CN101589466B - 电子元件 - Google Patents

电子元件 Download PDF

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Publication number
CN101589466B
CN101589466B CN200880002906.XA CN200880002906A CN101589466B CN 101589466 B CN101589466 B CN 101589466B CN 200880002906 A CN200880002906 A CN 200880002906A CN 101589466 B CN101589466 B CN 101589466B
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CN
China
Prior art keywords
layer
electronic component
component according
diffusion barrier
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200880002906.XA
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English (en)
Chinese (zh)
Other versions
CN101589466A (zh
Inventor
R·菲克斯
O·沃尔斯特
A·马丁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of CN101589466A publication Critical patent/CN101589466A/zh
Application granted granted Critical
Publication of CN101589466B publication Critical patent/CN101589466B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H01L23/4827—Materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/403—Cells and electrode assemblies
    • G01N27/414—Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Power Engineering (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
CN200880002906.XA 2007-01-24 2008-01-09 电子元件 Expired - Fee Related CN101589466B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007003541A DE102007003541A1 (de) 2007-01-24 2007-01-24 Elektronisches Bauteil
DE102007003541.3 2007-01-24
PCT/EP2008/050199 WO2008090023A1 (de) 2007-01-24 2008-01-09 Elektronisches bauteil

Publications (2)

Publication Number Publication Date
CN101589466A CN101589466A (zh) 2009-11-25
CN101589466B true CN101589466B (zh) 2011-09-28

Family

ID=39323786

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880002906.XA Expired - Fee Related CN101589466B (zh) 2007-01-24 2008-01-09 电子元件

Country Status (6)

Country Link
US (1) US8242599B2 (enExample)
EP (1) EP2113131A1 (enExample)
JP (1) JP2010517280A (enExample)
CN (1) CN101589466B (enExample)
DE (1) DE102007003541A1 (enExample)
WO (1) WO2008090023A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011002854A1 (de) 2010-08-10 2012-02-16 Robert Bosch Gmbh Feldeffekt-Gassensor, Verfahren zur Herstellung eines Feldeffekt-Gassensors und Verfahren zur Detektion von Gas
DE102012211460A1 (de) * 2012-07-03 2014-01-09 Robert Bosch Gmbh Gassensor und Verfahren zum Herstellen eines solchen
DE102013204262A1 (de) 2013-03-12 2014-09-18 Robert Bosch Gmbh Funktionselement zum Anordnen vor dem aktiven Messbereich eines Sensorelements
DE102015106002A1 (de) * 2015-04-20 2016-10-20 Gottfried Wilhelm Leibniz Universität Hannover Elektrisches Bauteil, Konstruktionsbauteil eines technischen Gegenstands sowie Verfahren zu deren Herstellung
DE102016208970A1 (de) * 2016-05-24 2017-11-30 Robert Bosch Gmbh Verfahren zum Herstellen einer Elektromigration-resistenten kristallinen Übergangsmetall-Silizidschicht, entsprechende Schichtenfolge und Mikro-Heizer

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6376888B1 (en) * 1999-04-30 2002-04-23 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
GB2096824A (en) 1981-04-09 1982-10-20 Sibbald Alastair Chemically sensitive field effect transistor
JPS62298136A (ja) * 1986-06-18 1987-12-25 Oki Electric Ind Co Ltd 半導体素子の製造方法
US4700462A (en) * 1986-10-08 1987-10-20 Hughes Aircraft Company Process for making a T-gated transistor
JPH02181920A (ja) * 1989-01-09 1990-07-16 Hitachi Ltd 半導体集積回路装置
JPH07161659A (ja) * 1993-12-07 1995-06-23 Nec Corp 半導体装置およびその製造方法
KR20010004598A (ko) * 1999-06-29 2001-01-15 김영환 반도체 소자의 게이트 형성방법
JP3974507B2 (ja) * 2001-12-27 2007-09-12 株式会社東芝 半導体装置の製造方法
US6696345B2 (en) * 2002-01-07 2004-02-24 Intel Corporation Metal-gate electrode for CMOS transistor applications
JP4221697B2 (ja) * 2002-06-17 2009-02-12 日本電気株式会社 半導体装置
US6787910B2 (en) * 2002-07-23 2004-09-07 National Chiao Tung University Schottky structure in GaAs semiconductor device
KR100459725B1 (ko) * 2002-09-19 2004-12-03 삼성전자주식회사 금속 게이트 패턴을 갖는 반도체소자의 제조방법
JP4218557B2 (ja) * 2004-03-12 2009-02-04 三菱電機株式会社 半導体装置
CN101019236A (zh) * 2004-07-15 2007-08-15 斯平内克半导体股份有限公司 金属源极功率晶体管及其制造方法
US7400042B2 (en) * 2005-05-03 2008-07-15 Rosemount Aerospace Inc. Substrate with adhesive bonding metallization with diffusion barrier
JPWO2007052335A1 (ja) * 2005-11-01 2009-04-30 株式会社日立製作所 半導体圧力センサ
US7389675B1 (en) * 2006-05-12 2008-06-24 The United States Of America As Represented By The National Aeronautics And Space Administration Miniaturized metal (metal alloy)/ PdOx/SiC hydrogen and hydrocarbon gas sensors
US7714386B2 (en) * 2006-06-09 2010-05-11 Northrop Grumman Systems Corporation Carbon nanotube field effect transistor
KR100781972B1 (ko) * 2006-09-18 2007-12-06 삼성전자주식회사 메모리 소자 및 그의 제조방법
US20090214777A1 (en) * 2008-02-22 2009-08-27 Demetrius Sarigiannis Multiple ampoule delivery systems

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6376888B1 (en) * 1999-04-30 2002-04-23 Kabushiki Kaisha Toshiba Semiconductor device and method of manufacturing the same

Also Published As

Publication number Publication date
CN101589466A (zh) 2009-11-25
WO2008090023A1 (de) 2008-07-31
JP2010517280A (ja) 2010-05-20
US20100072621A1 (en) 2010-03-25
EP2113131A1 (de) 2009-11-04
US8242599B2 (en) 2012-08-14
DE102007003541A1 (de) 2008-07-31

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SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110928

Termination date: 20150109

EXPY Termination of patent right or utility model