CN101563590B - 灵敏度增加的热传感器 - Google Patents
灵敏度增加的热传感器 Download PDFInfo
- Publication number
- CN101563590B CN101563590B CN2007800468113A CN200780046811A CN101563590B CN 101563590 B CN101563590 B CN 101563590B CN 2007800468113 A CN2007800468113 A CN 2007800468113A CN 200780046811 A CN200780046811 A CN 200780046811A CN 101563590 B CN101563590 B CN 101563590B
- Authority
- CN
- China
- Prior art keywords
- sensor
- temperature sensing
- substrate
- cover
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J1/00—Photometry, e.g. photographic exposure meter
- G01J1/02—Details
- G01J1/04—Optical or mechanical part supplementary adjustable parts
- G01J1/0407—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings
- G01J1/0411—Optical elements not provided otherwise, e.g. manifolds, windows, holograms, gratings using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
- G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/05—Means for preventing contamination of the components of the optical system; Means for preventing obstruction of the radiation path
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/07—Arrangements for adjusting the solid angle of collected radiation, e.g. adjusting or orienting field of view, tracking position or encoding angular position
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0801—Means for wavelength selection or discrimination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0806—Focusing or collimating elements, e.g. lenses or concave mirrors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/08—Optical arrangements
- G01J5/0846—Optical arrangements having multiple detectors for performing different types of detection, e.g. using radiometry and reflectometry channels
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
- G01J5/22—Electrical features thereof
- G01J5/24—Use of specially adapted circuits, e.g. bridge circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/70—Passive compensation of pyrometer measurements, e.g. using ambient temperature sensing or sensing of temperature within housing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/407—Optical elements or arrangements indirectly associated with the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
- G01J5/045—Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Radiation Pyrometers (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/584466 | 2006-10-20 | ||
| US11/584,466 | 2006-10-20 | ||
| US11/584,466 US7435964B2 (en) | 2005-01-26 | 2006-10-20 | Thermal sensor with increased sensitivity |
| PCT/EP2007/061096 WO2008046864A1 (en) | 2006-10-20 | 2007-10-17 | Thermal sensor with increased sensitivity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101563590A CN101563590A (zh) | 2009-10-21 |
| CN101563590B true CN101563590B (zh) | 2011-03-23 |
Family
ID=38924285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800468113A Expired - Fee Related CN101563590B (zh) | 2006-10-20 | 2007-10-17 | 灵敏度增加的热传感器 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7435964B2 (enExample) |
| EP (1) | EP2087331A1 (enExample) |
| JP (1) | JP5358445B2 (enExample) |
| CN (1) | CN101563590B (enExample) |
| WO (1) | WO2008046864A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI473982B (zh) * | 2013-03-22 | 2015-02-21 | Nat Univ Kaohsiung | Infrared sensing chip |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7692148B2 (en) * | 2005-01-26 | 2010-04-06 | Analog Devices, Inc. | Thermal sensor with thermal barrier |
| US8487260B2 (en) * | 2005-01-26 | 2013-07-16 | Analog Devices, Inc. | Sensor |
| US7718967B2 (en) * | 2005-01-26 | 2010-05-18 | Analog Devices, Inc. | Die temperature sensors |
| US7807972B2 (en) * | 2005-01-26 | 2010-10-05 | Analog Devices, Inc. | Radiation sensor with cap and optical elements |
| US7910890B2 (en) * | 2006-08-24 | 2011-03-22 | Pacific Advanced Technology | Infrared camera system with diffractive optical array |
| US8081368B2 (en) * | 2007-03-29 | 2011-12-20 | Bose Corporation | Selective absorbing |
| DE102007057037A1 (de) * | 2007-11-27 | 2009-05-28 | Robert Bosch Gmbh | Sensorelement für spektroskopische oder optische Messungen und Verfahren zu dessen Herstellung |
| US8523427B2 (en) * | 2008-02-27 | 2013-09-03 | Analog Devices, Inc. | Sensor device with improved sensitivity to temperature variation in a semiconductor substrate |
| JP5640529B2 (ja) * | 2009-10-17 | 2014-12-17 | 三菱マテリアル株式会社 | 赤外線センサ及びこれを備えた回路基板 |
| US8411442B2 (en) | 2010-09-09 | 2013-04-02 | Texas Instruments Incorporated | Vias in substrate between IC seat and peripheral thermal cage |
| FR2966596B1 (fr) * | 2010-10-26 | 2012-12-07 | Commissariat Energie Atomique | Dispositif de detection d'un rayonnement electromagnetique. |
| FR2966595B1 (fr) * | 2010-10-26 | 2013-01-25 | Commissariat Energie Atomique | Dispositif de detection d'un rayonnement electromagnetique. |
| JP5910989B2 (ja) * | 2012-03-09 | 2016-04-27 | 株式会社リコー | 分光計測装置、画像評価装置及び画像形成装置 |
| US8816280B2 (en) | 2012-03-21 | 2014-08-26 | Analog Devices, Inc. | Infrared sensor |
| US9476772B2 (en) * | 2012-03-29 | 2016-10-25 | Analog Devices, Inc. | Temperature sensor and an infrared detector including such a sensor |
| CH707390A2 (de) * | 2012-12-28 | 2014-06-30 | Greenteg Ag | Wärmeflusssensor. |
| JP5902107B2 (ja) * | 2013-01-24 | 2016-04-13 | オリジン電気株式会社 | 加熱接合装置及び加熱接合製品の製造方法 |
| KR101570445B1 (ko) * | 2014-02-27 | 2015-11-20 | 한국과학기술원 | 적외선 검출기 |
| US9227839B2 (en) * | 2014-05-06 | 2016-01-05 | Raytheon Company | Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling |
| EP3035015B1 (en) * | 2014-12-15 | 2017-04-12 | Melexis Technologies NV | Ir sensor for ir sensing based on power control |
| CN107543618A (zh) * | 2016-09-05 | 2018-01-05 | 北京卫星环境工程研究所 | 基于柔性薄膜热电堆的圆箔式辐射热流测量装置 |
| DE102017206388A1 (de) * | 2017-04-13 | 2018-10-18 | Robert Bosch Gmbh | Verfahren zum Schutz einer MEMS-Einheit vor Infrarot-Untersuchungen sowie MEMS-Einheit |
| US12379264B2 (en) * | 2019-02-12 | 2025-08-05 | Accure Acne, Inc. | Self-calibrating temperature sensing apparatus for use with a photo-thermal targeted treatment system and associated methods |
| US11391634B2 (en) * | 2019-02-12 | 2022-07-19 | Accure Acne, Inc. | Temperature sensing apparatus for use with a photo-thermal targeted treatment system and associated methods |
| CN110783354B (zh) * | 2019-10-30 | 2022-02-15 | 深圳先进技术研究院 | 太赫兹信号探测器及其制备方法 |
| US20230140390A1 (en) * | 2020-04-13 | 2023-05-04 | T-Smart Systems Llc | Structure and Method of Manufacturing for a Hermetic Housing Enclosure for a Thermal Shock Proof, Zero Thermal Gradient Imaging or Sensing Core |
| CN113701900A (zh) * | 2020-05-22 | 2021-11-26 | 众智光电科技股份有限公司 | 红外线温度感测器 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5962854A (en) * | 1996-06-12 | 1999-10-05 | Ishizuka Electronics Corporation | Infrared sensor and infrared detector |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4286225A (en) | 1979-12-31 | 1981-08-25 | Analog Devices, Incorporated | Isolation amplifier |
| US4360784A (en) | 1980-08-13 | 1982-11-23 | Automation Systems, Inc. | Transformer coupled isolation amplifier |
| US7415126B2 (en) * | 1992-05-05 | 2008-08-19 | Automotive Technologies International Inc. | Occupant sensing system |
| JPH05157625A (ja) * | 1991-12-06 | 1993-06-25 | Murata Mfg Co Ltd | 赤外線センサアレイ用フィルタおよびその作製方法 |
| JP3181363B2 (ja) * | 1992-04-17 | 2001-07-03 | テルモ株式会社 | 赤外線センサおよびその製造方法 |
| JP3200657B2 (ja) * | 1992-04-30 | 2001-08-20 | テルモ株式会社 | 赤外線センサ |
| US5754088A (en) | 1994-11-17 | 1998-05-19 | International Business Machines Corporation | Planar transformer and method of manufacture |
| US5550373A (en) * | 1994-12-30 | 1996-08-27 | Honeywell Inc. | Fabry-Perot micro filter-detector |
| US5650624A (en) * | 1995-04-13 | 1997-07-22 | Engelhard Sensor Technologies, Inc. | Passive infrared analysis gas sensor |
| US5914488A (en) * | 1996-03-05 | 1999-06-22 | Mitsubishi Denki Kabushiki Kaisha | Infrared detector |
| JPH09257587A (ja) * | 1996-03-26 | 1997-10-03 | Terumo Corp | 非接触型温度計 |
| CN1183587C (zh) | 1996-04-08 | 2005-01-05 | 德克萨斯仪器股份有限公司 | 用于把两个集成电路直流上相互隔离的方法和设备 |
| JPH09329499A (ja) * | 1996-06-12 | 1997-12-22 | Ishizuka Denshi Kk | 赤外線センサ及び赤外線検出器 |
| WO1998036247A1 (de) * | 1997-02-14 | 1998-08-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Strömungssensorkomponente |
| EP0863640A3 (en) | 1997-03-04 | 2005-09-21 | Texas Instruments Incorporated | Improved physical layer interface device |
| JP3670450B2 (ja) * | 1997-07-17 | 2005-07-13 | 株式会社山形チノー | 狭視野サーミスタボロメータ |
| US6252229B1 (en) | 1998-07-10 | 2001-06-26 | Boeing North American, Inc. | Sealed-cavity microstructure and microbolometer and associated fabrication methods |
| KR100290870B1 (ko) * | 1999-03-27 | 2001-05-15 | 구자홍 | 저항형 볼로미터 센서 |
| US6222454B1 (en) * | 1999-07-01 | 2001-04-24 | Goal Electronics Inc. | Non-contacting temperature sensing device |
| US6566725B1 (en) | 1999-07-30 | 2003-05-20 | Xactix, Inc. | Thermal isolation using vertical structures |
| JP2001304973A (ja) | 2000-04-26 | 2001-10-31 | Denso Corp | 赤外線イメージセンサ |
| FR2822541B1 (fr) * | 2001-03-21 | 2003-10-03 | Commissariat Energie Atomique | Procedes et dispositifs de fabrication de detecteurs de rayonnement |
| US20020166968A1 (en) * | 2001-05-11 | 2002-11-14 | Bradley Martin G. | Apparatus and method of measuring bolometric resistance changes in an uncooled and thermally unstabilized focal plane array over a wide temperature range |
| US6890834B2 (en) * | 2001-06-11 | 2005-05-10 | Matsushita Electric Industrial Co., Ltd. | Electronic device and method for manufacturing the same |
| US6893574B2 (en) * | 2001-10-23 | 2005-05-17 | Analog Devices Inc | MEMS capping method and apparatus |
| JP3806923B2 (ja) * | 2001-10-30 | 2006-08-09 | 富士電機デバイステクノロジー株式会社 | 半導体装置 |
| JP2003315148A (ja) * | 2002-04-24 | 2003-11-06 | Kyocera Corp | 赤外線センサ素子収納用パッケージおよび赤外線センサ装置 |
| JP2004245692A (ja) * | 2003-02-13 | 2004-09-02 | Toshiba Corp | 赤外線撮像素子 |
| US7064442B1 (en) | 2003-07-02 | 2006-06-20 | Analog Devices, Inc. | Integrated circuit package device |
| DE102004034066B4 (de) | 2004-07-15 | 2012-10-31 | Bayerische Motoren Werke Aktiengesellschaft | Vorrichtung zur Steuerung der Kühlung einer Brennkraftmaschine für Kraftfahrzeuge |
| DE102004061337A1 (de) * | 2004-12-20 | 2006-07-06 | Robert Bosch Gmbh | Sensor und Verfahren zur Montage eines Sensorchips auf einem Träger |
| US7326932B2 (en) * | 2005-01-26 | 2008-02-05 | Analog Devices, Inc. | Sensor and cap arrangement |
-
2006
- 2006-10-20 US US11/584,466 patent/US7435964B2/en not_active Expired - Lifetime
-
2007
- 2007-10-17 CN CN2007800468113A patent/CN101563590B/zh not_active Expired - Fee Related
- 2007-10-17 WO PCT/EP2007/061096 patent/WO2008046864A1/en not_active Ceased
- 2007-10-17 EP EP07821461A patent/EP2087331A1/en not_active Withdrawn
- 2007-10-17 JP JP2009532798A patent/JP5358445B2/ja not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5962854A (en) * | 1996-06-12 | 1999-10-05 | Ishizuka Electronics Corporation | Infrared sensor and infrared detector |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI473982B (zh) * | 2013-03-22 | 2015-02-21 | Nat Univ Kaohsiung | Infrared sensing chip |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2087331A1 (en) | 2009-08-12 |
| CN101563590A (zh) | 2009-10-21 |
| JP5358445B2 (ja) | 2013-12-04 |
| US20070138394A1 (en) | 2007-06-21 |
| US7435964B2 (en) | 2008-10-14 |
| JP2010507084A (ja) | 2010-03-04 |
| WO2008046864A1 (en) | 2008-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101563590B (zh) | 灵敏度增加的热传感器 | |
| CN101563591B (zh) | 包括参考传感器元件的传感器 | |
| CN101563592B (zh) | 具有热阻挡体的热传感器 | |
| CN101568813B (zh) | 芯片温度传感器 | |
| US8304850B2 (en) | Integrated infrared sensors with optical elements, and methods | |
| KR101869066B1 (ko) | 모놀리식 Si-마이크로 기계 써모파일 적외선 센서 | |
| EP1842040B1 (en) | A sensor | |
| JP7008019B2 (ja) | ウェハレベルパッケージ内の熱赤外線センサアレイ | |
| EP2986959B1 (en) | Thin-film encapsulated infrared sensor | |
| SG192390A1 (en) | Radiation sensor | |
| KR20200090797A (ko) | 전기적 검사 방법 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110323 |