CN101563765A - 电子的、尤其是微电子的功能团及其生产方法 - Google Patents
电子的、尤其是微电子的功能团及其生产方法 Download PDFInfo
- Publication number
- CN101563765A CN101563765A CNA2006800564582A CN200680056458A CN101563765A CN 101563765 A CN101563765 A CN 101563765A CN A2006800564582 A CNA2006800564582 A CN A2006800564582A CN 200680056458 A CN200680056458 A CN 200680056458A CN 101563765 A CN101563765 A CN 101563765A
- Authority
- CN
- China
- Prior art keywords
- adhesive layer
- conductor structure
- carrier
- electronic component
- functional group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 30
- 125000000524 functional group Chemical group 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000004377 microelectronic Methods 0.000 title claims abstract description 12
- 239000004020 conductor Substances 0.000 claims abstract description 60
- 239000012790 adhesive layer Substances 0.000 claims abstract description 59
- 239000000853 adhesive Substances 0.000 claims abstract description 16
- 230000001070 adhesive effect Effects 0.000 claims abstract description 16
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 238000007641 inkjet printing Methods 0.000 claims description 3
- 239000000969 carrier Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000003292 glue Substances 0.000 description 14
- 229920000297 Rayon Polymers 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 8
- 238000005452 bending Methods 0.000 description 6
- 230000002349 favourable effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000002045 lasting effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- -1 polysiloxanes Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/81201—Compression bonding
- H01L2224/81205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Details Of Resistors (AREA)
Abstract
本发明涉及一种电子的、尤其是微电子的功能团以及其生产方法。本发明的方法包括如下步骤:a)在一衬纸(5a)上涂覆一非导电胶(4a);b)将一导体结构涂覆在所述粘合层(4a)的子区域中;c)将一电子元件(1)置于所述粘合层(4a)上的至少一个外部电子连接触点(2)和所述导体结构(3)上,所述电子元件的所述至少一个连接触点(2)与所述导体结构(3)直接接触,且所述元件(1)的外壳的一部分与所述粘合层(4a)直接接触。本发明的方法使得电子的、尤其是微电子的功能团可以小心、快速且尤其低成本被生产。
Description
技术领域
本发明涉及一种电子的、尤其是微电子的功能团以及生产这种功能团的方法。
背景技术
一个电子功能团通常包含至少一个或多个电子元件、接触该电子元件的一导体结构以及涂覆有电子元件和导体结构的一载体。
为了将一电子元件、尤其一微电子元件,例如芯片,电连接在该导体结构上,并将其安设在载体上,各种方法已知:
在一方面,公知的是利用位于一导体结构上的电连接触点处理芯片,该导体结构涂覆在一载体上,通过输入能量,例如通过热量、超声波或者电压,以在芯片的金属触点和导体结构的指定触点之间产生一整体接头。
另一种可能是采用一各向同性导电胶将导体结构至少配置在区域中,以将芯片安置在该区域上,然后允许该粘胶凝固。
此外,公知的是利用各向同性导电胶,将芯片镀在整个表面的接触侧,该粘胶包含一小比例的金属球或金属涂层球。该芯片被压在一基底和配置的导体结构上。当将芯片压在基底上时,球的统计分布确保足够数量的球总是位于触点表面的区域中。由于在粘胶凝固过程中的大接触压力和收缩,因此触点保持摩擦地彼此连接。在另一方面,对于导电来说,不足的金属球是可获得的,通过更多的触点形成不期望的电桥。
作为一种选择,非导电胶也可被使用。芯片的连接触点在这种情况下被配置作为导电凸起。由于足够大的接触压力,以及粘胶的凝固和收缩,导电凸起与导体结构的直接触点被产生且被维持。
上述方法的一个缺点在于这些方法不是大大加重了电子元件的热能和/或机械能,就是导致元件和载体之间在机械上的连接不足。在后者的情况中,需要更多的措施以保证元件的机械安装,然而这导致方法变得更加复杂。上述方法的另一缺点在于这些方法需要部分导电的粘胶,然而这种类型的粘胶相对昂贵,且由于其绝缘属性不适合于许多应用。
发明内容
因此,本发明的目的在于提出一种电子的、尤其是微电子的功能团,确保元件与导体结构和载体的稳定连接,其能够以低复杂度和成本来生产,同时保护元件,特别地不需要导电胶。本发明的另一目的在于提出一种生产这种功能团的方法。
这些目的通过根据独立权利要求的一功能团以及一生产功能团的方法来实现。
有利的扩展被描述在从属权利要求中。
本发明提供了一种电子的、尤其是微电子的功能团,包括:一平面第一载体;一第一粘合层,其包括涂覆在所述载体上的一非导电胶;一导体结构,其涂覆在所述粘合层远离所述载体的一边的部分区域上;以及至少一个电子元件、尤其是一微电子芯片,其具有至少一个置于外部的电子连接触点,所述电子元件的所述至少一个连接触点与所述导体结构直接接触,且所述元件的外壳的一部分与所述粘合层直接接触。通过置于外部的触点,可以理解从外部得到的元件的每个触点,以及将要通过导体结构被接触的元件的每个触点。
根据本发明,所述非导电粘合层用于所述电子元件的机械固定。
这种类型的粘胶可以经济地获得。这尤其使得将粘胶作为一层涂覆在载体表面的整个表面成为可能,这降低了复杂性,且由于粘胶无需特殊结构因此降低了工艺成本。此外,避免了各向异性导电胶的低绝缘属性以及可能太高的各项同性导电胶的阻抗。
通过使用未设置的或仅设置在低温下的粘胶,电子元件的热负荷可以被避免。由于元件与导体结构之间的电子触点的生产无需高接触压力,且当使用各向异性导电胶时,机械负荷也可以被维持得较低。
导体结构较佳地直接配置在所述粘合层上。
载体、粘合层、导体结构和/或所述至少一个电子元件可以是机械刚性的或柔性的。
柔性元件的使用,尤其是柔性载体,使得产生柔性电子功能团成为可能。这种类型的柔性功能团特别适合于用作所谓的“智能标签”,因此可以理解,设置有芯片和天线的标签在激活时因此能够发送高频鉴别信号。
功能团的刚性、抗弯曲性结构从根本上来说也是可能的。
其他应用领域被开拓在聚合物电子技术领域,例如用于RFID应用,诸如智能标签、电子纸以及可以用于如津贴卡的普通柔性显示器,例如电话卡、客户打折系统及其类似物。
可以用作载体的有例如纸、纸板、聚合物膜或印刷电路板,根据其是否为想要达到的柔性或抗弯曲性结构。
可以用作粘胶的有例如丙烯酸酯、聚硅氧烷、环氧化物、热塑性塑料,可能进行适当的表面处理。
导体结构可以通过涂覆银浆或导电浆料来形成。
本发明的一个有利的扩展,提供一种功能团具有包括一非导电胶的一第二粘合层和一平面第二载体,与第一粘合层和第一载体形成一固体层复合第一载体-第一粘合层-第二粘合层-第二载体,所述导体结构和/或所述至少一个电子元件至少置于第一和第二载体之间的区域中。
在这种方式中,可能的是,在一方面,机械地稳定电子元件和/或导体结构,在另一方面,这两种元件可以通过诸如一“夹心面包”结构被机械地保护。
优选地,导体结构和至少一个电子元件部分地或完全地置于第一和第二粘合层之间,特别地嵌入粘合层中。
两个粘合层较佳地完全由载体覆盖在上侧和下侧。
较佳地,第一和第二粘合层的粘胶是相同的。这确保了层与层之间的良好整体连接。
也可能提供第二粘合层,类似于第一粘合层,具有一导体结构,将电子元件与后者连接在一起,因此例如为了将电绝缘桥横跨涂覆于天线线圈的绕组上。
此外,本发明提供一种上述电子功能团的生产方法,包括步骤:
a)在一载体上涂覆一非导电胶;
b)将一导体结构设置在粘合层的部分区域上;
c)将一具有至少一个置于外部的电子连接触电的电子元件置于所述粘合层和所述导体结构上,所述电子元件的所述至少一个连接触点与所述导体结构直接接触,且所述元件的外壳的一部分与所述粘合层直接接触。
特别地,电子元件的轻压制足以产生元件的接触触点与导体结构之间的良好电子触点,也足以将元件黏附地连接在粘合层上。较佳地,粘合层被配置为充分大的表面,以便向电子元件提供一充分大的接触表面。
元件的连接触点与导体结构之间的摩擦连接适合于确保大多数涂覆的电连接。在这种情况下,可以在没有元件的高机械和热负荷情况下实现电子元件的固定。如在敏感元件,诸如微电子芯片被固定时特别有利。
可选地,在进一步的步骤中,元件的至少一个电连接触点也可能通过热处理的方式被连接到电接触触点的导体结构的区域。这样,易导电的金属间相被形成。
根据本发明可能在卷带式工艺中应用该方法,如在一持续工艺中。特别地,胶粘可以在单独熔炉中无需进行后续设置而被使用。根据本发明的方法可以在一个持续几秒钟的时间周期内实施。因此特别在生产电子功能团,例如上述提到的“智能标签”时有利,为了经济利益,其必须能够以大数量且低成本被生产。
除了卷带式工艺,作为卷片材料或片片材料,当然同样地也可能构造该方法。如果想要生产抗弯曲性功能团则后者特别可能。
本发明的一个有利扩展是,在进一步的步骤中,提供了第一粘合层、以及较佳地安置在第一粘合层上的元件和/或导体结构被至少涂覆在具有另一非导电胶的区域中,且另一载体被安置在该第二粘合层上。
特别地,这可以通过安设有导体结构、至少一个电子元件和粘合层的载体的迭片结构产生效果。该方法同样可以产生优点在于,首先另一载体被涂覆第二粘合层,仅为了然后通过迭片工艺使其全部在第一粘合层之上,或者在具有涂覆的元件和/或导体结构之上。
导体结构能够通过例如喷墨印刷方法直接被涂覆在粘合层的表面。另一种可能是首先将导体结构配置在基底的表面上,通过将基底安置在导体结构的粘合层上,以将其从所述基底传送到粘合层上。
附图说明
参考几幅附图所代表的实施例,更详细地解释本发明。如下所示:
图1为本发明将电子元件与导体结构和粘合层连接之前的功能团的一实施例;
图2为将元件与导体结构和粘合层连接之后的方法;以及
图3为本发明完成生产方法之后的电子功能团的另一实施例。
具体实施方式
根据本发明方法的一个实施例,首先一平面载体5a,此处为厚度为200微米的一张纸,利用非导电胶被统一涂覆在整个表面的一侧,此处为丙烯酸酯,以使得形成厚度为20微米的第一粘合层4a。以之前定义的导体结构3形式的银浆通过喷墨打印方法涂覆在粘合层4a的部分区域中。
图1显示了这种过程情况,简略地在一电子元件之前,此处为具有置于外部的电子连接触点2的一RFID芯片,被设置在导体结构3和粘合层4a上。
具有置于外部的电子连接触点2的芯片1,被配置为诸如凸起的形式,但也可以具有其他配置方式,被设置在粘合层4a和导体结构3上,该连接触点2与导体结构3直接接触,且元件1的外壳的一部分与粘合层直接接触。为了确保连接触点2与导体结构3之间的良好摩擦连接,以及外壳与粘合层4a之间的良好粘合连接,芯片1被向载体5a的方向轻轻按压。
图2显示了方法的这种情况。
包括非导电胶的第二层,此处同样为丙烯酸酯,被涂覆在第一粘合层4a的自由表面区域、导体结构3和芯片1的自由表面上。该第二粘合层4b被焊在其具有第二载体5b的上侧,此处同样为具有壁厚为200微米的一层纸(图3)。
导体结构3和芯片1因此完全被嵌在粘合层4a和4b中。他们通过置于外部的载体层5a和5b被机械地保护。由纸制成的柔性载体、薄的粘合层4a、4b以及薄的导体结构3确保电子功能团整体是柔性的。芯片自身具有低柔性;然而其相对于载体层5a和5b的可能弯曲半径来说非常小。而且局部增强可以根据需要被要求。
在本实施例中,该电子功能团形成一个所谓的“智能标签”。RFID芯片能够发送用于鉴别的高频电磁信号。导体结构3在这方面被配置为芯片1的发送-接收天线。
作为此处描述的实施例的一个选择,可能特别地使用抗弯曲性元件,特别为抗弯曲性载体。此外,也可能通过热处理将导体结构3和电子元件的连接触点2转换到一金属间相。另外,在分离过程中能够提供载体、粘合层和导体结构。
此处描述的方法特别适用于“智能标签”的生产。其使用特别是已经存在的材料,将安装和连接工艺的工艺步骤减少到最小值。生产能够特别在经济上产生效果,且具有理想的生产量,例如通过具有可能后续设置阶段的卷带式工艺,如作为在室温或在加热室内的一整个卷轴或作为片材。另外,该方法能够以具有低机械负荷的保护方式被实施。
Claims (7)
1、一种电子的、尤其是微电子的功能团,包括:
一平面第一载体(5a);
一第一粘合层(4a),其包括涂覆在所述载体(5a)上的一非导电胶;
一导体结构(3),其涂覆在所述粘合层(4a)远离所述载体(5a)的一边的部分区域上;以及
至少一个电子元件(1),尤其是一微电子芯片(1),其具有至少一个置于外部的电子连接触点(2),所述电子元件(1)的所述至少一个连接触点(2)与所述导体结构(3)直接接触,且所述元件(1)的外壳的一部分与所述粘合层(4a)直接接触。
2、根据权利要求1所述的功能团,其特征在于,所述功能团具有包括一非导电胶的一第二粘合层(4b)和一平面第二载体(5b),与第一粘合层(4a)和第一载体(5a)形成一固体层复合第一载体(5a)-第一粘合层(4a)-第二粘合层(4b)-第二载体(5b),所述导体结构(3)和/或所述至少一个电子元件(1)至少置于第一和第二载体(5)之间的区域中。
3、根据前述权利要求中任一所述的功能团,其特征在于,载体(5a、5b)、粘合层(4a、4b)、导体结构(3)和/或所述至少一个电子元件(1)是柔性的。
4、一种生产电子功能团,尤其是生产权利要求1-3中任一所述的功能团的方法,包括步骤:
a)在一载体(5a)上涂覆一非导电胶;
b)将一导体结构设置在粘合层(4a)的部分区域上;
c)将一具有至少一个置于外部的电子连接触点(2)的电子元件(1)置于所述粘合层(4a)和所述导体结构(3)上,所述电子元件(1)的所述至少一个连接触点(2)与所述导体结构(3)直接接触,且所述元件(1)的外壳的一部分与所述粘合层(4a)直接接触。
5、根据权利要求4所述的方法,其特征在于,在进一步的步骤中,所述第一粘合层(4a)以及较佳地安置在导体结构(3)上和所述第一粘合层(4a)上的所述元件(1)和/或所述导体结构(3)被至少涂覆在具有另一非导电胶的区域中,且另一载体(5b)被安置在该第二粘合层(4b)上。
6、根据权利要求4-5中任一所述的方法,其特征在于,在进一步的步骤中,所述元件(1)的所述至少一个电子连接触点(2)通过热处理的方式被连接到电接触所述触点的所述导体结构(3)的所述区域。
7、根据权利要求4-6中任一所述的方法,其特征在于,所述导体结构(3)通过喷墨印刷工艺、丝网印刷工艺,通过喷雾或通过从一基底传送设置在所述粘合层(4a)上。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2006/011515 WO2008061554A1 (de) | 2006-11-24 | 2006-11-24 | Elektronische, insbesondere mikroelektronische funktionsgruppe und verfahren zu deren herstellung |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101563765A true CN101563765A (zh) | 2009-10-21 |
CN101563765B CN101563765B (zh) | 2013-09-25 |
Family
ID=37670157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800564582A Expired - Fee Related CN101563765B (zh) | 2006-11-24 | 2006-11-24 | 电子的、尤其是微电子的功能团及其生产方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20100142167A1 (zh) |
EP (1) | EP2100327A1 (zh) |
JP (1) | JP5248518B2 (zh) |
CN (1) | CN101563765B (zh) |
NO (1) | NO20091913L (zh) |
WO (1) | WO2008061554A1 (zh) |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2701139B1 (fr) * | 1993-02-01 | 1995-04-21 | Solaic Sa | Procédé pour l'implantation d'un micro-circuit sur un corps de carte intelligente et/ou à mémoire, et carte comportant un micro-circuit ainsi implanté. |
DE19529490A1 (de) * | 1995-08-10 | 1997-02-13 | Fraunhofer Ges Forschung | Chipkontaktierungsverfahren, damit hergestellte elektronische Schaltung und Trägersubstrat zur Kontaktierung von Chips |
US6482495B1 (en) * | 1996-09-04 | 2002-11-19 | Hitachi Maxwell, Ltd. | Information carrier and process for production thereof |
JP2000068328A (ja) * | 1998-08-21 | 2000-03-03 | Olympus Optical Co Ltd | フリップチップ実装用配線基板 |
JP4508301B2 (ja) * | 1998-09-16 | 2010-07-21 | 大日本印刷株式会社 | 非接触icカード |
US6404643B1 (en) * | 1998-10-15 | 2002-06-11 | Amerasia International Technology, Inc. | Article having an embedded electronic device, and method of making same |
JP3502557B2 (ja) * | 1999-01-07 | 2004-03-02 | 松下電器産業株式会社 | 非接触icカードの製造方法 |
DE19921230B4 (de) * | 1999-05-07 | 2009-04-02 | Giesecke & Devrient Gmbh | Verfahren zum Handhaben von gedünnten Chips zum Einbringen in Chipkarten |
EP1156521A3 (en) * | 2000-04-24 | 2007-05-23 | Interuniversitair Microelektronica Centrum Vzw | Low cost electroless plating process for single chips and wafer parts and products obtained thereof |
CN1498417A (zh) * | 2000-09-19 | 2004-05-19 | 纳诺皮尔斯技术公司 | 用于在无线频率识别装置中装配元件和天线的方法 |
US6951596B2 (en) * | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
DE10124770C1 (de) * | 2001-05-21 | 2002-10-17 | Infineon Technologies Ag | Verfahren zur Kontaktierung eines elektrischen Bauelementes mit einem eine Leiterstruktur aufweisenden Substrat |
JP2003233793A (ja) * | 2002-02-12 | 2003-08-22 | Konica Corp | Icカード |
AU2003261394A1 (en) * | 2002-08-05 | 2004-02-23 | Research Foundation Of The State University Of New York | System and method for manufacturing embedded conformal electronics |
WO2004057528A1 (fr) * | 2002-12-20 | 2004-07-08 | Nagraid Sa | Transpondeur electronique realise par depot d'encre conductrice |
JP4479209B2 (ja) * | 2003-10-10 | 2010-06-09 | パナソニック株式会社 | 電子回路装置およびその製造方法並びに電子回路装置の製造装置 |
JP2006043969A (ja) * | 2004-08-03 | 2006-02-16 | Mejiro Precision:Kk | 電子装置の製造方法 |
JP2006127474A (ja) * | 2004-09-30 | 2006-05-18 | Toppan Forms Co Ltd | 通信用回路保持体 |
US7360437B2 (en) * | 2005-06-28 | 2008-04-22 | General Electric Company | Devices for evaluating material properties, and related processes |
US20070163704A1 (en) * | 2006-01-18 | 2007-07-19 | Upm Rafsec Oy | Method for manufacturing a label comprising a transponder |
-
2006
- 2006-11-24 JP JP2009537486A patent/JP5248518B2/ja not_active Expired - Fee Related
- 2006-11-24 EP EP06829212A patent/EP2100327A1/de not_active Withdrawn
- 2006-11-24 WO PCT/EP2006/011515 patent/WO2008061554A1/de active Application Filing
- 2006-11-24 CN CN2006800564582A patent/CN101563765B/zh not_active Expired - Fee Related
- 2006-11-24 US US12/515,804 patent/US20100142167A1/en not_active Abandoned
-
2009
- 2009-05-15 NO NO20091913A patent/NO20091913L/no not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
US20100142167A1 (en) | 2010-06-10 |
EP2100327A1 (de) | 2009-09-16 |
CN101563765B (zh) | 2013-09-25 |
WO2008061554A1 (de) | 2008-05-29 |
NO20091913L (no) | 2009-06-24 |
JP5248518B2 (ja) | 2013-07-31 |
JP2010510678A (ja) | 2010-04-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW502220B (en) | IC card | |
KR101189636B1 (ko) | 평면 안테나 및 그 제조방법 | |
JP2005129019A (ja) | Icカード | |
US20030094697A1 (en) | Circuit substrate and its manufacturing method | |
KR20010030032A (ko) | Ic 카드 | |
JP4569399B2 (ja) | 回路基板 | |
TWI295789B (zh) | ||
US20110073357A1 (en) | Electronic device and method of manufacturing an electronic device | |
US8695207B2 (en) | Method for manufacturing an electronic device | |
CN101563765B (zh) | 电子的、尤其是微电子的功能团及其生产方法 | |
JP2002366918A (ja) | 非接触icカード | |
US20070159341A1 (en) | Packaging structure for radio frequency identification devices | |
JP4413305B2 (ja) | Icカード | |
JPH058831B2 (zh) | ||
JP4777015B2 (ja) | 通信用回路保持体 | |
JP2015106331A (ja) | デュアルicカード | |
JP4598113B2 (ja) | Icカード | |
KR101031884B1 (ko) | Rfid 태그 제조방법 및 이를 이용한 rfid 태그 | |
JP2003162703A (ja) | Icカードとその製造方法 | |
JP4569400B2 (ja) | 回路基板 | |
JP2022095262A (ja) | メタルカード | |
JP2002259923A (ja) | 非接触icカードおよびその製造方法 | |
JP4777016B2 (ja) | 通信用回路保持体 | |
JPS6072237A (ja) | 高分子素子のリ−ド線接続方法 | |
JP2009295708A (ja) | Icモジュール製造方法、icタグインレット製造方法、icタグインレット、および非接触ic媒体 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130925 Termination date: 20141124 |
|
EXPY | Termination of patent right or utility model |