum chamber of above-mentioned chamber, particularly described vacuum treatment installation need be opened and maintain or keep in repair.
Fig. 1 is the perspective view of traditional vacuum treatment installation, and its loam cake is openable.
As shown in Figure 1, in vacuum treatment installation, as the semiconductor processing device of main processing small size substrate, loam cake 3 is opened by hinge 5 and cylinder 7 from cavity 1.
But as shown in Figure 1, its very difficult complete opening loam cake 3 is also replaced the internal components of installing in the cavity 1 of vacuum treatment installation.
Particularly, because it is very heavy to be used to handle the internal components that large area substrates installs in semiconductor processing device, use crane to replace internal components.Yet described internal components can not be suspended on the crane, because the loam cake 3 of semiconductor processing device shown in Figure 1 can not overturn.
Although by enlarging semiconductor processing device, the semiconductor processing device loam cake among Fig. 1 can be with 180 ° of angle upsets, defective is that the gate device of semiconductor processing device is also extended, and the open mode instability of semiconductor processing device.
Fig. 2 to Fig. 4 represents the perspective view of another example loam cake opening procedure of traditional vacuum processing unit.
Vacuum treatment installation among Fig. 2, open in Korea S issued patents document NO.10-2001-0067439, it is by providing one to rotate and upgrade the height that equipment 15 lifting loam cakes 13 are scheduled to from cavity 11 to.And as shown in Figure 3, by using a mobile device 17 that loam cake 13 is moved to a rotatable position.Then as shown in Figure 4, rotate and upgrade equipment 15 by use and open loam cake 13.In Fig. 2 to Fig. 4, mobile device 17 comprises the first mobile device 17a and the second mobile device 17b.
Simultaneously, owing to rotate and upgrade equipment and mobile device is to combine in the traditional vacuum processing unit, very difficult installation rotates and upgrades equipment and mobile device.
In addition, although height is installed the not big difficulty of door equipment at the conventional process device of determining scope, on low height, cover very difficulty of direct installation door equipment.
Summary of the invention
In order to address the above problem, the purpose of this invention is to provide a kind of vacuum treatment installation, isolate loam cake by a lifting unit from lower cover, a horizontal movement unit moves horizontally and rotates loam cake, makes the installation of vacuum treatment installation become easy.
Another object of the present invention provides a vacuum treatment installation, by be separated out horizontal movement unit and lifting unit from vacuum chamber, prevents because loam cake moves horizontally the vibration transmission that causes to lower cover.
Another object of the present invention provides a vacuum treatment installation, by perpendicular to loam cake be used for the loam cake that moves up from the connection side that lower cover separates the transfer chamber of loam cake, make the installation more efficient use space of vacuum treatment installation.
To achieve these goals, the invention provides a vacuum treatment installation, comprise a loam cake and a lower cover, the connection between loam cake and the lower cover is the separable vacuum treatment space of forming; A pair of lower horizontal mobile unit is installed in each side of lower cover separately; A pair of upper level mobile unit, described each upper level mobile unit is rotatable on each bottom mobile unit to be connected with loam cake, and moves the loam cake that separates from lower cover in the horizontal direction; Lifting unit supports by the lower horizontal mobile unit and is mounted thereto, and described lifting unit separates loam cake or connects loam cake and lower cover by promoting or reducing the lower horizontal mobile unit from lower cover.
Each upper level mobile unit comprises that a top guidance unit is at the rotatable connection loam cake of each side of loam cake, with a upper level mobile unit that is connected to the top guidance unit, make that move horizontally can be along the top guidance unit, the rotatable connection loam cake of this upper level mobile unit; And each lower horizontal mobile unit comprises a bottom guidance unit, and it is installed in each limit of lower cover with horizontal direction, is connected the lower guide unit with a bottom horizontal movement unit, makes that move horizontally can be along the lower guide unit.Lifting unit comprises that at least one first promotes a terminal lower guide unit that connects of mobile unit, this first lifting mobile unit, its another end connects the top guidance unit, first promotes the mobile unit lifting or reduces the top guidance unit, promote mobile unit, this second lifting mobile unit, one terminal lower horizontal mobile unit that is connected with at least one second, its another end connects the top mobile unit, and second promotes the mobile unit lifting or reduce the top mobile unit.
To achieve these goals, the present invention also provides a vacuum treatment installation, comprises that a load lock chambers takes to receive from the outside substrate and carry out substrate after vacuum treatment and the transmission process to the outside; One transmission cavity receives substrate from load lock chambers and carries out substrate after vacuum treatment and the transmission process to load lock chambers; Receive substrate with a vacuum chamber from transmission cavity and carry out vacuum treatment, the substrate after using vacuum treatment and transmission process on the substrate is to transmission cavity; Wherein vacuum chamber comprises a loam cake and a lower cover, and the vacuum treatment space is formed in separable connection between loam cake and the lower cover; With a horizontal movement unit, move loam cake by vertical loam cake connection adjacent cavity closure and separate loam cake from lower cover.
Description of drawings
Fig. 1 is the perspective view of openable traditional vacuum processing unit one example of expression loam cake.
Fig. 2 to Fig. 4 is the perspective view of another example loam cake opening procedure of expression traditional vacuum processing unit.
Fig. 5 is the perspective view of expression according to the first embodiment of the invention vacuum treatment installation.
Fig. 6 is the perspective view of vacuum treatment installation shown in Fig. 5.
Fig. 7 is the end view of the vacuum chamber of vacuum treatment installation shown in Fig. 5.
Fig. 8 is the perspective view of the vacuum chamber of vacuum treatment installation shown in Fig. 5.
Fig. 9 to 11 is work schematic diagrames of the opening procedure of vacuum chamber shown in Fig. 5.
Figure 12 is the perspective view of vacuum chamber shown in Figure 11.
Figure 13 is the perspective view according to second embodiment of the invention vacuum treatment installation vacuum chamber.
Figure 14 to 17 is work schematic diagrames of vacuum chamber opening procedure shown in Figure 13.
Figure 18 is the profile according to vacuum treatment installation vacuum chamber of the present invention.
Figure 19 is the amplification profile of vacuum treatment installation cavity sealing unit shown in Figure 180.
Figure 20 is the amplification profile that vacuum treatment installation shown in Figure 180 is adjusted the rear chamber sealing unit.
Figure 21 is the amplification profile of another adjustment rear chamber sealing unit of vacuum treatment installation shown in Figure 180.
Figure 22 is that another adjusts the amplification profile of rear chamber sealing unit to vacuum treatment installation shown in Figure 180 again.
Figure 23 is the profile that is parallel to the vacuum chamber of vacuum chamber shown in Figure 180 and transmission cavity closure.
Embodiment
Hereinafter, vacuum treatment installation of the present invention is elaborated with reference to the accompanying drawings.
Vacuum treatment installation 100 of the present invention is made of a plurality of vacuum chamber 200, and the multi-cavity type is used for treatment substrate such as being used for LCD, Plasmia indicating panel (PDP), and the glass of organic light emitting display (OLED), or the like.In other words, the vacuum treatment installation 100 as shown in Fig. 5 and 6 may be made up of a plurality of transmission cavities 120 and load lock chambers 130.
Three vacuum chamber 200 that are used for etching or spraying plating are arranged around transmission cavity 120.Gate valve 102 is installed between transmission cavity 120 and the load lock chambers 130, between transmission cavity 120 and each vacuum chamber 200 and on the outer openings of load lock chambers 130.Gate valve 102 can be airtight or at each opening selectively unlocking.
In the outside of load lock chambers 130 two boxlike support units 104 are arranged, on boxlike support unit 104, be mounted with magazine 108.Carry out vacuum treated substrate 106 and be received in the magazine 108, the intact substrate 106 of vacuum treatment is received in another magazine 108.Magazine 108 can promote or reduction by a lowering or hoisting gear 140, and has only a magazine 108 to be mounted.Having only under magazine 108 situations, the intact substrate 106 of vacuum treatment is returned to the free space of same magazine 108.
One transmitting device 160 that is used for substrate transport 106 is installed in two support units 104 between the magazine 108.Transmission equipment 160 is made of the pedestal 163 of an arm 161,162 that is arranged above and below and a support arm 161,162, the rising that described arm 161,162 can be complete on pedestal 163, landing and rotation.Four convex bodys 164 that are used for supporting substrate 106 are arranged in arm 161,162.Convex body 164 is made such as the synthetic rubber of great friction coefficient by elastomeric material, in order to prevent substrate 106 displacements or to drop.
Each vacuum chamber 200 can comprise a loam cake 210 and a lower cover 220, and it is interconnected to constitute a vacuum treatment space separably, under the step-down of vacuum treatment space substrate 106 is carried out vacuum treatment.Pump that is used for the step-down of vacuum treatment space etc. is installed in vacuum chamber 200, omits the detailed description to them for simplicity.
The transmission cavity 120 of vacuum treatment installation is kept under vacuum chamber 200 step-downs.One transmitting device 121 is installed in the transmission cavity 120.Transmitting device 121 is substrate transport 106 between load lock chambers 130 and three vacuum chamber 200.Transmitting device 121 can be made of the first, the second and the 3rd arm 123,124,125 that extension is installed on the pedestal 122.
One end of the first arm 123 rotatably is connected on the pedestal 122, and an end of second arm 124 rotatably is connected on another end of the first arm 123, and an end of the 3rd arm 125 rotatably is connected on another end of second arm 124.The 3rd arm 125 constitutes the shape that resembles fork and is used for supporting substrate 106.
The the first, the second and the 3rd arm 123,124,125 drives by a driving arrangement (not shown) that is installed in pedestal 122 inside, and makes the 3rd arm 125 can transmit substrate 106.The structure of pedestal 122 make its can more than move, move down and rotate.
Load lock chambers 130 is kept under vacuum chamber 200 step-downs.Load lock chambers 130 can be separated up or down, and pending substrate 106 is admitted to the top of load lock chambers 130, and the substrate 106 after the processing is admitted to the bottom of load lock chambers 130.Enquiring digital 131 among Fig. 6 shows the support platform of a supporting substrate 106.Arrange the locator 132 of substrate 106 positions to be installed in 130 li of load lock chambers.
Simultaneously, vacuum chamber 200 is kept or repaired to split the coming of vacuum chamber 200 needs that comprises the vacuum treatment installation of loam cake 210 and lower cover 220.
The invention provides various structure partition loam cakes 210 and lower cover 220, the various structures of partition loam cake 210 and lower cover 220 will be described in more detail below.
Fig. 7 to 12 expression is according to the vacuum treatment installation of first embodiment of the invention.
Vacuum chamber 200 according to first embodiment of the invention, shown in Fig. 7 and 8, comprise a loam cake 210 and a lower cover 220, loam cake 210 and lower cover 220 are interconnected to constitute a vacuum treatment space separably, a pair of lower horizontal mobile unit 410, described lower horizontal mobile unit 410 is installed in each side of lower cover 220 respectively; A pair of upper level mobile unit 420, described each upper level mobile unit 420 rotatably is connected with loam cake 210 on each lower horizontal mobile unit 410, and moves the loam cake 210 that separates from lower cover 220 in the horizontal direction; Lifting unit 500 supports by lower horizontal mobile unit 410 and is mounted thereto, and lifting unit 500 connects loam cake 210 and lower cover 220 with loam cake 210 from lower cover 220 separation or by promoting or reducing upper level mobile unit 420.
Loam cake 210 and lower cover 220 separable interconnecting are formed for the vacuum treatment space of vacuum treatment substrate 106.One bracing frame that is used to support lower cover 220 can be installed under the lower cover 220, and support frame as described above can be made up of a series of support bars 221.
Simultaneously, loam cake 210 and lower cover 220 can have a kind of structure, the container of indent for example, and loam cake 210 can be a smooth panel, i.e. a lid simultaneously.
A pair of lower horizontal mobile unit 410 shown in Fig. 7 and 8, can comprise the lower guide unit 411 that is installed in lower cover 220 each side, and is connected the lower horizontal mobile unit 412 of lower guide unit 411 separately, and it moves horizontally along lower guide unit 411.
A pair of upper level mobile unit 420 can comprise the top guidance unit 421 that is installed in loam cake 210 each side, with the upper level mobile unit 422 that is connected each top guidance unit 421, its along top guidance unit 421 move horizontally and with 210 rotatable connections of loam cake.
Pair of rotary shafts 123 is installed in each end of loam cake 210, inserts the through hole 422a that passes through its formation in the upper level mobile unit 422 separately, and has at least this that one of rotating shaft 123 is connected with the rotary drive unit 450 that drives rotating shaft 123 rotations.Described rotary drive 450 as shown in Figs. 5 to 7, can be installed in the upper level mobile unit 422.In addition, rotating shaft 123 is more suitable for being installed on certain point of process loam cake 210 center of gravity line, so that more firmly support loam cake 210.
The structure of lower horizontal mobile unit 410 and upper level mobile unit 420 can be guide rail and slider component or cylinder, the combination of shelf and pinion, chain belt combination, linear movement guide rail or the like.
At least in lower horizontal mobile unit 410 and the upper level mobile unit 420 shown in Fig. 5 to 8, is furnished with CD-ROM drive motor 430 and comes mobile lower horizontal mobile unit 412 or upper level mobile unit 422.
Simultaneously, lower horizontal mobile unit 410 is connected with the sidewall of lower cover 220, and more preferably it separates with lower cover 220, thereby prevents because moving horizontally of loam cake 210 has influence on lower cover 220 caused vibrations etc.
Lifting unit 500, shown in Fig. 7 and 8, at least one first promotes mobile unit 510, these first lifting mobile unit, 510 1 ends are connected with lower guide unit 411, this first another end that promotes mobile unit 510 is connected with top guidance unit 421, this first lifting mobile unit 510 promotes or reduction top guidance unit 421, and at least one second lifting mobile unit 520, this second end that promotes mobile unit 520 is connected with lower horizontal mobile unit 412, this second another end that promotes mobile unit 520 is connected with upper level mobile unit 422, and this second lifting mobile unit 520 promotes or reduction upper level mobile unit 422.
It can be any device that can move up and down, for example cylinder or jackscrew etc. that the first lifting mobile unit 510 and second promotes mobile unit 520.
Simultaneously, lower guide unit 411 or lower horizontal mobile unit 412 can further be furnished with the strutting piece 530 that is used to support lower guide unit 411 or lower horizontal mobile unit 412, as shown in Figure 7, the first lifting mobile unit 510 and the second lifting mobile unit 520 can be installed on the strutting piece 530.
Simultaneously, the moving direction of vacuum chamber 200 loam cakes 210 in the first embodiment of the invention can be perpendicular to the closure of loam cake 210 connection adjacent cavity, and for example transmission cavity 120, shown in arrow among Fig. 6.
, compare with the structure that is parallel to loam cake 210 closures and moves with loam cake 210 under situation about moving with the closure that connects transmission cavities 120 perpendicular to loam cake 210 at loam cake 210, vacuum treatment installation has been saved the space.
The opening process of vacuum treatment installation vacuum chamber is elaborated with reference to Fig. 9 to 12 in the first embodiment of the present invention.
At first, as shown in Figure 9, loam cake 210 is raised by operation lifting unit 500 and separates from lower cover 220, and this lifting unit 500 comprises that first promotes the mobile unit 510 and the second lifting mobile unit 520.
And as shown in figure 10, by driving CD-ROM drive motor 430, the loam cake 210 that separates from lower cover 220 is moved horizontally.Wherein loam cake 210 is moved horizontally to much larger than the position of loam cake 210 radiuss of turn, thereby prevents that the rotation of loam cake 210 is disturbed.
To be described in more detail moving horizontally of loam cake 210.
CD-ROM drive motor 430 is driven and is used for moving the lower horizontal mobile unit 412 that is connected with lower guide unit 411.Move according to moving together of lower guide unit 411 by the second upper level mobile unit 422 that promotes mobile unit 520 supports.Therefore, the loam cake 210 that is connected with upper level mobile unit 422 is moved horizontally to a certain position.
Simultaneously, loam cake 210 is moved horizontally to a certain position, shown in Figure 11 and 12, by rotary drive unit 450 rotations.Wherein the direction of rotation of loam cake 210 is convenient to M R loam cake 210 according to the workman, can be clockwise or counterclockwise, and the anglec of rotation of loam cake 210 can be from 0 to 180 °.
Because because vibration of causing of CD-ROM drive motor 430 grades or the like, when mobile loam cake 210 is not directly delivered to lower cover 220, be installed in the influence that interior arrangement in the lower cover 220 or its internal environment can not vibrated etc.
The structure of vacuum treatment installation can be simplified in the first embodiment of the invention, because be used for rotation, and lifting and move horizontally loam cake and do not make up and do not constitute as one from the device that lower cover separates loam cake.
In addition, install one and be used for separating loam cake, especially the equipment of a low height loam cake is not difficult, is not to be installed to loam cake because be used for from the device of lower cover separation and lifting loam cake.
In addition, the loam cake of first embodiment of the invention vacuum treatment installation is applied to the pressure of rotating shaft, can be disperseed and causes loam cake also can be prevented from the caused danger that tilts of a certain direction by support loam cake with a series of parts.
The vacuum plant of Figure 13 to 17 expression second embodiment of the present invention.
Hereinafter, with reference to the accompanying drawings, the vacuum treatment installation in the second embodiment of the present invention is described in detail.Wherein, will be omitted, and will be marked by same numbers with the similar structure of first embodiment with the similar structure of first embodiment.
Vacuum chamber 200 in the second embodiment of the present invention, as shown in figure 13, comprise a loam cake 210 and a lower cover 220, loam cake 210 and lower cover 220 are connected to each other separably and constitute the vacuum treatment space, a pair of horizontal movement unit 710 connects each limit of loam cake 210 separately, with a pair of guidance unit 720, each guidance unit 720 is installed in lower cover 220 each limit, and moving horizontally of horizontal movement unit 710 of guiding can be moved horizontal movement unit 710.
Horizontal movement unit 710 is connected with guidance unit 730 and can slides along it, and can comprise that a supporter rotatably supports loam cake 210.Wherein, this supporter can be connected with a sliding part that slidably is connected guidance unit 720.
Guidance unit 720, as shown in figure 13, can comprise first guidance unit 721 that is installed in vacuum chamber 200 1 sides, for example lower cover 220, with second guidance unit 722 of support level mobile unit 710, it can rise to the height of first guidance unit 721 by lifting unit 800.
First guidance unit 721 is fixed on first bracing frame 730 that is installed to vacuum chamber 200 1 sides.Wherein, first bracing frame 730 can be fixed on a side of vacuum chamber 200, or is movably mounted.If first bracing frame 730 is installed movably, the installing space of vacuum treatment installation 100 can be used effectively.
Second guidance unit 722 as shown in figure 13, supports the horizontal movement unit 710 that is connected with a pair of lifting moving unit 810 of lifting unit 800.
Simultaneously, be used for first guidance unit 721 and second guidance unit 722 and horizontal movement unit 710 to be connected and to drive can be any structure, be used for moving horizontally described horizontal movement unit 710 along first guidance unit 721 and second guidance unit 722, for example can be guide rail and slider part or track, the combination of shelf and pinion, the chain belt combination, linear movement guide rail or the like.
Be used for the example of the mechanical device of mobile and horizontal mobile unit 710 at another, the horizontal movement unit 710 that is connected with loam cake 210 with rotating shaft 213, can on the horizontal direction of loam cake 210, form by penetrating loam cake 210 pilot hole (not shown) wherein, ball screw axle (not shown) spiral connects and inserts in the pilot hole (not shown), and be used for the CD-ROM drive motor of swing roller helical axis, thereby flatly mobile loam cake 210.
A driver element (not shown) can be installed on the horizontal movement unit 710, so horizontal movement unit 710 can move along first guidance unit 721 and second guidance unit 722.
Lifting unit 800 as shown in figure 13, can comprise that at least one lifting moving unit 810 is fixed on second bracing frame 830 of support and lifting first guidance unit 722.
One lifting moving unit 810, as shown in figure 13, can be preferably a pair of, a kind of device that raises or descend, cylinder for example, the jackscrew of the usefulness servo motor driven described in the hydraulic cylinder or first embodiment.
Simultaneously, second bracing frame 830 can support lower cover 220 together.
The opening process of the vacuum chamber of vacuum treatment installation will be described in detail in the second embodiment of the present invention.
At first, shown in Figure 14 and 15, second guidance unit 722 is by driving the height that lifting unit 800 is promoted to first guidance unit 721.
As shown in figure 15, when second guidance unit 722 is promoted to the height of first guidance unit 721, lifting unit 800 stops to drive, as shown in figure 16, horizontal movement unit 800 is driven, and loam cake 210 is moved to first guidance unit 721 from second guidance unit 722.
As shown in figure 17, when the mobile end of loam cake 210 to first guidance units 72, by driving rotary drive unit 450, loam cake 210 is rotated.
Simultaneously, for the maintenance and repair vacuum treatment installation, be used for comprising the lifting loam cake and after moving horizontally loam cake, rotating loam cake from the separation process of lower cover separation loam cake.
Yet the trend of pending substrate is to enlarge gradually, the vacuum treatment installation needs of substrate that are used to handle expansion are extended, the vacuum treatment space that loam cake and lower cover form is extended, so their weight increases, the result causes loam cake is separated the difficulty that becomes from lower cover.
The present invention also provides a vacuum treatment installation, and its loam cake can and need not promote loam cake from the lower cover separation.
That is to say that the vacuum chamber among the present invention can comprise a loam cake 210 and a lower cover 220, loam cake 210 and lower cover 220 interconnect, and space of formation forms a vacuum treatment space between loam cake 210 and lower cover 220; One by sealing or open the space and seal or open the cavity sealing unit 310 in vacuum treatment space; With one be used to keep the space maintenance unit 320 in space, space holding unit 320 is installed on loam cake 210 and the lower cover 220.
Cavity sealing unit 310 as shown in figure 18, can comprise at least one perpendicular to the connecting rod 312 of loam cake 210 in the installation of loam cake 210 sidewalls; With one be used for the seal arm 313 that sealed vacuum is handled the space, it is terminal and contact with loam cake 210 1 inner surfaces and lower cover 220 1 inner surfaces that sealing arm 313 is connected to connecting rod 312 1.
Connecting rod 312 vertical loam cakes 210 are installed along the sidewall of loam cake 210, can move up and down by a linear motion device (not shown), for example cylinder or hydraulic cylinder.
Preferably, connecting rod 312 connects loam cake 210 and comes sealed chamber, leaks and plasma reaction to prevent vacuum pressure.Connecting rod 312 can be made the influence that prevents vacuum treatment space ionic medium precursor reactant by insulating material, and the surface of insulation coating at connecting rod 312 perhaps preferably arranged.
Seal arm 313 moves according to the linearity of connecting rod 312, and the inner surface by tight contact loam cake 210 and lower cover 220 comes sealed vacuum to handle the space.
Seal 313a, 313b can further connect seal arm 313 and strengthen sealing effectiveness, as shown in figure 18, and comprise the first seal member 313a of tight contact loam cake 210 inner surfaces, with the second seal member 313b that closely contacts lower cover 220 inner surfaces.
Simultaneously, seal arm 313 can be made with the influence that prevents vacuum treatment space ionic medium precursor reactant or the surface of insulation coating in seal arm 313 preferably arranged by insulating material.
Simultaneously, a direction recess 211 that is used to connecting rod is moved up and down forms at the inner surface of loam cake 210.Preferably can form the step portion of ' L ' shape etc. at the edge of loam cake 210.
That is to say that a seal arm is accepted the shape formation definite shape of unit 214 according to seal arm 313, its edge at loam cake 210 forms, for seal arm 313 contacts with loam cake 210 and sealed vacuum processing space, as shown in figure 18.
Reference number 230 expression one import among Figure 18 transmits for the substrate 106 from transmission cavity and enters, and this inlet 230 forms on lower cover 220 and is used for installing connecting rods 312.
Simultaneously, the connecting rod 312 of cavity sealing unit 310 and seal arm 313 are installed in lower cover 220 rather than loam cake 210, as shown in figure 20.230 formation on loam cake 210 wherein enter the mouth.Reference number 221 expressions one direction recess in Figure 20 and 22 is used for making the connecting rod 312 at lower cover 220 to move up and down, and reference number 224 expressions one seal arm is accepted the unit.
In addition, shown in Figure 21 and 22, the seal arm 313 of cavity sealing unit 310 can be that conical in shape is come the enhanced leaktightness effect.
In particular, seal arm 313 can preferably have a tapered cross-section in the face of loam cake 210 or lower cover 220 inner surfaces.
Wherein the inner surface of loam cake 210 or lower cover 220 have one with the corresponding to inclined surface in tapered cross-section of seal arm 313.
Simultaneously, as shown in figure 23, space holding unit 320 can comprise first bracing frame of installing around lower cover 220 321, second bracing frame 322 that is connected with loam cake 210, with at least one strutting piece 323, the one end is supported by first bracing frame 321, and another end support also connects second bracing frame 322.
First bracing frame 321 comprises from lower cover 220 and separating, or the separator frame that is connected with the outer surface of lower cover 220.
Simultaneously, upper level mobile unit among the space holding unit 320 and first embodiment, the structure of lower horizontal mobile unit and lifting unit, with the pilot unit in second specific embodiment and the structure of lifting unit, or with Korean Patent issued patents document No.10-2001-0067439 in disclosed structure, also shown in Fig. 2 to 4, similar structure is arranged.
That is to say that first bracing frame 321 comprises the guide rail of a pair of connection lower cover 220 outer walls, second bracing frame 322 rotatably supports loam cake 210.
Support component 323 can be connected with a horizontal movement unit (not shown), and moves along first bracing frame 311 by this horizontal movement unit.
The lifting unit 500,800 among first embodiment and second embodiment and come to separate loam cake 210 wherein from lower cover 220 without any need for additional elevating function.
That is to say, shown in Figure 19 to 22, when needs when lower cover 220 separates loam cakes 210 and comes the maintenance and repair vacuum chamber, seal arm 313 is come deblocking loam cake 210 and lower cover 220 by mobile link 312.
When seal arm 313 deblocking loam cakes 210 and lower cover 220, loam cake 210 among first embodiment and second embodiment can be moved horizontally to a certain definite position, because loam cake 210 and lower cover 220 safeguard between loam cake 210 and lower cover 220 space is arranged under released state.
By being driven in rotation the unit rotation and being exposed to the outside, the loam cake 210 maintained and repairings that move horizontally.
According to mentioned above, when maintenance and repair, the vacuum treatment installation among the present invention moves loam cake and need not lifting, has prevented because loam cake moves the infringement that is brought, and can be simplified according to the structure of vacuum treatment installation of the present invention.
The vacuum treatment installation structure can be simplified among the present invention, because be used for rotation, and lifting and move horizontally loam cake and do not make up and do not constitute as one from the device that lower cover separates loam cake.
In addition, it is not difficult that a device that separates loam cake is installed, and particularly the loam cake of low height is not to be installed to loam cake because be used for from the device of lower cover separation and lifting loam cake.
In addition, the loam cake of vacuum treatment installation of the present invention is applied to the pressure of rotating shaft, can be disperseed and causes loam cake also can be prevented from the caused danger that tilts of a certain direction by support loam cake with a series of parts.
Introduce and described various preferred embodiments at present, but under spirit of the present invention and category, can make various changes and modifications by understanding described technology, therefore correspondingly, category of the present invention is not limited only to scope as described above, and will be according to following claim and equivalent thereof.

Claims (4)

1. a vacuum treatment installation comprises:
One vacuum chamber comprises a loam cake and a lower cover, and this loam cake and lower cover interconnect separably, constitutes a vacuum treatment space; With
One horizontal movement unit by to move horizontally loam cake on the closure that connects adjacent cavity perpendicular to loam cake, is used for separating loam cake from lower cover.
2. vacuum treatment installation as claimed in claim 1, wherein horizontal movement unit comprises:
A pair of lower horizontal mobile unit is installed in the lower cover opposite side respectively;
A pair of upper level mobile unit, each upper level mobile unit is rotatable on each lower horizontal mobile unit to be connected with loam cake, and moves loam cake with horizontal direction and separate from lower cover; And
One lifting unit supports and is installed on it by the lower horizontal mobile unit, and this lifting unit separates loam cake or by promoting or reducing the upper level mobile unit loam cake is connected with lower cover from lower cover.
3. vacuum treatment installation as claimed in claim 2, wherein each upper level mobile unit comprises that a top guidance unit is connected with loam cake in each side of loam cake, one upper level moving-member is connected with the top guidance unit, be used for making moving horizontally along the top guidance unit of loam cake, the upper level moving-member is connected with loam cake; And
Each lower horizontal mobile unit comprises that one is installed in the lower guide unit of each side of lower cover with horizontal direction, is connected the lower horizontal moving-member of lower guide unit with one, makes moving horizontally along the lower guide unit of lower cover.
4. vacuum treatment installation as claimed in claim 3, wherein lifting unit comprises that at least one first promotes mobile unit, this first end that promotes mobile unit connects the lower guide unit, its another end connects the top guidance unit, and this first lifting mobile unit promotes or reduction top guidance unit; With at least one second promote mobile unit, this second terminal lower horizontal moving-member that connects that promotes mobile unit, its another terminal upper level moving-member that connects, this second promotes mobile unit and promotes or reduce the upper level moving-member.
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KR1020050059031A KR100682738B1 (en) 2005-07-01 2005-07-01 Apparatus for semiconductor process
KR10-2005-0059031 2005-07-01
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103213815A (en) * 2013-03-07 2013-07-24 陈立明 Embedded rotor spiral speed-regulation constant feeder
CN109850573A (en) * 2018-12-04 2019-06-07 武汉华星光电半导体显示技术有限公司 Conveying machine

Families Citing this family (290)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4664142B2 (en) * 2005-07-21 2011-04-06 住友重機械工業株式会社 Stage equipment
KR100773720B1 (en) * 2006-11-23 2007-11-06 주식회사 아이피에스 Vacuum processing system and method for opening and closing the same
KR100925172B1 (en) * 2007-12-24 2009-11-05 주식회사 에이디피엔지니어링 Apparatus and method for opening and closing lid
KR101000330B1 (en) * 2008-04-22 2010-12-13 엘아이지에이디피 주식회사 apparatus for processing substrate
KR101036186B1 (en) * 2008-04-22 2011-05-23 엘아이지에이디피 주식회사 apparatus for processing substrate
KR101036605B1 (en) * 2008-06-30 2011-05-24 세메스 주식회사 Substrate supporting unit and single type substrate polishing apparatus using the same
KR101544901B1 (en) * 2008-11-10 2015-08-17 주식회사 원익아이피에스 Vacuum processing apparatus and method for replacing showrhead thereof
US10378106B2 (en) 2008-11-14 2019-08-13 Asm Ip Holding B.V. Method of forming insulation film by modified PEALD
US9394608B2 (en) 2009-04-06 2016-07-19 Asm America, Inc. Semiconductor processing reactor and components thereof
US8802201B2 (en) 2009-08-14 2014-08-12 Asm America, Inc. Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
US9312155B2 (en) 2011-06-06 2016-04-12 Asm Japan K.K. High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modules
US10854498B2 (en) 2011-07-15 2020-12-01 Asm Ip Holding B.V. Wafer-supporting device and method for producing same
US20130023129A1 (en) 2011-07-20 2013-01-24 Asm America, Inc. Pressure transmitter for a semiconductor processing environment
US9017481B1 (en) 2011-10-28 2015-04-28 Asm America, Inc. Process feed management for semiconductor substrate processing
CN103367195B (en) * 2012-03-26 2016-11-23 上海华虹宏力半导体制造有限公司 A kind of transmission cavity top cover being applicable to there is the semiconductor equipment in multiprocessing chamber
US9659799B2 (en) 2012-08-28 2017-05-23 Asm Ip Holding B.V. Systems and methods for dynamic semiconductor process scheduling
US10714315B2 (en) 2012-10-12 2020-07-14 Asm Ip Holdings B.V. Semiconductor reaction chamber showerhead
CN103151243B (en) * 2012-12-31 2016-08-03 上海新阳半导体材料股份有限公司 Production of electronic components is with sealing container
US20160376700A1 (en) 2013-02-01 2016-12-29 Asm Ip Holding B.V. System for treatment of deposition reactor
TWI674620B (en) * 2013-12-13 2019-10-11 日商荏原製作所股份有限公司 Structure for vacuum magnetic shield container
CN104726843B (en) * 2013-12-19 2017-09-01 北京北方微电子基地设备工艺研究中心有限责任公司 The sealing device and reaction chamber of transparency window
JP6293499B2 (en) * 2014-01-27 2018-03-14 株式会社日立ハイテクノロジーズ Vacuum processing equipment
US10683571B2 (en) 2014-02-25 2020-06-16 Asm Ip Holding B.V. Gas supply manifold and method of supplying gases to chamber using same
US10167557B2 (en) 2014-03-18 2019-01-01 Asm Ip Holding B.V. Gas distribution system, reactor including the system, and methods of using the same
US11015245B2 (en) 2014-03-19 2021-05-25 Asm Ip Holding B.V. Gas-phase reactor and system having exhaust plenum and components thereof
US10858737B2 (en) 2014-07-28 2020-12-08 Asm Ip Holding B.V. Showerhead assembly and components thereof
US9890456B2 (en) 2014-08-21 2018-02-13 Asm Ip Holding B.V. Method and system for in situ formation of gas-phase compounds
US9657845B2 (en) 2014-10-07 2017-05-23 Asm Ip Holding B.V. Variable conductance gas distribution apparatus and method
US10941490B2 (en) 2014-10-07 2021-03-09 Asm Ip Holding B.V. Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
KR102263121B1 (en) 2014-12-22 2021-06-09 에이에스엠 아이피 홀딩 비.브이. Semiconductor device and manufacuring method thereof
CN104451581B (en) * 2014-12-29 2017-02-22 中国科学院长春光学精密机械与物理研究所 Magnetron sputtering coating vacuum box
US10529542B2 (en) 2015-03-11 2020-01-07 Asm Ip Holdings B.V. Cross-flow reactor and method
US10276355B2 (en) 2015-03-12 2019-04-30 Asm Ip Holding B.V. Multi-zone reactor, system including the reactor, and method of using the same
US10043689B2 (en) 2015-06-05 2018-08-07 Hirata Corporation Chamber apparatus and processing system
TWI600853B (en) * 2015-06-05 2017-10-01 Hirata Spinning Chamber device and processing system
US10458018B2 (en) 2015-06-26 2019-10-29 Asm Ip Holding B.V. Structures including metal carbide material, devices including the structures, and methods of forming same
US10600673B2 (en) 2015-07-07 2020-03-24 Asm Ip Holding B.V. Magnetic susceptor to baseplate seal
US9960072B2 (en) 2015-09-29 2018-05-01 Asm Ip Holding B.V. Variable adjustment for precise matching of multiple chamber cavity housings
US10211308B2 (en) 2015-10-21 2019-02-19 Asm Ip Holding B.V. NbMC layers
US11139308B2 (en) 2015-12-29 2021-10-05 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices
US10468251B2 (en) 2016-02-19 2019-11-05 Asm Ip Holding B.V. Method for forming spacers using silicon nitride film for spacer-defined multiple patterning
US10529554B2 (en) 2016-02-19 2020-01-07 Asm Ip Holding B.V. Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
US10190213B2 (en) 2016-04-21 2019-01-29 Asm Ip Holding B.V. Deposition of metal borides
US10865475B2 (en) 2016-04-21 2020-12-15 Asm Ip Holding B.V. Deposition of metal borides and silicides
US10367080B2 (en) 2016-05-02 2019-07-30 Asm Ip Holding B.V. Method of forming a germanium oxynitride film
US10032628B2 (en) 2016-05-02 2018-07-24 Asm Ip Holding B.V. Source/drain performance through conformal solid state doping
US11453943B2 (en) 2016-05-25 2022-09-27 Asm Ip Holding B.V. Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
US10388509B2 (en) 2016-06-28 2019-08-20 Asm Ip Holding B.V. Formation of epitaxial layers via dislocation filtering
US9859151B1 (en) 2016-07-08 2018-01-02 Asm Ip Holding B.V. Selective film deposition method to form air gaps
US10612137B2 (en) 2016-07-08 2020-04-07 Asm Ip Holdings B.V. Organic reactants for atomic layer deposition
US10714385B2 (en) 2016-07-19 2020-07-14 Asm Ip Holding B.V. Selective deposition of tungsten
US9812320B1 (en) 2016-07-28 2017-11-07 Asm Ip Holding B.V. Method and apparatus for filling a gap
US9887082B1 (en) 2016-07-28 2018-02-06 Asm Ip Holding B.V. Method and apparatus for filling a gap
US10395919B2 (en) 2016-07-28 2019-08-27 Asm Ip Holding B.V. Method and apparatus for filling a gap
KR102532607B1 (en) 2016-07-28 2023-05-15 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus and method of operating the same
US10410943B2 (en) 2016-10-13 2019-09-10 Asm Ip Holding B.V. Method for passivating a surface of a semiconductor and related systems
US10643826B2 (en) 2016-10-26 2020-05-05 Asm Ip Holdings B.V. Methods for thermally calibrating reaction chambers
US11532757B2 (en) 2016-10-27 2022-12-20 Asm Ip Holding B.V. Deposition of charge trapping layers
US10714350B2 (en) 2016-11-01 2020-07-14 ASM IP Holdings, B.V. Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10229833B2 (en) 2016-11-01 2019-03-12 Asm Ip Holding B.V. Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10435790B2 (en) 2016-11-01 2019-10-08 Asm Ip Holding B.V. Method of subatmospheric plasma-enhanced ALD using capacitively coupled electrodes with narrow gap
US10134757B2 (en) 2016-11-07 2018-11-20 Asm Ip Holding B.V. Method of processing a substrate and a device manufactured by using the method
KR102546317B1 (en) 2016-11-15 2023-06-21 에이에스엠 아이피 홀딩 비.브이. Gas supply unit and substrate processing apparatus including the same
US10340135B2 (en) 2016-11-28 2019-07-02 Asm Ip Holding B.V. Method of topologically restricted plasma-enhanced cyclic deposition of silicon or metal nitride
KR20180068582A (en) 2016-12-14 2018-06-22 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US11581186B2 (en) 2016-12-15 2023-02-14 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus
US11447861B2 (en) 2016-12-15 2022-09-20 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus and a method of forming a patterned structure
KR20180070971A (en) 2016-12-19 2018-06-27 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US10269558B2 (en) 2016-12-22 2019-04-23 Asm Ip Holding B.V. Method of forming a structure on a substrate
US10867788B2 (en) 2016-12-28 2020-12-15 Asm Ip Holding B.V. Method of forming a structure on a substrate
US11390950B2 (en) 2017-01-10 2022-07-19 Asm Ip Holding B.V. Reactor system and method to reduce residue buildup during a film deposition process
US10655221B2 (en) 2017-02-09 2020-05-19 Asm Ip Holding B.V. Method for depositing oxide film by thermal ALD and PEALD
US10468261B2 (en) 2017-02-15 2019-11-05 Asm Ip Holding B.V. Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
US10529563B2 (en) 2017-03-29 2020-01-07 Asm Ip Holdings B.V. Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
KR102457289B1 (en) 2017-04-25 2022-10-21 에이에스엠 아이피 홀딩 비.브이. Method for depositing a thin film and manufacturing a semiconductor device
US10446393B2 (en) 2017-05-08 2019-10-15 Asm Ip Holding B.V. Methods for forming silicon-containing epitaxial layers and related semiconductor device structures
US10892156B2 (en) 2017-05-08 2021-01-12 Asm Ip Holding B.V. Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
US10770286B2 (en) 2017-05-08 2020-09-08 Asm Ip Holdings B.V. Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
US10504742B2 (en) 2017-05-31 2019-12-10 Asm Ip Holding B.V. Method of atomic layer etching using hydrogen plasma
US10886123B2 (en) 2017-06-02 2021-01-05 Asm Ip Holding B.V. Methods for forming low temperature semiconductor layers and related semiconductor device structures
US11306395B2 (en) 2017-06-28 2022-04-19 Asm Ip Holding B.V. Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
US10685834B2 (en) 2017-07-05 2020-06-16 Asm Ip Holdings B.V. Methods for forming a silicon germanium tin layer and related semiconductor device structures
KR20190009245A (en) 2017-07-18 2019-01-28 에이에스엠 아이피 홀딩 비.브이. Methods for forming a semiconductor device structure and related semiconductor device structures
US10541333B2 (en) 2017-07-19 2020-01-21 Asm Ip Holding B.V. Method for depositing a group IV semiconductor and related semiconductor device structures
US11018002B2 (en) 2017-07-19 2021-05-25 Asm Ip Holding B.V. Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
US11374112B2 (en) 2017-07-19 2022-06-28 Asm Ip Holding B.V. Method for depositing a group IV semiconductor and related semiconductor device structures
US10605530B2 (en) 2017-07-26 2020-03-31 Asm Ip Holding B.V. Assembly of a liner and a flange for a vertical furnace as well as the liner and the vertical furnace
US10590535B2 (en) 2017-07-26 2020-03-17 Asm Ip Holdings B.V. Chemical treatment, deposition and/or infiltration apparatus and method for using the same
US10770336B2 (en) 2017-08-08 2020-09-08 Asm Ip Holding B.V. Substrate lift mechanism and reactor including same
US10692741B2 (en) 2017-08-08 2020-06-23 Asm Ip Holdings B.V. Radiation shield
US10249524B2 (en) 2017-08-09 2019-04-02 Asm Ip Holding B.V. Cassette holder assembly for a substrate cassette and holding member for use in such assembly
US11769682B2 (en) 2017-08-09 2023-09-26 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
US11139191B2 (en) 2017-08-09 2021-10-05 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
USD900036S1 (en) 2017-08-24 2020-10-27 Asm Ip Holding B.V. Heater electrical connector and adapter
US11830730B2 (en) 2017-08-29 2023-11-28 Asm Ip Holding B.V. Layer forming method and apparatus
KR102491945B1 (en) 2017-08-30 2023-01-26 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US11056344B2 (en) 2017-08-30 2021-07-06 Asm Ip Holding B.V. Layer forming method
US11295980B2 (en) 2017-08-30 2022-04-05 Asm Ip Holding B.V. Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
CN107587101A (en) * 2017-08-31 2018-01-16 北京创昱科技有限公司 A kind of floating junction device and the maintenance frock for being easy to dismount the floating junction device
US10607895B2 (en) 2017-09-18 2020-03-31 Asm Ip Holdings B.V. Method for forming a semiconductor device structure comprising a gate fill metal
KR102630301B1 (en) 2017-09-21 2024-01-29 에이에스엠 아이피 홀딩 비.브이. Method of sequential infiltration synthesis treatment of infiltrateable material and structures and devices formed using same
US10844484B2 (en) 2017-09-22 2020-11-24 Asm Ip Holding B.V. Apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
US10658205B2 (en) 2017-09-28 2020-05-19 Asm Ip Holdings B.V. Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
US10403504B2 (en) 2017-10-05 2019-09-03 Asm Ip Holding B.V. Method for selectively depositing a metallic film on a substrate
US10319588B2 (en) 2017-10-10 2019-06-11 Asm Ip Holding B.V. Method for depositing a metal chalcogenide on a substrate by cyclical deposition
US10923344B2 (en) 2017-10-30 2021-02-16 Asm Ip Holding B.V. Methods for forming a semiconductor structure and related semiconductor structures
KR102443047B1 (en) 2017-11-16 2022-09-14 에이에스엠 아이피 홀딩 비.브이. Method of processing a substrate and a device manufactured by the same
US10910262B2 (en) 2017-11-16 2021-02-02 Asm Ip Holding B.V. Method of selectively depositing a capping layer structure on a semiconductor device structure
US11022879B2 (en) 2017-11-24 2021-06-01 Asm Ip Holding B.V. Method of forming an enhanced unexposed photoresist layer
CN111344522B (en) 2017-11-27 2022-04-12 阿斯莫Ip控股公司 Including clean mini-environment device
KR102597978B1 (en) 2017-11-27 2023-11-06 에이에스엠 아이피 홀딩 비.브이. Storage device for storing wafer cassettes for use with batch furnaces
US10872771B2 (en) 2018-01-16 2020-12-22 Asm Ip Holding B. V. Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
TW202325889A (en) 2018-01-19 2023-07-01 荷蘭商Asm 智慧財產控股公司 Deposition method
CN111630203A (en) 2018-01-19 2020-09-04 Asm Ip私人控股有限公司 Method for depositing gap filling layer by plasma auxiliary deposition
USD903477S1 (en) 2018-01-24 2020-12-01 Asm Ip Holdings B.V. Metal clamp
US11018047B2 (en) 2018-01-25 2021-05-25 Asm Ip Holding B.V. Hybrid lift pin
USD880437S1 (en) 2018-02-01 2020-04-07 Asm Ip Holding B.V. Gas supply plate for semiconductor manufacturing apparatus
US10535516B2 (en) 2018-02-01 2020-01-14 Asm Ip Holdings B.V. Method for depositing a semiconductor structure on a surface of a substrate and related semiconductor structures
US11081345B2 (en) 2018-02-06 2021-08-03 Asm Ip Holding B.V. Method of post-deposition treatment for silicon oxide film
EP3737779A1 (en) 2018-02-14 2020-11-18 ASM IP Holding B.V. A method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
US10896820B2 (en) 2018-02-14 2021-01-19 Asm Ip Holding B.V. Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
US10731249B2 (en) 2018-02-15 2020-08-04 Asm Ip Holding B.V. Method of forming a transition metal containing film on a substrate by a cyclical deposition process, a method for supplying a transition metal halide compound to a reaction chamber, and related vapor deposition apparatus
US10658181B2 (en) 2018-02-20 2020-05-19 Asm Ip Holding B.V. Method of spacer-defined direct patterning in semiconductor fabrication
KR102636427B1 (en) 2018-02-20 2024-02-13 에이에스엠 아이피 홀딩 비.브이. Substrate processing method and apparatus
US10975470B2 (en) 2018-02-23 2021-04-13 Asm Ip Holding B.V. Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
US11473195B2 (en) 2018-03-01 2022-10-18 Asm Ip Holding B.V. Semiconductor processing apparatus and a method for processing a substrate
US11629406B2 (en) 2018-03-09 2023-04-18 Asm Ip Holding B.V. Semiconductor processing apparatus comprising one or more pyrometers for measuring a temperature of a substrate during transfer of the substrate
US11114283B2 (en) 2018-03-16 2021-09-07 Asm Ip Holding B.V. Reactor, system including the reactor, and methods of manufacturing and using same
KR102646467B1 (en) 2018-03-27 2024-03-11 에이에스엠 아이피 홀딩 비.브이. Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
US11230766B2 (en) 2018-03-29 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
US10510536B2 (en) 2018-03-29 2019-12-17 Asm Ip Holding B.V. Method of depositing a co-doped polysilicon film on a surface of a substrate within a reaction chamber
US11088002B2 (en) 2018-03-29 2021-08-10 Asm Ip Holding B.V. Substrate rack and a substrate processing system and method
KR102501472B1 (en) 2018-03-30 2023-02-20 에이에스엠 아이피 홀딩 비.브이. Substrate processing method
TW202344708A (en) 2018-05-08 2023-11-16 荷蘭商Asm Ip私人控股有限公司 Methods for depositing an oxide film on a substrate by a cyclical deposition process and related device structures
TWI816783B (en) 2018-05-11 2023-10-01 荷蘭商Asm 智慧財產控股公司 Methods for forming a doped metal carbide film on a substrate and related semiconductor device structures
KR102596988B1 (en) 2018-05-28 2023-10-31 에이에스엠 아이피 홀딩 비.브이. Method of processing a substrate and a device manufactured by the same
US11718913B2 (en) 2018-06-04 2023-08-08 Asm Ip Holding B.V. Gas distribution system and reactor system including same
US11270899B2 (en) 2018-06-04 2022-03-08 Asm Ip Holding B.V. Wafer handling chamber with moisture reduction
US11286562B2 (en) 2018-06-08 2022-03-29 Asm Ip Holding B.V. Gas-phase chemical reactor and method of using same
US10797133B2 (en) 2018-06-21 2020-10-06 Asm Ip Holding B.V. Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
KR102568797B1 (en) 2018-06-21 2023-08-21 에이에스엠 아이피 홀딩 비.브이. Substrate processing system
WO2020003000A1 (en) 2018-06-27 2020-01-02 Asm Ip Holding B.V. Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
US11492703B2 (en) 2018-06-27 2022-11-08 Asm Ip Holding B.V. Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
KR20200002519A (en) 2018-06-29 2020-01-08 에이에스엠 아이피 홀딩 비.브이. Method for depositing a thin film and manufacturing a semiconductor device
US10612136B2 (en) 2018-06-29 2020-04-07 ASM IP Holding, B.V. Temperature-controlled flange and reactor system including same
US10388513B1 (en) 2018-07-03 2019-08-20 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10755922B2 (en) 2018-07-03 2020-08-25 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10767789B2 (en) 2018-07-16 2020-09-08 Asm Ip Holding B.V. Diaphragm valves, valve components, and methods for forming valve components
US10483099B1 (en) 2018-07-26 2019-11-19 Asm Ip Holding B.V. Method for forming thermally stable organosilicon polymer film
US11053591B2 (en) 2018-08-06 2021-07-06 Asm Ip Holding B.V. Multi-port gas injection system and reactor system including same
US10883175B2 (en) 2018-08-09 2021-01-05 Asm Ip Holding B.V. Vertical furnace for processing substrates and a liner for use therein
US10829852B2 (en) 2018-08-16 2020-11-10 Asm Ip Holding B.V. Gas distribution device for a wafer processing apparatus
US11430674B2 (en) 2018-08-22 2022-08-30 Asm Ip Holding B.V. Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
CN108776559A (en) * 2018-09-03 2018-11-09 德清科电子有限公司 A kind of safe touch panel device
KR20200030162A (en) 2018-09-11 2020-03-20 에이에스엠 아이피 홀딩 비.브이. Method for deposition of a thin film
US11024523B2 (en) 2018-09-11 2021-06-01 Asm Ip Holding B.V. Substrate processing apparatus and method
US11049751B2 (en) 2018-09-14 2021-06-29 Asm Ip Holding B.V. Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
CN110970344A (en) 2018-10-01 2020-04-07 Asm Ip控股有限公司 Substrate holding apparatus, system including the same, and method of using the same
US11232963B2 (en) 2018-10-03 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
KR102592699B1 (en) 2018-10-08 2023-10-23 에이에스엠 아이피 홀딩 비.브이. Substrate support unit and apparatuses for depositing thin film and processing the substrate including the same
US10847365B2 (en) 2018-10-11 2020-11-24 Asm Ip Holding B.V. Method of forming conformal silicon carbide film by cyclic CVD
US10811256B2 (en) 2018-10-16 2020-10-20 Asm Ip Holding B.V. Method for etching a carbon-containing feature
KR102605121B1 (en) 2018-10-19 2023-11-23 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus and substrate processing method
KR102546322B1 (en) 2018-10-19 2023-06-21 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus and substrate processing method
USD948463S1 (en) 2018-10-24 2022-04-12 Asm Ip Holding B.V. Susceptor for semiconductor substrate supporting apparatus
US10381219B1 (en) 2018-10-25 2019-08-13 Asm Ip Holding B.V. Methods for forming a silicon nitride film
US11087997B2 (en) 2018-10-31 2021-08-10 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
KR20200051105A (en) 2018-11-02 2020-05-13 에이에스엠 아이피 홀딩 비.브이. Substrate support unit and substrate processing apparatus including the same
US11572620B2 (en) 2018-11-06 2023-02-07 Asm Ip Holding B.V. Methods for selectively depositing an amorphous silicon film on a substrate
US11031242B2 (en) 2018-11-07 2021-06-08 Asm Ip Holding B.V. Methods for depositing a boron doped silicon germanium film
US10818758B2 (en) 2018-11-16 2020-10-27 Asm Ip Holding B.V. Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
US10847366B2 (en) 2018-11-16 2020-11-24 Asm Ip Holding B.V. Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
US10559458B1 (en) 2018-11-26 2020-02-11 Asm Ip Holding B.V. Method of forming oxynitride film
US11217444B2 (en) 2018-11-30 2022-01-04 Asm Ip Holding B.V. Method for forming an ultraviolet radiation responsive metal oxide-containing film
KR102636428B1 (en) 2018-12-04 2024-02-13 에이에스엠 아이피 홀딩 비.브이. A method for cleaning a substrate processing apparatus
US11158513B2 (en) 2018-12-13 2021-10-26 Asm Ip Holding B.V. Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
JP2020096183A (en) 2018-12-14 2020-06-18 エーエスエム・アイピー・ホールディング・ベー・フェー Method of forming device structure using selective deposition of gallium nitride, and system for the same
TWI819180B (en) 2019-01-17 2023-10-21 荷蘭商Asm 智慧財產控股公司 Methods of forming a transition metal containing film on a substrate by a cyclical deposition process
KR20200091543A (en) 2019-01-22 2020-07-31 에이에스엠 아이피 홀딩 비.브이. Semiconductor processing device
CN111524788B (en) 2019-02-01 2023-11-24 Asm Ip私人控股有限公司 Method for topologically selective film formation of silicon oxide
KR20200102357A (en) 2019-02-20 2020-08-31 에이에스엠 아이피 홀딩 비.브이. Apparatus and methods for plug fill deposition in 3-d nand applications
TW202104632A (en) 2019-02-20 2021-02-01 荷蘭商Asm Ip私人控股有限公司 Cyclical deposition method and apparatus for filling a recess formed within a substrate surface
KR102626263B1 (en) 2019-02-20 2024-01-16 에이에스엠 아이피 홀딩 비.브이. Cyclical deposition method including treatment step and apparatus for same
TW202044325A (en) 2019-02-20 2020-12-01 荷蘭商Asm Ip私人控股有限公司 Method of filling a recess formed within a surface of a substrate, semiconductor structure formed according to the method, and semiconductor processing apparatus
TW202100794A (en) 2019-02-22 2021-01-01 荷蘭商Asm Ip私人控股有限公司 Substrate processing apparatus and method for processing substrate
KR20200108242A (en) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. Method for Selective Deposition of Silicon Nitride Layer and Structure Including Selectively-Deposited Silicon Nitride Layer
KR20200108243A (en) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. Structure Including SiOC Layer and Method of Forming Same
KR20200108248A (en) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. STRUCTURE INCLUDING SiOCN LAYER AND METHOD OF FORMING SAME
JP2020167398A (en) 2019-03-28 2020-10-08 エーエスエム・アイピー・ホールディング・ベー・フェー Door opener and substrate processing apparatus provided therewith
KR20200116855A (en) 2019-04-01 2020-10-13 에이에스엠 아이피 홀딩 비.브이. Method of manufacturing semiconductor device
KR20200123380A (en) 2019-04-19 2020-10-29 에이에스엠 아이피 홀딩 비.브이. Layer forming method and apparatus
KR20200125453A (en) 2019-04-24 2020-11-04 에이에스엠 아이피 홀딩 비.브이. Gas-phase reactor system and method of using same
KR20200130121A (en) 2019-05-07 2020-11-18 에이에스엠 아이피 홀딩 비.브이. Chemical source vessel with dip tube
KR20200130118A (en) 2019-05-07 2020-11-18 에이에스엠 아이피 홀딩 비.브이. Method for Reforming Amorphous Carbon Polymer Film
KR20200130652A (en) 2019-05-10 2020-11-19 에이에스엠 아이피 홀딩 비.브이. Method of depositing material onto a surface and structure formed according to the method
JP2020188255A (en) 2019-05-16 2020-11-19 エーエスエム アイピー ホールディング ビー.ブイ. Wafer boat handling device, vertical batch furnace, and method
USD975665S1 (en) 2019-05-17 2023-01-17 Asm Ip Holding B.V. Susceptor shaft
USD947913S1 (en) 2019-05-17 2022-04-05 Asm Ip Holding B.V. Susceptor shaft
USD935572S1 (en) 2019-05-24 2021-11-09 Asm Ip Holding B.V. Gas channel plate
USD922229S1 (en) 2019-06-05 2021-06-15 Asm Ip Holding B.V. Device for controlling a temperature of a gas supply unit
KR20200141003A (en) 2019-06-06 2020-12-17 에이에스엠 아이피 홀딩 비.브이. Gas-phase reactor system including a gas detector
KR20200143254A (en) 2019-06-11 2020-12-23 에이에스엠 아이피 홀딩 비.브이. Method of forming an electronic structure using an reforming gas, system for performing the method, and structure formed using the method
USD944946S1 (en) 2019-06-14 2022-03-01 Asm Ip Holding B.V. Shower plate
USD931978S1 (en) 2019-06-27 2021-09-28 Asm Ip Holding B.V. Showerhead vacuum transport
KR20210005515A (en) 2019-07-03 2021-01-14 에이에스엠 아이피 홀딩 비.브이. Temperature control assembly for substrate processing apparatus and method of using same
JP2021015791A (en) 2019-07-09 2021-02-12 エーエスエム アイピー ホールディング ビー.ブイ. Plasma device and substrate processing method using coaxial waveguide
CN112216646A (en) 2019-07-10 2021-01-12 Asm Ip私人控股有限公司 Substrate supporting assembly and substrate processing device comprising same
KR20210010307A (en) 2019-07-16 2021-01-27 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
KR20210010816A (en) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. Radical assist ignition plasma system and method
KR20210010820A (en) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. Methods of forming silicon germanium structures
US11643724B2 (en) 2019-07-18 2023-05-09 Asm Ip Holding B.V. Method of forming structures using a neutral beam
CN112242296A (en) 2019-07-19 2021-01-19 Asm Ip私人控股有限公司 Method of forming topologically controlled amorphous carbon polymer films
CN112309843A (en) 2019-07-29 2021-02-02 Asm Ip私人控股有限公司 Selective deposition method for achieving high dopant doping
CN112309900A (en) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 Substrate processing apparatus
CN112309899A (en) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 Substrate processing apparatus
US11227782B2 (en) 2019-07-31 2022-01-18 Asm Ip Holding B.V. Vertical batch furnace assembly
US11587815B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11587814B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
KR20210018759A (en) 2019-08-05 2021-02-18 에이에스엠 아이피 홀딩 비.브이. Liquid level sensor for a chemical source vessel
USD965044S1 (en) 2019-08-19 2022-09-27 Asm Ip Holding B.V. Susceptor shaft
USD965524S1 (en) 2019-08-19 2022-10-04 Asm Ip Holding B.V. Susceptor support
JP2021031769A (en) 2019-08-21 2021-03-01 エーエスエム アイピー ホールディング ビー.ブイ. Production apparatus of mixed gas of film deposition raw material and film deposition apparatus
USD940837S1 (en) 2019-08-22 2022-01-11 Asm Ip Holding B.V. Electrode
USD949319S1 (en) 2019-08-22 2022-04-19 Asm Ip Holding B.V. Exhaust duct
USD930782S1 (en) 2019-08-22 2021-09-14 Asm Ip Holding B.V. Gas distributor
KR20210024423A (en) 2019-08-22 2021-03-05 에이에스엠 아이피 홀딩 비.브이. Method for forming a structure with a hole
USD979506S1 (en) 2019-08-22 2023-02-28 Asm Ip Holding B.V. Insulator
US11286558B2 (en) 2019-08-23 2022-03-29 Asm Ip Holding B.V. Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
KR20210024420A (en) 2019-08-23 2021-03-05 에이에스엠 아이피 홀딩 비.브이. Method for depositing silicon oxide film having improved quality by peald using bis(diethylamino)silane
KR20210029090A (en) 2019-09-04 2021-03-15 에이에스엠 아이피 홀딩 비.브이. Methods for selective deposition using a sacrificial capping layer
KR20210029663A (en) 2019-09-05 2021-03-16 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US11562901B2 (en) 2019-09-25 2023-01-24 Asm Ip Holding B.V. Substrate processing method
CN112593212B (en) 2019-10-02 2023-12-22 Asm Ip私人控股有限公司 Method for forming topologically selective silicon oxide film by cyclic plasma enhanced deposition process
TW202129060A (en) 2019-10-08 2021-08-01 荷蘭商Asm Ip控股公司 Substrate processing device, and substrate processing method
KR20210043460A (en) 2019-10-10 2021-04-21 에이에스엠 아이피 홀딩 비.브이. Method of forming a photoresist underlayer and structure including same
KR20210045930A (en) 2019-10-16 2021-04-27 에이에스엠 아이피 홀딩 비.브이. Method of Topology-Selective Film Formation of Silicon Oxide
US11637014B2 (en) 2019-10-17 2023-04-25 Asm Ip Holding B.V. Methods for selective deposition of doped semiconductor material
KR20210047808A (en) 2019-10-21 2021-04-30 에이에스엠 아이피 홀딩 비.브이. Apparatus and methods for selectively etching films
US11646205B2 (en) 2019-10-29 2023-05-09 Asm Ip Holding B.V. Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
KR20210054983A (en) 2019-11-05 2021-05-14 에이에스엠 아이피 홀딩 비.브이. Structures with doped semiconductor layers and methods and systems for forming same
US11501968B2 (en) 2019-11-15 2022-11-15 Asm Ip Holding B.V. Method for providing a semiconductor device with silicon filled gaps
KR20210062561A (en) 2019-11-20 2021-05-31 에이에스엠 아이피 홀딩 비.브이. Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure
KR20210065848A (en) 2019-11-26 2021-06-04 에이에스엠 아이피 홀딩 비.브이. Methods for selectivley forming a target film on a substrate comprising a first dielectric surface and a second metallic surface
CN112951697A (en) 2019-11-26 2021-06-11 Asm Ip私人控股有限公司 Substrate processing apparatus
CN112885692A (en) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 Substrate processing apparatus
CN112885693A (en) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 Substrate processing apparatus
JP2021090042A (en) 2019-12-02 2021-06-10 エーエスエム アイピー ホールディング ビー.ブイ. Substrate processing apparatus and substrate processing method
KR20210070898A (en) 2019-12-04 2021-06-15 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
TW202125596A (en) 2019-12-17 2021-07-01 荷蘭商Asm Ip私人控股有限公司 Method of forming vanadium nitride layer and structure including the vanadium nitride layer
KR20210080214A (en) 2019-12-19 2021-06-30 에이에스엠 아이피 홀딩 비.브이. Methods for filling a gap feature on a substrate and related semiconductor structures
JP2021109175A (en) 2020-01-06 2021-08-02 エーエスエム・アイピー・ホールディング・ベー・フェー Gas supply assembly, components thereof, and reactor system including the same
KR20210095050A (en) 2020-01-20 2021-07-30 에이에스엠 아이피 홀딩 비.브이. Method of forming thin film and method of modifying surface of thin film
TW202130846A (en) 2020-02-03 2021-08-16 荷蘭商Asm Ip私人控股有限公司 Method of forming structures including a vanadium or indium layer
TW202146882A (en) 2020-02-04 2021-12-16 荷蘭商Asm Ip私人控股有限公司 Method of verifying an article, apparatus for verifying an article, and system for verifying a reaction chamber
US11776846B2 (en) 2020-02-07 2023-10-03 Asm Ip Holding B.V. Methods for depositing gap filling fluids and related systems and devices
US11781243B2 (en) 2020-02-17 2023-10-10 Asm Ip Holding B.V. Method for depositing low temperature phosphorous-doped silicon
KR20210116240A (en) 2020-03-11 2021-09-27 에이에스엠 아이피 홀딩 비.브이. Substrate handling device with adjustable joints
US11876356B2 (en) 2020-03-11 2024-01-16 Asm Ip Holding B.V. Lockout tagout assembly and system and method of using same
KR20210117157A (en) 2020-03-12 2021-09-28 에이에스엠 아이피 홀딩 비.브이. Method for Fabricating Layer Structure Having Target Topological Profile
KR20210124042A (en) 2020-04-02 2021-10-14 에이에스엠 아이피 홀딩 비.브이. Thin film forming method
TW202146689A (en) 2020-04-03 2021-12-16 荷蘭商Asm Ip控股公司 Method for forming barrier layer and method for manufacturing semiconductor device
TW202145344A (en) 2020-04-08 2021-12-01 荷蘭商Asm Ip私人控股有限公司 Apparatus and methods for selectively etching silcon oxide films
US11821078B2 (en) 2020-04-15 2023-11-21 Asm Ip Holding B.V. Method for forming precoat film and method for forming silicon-containing film
KR20210132605A (en) 2020-04-24 2021-11-04 에이에스엠 아이피 홀딩 비.브이. Vertical batch furnace assembly comprising a cooling gas supply
KR20210132600A (en) 2020-04-24 2021-11-04 에이에스엠 아이피 홀딩 비.브이. Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element
US11898243B2 (en) 2020-04-24 2024-02-13 Asm Ip Holding B.V. Method of forming vanadium nitride-containing layer
KR20210134226A (en) 2020-04-29 2021-11-09 에이에스엠 아이피 홀딩 비.브이. Solid source precursor vessel
KR20210134869A (en) 2020-05-01 2021-11-11 에이에스엠 아이피 홀딩 비.브이. Fast FOUP swapping with a FOUP handler
KR20210141379A (en) 2020-05-13 2021-11-23 에이에스엠 아이피 홀딩 비.브이. Laser alignment fixture for a reactor system
KR20210143653A (en) 2020-05-19 2021-11-29 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
KR20210145078A (en) 2020-05-21 2021-12-01 에이에스엠 아이피 홀딩 비.브이. Structures including multiple carbon layers and methods of forming and using same
TW202201602A (en) 2020-05-29 2022-01-01 荷蘭商Asm Ip私人控股有限公司 Substrate processing device
TW202218133A (en) 2020-06-24 2022-05-01 荷蘭商Asm Ip私人控股有限公司 Method for forming a layer provided with silicon
TW202217953A (en) 2020-06-30 2022-05-01 荷蘭商Asm Ip私人控股有限公司 Substrate processing method
TW202219628A (en) 2020-07-17 2022-05-16 荷蘭商Asm Ip私人控股有限公司 Structures and methods for use in photolithography
TW202204662A (en) 2020-07-20 2022-02-01 荷蘭商Asm Ip私人控股有限公司 Method and system for depositing molybdenum layers
KR20220027026A (en) 2020-08-26 2022-03-07 에이에스엠 아이피 홀딩 비.브이. Method and system for forming metal silicon oxide and metal silicon oxynitride
USD990534S1 (en) 2020-09-11 2023-06-27 Asm Ip Holding B.V. Weighted lift pin
USD1012873S1 (en) 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
CN112151421B (en) * 2020-09-25 2024-04-16 北京北方华创微电子装备有限公司 Cover opening mechanism for semiconductor device and semiconductor equipment
TW202229613A (en) 2020-10-14 2022-08-01 荷蘭商Asm Ip私人控股有限公司 Method of depositing material on stepped structure
KR20220053482A (en) 2020-10-22 2022-04-29 에이에스엠 아이피 홀딩 비.브이. Method of depositing vanadium metal, structure, device and a deposition assembly
TW202223136A (en) 2020-10-28 2022-06-16 荷蘭商Asm Ip私人控股有限公司 Method for forming layer on substrate, and semiconductor processing system
TW202235675A (en) 2020-11-30 2022-09-16 荷蘭商Asm Ip私人控股有限公司 Injector, and substrate processing apparatus
US11946137B2 (en) 2020-12-16 2024-04-02 Asm Ip Holding B.V. Runout and wobble measurement fixtures
TW202231903A (en) 2020-12-22 2022-08-16 荷蘭商Asm Ip私人控股有限公司 Transition metal deposition method, transition metal layer, and deposition assembly for depositing transition metal on substrate
USD980814S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD980813S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD981973S1 (en) 2021-05-11 2023-03-28 Asm Ip Holding B.V. Reactor wall for substrate processing apparatus
USD990441S1 (en) 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3909608B2 (en) * 1994-09-30 2007-04-25 株式会社アルバック Vacuum processing equipment
JP3527450B2 (en) * 1999-12-22 2004-05-17 東京エレクトロン株式会社 Processing equipment
CN1327493C (en) * 2000-05-17 2007-07-18 东京毅力科创株式会社 Mechanism and method for assembling processing device parts, and lock mechanism and method for locking the lock mechanism
CN2617030Y (en) * 2003-02-11 2004-05-19 厦门大学 Silicon and silicon vacuum bonding device
CN2613647Y (en) * 2003-05-09 2004-04-28 西安理工大学 Vacuum seal device for preventing leakage
JP4199062B2 (en) * 2003-07-07 2008-12-17 株式会社神戸製鋼所 Vacuum deposition equipment
KR100515955B1 (en) * 2003-11-18 2005-09-23 주식회사 에이디피엔지니어링 Processing chamber of FPD manufacturing machine having a device for opening the cover
KR100640559B1 (en) * 2004-06-17 2006-10-31 주식회사 에이디피엔지니어링 Apparatus for manufacturing fpd

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CN103213815B (en) * 2013-03-07 2015-04-29 陈立明 Embedded rotor spiral speed-regulation constant feeder
CN109850573A (en) * 2018-12-04 2019-06-07 武汉华星光电半导体显示技术有限公司 Conveying machine

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CN100578732C (en) 2010-01-06
CN100444311C (en) 2008-12-17
CN101192511A (en) 2008-06-04
CN100536070C (en) 2009-09-02
CN1825535A (en) 2006-08-30
CN101174552A (en) 2008-05-07
KR20060094746A (en) 2006-08-30
KR100667598B1 (en) 2007-01-12
CN101615569B (en) 2012-05-09

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