CN101496189B - 照明装置 - Google Patents

照明装置 Download PDF

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Publication number
CN101496189B
CN101496189B CN200780028740.4A CN200780028740A CN101496189B CN 101496189 B CN101496189 B CN 101496189B CN 200780028740 A CN200780028740 A CN 200780028740A CN 101496189 B CN101496189 B CN 101496189B
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CN
China
Prior art keywords
radiation
lighting device
reflector
semiconductor chip
shaped element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN200780028740.4A
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English (en)
Chinese (zh)
Other versions
CN101496189A (zh
Inventor
M·万宁格
M·泽勒
H·奥特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN101496189A publication Critical patent/CN101496189A/zh
Application granted granted Critical
Publication of CN101496189B publication Critical patent/CN101496189B/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • G02B3/04—Simple or compound lenses with non-spherical faces with continuous faces that are rotationally symmetrical but deviate from a true sphere, e.g. so called "aspheric" lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
  • Led Devices (AREA)
CN200780028740.4A 2006-07-31 2007-07-27 照明装置 Active CN101496189B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006035635.7 2006-07-31
DE102006035635A DE102006035635A1 (de) 2006-07-31 2006-07-31 Beleuchtungsanordnung
PCT/DE2007/001348 WO2008014771A1 (de) 2006-07-31 2007-07-27 Beleuchtungsanordnung

Publications (2)

Publication Number Publication Date
CN101496189A CN101496189A (zh) 2009-07-29
CN101496189B true CN101496189B (zh) 2014-06-18

Family

ID=38692073

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200780028740.4A Active CN101496189B (zh) 2006-07-31 2007-07-27 照明装置

Country Status (8)

Country Link
US (1) US8585252B2 (enExample)
EP (1) EP2047526B1 (enExample)
JP (2) JP5675101B2 (enExample)
KR (1) KR101314414B1 (enExample)
CN (1) CN101496189B (enExample)
DE (1) DE102006035635A1 (enExample)
TW (1) TWI396309B (enExample)
WO (1) WO2008014771A1 (enExample)

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US8083380B2 (en) * 2009-04-17 2011-12-27 Mig Technology Inc. Integrated structure for optical refractor
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JP5263788B2 (ja) * 2009-10-22 2013-08-14 シャープ株式会社 表示装置
CN102054920A (zh) * 2009-10-27 2011-05-11 展晶科技(深圳)有限公司 发光二极管封装结构
TWI422074B (zh) * 2010-01-07 2014-01-01 首爾半導體股份有限公司 非球面ｌｅｄ鏡片以及含有此鏡片的發光元件
US20110273892A1 (en) * 2010-05-07 2011-11-10 Tyco Electronics Corporation Solid state lighting assembly
CN104154463A (zh) * 2010-09-27 2014-11-19 北京京东方光电科技有限公司 发光二极管光源及其制造方法、具有其的背光源
DE102010048162A1 (de) 2010-10-11 2012-04-12 Osram Opto Semiconductors Gmbh Konversionsbauteil
CN103502872B (zh) 2011-05-05 2016-09-14 皇家飞利浦有限公司 用于形成光束的光学器件
KR101978634B1 (ko) * 2012-07-27 2019-05-15 엘지이노텍 주식회사 조명기기
CN104235754B (zh) * 2013-06-20 2019-06-18 欧司朗有限公司 用于照明装置的透镜和具有该透镜的照明装置
TW201508220A (zh) * 2013-08-27 2015-03-01 Hon Hai Prec Ind Co Ltd 發光二極體模組
JP6323020B2 (ja) 2014-01-20 2018-05-16 セイコーエプソン株式会社 光源装置およびプロジェクター
JP6374723B2 (ja) 2014-07-25 2018-08-15 スタンレー電気株式会社 半導体発光装置
DE102015101216A1 (de) * 2015-01-28 2016-07-28 Osram Opto Semiconductors Gmbh Optoelektronische Anordnung mit Strahlungskonversionselement und Verfahren zur Herstellung eines Strahlungskonversionselements
USD779112S1 (en) 2015-04-24 2017-02-14 Abl Ip Holding Llc Tri-lobe light fixture optic
US10393341B2 (en) 2015-04-24 2019-08-27 Abl Ip Holding Llc Tri-lobe optic and associated light fixtures
DE102015112042B4 (de) 2015-07-23 2021-07-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Leuchtvorrichtung
US10466533B2 (en) * 2015-10-07 2019-11-05 Enplas Corporation Light flux control member, light-emitting device, surface light source device and display device
JP6110528B2 (ja) * 2016-02-03 2017-04-05 京セラコネクタプロダクツ株式会社 半導体発光素子用ホルダ、及び、半導体発光素子モジュール
US11128100B2 (en) 2017-02-08 2021-09-21 Princeton Optronics, Inc. VCSEL illuminator package including an optical structure integrated in the encapsulant
US10738985B2 (en) 2018-06-12 2020-08-11 Stmicroelectronics (Research & Development) Limited Housing for light source
CN210118715U (zh) 2018-06-12 2020-02-28 意法半导体(格勒诺布尔2)公司 用于安装在基板上的光源的壳体和电子设备
US10865962B2 (en) * 2018-06-12 2020-12-15 Stmicroelectronics (Grenoble 2) Sas Protection mechanism for light source
FR3085465B1 (fr) 2018-08-31 2021-05-21 St Microelectronics Grenoble 2 Mecanisme de protection pour source lumineuse
CN210153731U (zh) 2018-06-12 2020-03-17 意法半导体(格勒诺布尔2)公司 安装在基板上的光源的外壳以及电子设备
DE102020121656A1 (de) * 2020-08-18 2022-02-24 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement
KR102543767B1 (ko) * 2020-11-26 2023-06-16 주식회사 사이언 야시조명계통용 발광다이오드
KR102733081B1 (ko) * 2021-09-17 2024-11-25 주식회사 사이언 야시조명계통용 led 패키지 및 그 제조 방법

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CN1693969A (zh) * 2004-04-29 2005-11-09 Lg.菲利浦Lcd株式会社 发光二极管灯单元

Also Published As

Publication number Publication date
US20100073907A1 (en) 2010-03-25
US8585252B2 (en) 2013-11-19
CN101496189A (zh) 2009-07-29
EP2047526B1 (de) 2018-07-25
JP6141248B2 (ja) 2017-06-07
KR101314414B1 (ko) 2013-10-04
JP5675101B2 (ja) 2015-02-25
KR20090034966A (ko) 2009-04-08
TW200814376A (en) 2008-03-16
WO2008014771A1 (de) 2008-02-07
JP2015015260A (ja) 2015-01-22
TWI396309B (zh) 2013-05-11
DE102006035635A1 (de) 2008-02-07
EP2047526A1 (de) 2009-04-15
JP2009545864A (ja) 2009-12-24

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