CN101419409B - Exposure device and rectification device of baseal plate - Google Patents
Exposure device and rectification device of baseal plate Download PDFInfo
- Publication number
- CN101419409B CN101419409B CN2008101680238A CN200810168023A CN101419409B CN 101419409 B CN101419409 B CN 101419409B CN 2008101680238 A CN2008101680238 A CN 2008101680238A CN 200810168023 A CN200810168023 A CN 200810168023A CN 101419409 B CN101419409 B CN 101419409B
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- Prior art keywords
- substrate
- mentioned
- worktable
- exposure
- confined space
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0508—Flood exposure
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention provides an exposure device and a correction device of a base plate, characterized in that the exposure device may correct the base plate. A sealing piece (3) is exerted with positive pressure to stretch such that it is contacted with an exposure worktable (1) so as to generate a sealed space (90); the sealed space (90) is sucked by a vacuum sucking hole (40) and a vacuum pump (4); a plate (20) is pressed by atmospheric pressure; a base plate (99) is exerted with loads by the plate (20) and the exposure worktable (1) so as to correct the base plate (99). The vacuum pump (4) is stopped, the sealing piece (3) is shrank, a handling device (2) is withdrawn to a carrying-in conveyer (53), and exposure is them executed if the base plate of a sucking pump (11) is provided with an adsorptive pressure reaching a predetermined set value.
Description
Technical field
The present invention relates to the apparatus for correcting of a kind of exposure device and substrate.
Background technology
In the exposure device of making printed base plate, adopted such structure: will also be aspirated on the exposure worktable that is fixed on location use by the substrate-placing that the base board delivery device conveyance comes and expose.
Patent documentation 1: TOHKEMY 2005-370037
But the substrate that printed wiring is used and semiconductor wafer etc. are compared, and the substrates distortion such as warpage and deformation easily occur, and deflection is also very large, can produce the gap between substrate and exposure worktable, its result is leaked for producing suction, has absorption not exclusively or hard problem.
Summary of the invention
The object of the invention is to solve the problem of above-mentioned prior art.
In order to achieve the above object, exposure device of the present invention is characterised in that, it comprises: exposure worktable, the substrate that its mounting printed wiring is used; Carrying device, its with substrate transferring to above-mentioned exposure worktable; Liftable plate, it is arranged at above-mentioned carrying device, is used for aforesaid substrate is pressed against correcting the distortion substrate on above-mentioned exposure worktable; Packoff, it seals the space between above-mentioned exposure worktable and plate, to form confined space; And aspirator, it aspirates the confined space that utilizes above-mentioned packoff to form, and makes this confined space become negative pressure, and above-mentioned plate relies on the negative pressure of above-mentioned confined space and descends, and aforesaid substrate is pressed against on above-mentioned exposure worktable, thereby corrects substrate.
In addition, the apparatus for correcting of substrate of the present invention is characterised in that, it comprises: worktable, and it loads substrate; Carrying device, its with substrate transferring to above-mentioned worktable; Liftable plate, it is arranged at above-mentioned carrying device, is used for aforesaid substrate is pressed against correcting the distortion substrate on above-mentioned worktable; Packoff, it seals the space between above-mentioned worktable and plate, to form confined space; And aspirator, it aspirates the confined space that utilizes above-mentioned packoff to form, and makes this confined space become negative pressure, and above-mentioned plate relies on the negative pressure of above-mentioned confined space and descends, and aforesaid substrate is pressed against on above-mentioned worktable, thereby corrects substrate.
According to exposure device of the present invention and apparatus for correcting, owing to generating confined space and being close to through plate by vacuum, substrate is pressed against on worktable, so can apply powerful load, can also correct substrate because be slab and have the distortion of powerful reacting force.Therefore, in exposure device, the leakage in the time of can preventing substrate adsorption can be carried out high efficiency exposure.
And, apply large load without the need for large-scale device, miniaturization that can implement device.
Has in addition following texts: as long as make the size of plate consistent with the substrate size of the maximum of application, can irrespectively sandwich reliably substrate (edge part that comprises substrate) with substrate size, can apply to the whole face of substrate impartial load.
Description of drawings
Fig. 1 means the schematic diagram of an embodiment of the invention.
Fig. 2 means the key diagram of the action of an embodiment of the invention.
Fig. 3 means the process flow diagram of the action of an embodiment of the invention.
Label declaration
1: exposure worktable; 2: carrying device; 3: seal (packing); 4: vacuum pump; 5: control device; 10: SS; 11: suction pump; 12: pressure transducer; 20: plate; 21: keep SS; 22: keep suction pump; 25: the lifting guiding piece; 30: vacuum pump; 31: seal pump (packing pump); 40: vacuum holes; 50: light source; 51: mask; 52: projecting lens; 53: move into conveyor; 54: take out of conveyor; 90: confined space; 99: substrate.
Embodiment
The embodiment of the exposure device that printed circuit board of the present invention is used below is described with reference to the accompanying drawings.
In Fig. 1, exposure worktable 1 mounting is exposed by light source 50, mask 51 and 52 pairs of these substrates 99 of projecting lens as the substrate 99 object, that printed wiring is used that is exposed that should expose.Exposure worktable 1 can move on the XYZ direction by drive unit (not shown), and can rotate on the θ direction.
Be provided with SS 10 on exposure worktable 1, aspirate substrate 99 by suction pump 11 and be fixed thereby constitute.Be provided with pressure transducer 12 in suction pump 11, thereby can detect swabbing pressure, detect suction and whether normally carry out.
Approaching side at exposure worktable 1 is provided with carrying device 2, and carrying device 2 constitutes and will be positioned on exposure worktable 1 from the substrate 99 that last operation conveyance comes by moving into conveyor 53.
Carrying device 2 has plate 20, this plate 20 by lifting guiding piece 25 remain can be on above-below direction free lifting.Be provided with maintenance SS 21 on plate 20, by keeping suction pump 22 suction substrates 99, thereby constitute, substrate 99 suspended in midair maintenance.
Plate 20 around be provided with seal 3, seal 3 contacts with exposure worktable 1, thus can and exposure worktable 1 and SS 10 between formation confined space 90.
Seal 3 can be flexible by seal pump 31, and when being filled with air in seal 3, seal 3 swells, and plays a role as seal.
On the plate 20 of carrying device 2, further be provided with vacuum holes 40 in the inboard of seal 3, this vacuum holes 40 is communicated to vacuum pump 4.Constitute: can aspirate above-mentioned confined space 90 by the suction of this vacuum pump 4, make the internal pressure of confined space 90 drop to state near vacuum.
In addition, 2 ' be the carrying device of taking out of use, the 54th, take out of conveyor.
5 pairs of exposure device integral body of control device are controlled, and above-mentioned exposure worktable 1, maintenance suction pump 22, seal pump 31, vacuum pump 4, suction pump 11 are also controlled by control device 5.
According to Fig. 2, action is described.
Carrying device 2 receives substrates 99 from moving into conveyor 53, by keeping SS 21 and keep suction pump 22 to aspirate maintenance, with substrate 99 conveyances to exposure worktable 1.(a)
Then, exposure worktable 1 rises in order to receive substrate 99, behind the position on top, carries out substrate adsorption by SS 10 and suction pump 11 suction substrates 99 on this exposure worktable 1 rises to plate 20.From keeping suction pump 22 air-blowing, remove the maintenance of 2 pairs of substrates 99 of carrying device simultaneously.(b)
In the situation that distortion has occured in substrate 99, the gap appears between substrate 99 and exposure worktable 1, and the substrate adsorption pressure of the suction of suction pump 11 can not raise.Control device 5 detects this situation according to the detection signal from pressure transducer 12, seal 3 is applied malleation make its stretching, extension, and seal 3 is contacted with exposure worktable 1, thereby generates confined space 90.(c)
Then, make to keep suction pump 22 to stop air-blowing, aspirate by vacuum holes 40 and 4 pairs of confined spaces 90 of vacuum pump, make to be the state near vacuum in confined space 90.Plate 20 can by lifting guiding piece 25 free lifting on above-below direction, so plate 20 is pressed by atmospheric pressure, by plate 20 and 1 pair of substrate 99 imposed load of exposure worktable, thereby be corrected substrate 99.(d)
Because substrate 99 has been applied in large load by means of vacuum pressure, so can effectively correct distortion.
After the distortion of having corrected substrate 99, having eliminated leakage, the substrate adsorption that utilizes suction pump 11 to carry out is normally carried out.If the adsorptive pressure from pressure transducer 12 has reached predetermined setting value, stop vacuum pump 4, seal 3 is shunk, make confined space 90 open, and exposure worktable 1 is descended.Then, carrying device 2 is returned to move into conveyor 53 tops.Then carry out position alignment etc., carry out exposure.(e)
Next the action of control device 5 is described according to Fig. 3.
When carrying device 2 with substrate 99 conveyances to exposure worktable 1 and when loading on exposure worktable 1 (step S1), make suction pump 11 work, suction substrate 99 carries out substrate adsorption (step S2).Inspection, is judged as absorption and normally carries out if more than or equal to predetermined value from the detected pressures of pressure transducer 12, jumps to step S7 and carries out exposure actions (step S3).In the situation that detected pressures does not reach predetermined value, being judged as absorption does not normally carry out, make 31 work of seal pump, apply malleation to seal 3 and make its expansion, thereby generate confined space 90 (step S4), by 20 pairs of substrate 99 imposed loads of plate to correct substrate 99 (step S5).If substrate 99 is corrected, is normally adsorbed and reached predetermined setting value (step S6) from the detected pressures of pressure transducer 12, vacuum pump 4 is stopped, and carrying device 2 is return, then carry out exposure-processed (step S7).
In addition, above the situation that will the invention provides to exposure device is illustrated, but the apparatus for correcting that also can be used as the distortion of correcting substrate 99 is realized.
Claims (3)
1. the exposure device of a substrate, the exposure device of this substrate are to make the substrate contacts that photomask do not use with printed wiring and the contactless exposure device that exposes is characterized in that,
The exposure device of this substrate comprises:
Exposure worktable, the substrate that its mounting printed wiring is used;
Carrying device, its with substrate transferring to above-mentioned exposure worktable;
Liftable plate, it is arranged at above-mentioned carrying device, is used for aforesaid substrate is pressed against correcting the distortion substrate on above-mentioned exposure worktable;
Packoff, it seals the space between above-mentioned exposure worktable and plate, to form confined space;
The confined space aspirator, it aspirates the confined space that utilizes above-mentioned packoff to form, and makes this confined space become negative pressure;
The substrate suction pump, it is arranged on above-mentioned exposure worktable, the substrate that loads is aspirated, thereby carry out substrate adsorption;
Pressure transducer, its adsorptive pressure to described substrate detects; And
Control device, its by the detected adsorptive pressure of above-mentioned pressure transducer when predetermined value is following, form above-mentioned confined space and make this confined space become negative pressure, thereby above-mentioned liftable plate is descended, aforesaid substrate is pressed against on above-mentioned exposure worktable, thereby corrects substrate
, after perhaps correcting described substrate, described carrying device and described liftable plate are kept out of the way, thereby exposed when predetermined value is above at described adsorptive pressure.
2. exposure device according to claim 1, is characterized in that,
Be provided with on above-mentioned liftable plate for the maintenance aspirator that keeps substrate,
Above-mentioned carrying device remains on substrate the conveyance of carrying out substrate on above-mentioned maintenance aspirator.
3. the apparatus for correcting of a substrate, the apparatus for correcting of this substrate are arranged at and make the substrate contacts that photomask do not use with printed wiring and the contactless exposure device that exposes is characterized in that,
The apparatus for correcting of this substrate comprises:
Worktable, it loads substrate;
Carrying device, its with substrate transferring to above-mentioned worktable;
Liftable plate, it is arranged at above-mentioned carrying device, is used for aforesaid substrate is pressed against correcting the distortion substrate on above-mentioned worktable;
Packoff, it seals the space between above-mentioned worktable and plate, to form confined space;
The confined space aspirator, it aspirates the confined space that utilizes above-mentioned packoff to form, and makes this confined space become negative pressure;
The substrate suction pump, it is arranged on above-mentioned worktable, the substrate that loads is aspirated, thereby carry out substrate adsorption;
Pressure transducer, its adsorptive pressure to described substrate detects; And
Control device, its by the detected adsorptive pressure of above-mentioned pressure transducer when predetermined value is following, form above-mentioned confined space and make this confined space become negative pressure, thereby above-mentioned liftable plate is descended, aforesaid substrate is pressed against on above-mentioned worktable, thereby corrects substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-278850 | 2007-10-26 | ||
| JP2007278850 | 2007-10-26 | ||
| JP2007278850A JP4949195B2 (en) | 2007-10-26 | 2007-10-26 | Exposure apparatus and substrate correction apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101419409A CN101419409A (en) | 2009-04-29 |
| CN101419409B true CN101419409B (en) | 2013-06-05 |
Family
ID=40630242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101680238A Active CN101419409B (en) | 2007-10-26 | 2008-09-25 | Exposure device and rectification device of baseal plate |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4949195B2 (en) |
| KR (1) | KR101450908B1 (en) |
| CN (1) | CN101419409B (en) |
| TW (1) | TWI427441B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102607772A (en) * | 2012-03-06 | 2012-07-25 | 常熟金像电子有限公司 | Testing method for marginal adaptation of exposure table of exposure machine |
| JP6663252B2 (en) * | 2016-03-01 | 2020-03-11 | 株式会社アドテックエンジニアリング | Exposure equipment for printed circuit boards |
| JP6774714B2 (en) | 2016-07-25 | 2020-10-28 | 株式会社アドテックエンジニアリング | Work stage and exposure equipment |
| JP6840223B2 (en) * | 2017-03-07 | 2021-03-10 | ヤマハ発動機株式会社 | How to hold the component mounting device and board |
| CN109571892A (en) * | 2018-11-23 | 2019-04-05 | 东方电气集团东方汽轮机有限公司 | A kind of cooling mould of injection moulding workpiece and cooling means |
| JP6789368B2 (en) * | 2019-12-25 | 2020-11-25 | 株式会社アドテックエンジニアリング | Exposure equipment for printed circuit boards |
| JP7456399B2 (en) * | 2021-02-12 | 2024-03-27 | 株式会社村田製作所 | Sheet conveying device |
| CN114265287A (en) * | 2022-02-07 | 2022-04-01 | 广东科视光学技术股份有限公司 | Single-side digital photoetching system |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1461975A (en) * | 2002-05-29 | 2003-12-17 | 三荣技研股份有限公司 | Exposure method and exposure device |
| CN1470940A (en) * | 2002-06-21 | 2004-01-28 | 株式会社阿迪泰克工程 | Close-connected exposure device |
| CN1987655A (en) * | 2005-12-22 | 2007-06-27 | 株式会社阿迪泰克工程 | Exposure device of closing type |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2685811B2 (en) * | 1988-06-10 | 1997-12-03 | 株式会社東芝 | Shadow mask exposure method and exposure apparatus thereof |
| JP2810909B2 (en) * | 1994-02-28 | 1998-10-15 | セイコープレシジョン株式会社 | Exposure equipment |
| JP4249869B2 (en) * | 1999-12-22 | 2009-04-08 | 株式会社オーク製作所 | Substrate transfer device |
| JP4420507B2 (en) * | 2000-01-24 | 2010-02-24 | 株式会社オーク製作所 | Substrate exposure method and apparatus |
| JP4594541B2 (en) * | 2001-03-09 | 2010-12-08 | 株式会社オーク製作所 | Substrate exposure apparatus and method of using the same |
| JP4407333B2 (en) * | 2004-03-23 | 2010-02-03 | ウシオ電機株式会社 | Strip workpiece exposure system |
| JP2006039398A (en) * | 2004-07-29 | 2006-02-09 | Fuji Photo Film Co Ltd | Exposure apparatus for original printing plate |
-
2007
- 2007-10-26 JP JP2007278850A patent/JP4949195B2/en active Active
-
2008
- 2008-09-10 KR KR1020080089216A patent/KR101450908B1/en active IP Right Grant
- 2008-09-19 TW TW097135948A patent/TWI427441B/en active
- 2008-09-25 CN CN2008101680238A patent/CN101419409B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1461975A (en) * | 2002-05-29 | 2003-12-17 | 三荣技研股份有限公司 | Exposure method and exposure device |
| CN1470940A (en) * | 2002-06-21 | 2004-01-28 | 株式会社阿迪泰克工程 | Close-connected exposure device |
| CN1987655A (en) * | 2005-12-22 | 2007-06-27 | 株式会社阿迪泰克工程 | Exposure device of closing type |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI427441B (en) | 2014-02-21 |
| TW200919123A (en) | 2009-05-01 |
| JP4949195B2 (en) | 2012-06-06 |
| KR101450908B1 (en) | 2014-10-14 |
| JP2009109553A (en) | 2009-05-21 |
| KR20090042710A (en) | 2009-04-30 |
| CN101419409A (en) | 2009-04-29 |
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