CN101562165B - 半导体装置 - Google Patents

半导体装置 Download PDF

Info

Publication number
CN101562165B
CN101562165B CN 200810181797 CN200810181797A CN101562165B CN 101562165 B CN101562165 B CN 101562165B CN 200810181797 CN200810181797 CN 200810181797 CN 200810181797 A CN200810181797 A CN 200810181797A CN 101562165 B CN101562165 B CN 101562165B
Authority
CN
China
Prior art keywords
semiconductor device
over
hang
lead portion
linking part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN 200810181797
Other languages
English (en)
Chinese (zh)
Other versions
CN101562165A (zh
Inventor
中川信也
川藤寿
林建一
川岛裕史
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN101562165A publication Critical patent/CN101562165A/zh
Application granted granted Critical
Publication of CN101562165B publication Critical patent/CN101562165B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN 200810181797 2008-04-15 2008-12-12 半导体装置 Active CN101562165B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008105800 2008-04-15
JP2008105800A JP5145596B2 (ja) 2008-04-15 2008-04-15 半導体装置
JP2008-105800 2008-04-15

Publications (2)

Publication Number Publication Date
CN101562165A CN101562165A (zh) 2009-10-21
CN101562165B true CN101562165B (zh) 2011-05-25

Family

ID=41220892

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200810181797 Active CN101562165B (zh) 2008-04-15 2008-12-12 半导体装置

Country Status (2)

Country Link
JP (1) JP5145596B2 (ja)
CN (1) CN101562165B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7316968B2 (ja) 2020-03-27 2023-07-28 三菱電機株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH073848B2 (ja) * 1984-09-28 1995-01-18 株式会社日立製作所 半導体装置
JPH08241948A (ja) * 1995-03-06 1996-09-17 Nec Corp 半導体集積回路のリードフレームとその製造方法
JP2006080180A (ja) * 2004-09-08 2006-03-23 Seiko Epson Corp 電子部品、圧電発振器および電子機器

Also Published As

Publication number Publication date
JP5145596B2 (ja) 2013-02-20
CN101562165A (zh) 2009-10-21
JP2009259961A (ja) 2009-11-05

Similar Documents

Publication Publication Date Title
CN211238167U (zh) 半导体器件
KR0139700B1 (ko) 반도체장치, 리드프레임 및 반도체장치의 제조방법
EP2581937B1 (en) Resin-sealed semiconductor device and method for manufacturing same
CN105826209B (zh) 一种封装结构及其制造方法
WO2007117819A2 (en) Molded semiconductor package with integrated through hole heat spreader pin(s)
CN103915405B (zh) 半导体器件和制造半导体器件的方法
TWI486105B (zh) 封裝結構及其製造方法
CN104465757A (zh) 半导体装置及其制造方法
CN101562165B (zh) 半导体装置
JP4039298B2 (ja) 樹脂封止型半導体装置およびその製造方法ならびに成形型
US9000570B2 (en) Semiconductor device with corner tie bars
CN219066818U (zh) 一种可控制焊料厚度的功率模块引线框架及功率模块结构
US7619307B1 (en) Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package
JP4252563B2 (ja) 半導体装置
JPH02129951A (ja) 半導体装置の製造方法
US7808088B2 (en) Semiconductor device with improved high current performance
CN117936486B (en) Power device packaging structure and preparation method thereof
CN201829483U (zh) 倒装薄的四边无引线封装的引线框及其封装结构
CN219917159U (zh) 一种半导体引线框架
KR101016715B1 (ko) 반도체장치
CN102376666B (zh) 一种球栅阵列封装结构及其制造方法
CN214336699U (zh) 功率模块外壳及功率模块、电子装置
CN214542226U (zh) 智能功率模块
CN111406311A (zh) 电子模块以及电子模块的制造方法
CN117936486A (zh) 一种功率器件封装结构及其制备方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant