TW200831910A - Rotating contact element and methods of fabrication - Google Patents
Rotating contact element and methods of fabrication Download PDFInfo
- Publication number
- TW200831910A TW200831910A TW096145879A TW96145879A TW200831910A TW 200831910 A TW200831910 A TW 200831910A TW 096145879 A TW096145879 A TW 096145879A TW 96145879 A TW96145879 A TW 96145879A TW 200831910 A TW200831910 A TW 200831910A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- tip
- assembly
- members
- contact
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 85
- 239000000523 sample Substances 0.000 claims description 66
- 238000012360 testing method Methods 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000010998 test method Methods 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 238000000059 patterning Methods 0.000 claims 3
- 229910017052 cobalt Inorganic materials 0.000 claims 2
- 239000010941 cobalt Substances 0.000 claims 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052715 tantalum Inorganic materials 0.000 claims 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims 2
- 241000209140 Triticum Species 0.000 claims 1
- 235000021307 Triticum Nutrition 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- 230000006835 compression Effects 0.000 abstract 1
- 238000007906 compression Methods 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 5
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910001152 Bi alloy Inorganic materials 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- QAAXRTPGRLVPFH-UHFFFAOYSA-N [Bi].[Cu] Chemical compound [Bi].[Cu] QAAXRTPGRLVPFH-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 210000000232 gallbladder Anatomy 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000009666 routine test Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- JFALSRSLKYAFGM-UHFFFAOYSA-N uranium(0) Chemical compound [U] JFALSRSLKYAFGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/617,394 US7851794B2 (en) | 2006-12-28 | 2006-12-28 | Rotating contact element and methods of fabrication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200831910A true TW200831910A (en) | 2008-08-01 |
Family
ID=39582969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096145879A TW200831910A (en) | 2006-12-28 | 2007-12-03 | Rotating contact element and methods of fabrication |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7851794B2 (enExample) |
| EP (1) | EP2097951A2 (enExample) |
| JP (1) | JP2010515057A (enExample) |
| KR (1) | KR20090108608A (enExample) |
| CN (1) | CN101569060A (enExample) |
| TW (1) | TW200831910A (enExample) |
| WO (1) | WO2008082847A2 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9702904B2 (en) | 2011-03-21 | 2017-07-11 | Formfactor, Inc. | Non-linear vertical leaf spring |
| US9052342B2 (en) | 2011-09-30 | 2015-06-09 | Formfactor, Inc. | Probe with cantilevered beam having solid and hollow sections |
| KR102466151B1 (ko) * | 2015-11-30 | 2022-11-15 | 삼성전자주식회사 | 프로브 카드 및 그를 포함하는 테스트 장치 |
| JP6562896B2 (ja) * | 2016-12-22 | 2019-08-21 | 三菱電機株式会社 | 半導体装置の評価装置およびそれを用いた半導体装置の評価方法 |
| US11973301B2 (en) | 2018-09-26 | 2024-04-30 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
| US12078657B2 (en) | 2019-12-31 | 2024-09-03 | Microfabrica Inc. | Compliant pin probes with extension springs, methods for making, and methods for using |
| US12181493B2 (en) | 2018-10-26 | 2024-12-31 | Microfabrica Inc. | Compliant probes including dual independently operable probe contact elements including at least one flat extension spring, methods for making, and methods for using |
| US12000865B2 (en) | 2019-02-14 | 2024-06-04 | Microfabrica Inc. | Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes |
| US11768227B1 (en) | 2019-02-22 | 2023-09-26 | Microfabrica Inc. | Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers |
| US11761982B1 (en) | 2019-12-31 | 2023-09-19 | Microfabrica Inc. | Probes with planar unbiased spring elements for electronic component contact and methods for making such probes |
| US11867721B1 (en) | 2019-12-31 | 2024-01-09 | Microfabrica Inc. | Probes with multiple springs, methods for making, and methods for using |
| US12196781B2 (en) | 2019-12-31 | 2025-01-14 | Microfabrica Inc. | Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes |
| US12196782B2 (en) | 2019-12-31 | 2025-01-14 | Microfabrica Inc. | Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes |
| US11774467B1 (en) | 2020-09-01 | 2023-10-03 | Microfabrica Inc. | Method of in situ modulation of structural material properties and/or template shape |
| US12146898B2 (en) | 2020-10-02 | 2024-11-19 | Microfabrica Inc. | Multi-beam probes with decoupled structural and current carrying beams and methods of making |
| TWI751940B (zh) * | 2021-04-14 | 2022-01-01 | 中華精測科技股份有限公司 | 探針卡裝置及類彈簧探針 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US536380A (en) * | 1895-03-26 | Brake for railway-cars | ||
| US4781640A (en) * | 1985-01-24 | 1988-11-01 | Varian Associates, Inc. | Basket electrode shaping |
| JPS6269164U (enExample) * | 1985-10-18 | 1987-04-30 | ||
| US5829128A (en) * | 1993-11-16 | 1998-11-03 | Formfactor, Inc. | Method of mounting resilient contact structures to semiconductor devices |
| US4793816A (en) * | 1987-07-20 | 1988-12-27 | Industrial Electronic Hardware | Terminal protector for circuit board connector |
| US5366380A (en) * | 1989-06-13 | 1994-11-22 | General Datacomm, Inc. | Spring biased tapered contact elements for electrical connectors and integrated circuit packages |
| US6624648B2 (en) * | 1993-11-16 | 2003-09-23 | Formfactor, Inc. | Probe card assembly |
| US6504223B1 (en) * | 1998-11-30 | 2003-01-07 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
| US6970005B2 (en) * | 2000-08-24 | 2005-11-29 | Texas Instruments Incorporated | Multiple-chip probe and universal tester contact assemblage |
| US6945827B2 (en) * | 2002-12-23 | 2005-09-20 | Formfactor, Inc. | Microelectronic contact structure |
| US7385411B2 (en) * | 2004-08-31 | 2008-06-10 | Formfactor, Inc. | Method of designing a probe card apparatus with desired compliance characteristics |
-
2006
- 2006-12-28 US US11/617,394 patent/US7851794B2/en not_active Expired - Fee Related
-
2007
- 2007-12-03 TW TW096145879A patent/TW200831910A/zh unknown
- 2007-12-06 KR KR1020097015660A patent/KR20090108608A/ko not_active Ceased
- 2007-12-06 CN CNA200780048252XA patent/CN101569060A/zh active Pending
- 2007-12-06 JP JP2009544147A patent/JP2010515057A/ja active Pending
- 2007-12-06 EP EP07854998A patent/EP2097951A2/en not_active Withdrawn
- 2007-12-06 WO PCT/US2007/086667 patent/WO2008082847A2/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008082847A3 (en) | 2008-12-31 |
| US7851794B2 (en) | 2010-12-14 |
| US20080157789A1 (en) | 2008-07-03 |
| JP2010515057A (ja) | 2010-05-06 |
| CN101569060A (zh) | 2009-10-28 |
| KR20090108608A (ko) | 2009-10-15 |
| WO2008082847A2 (en) | 2008-07-10 |
| EP2097951A2 (en) | 2009-09-09 |
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