CN101529583B - 功能部件用盖及其制造方法 - Google Patents

功能部件用盖及其制造方法 Download PDF

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Publication number
CN101529583B
CN101529583B CN2007800395682A CN200780039568A CN101529583B CN 101529583 B CN101529583 B CN 101529583B CN 2007800395682 A CN2007800395682 A CN 2007800395682A CN 200780039568 A CN200780039568 A CN 200780039568A CN 101529583 B CN101529583 B CN 101529583B
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China
Prior art keywords
lid
powder
solder
lead
based metal
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Chinese (zh)
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CN101529583A (zh
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加藤力弥
禅三津夫
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Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/166—Material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12063—Nonparticulate metal component

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN2007800395682A 2006-09-01 2007-09-03 功能部件用盖及其制造方法 Active CN101529583B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP237259/2006 2006-09-01
JP2006237259 2006-09-01
PCT/JP2007/067144 WO2008026761A1 (fr) 2006-09-01 2007-09-03 Couvercle pour une pièce fonctionnelle et son procédé de production

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CN101529583A CN101529583A (zh) 2009-09-09
CN101529583B true CN101529583B (zh) 2011-03-02

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US (1) US20100291399A1 (fr)
JP (1) JP5045673B2 (fr)
KR (1) KR101004589B1 (fr)
CN (1) CN101529583B (fr)
WO (1) WO2008026761A1 (fr)

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JP5292977B2 (ja) * 2008-08-01 2013-09-18 富士電機株式会社 接合材、半導体装置およびその製造方法
JP5310309B2 (ja) * 2009-06-26 2013-10-09 千住金属工業株式会社 はんだコートリッド
WO2011027659A1 (fr) 2009-09-03 2011-03-10 株式会社村田製作所 Pâte à souder, procédé d'assemblage utilisant cette pâte et structure d'assemblage
CN101969054B (zh) * 2010-08-20 2012-01-18 常州银河电器有限公司 一种半导体芯片的制备方法
TWI436710B (zh) * 2011-02-09 2014-05-01 Murata Manufacturing Co Connection structure
JP2012174332A (ja) * 2011-02-17 2012-09-10 Fujitsu Ltd 導電性接合材料、導体の接合方法、及び半導体装置の製造方法
DE102011084174A1 (de) * 2011-10-07 2013-04-11 Tyco Electronics Amp Gmbh Crimpverbindung
CN104245204A (zh) * 2012-03-05 2014-12-24 株式会社村田制作所 接合方法、接合结构体及其制造方法
US9198302B2 (en) * 2012-07-18 2015-11-24 Koninklijke Philips N.V. Method of soldering an electronic component with a high lateral accuracy
JP6079374B2 (ja) * 2013-03-29 2017-02-15 三菱マテリアル株式会社 ハンダ粉末の製造方法及びこの粉末を用いたハンダ用ペースト
JP5962939B2 (ja) * 2013-04-09 2016-08-03 千住金属工業株式会社 ソルダペースト
KR102156373B1 (ko) 2013-05-10 2020-09-16 엘지이노텍 주식회사 솔더 페이스트
US9355980B2 (en) * 2013-09-03 2016-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Three-dimensional chip stack and method of forming the same
US9831206B2 (en) * 2014-03-28 2017-11-28 Intel Corporation LPS solder paste based low cost fine pitch pop interconnect solutions
JP6288284B2 (ja) * 2014-09-10 2018-03-07 株式会社村田製作所 金属間化合物の生成方法
JP6281468B2 (ja) 2014-10-30 2018-02-21 トヨタ自動車株式会社 半導体装置とその製造方法
JP6287759B2 (ja) 2014-10-30 2018-03-07 トヨタ自動車株式会社 半導体装置とその製造方法
JP6575301B2 (ja) * 2014-10-31 2019-09-18 三菱マテリアル株式会社 封止用ペースト、ろう接合材とその製造方法、封止用蓋材とその製造方法、及びパッケージ封止方法
CN104588906A (zh) * 2014-11-26 2015-05-06 东北大学 一种Sn-Cu高温无铅焊膏及其制备方法和使用方法
US20170095891A1 (en) * 2015-10-01 2017-04-06 Iowa State University Research Foundation, Inc. Lead-free composite solder
JP6144440B1 (ja) * 2017-01-27 2017-06-07 有限会社 ナプラ 半導体封止用プリフォーム
JP6205083B1 (ja) * 2017-03-07 2017-09-27 有限会社 ナプラ 接合構造部
JP6156965B1 (ja) * 2017-03-31 2017-07-05 有限会社 ナプラ 半導体封止用プリフォーム
DE102017206932A1 (de) * 2017-04-25 2018-10-25 Siemens Aktiengesellschaft Lotformteil zum Erzeugen einer Diffusionslötverbindung und Verfahren zum Erzeugen eines Lotformteils
DE102017213170A1 (de) * 2017-07-31 2019-01-31 Infineon Technologies Ag Löten eines leiters an eine aluminiummetallisierung
CN107350655B (zh) * 2017-08-07 2020-05-12 北京科技大学 一种铜/锡纳米复合粉末活性焊料及其制备方法
DE102018201974A1 (de) * 2018-02-08 2019-08-08 Siemens Aktiengesellschaft Verfahren zum Herstellen einer Baueinheit sowie Verfahren zum Verbinden eines Bauteils mit einer solchen Baueinheit
CN108682711A (zh) * 2018-06-11 2018-10-19 刘金花 高效光伏焊带及其焊接方法和实施该方法的丝网印刷设备
JP6803107B1 (ja) * 2019-07-26 2020-12-23 株式会社日本スペリア社 プリフォームはんだ及び該プリフォームはんだを用いて形成されたはんだ接合体
WO2021020309A1 (fr) * 2019-07-26 2021-02-04 株式会社日本スペリア社 Brasure de préforme et corps lié par soudure formé à l'aide de ladite brasure de préforme
JP7412532B2 (ja) * 2020-03-06 2024-01-12 三菱電機株式会社 薄板状接合部材の製造方法、半導体装置の製造方法、ならびに、電力変換装置の製造方法
CN116970949A (zh) * 2023-09-21 2023-10-31 航天泰心科技有限公司 一种金属零件间金属化合物层的制备方法

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CN1197996A (zh) * 1997-04-25 1998-11-04 株式会社东芝 焊料合金及其用途
US6680528B2 (en) * 1999-02-05 2004-01-20 Matsushita Electric Industrial Co., Ltd. Electronic component and electronic equipment using the same
US6758387B1 (en) * 1999-10-20 2004-07-06 Senju Metal Industry Co., Ltd. Solder coated material and method for its manufacture

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Publication number Publication date
KR20090046954A (ko) 2009-05-11
KR101004589B1 (ko) 2010-12-29
WO2008026761A1 (fr) 2008-03-06
JPWO2008026761A1 (ja) 2010-01-21
CN101529583A (zh) 2009-09-09
US20100291399A1 (en) 2010-11-18
JP5045673B2 (ja) 2012-10-10

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