Summary of the invention
The contradiction that the objective of the invention is to solve that existing single electric welding machine special rectifier diode capacity is little, device needs parallel current-sharing in using, on the basis of original 13500A/200~400V welding machine special rectifier diode, provide that a kind of current expansion ability is stronger, capacity is bigger, better quality, reliability be higher, the 16000A/200 that use cost is lower~400V electric welding machine avalanche commutation diode special and manufacture method thereof.
Technical solution of the present invention is:
This 16000A/200~400V electric welding machine avalanche commutation diode special is to be made of shell, chip, and described chip comprises base N, expands phosphorus district N
+With expansion boron district P
+And cathode and anode ohmic contact, its special character is: described chip adopts radially low-resistance monocrystalline silicon piece of N type (100), described monocrystalline silicon piece electricalresistivity n is that 5~10 Ω-cm, diameter are 70mm, thickness 0.17~0.19mm, and pipe thickness is 5~6mm, expands phosphorus district N
+With expansion boron district P
+Once diffuse to form for two-sided, the cathode and anode ohmic contact is titanium-nickel-Jin or titanium-nickel-Yin.
The manufacture method of this electric welding machine avalanche commutation diode special is:
Adopting electricalresistivity n is that 5~10 Ω-cm, diameter are N type (100) the low-resistance monocrystalline silicon piece radially of 70mm, thickness 0.17~0.19mm;
Two-sided once diffusion is carried out in the silicon chip diffusion under 1250 ℃;
Diffusion sheet detects, P
+District surface concentration 0.04~0.06mV/mA, junction depth X
JPBe 78~82) μ m; N
+District surface concentration 0.06~0.08mV/mA, junction depth X
JNBe 58~62 μ m; Base remaining minority carrier life time τ p is 9~13 μ S;
Diffusion sheet carries out the evaporation of electron beam multilevel metallization behind sandblast, cleaning, dewatered drying, realize cathode and anode titanium-nickel-Jin ohmic contact; Table surface undergoes spray sand molding, after burn into cleaning, polyimide passivation protection, middle test;
With middle test passes chip, in the shell of packing into, carry out cold weld encapsulation under the inflated with nitrogen, encapsulation back pipe thickness 5~6mm.
The manufacture method of above-mentioned 16000A/200~400V electric welding machine avalanche commutation diode special is placed on the silicon boat after earlier silicon chip being cleaned when silicon chip spreads, and alternately places N between adjacent monocrystalline silicon piece
+, P
+Paper source sheet is placed the silicon liner at silicon boat two ends, push in the diffusion furnace after spring that silicon boat one end is put compresses monocrystalline silicon piece and paper source sheet; When silicon boat temperature during to 390-410 ℃, sheet burning in paper source also makes silicon chip be pressed tightlyer, moves the silicon boat to fire door from diffusion furnace, carefully takes off spring, the silicon boat is pushed once more the flat-temperature zone carries out High temperature diffusion in the diffusion furnace under 1250 ℃.
The manufacture method of above-mentioned electric welding machine avalanche commutation diode special, described titanium: nickel: gold or titanium: nickel: silver-colored thickness is respectively 0.2 μ m: 0.5 μ m: 0.1 μ m.
The manufacture method of above-mentioned electric welding machine avalanche commutation diode special, cathode table surface undergoes spray sand molding angle are 45~55 °, to satisfy the avalanche characteristic requirement.
Advantage of the present invention is:
1, owing to adopt radially low-resistance monocrystalline silicon piece of N type (100), improves current expansion ability 30%;
2, adopt diameter of phi 70mm, thickness 0.18 ± 0.01mm monocrystalline silicon piece, once spread simultaneously and place the compaction measure of silicon boat one end spring, guaranteed that diffusion back silicon chip is indeformable, thereby promoted high current capacity, reduced power consumption through the silicon pad by two-sided.
3, by being lowered into product tube thickness to 5.5 ± 0.5mm, improve the moment heat-sinking capability, satisfy the welding machine requirement.
4, N-PT (non-break-through) the snowslide structure by optimizing, and supreme thermal compensation sheet Zhan won ton down is approximately thin respectful difficulty
Is nice food accumulate the numerous F human skull of the sound of footsteps and is called out the catfish firewood and carefully kowtow angry blood clam and rouse the health fine linen? IFSM 〉=1 * 10
5A/10ms) ability, and very high reverse surge current (IRSM 〉=1 * 10 is arranged
4A/2ms) ability.
5, cathode and anode titanium-nickel-Jin ohmic contact, and each layer thickness scientific optimization are guaranteed the reliability that device works long hours.
Embodiment
Embodiment 1
As shown in the figure, this electric welding machine avalanche commutation diode special is to be made of shell, chip 1, and described chip 1 comprises base N, expands phosphorus district N
+With expansion boron district P
+And cathode and anode titanium-nickel-Jin (ohmic contact 2,3 of or titanium-nickel-Yin), evaporation layer titanium: nickel: (or titanium: nickel: silver) thickness is respectively 0.2 μ m to gold: 0.5 μ m: 0.1 μ m, pipe thickness 5.5 ± 0.5mm.Chip 1 adopts radially low-resistance monocrystalline silicon piece of N type (100), and electricalresistivity n is that 5~10 Ω-cm, diameter are Φ 70mm, thickness 0.18 ± 0.01mm, expands phosphorus district N
+With expansion boron district P
+Once diffuse to form for two-sided.
The manufacture method of this electric welding machine avalanche commutation diode special is: adopt radially low-resistance monocrystalline silicon piece 101 of N type (100), described monocrystalline silicon piece 101 diameters are 70mm, and thickness 0.18 ± 0.01mm, electricalresistivity n are 5~10 Ω-cm.After the cleaning, be placed on the silicon boat 4, between adjacent monocrystalline silicon piece 1, alternately place N
+, P
+ Paper source sheet 5 is placed silicon liner 6 at silicon boat 4 two ends, the spring 7 by placing silicon boat 4 one ends pushes diffusion furnace after monocrystalline silicon piece 1 and paper source sheet 5 are compressed; When silicon boat 4 temperature to 390~410 ℃, paper source sheet 5 burning also makes silicon chip 101 be pressed tightlyer in the effect of spring 7, move silicon boat 4 to fire door from diffusion furnace, take off spring 7, (silicon chip 101 in this moment silicon boat 4 together with the silicon liner 6 at two ends by tighter being crimped on) pushes silicon boat 4 that the flat-temperature zone carries out two-sided once diffusion in the diffusion furnace under 1250 ℃ once more.
Diffusion sheet detects: P
+District surface concentration 0.04~0.06mV/mA, junction depth X
JPBe 78~82 μ m; N
+District surface concentration 0.06~0.08mV/mA, junction depth X
JNBe 58~62 μ m; Base remaining minority carrier life time τ p is 9~13 μ S.
Diffusion sheet carries out the evaporation of electron beam multilevel metallization behind sandblast, cleaning, dewatered drying, (ohmic contact of or titanium-nickel-Yin), evaporation layer titanium: nickel: (or titanium: nickel: silver) thickness is respectively gold: 0.2 μ m: 0.5 μ m: 0.1 μ m to realize cathode and anode titanium-nickel-Jin.
45~55 ° of cathode table surface undergoes spray sand molding angles are cleaned, after the polyimide passivation protection, are carried out centre and test (comprising oppositely withstand voltage, high temperature electric leakage, peak on state voltage, threshold voltage, slope resistance and surge current voltage) through burn into; With middle test passes chip 1, be contained in the chip locating ring 9, be placed in the lower house then and cover anode cover 8, described lower house is to be one by copper briquetting 10 and ceramic ring 11 burn-backs, carries out cold weld encapsulation under the inflated with nitrogen; Encapsulation back pipe thickness 5.5 ± 0.5mm.
Pipe after the encapsulation is through conventionally test and avalanche condition tests such as high temperature off-state, 16000 amperes of on-states.After the test passes, coupling, grouping, packing warehouse-in.
Embodiment 2
As shown in the figure, this electric welding machine avalanche commutation diode special is to be made of shell, chip 1, described chip 1 comprises base N, expand phosphorus district N+ and expand boron district P+ and cathode and anode titanium-nickel-Jin (ohmic contact 2,3 of or titanium-nickel-Yin), titanium: nickel: (or titanium: nickel: silver) thickness is respectively gold: 0.2 μ m: 0.5 μ m: 0.1 μ m, pipe thickness 5.5 ± 0.5mm.Chip 1 adopts radially low-resistance monocrystalline silicon piece of N type (100), and electricalresistivity n is 5~10 Ω-cm, and diameter is 70mm, thickness 0.18 ± 0.01mm, expands phosphorus district N
+With expansion boron district P
+Once diffuse to form for two-sided.
The manufacture method of this electric welding machine avalanche commutation diode special is: adopt radially low-resistance monocrystalline silicon piece 101 of N type (100), described monocrystalline silicon piece 101 diameters are 70mm, and thickness 0.18 ± 0.01mm, electricalresistivity n are 5~10 Ω-cm.After the cleaning, be placed on the silicon boat 4, between adjacent monocrystalline silicon piece 1, alternately place N
+, P
+ Paper source sheet 5 is placed silicon liner 6 at silicon boat 4 two ends, the spring 7 by placing silicon boat 4 one ends pushes diffusion furnace after monocrystalline silicon piece 101 and paper source sheet 5 are compressed; When silicon boat 4 temperature to 390~410 ℃, paper source sheet 5 burning also makes silicon chip 101 be pressed tightlyer in the effect of spring 7, move silicon boat 4 to fire door from diffusion furnace, take off spring 7, (silicon chip 101 in this moment silicon boat 4 together with the silicon liner 6 at two ends by tighter being crimped on) pushes silicon boat 4 that the flat-temperature zone carries out two-sided once diffusion in the diffusion furnace under 1250 ℃ once more.
Diffusion sheet detects: P
+District surface concentration 0.04~0.06mV/mA, junction depth X
JPBe 78~82 μ m; N
+District surface concentration 0.06~0.08mV/mA, junction depth X
JNBe 58~62 μ m; Base remaining minority carrier life time τ p is 9~13 μ S.
Diffusion sheet carries out the evaporation of electron beam multilevel metallization behind sandblast, cleaning, dewatered drying, evaporation layer titanium: nickel: (or titanium: nickel: silver) thickness is gold: 0.2 μ m: 0.5 μ m: 0.1 μ m.
Cathode table surface undergoes spray sand molding angle θ is 45~55 °, after burn into cleaning, polyimide passivation protection, carries out centre test (comprising off-state, on-state test); With middle test passes chip 1, be contained in and be placed in the lower house in the chip locating ring 9 then and cover anode cover 8, described lower house is to be one by copper briquetting 10 and ceramic ring 11 burn-backs, carries out cold weld encapsulation under the inflated with nitrogen; Encapsulation back pipe thickness 5.5 ± 0.5mm.
Pipe after the encapsulation is through off-state and on-state test (comprising oppositely withstand voltage, high temperature electric leakage, peak on state voltage, threshold voltage, slope resistance and surge current voltage tester) and avalanche condition test.After the test passes, coupling, grouping, packing warehouse-in.
Embodiment 3
As shown in the figure, this electric welding machine avalanche commutation diode special is to be made of shell, chip 1, and described chip 1 comprises base N, expands phosphorus district N
+With expansion boron district P
+And cathode and anode titanium-nickel-Jin (ohmic contact 2,3 of or titanium-nickel-Yin), titanium: nickel: (or titanium: nickel: silver) thickness is respectively 0.2 μ m to gold: 0.5 μ m: 0.1 μ m, pipe thickness 5.5 ± 0.5mmmm.Chip 1 is adopted as radially low-resistance monocrystalline silicon piece of N type (100), and electricalresistivity n is 5~10 Ω-cm, and diameter is Φ 70mm, thickness 0.18 ± 0.01mm.Expand phosphorus district N
+With expansion boron district P
+Once diffuse to form for two-sided.
The manufacture method of this electric welding machine avalanche commutation diode special is: adopt radially low-resistance monocrystalline silicon piece 101 of N type (100), described monocrystalline silicon piece 101 diameters are 70mm, and thickness 0.18 ± 0.01mm, electricalresistivity n are 5~10 Ω-cm.After the cleaning, be placed on the silicon boat 4, between adjacent monocrystalline silicon piece 101, alternately place N
+, P
+Silicon liner 6 is placed in paper source 5 at silicon boat 4 two ends, the spring 7 by placing silicon boat 4 one ends pushes diffusion furnace after monocrystalline silicon piece 101 and paper source 5 are compressed; When silicon boat 4 temperature to 390~410 ℃, paper source sheet 5 burning also makes silicon chip 101 be pressed tightlyer in the effect of spring 7, move silicon boat 4 to fire door from diffusion furnace, take off spring 7, (silicon chip 101 in this moment silicon boat 4 together with the silicon liner 6 at two ends by being crimped on more tightly) pushes silicon boat 4 that the flat-temperature zone carries out two-sided once diffusion in the diffusion furnace under 1250 ℃ once more.
Diffusion sheet detects: P
+District surface concentration 0.04~0.06mV/mA, junction depth X
JPBe 78~82 μ m; N
+District surface concentration 0.06~0.08mV/mA, junction depth X
JNBe 58~62 μ m; Base remaining minority carrier life time τ p is 9~13 μ S.
Diffusion sheet carries out the evaporation of electron beam multilevel metallization behind sandblast, cleaning, dewatered drying, (ohmic contact of or titanium-nickel-Yin), evaporation layer titanium: nickel: (or titanium: nickel: silver) thickness is respectively 0.2 μ m to gold: 0.5 μ m: 0.1 μ m to realize cathode and anode titanium-nickel-Jin.
45~55 ° of cathode table surface undergoes spray sand molding angles are cleaned, after the polyimide passivation protection, are carried out centre and test (comprising oppositely withstand voltage, high temperature electric leakage, peak on state voltage, threshold voltage, slope resistance and surge current voltage) through burn into; With middle test passes chip 1, be contained in and be placed in the lower house in the chip locating ring 9 then and cover anode cover 8, described lower house is to be welded as a whole by copper briquetting 10 and ceramic ring 11, carries out cold weld encapsulation under the inflated with nitrogen; Encapsulation back pipe thickness 5.5 ± 0.5mm.
Pipe after the encapsulation is through conventionally test and avalanche condition test.After the test passes, coupling, grouping, packing warehouse-in.