KR20090108608A - 회전형 접촉 요소 및 이 회전형 접촉 요소의 제조 방법 - Google Patents

회전형 접촉 요소 및 이 회전형 접촉 요소의 제조 방법 Download PDF

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Publication number
KR20090108608A
KR20090108608A KR1020097015660A KR20097015660A KR20090108608A KR 20090108608 A KR20090108608 A KR 20090108608A KR 1020097015660 A KR1020097015660 A KR 1020097015660A KR 20097015660 A KR20097015660 A KR 20097015660A KR 20090108608 A KR20090108608 A KR 20090108608A
Authority
KR
South Korea
Prior art keywords
contact element
tip
layer
probe card
members
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020097015660A
Other languages
English (en)
Korean (ko)
Inventor
에릭 디 홉스
Original Assignee
폼팩터, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 폼팩터, 인코포레이티드 filed Critical 폼팩터, 인코포레이티드
Publication of KR20090108608A publication Critical patent/KR20090108608A/ko
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020097015660A 2006-12-28 2007-12-06 회전형 접촉 요소 및 이 회전형 접촉 요소의 제조 방법 Ceased KR20090108608A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/617,394 US7851794B2 (en) 2006-12-28 2006-12-28 Rotating contact element and methods of fabrication
US11/617,394 2006-12-28
PCT/US2007/086667 WO2008082847A2 (en) 2006-12-28 2007-12-06 Rotating contact element and methods of fabrication

Publications (1)

Publication Number Publication Date
KR20090108608A true KR20090108608A (ko) 2009-10-15

Family

ID=39582969

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097015660A Ceased KR20090108608A (ko) 2006-12-28 2007-12-06 회전형 접촉 요소 및 이 회전형 접촉 요소의 제조 방법

Country Status (7)

Country Link
US (1) US7851794B2 (enExample)
EP (1) EP2097951A2 (enExample)
JP (1) JP2010515057A (enExample)
KR (1) KR20090108608A (enExample)
CN (1) CN101569060A (enExample)
TW (1) TW200831910A (enExample)
WO (1) WO2008082847A2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9702904B2 (en) 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
US9052342B2 (en) 2011-09-30 2015-06-09 Formfactor, Inc. Probe with cantilevered beam having solid and hollow sections
KR102466151B1 (ko) * 2015-11-30 2022-11-15 삼성전자주식회사 프로브 카드 및 그를 포함하는 테스트 장치
JP6562896B2 (ja) * 2016-12-22 2019-08-21 三菱電機株式会社 半導体装置の評価装置およびそれを用いた半導体装置の評価方法
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
US12181493B2 (en) 2018-10-26 2024-12-31 Microfabrica Inc. Compliant probes including dual independently operable probe contact elements including at least one flat extension spring, methods for making, and methods for using
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US11867721B1 (en) 2019-12-31 2024-01-09 Microfabrica Inc. Probes with multiple springs, methods for making, and methods for using
US12196781B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US12196782B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
US12146898B2 (en) 2020-10-02 2024-11-19 Microfabrica Inc. Multi-beam probes with decoupled structural and current carrying beams and methods of making
TWI751940B (zh) * 2021-04-14 2022-01-01 中華精測科技股份有限公司 探針卡裝置及類彈簧探針

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US536380A (en) * 1895-03-26 Brake for railway-cars
US4781640A (en) * 1985-01-24 1988-11-01 Varian Associates, Inc. Basket electrode shaping
JPS6269164U (enExample) * 1985-10-18 1987-04-30
US5829128A (en) * 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US4793816A (en) * 1987-07-20 1988-12-27 Industrial Electronic Hardware Terminal protector for circuit board connector
US5366380A (en) * 1989-06-13 1994-11-22 General Datacomm, Inc. Spring biased tapered contact elements for electrical connectors and integrated circuit packages
US6624648B2 (en) * 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US6504223B1 (en) * 1998-11-30 2003-01-07 Advantest Corp. Contact structure and production method thereof and probe contact assembly using same
US6970005B2 (en) * 2000-08-24 2005-11-29 Texas Instruments Incorporated Multiple-chip probe and universal tester contact assemblage
US6945827B2 (en) * 2002-12-23 2005-09-20 Formfactor, Inc. Microelectronic contact structure
US7385411B2 (en) * 2004-08-31 2008-06-10 Formfactor, Inc. Method of designing a probe card apparatus with desired compliance characteristics

Also Published As

Publication number Publication date
WO2008082847A3 (en) 2008-12-31
US7851794B2 (en) 2010-12-14
US20080157789A1 (en) 2008-07-03
JP2010515057A (ja) 2010-05-06
CN101569060A (zh) 2009-10-28
WO2008082847A2 (en) 2008-07-10
EP2097951A2 (en) 2009-09-09
TW200831910A (en) 2008-08-01

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Patent event date: 20090724

Patent event code: PA01051R01D

Comment text: International Patent Application

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Patent event code: PA02012R01D

Patent event date: 20121129

Comment text: Request for Examination of Application

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Comment text: Notification of reason for refusal

Patent event date: 20131028

Patent event code: PE09021S01D

E601 Decision to refuse application
PE0601 Decision on rejection of patent

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Comment text: Notification of reason for refusal

Patent event code: PE06011S01I