CN101533827A - 半导体集成电路装置 - Google Patents
半导体集成电路装置 Download PDFInfo
- Publication number
- CN101533827A CN101533827A CNA2009100046269A CN200910004626A CN101533827A CN 101533827 A CN101533827 A CN 101533827A CN A2009100046269 A CNA2009100046269 A CN A2009100046269A CN 200910004626 A CN200910004626 A CN 200910004626A CN 101533827 A CN101533827 A CN 101533827A
- Authority
- CN
- China
- Prior art keywords
- wiring
- illusory
- wiring layer
- hole body
- crossing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000003475 lamination Methods 0.000 claims description 49
- 239000004020 conductor Substances 0.000 claims description 33
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 239000004744 fabric Substances 0.000 description 7
- 230000007423 decrease Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5226—Via connections in a multilevel interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008061665 | 2008-03-11 | ||
JP2008-061665 | 2008-03-11 | ||
JP2008061665 | 2008-03-11 | ||
JP2009032318A JP4642908B2 (ja) | 2008-03-11 | 2009-02-16 | 半導体集積回路装置 |
JP2009-032318 | 2009-02-16 | ||
JP2009032318 | 2009-02-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101533827A true CN101533827A (zh) | 2009-09-16 |
CN101533827B CN101533827B (zh) | 2012-06-27 |
Family
ID=41104326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009100046269A Active CN101533827B (zh) | 2008-03-11 | 2009-03-02 | 半导体集成电路装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2011071541A (zh) |
CN (1) | CN101533827B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6325831B2 (ja) * | 2014-02-05 | 2018-05-16 | 株式会社メガチップス | 半導体集積回路の設計方法、プログラムおよび半導体集積回路 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4192348B2 (ja) * | 1999-08-09 | 2008-12-10 | 株式会社デンソー | 半導体装置 |
JP2001274163A (ja) * | 2000-03-27 | 2001-10-05 | Toshiba Corp | 半導体装置 |
JP2002184950A (ja) * | 2000-12-15 | 2002-06-28 | Fujitsu Ltd | 多層配線構造の半導体装置、配線方法、配線装置、及び記録媒体 |
JP4346410B2 (ja) * | 2003-10-28 | 2009-10-21 | 東芝メモリシステムズ株式会社 | 半導体集積回路の配線設計方法及び半導体集積回路 |
JP4047324B2 (ja) * | 2003-12-03 | 2008-02-13 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
JP4799858B2 (ja) * | 2004-12-24 | 2011-10-26 | オンセミコンダクター・トレーディング・リミテッド | 半導体集積回路の自動設計方法 |
CN100428250C (zh) * | 2005-11-08 | 2008-10-22 | 华为技术有限公司 | 印刷电路板的过孔和焊盘间导线长度控制的方法 |
JP2007305713A (ja) * | 2006-05-10 | 2007-11-22 | Matsushita Electric Ind Co Ltd | 半導体装置及び配線補助パターン生成方法 |
-
2009
- 2009-03-02 CN CN2009100046269A patent/CN101533827B/zh active Active
-
2010
- 2010-11-30 JP JP2010266875A patent/JP2011071541A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN101533827B (zh) | 2012-06-27 |
JP2011071541A (ja) | 2011-04-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200827 Address after: Kyoto Japan Patentee after: Panasonic semiconductor solutions Co.,Ltd. Address before: Osaka Japan Patentee before: Matsushita Electric Industrial Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: Kyoto Japan Patentee after: Nuvoton Technology Corporation Japan Country or region after: Japan Address before: Kyoto Japan Patentee before: Panasonic semiconductor solutions Co.,Ltd. Country or region before: Japan |