CN101569060A - 旋转接触元件及其制造方法 - Google Patents

旋转接触元件及其制造方法 Download PDF

Info

Publication number
CN101569060A
CN101569060A CNA200780048252XA CN200780048252A CN101569060A CN 101569060 A CN101569060 A CN 101569060A CN A200780048252X A CNA200780048252X A CN A200780048252XA CN 200780048252 A CN200780048252 A CN 200780048252A CN 101569060 A CN101569060 A CN 101569060A
Authority
CN
China
Prior art keywords
needle point
contact element
assembly
contact
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200780048252XA
Other languages
English (en)
Chinese (zh)
Inventor
E·D·霍博斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FormFactor Inc
Original Assignee
FormFactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FormFactor Inc filed Critical FormFactor Inc
Publication of CN101569060A publication Critical patent/CN101569060A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CNA200780048252XA 2006-12-28 2007-12-06 旋转接触元件及其制造方法 Pending CN101569060A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/617,394 US7851794B2 (en) 2006-12-28 2006-12-28 Rotating contact element and methods of fabrication
US11/617,394 2006-12-28

Publications (1)

Publication Number Publication Date
CN101569060A true CN101569060A (zh) 2009-10-28

Family

ID=39582969

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200780048252XA Pending CN101569060A (zh) 2006-12-28 2007-12-06 旋转接触元件及其制造方法

Country Status (7)

Country Link
US (1) US7851794B2 (enExample)
EP (1) EP2097951A2 (enExample)
JP (1) JP2010515057A (enExample)
KR (1) KR20090108608A (enExample)
CN (1) CN101569060A (enExample)
TW (1) TW200831910A (enExample)
WO (1) WO2008082847A2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9702904B2 (en) 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
US9052342B2 (en) 2011-09-30 2015-06-09 Formfactor, Inc. Probe with cantilevered beam having solid and hollow sections
KR102466151B1 (ko) * 2015-11-30 2022-11-15 삼성전자주식회사 프로브 카드 및 그를 포함하는 테스트 장치
JP6562896B2 (ja) * 2016-12-22 2019-08-21 三菱電機株式会社 半導体装置の評価装置およびそれを用いた半導体装置の評価方法
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
US12181493B2 (en) 2018-10-26 2024-12-31 Microfabrica Inc. Compliant probes including dual independently operable probe contact elements including at least one flat extension spring, methods for making, and methods for using
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US11867721B1 (en) 2019-12-31 2024-01-09 Microfabrica Inc. Probes with multiple springs, methods for making, and methods for using
US12196781B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US12196782B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
US12146898B2 (en) 2020-10-02 2024-11-19 Microfabrica Inc. Multi-beam probes with decoupled structural and current carrying beams and methods of making
TWI751940B (zh) * 2021-04-14 2022-01-01 中華精測科技股份有限公司 探針卡裝置及類彈簧探針

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US536380A (en) * 1895-03-26 Brake for railway-cars
US4781640A (en) * 1985-01-24 1988-11-01 Varian Associates, Inc. Basket electrode shaping
JPS6269164U (enExample) * 1985-10-18 1987-04-30
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US4793816A (en) * 1987-07-20 1988-12-27 Industrial Electronic Hardware Terminal protector for circuit board connector
US5366380A (en) * 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
US6624648B2 (en) * 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US6504223B1 (en) * 1998-11-30 2003-01-07 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6970005B2 (en) * 2000-08-24 2005-11-29 Texas Instruments Incorporated Multiple-chip probe and universal tester contact assemblage
US6945827B2 (en) * 2002-12-23 2005-09-20 Formfactor, Inc. Microelectronic contact structure
US7385411B2 (en) * 2004-08-31 2008-06-10 Formfactor, Inc. Method of designing a probe card apparatus with desired compliance characteristics

Also Published As

Publication number Publication date
WO2008082847A3 (en) 2008-12-31
US7851794B2 (en) 2010-12-14
US20080157789A1 (en) 2008-07-03
JP2010515057A (ja) 2010-05-06
KR20090108608A (ko) 2009-10-15
WO2008082847A2 (en) 2008-07-10
EP2097951A2 (en) 2009-09-09
TW200831910A (en) 2008-08-01

Similar Documents

Publication Publication Date Title
CN101569060A (zh) 旋转接触元件及其制造方法
US6920689B2 (en) Method for making a socket to perform testing on integrated circuits
US7674112B2 (en) Resilient contact element and methods of fabrication
JP2710544B2 (ja) プローブ構造、プローブ構造の形成方法
US8272124B2 (en) Anchoring carbon nanotube columns
USRE41515E1 (en) Contactor and production method for contactor
KR20120112879A (ko) 한번에 다수 방식으로 와이어 본드 프로브 카드를 구축하는 방법
JP2001056345A (ja) プロービングカード及びその製造方法
CN101673694A (zh) 半导体测试探针卡空间变换器的制造方法
US8054095B2 (en) Metalized elastomeric probe structure
KR100968520B1 (ko) 프로브 카드의 프로브 어셈블리 및 그 제조 방법
JP2005300545A (ja) 電気信号接続装置及びこれを用いたプローブ組立体並びにプローバ装置
KR20000024688A (ko) 수직형미세탐침카드
US20090053908A1 (en) Metalized Elastomeric Electrical Contacts
US8832936B2 (en) Method of forming metallized elastomeric electrical contacts
US8115504B2 (en) Microspring array having reduced pitch contact elements
KR100313185B1 (ko) 집적 회로 소자의 전기적 액세스 및 상호 접속 방법과 그 장치
KR101149808B1 (ko) 프로브 및 프로브 카드 제조방법
JP4962929B2 (ja) プローバ装置及びこれに用いるプローブ組立体
JP2000055936A (ja) コンタクタ
KR101884745B1 (ko) 초정밀 가공 기술을 이용한 양방향 도전성 모듈의 제조방법 및 이를 이용한 양방향 도전성 테스트 모듈의 제조방법
JPH1172512A (ja) プローブカードおよびその形成方法
JP2003121470A (ja) プローブの製造方法及びプローブ
US20090151159A1 (en) Method for arranging a plurality of connecting elements

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20091028