JP2013167712A - Substrate bonding device, and substrate bonding method - Google Patents

Substrate bonding device, and substrate bonding method Download PDF

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Publication number
JP2013167712A
JP2013167712A JP2012030206A JP2012030206A JP2013167712A JP 2013167712 A JP2013167712 A JP 2013167712A JP 2012030206 A JP2012030206 A JP 2012030206A JP 2012030206 A JP2012030206 A JP 2012030206A JP 2013167712 A JP2013167712 A JP 2013167712A
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Japan
Prior art keywords
substrate
bonding
display
display substrate
cover
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JP2012030206A
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Japanese (ja)
Inventor
Fujio Yamazaki
不二夫 山崎
Fumio Kataoka
文雄 片岡
Masatoshi Muneto
正利 宗藤
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Hitachi High-Technologies Corp
株式会社日立ハイテクノロジーズ
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Priority to JP2012030206A priority Critical patent/JP2013167712A/en
Publication of JP2013167712A publication Critical patent/JP2013167712A/en
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Abstract

The present invention provides a substrate bonding apparatus and a substrate bonding method capable of reducing manufacturing time and bonding substrates with high accuracy.
In a bonding apparatus 1, the relative positions of a display substrate 101 and a substrate 121 with a touch sensor in a vacuum container 20 are detected by imaging units 27A and 27B. Then, based on the detection results of the imaging units 27A and 27B, the substrate holding unit 25 and the substrate support bases 35A and 35B are relatively moved, and the substrates 101 and 121 are positioned and bonded together. Next, the relative positions of the bonded substrates 101 and 121 are detected by the imaging units 27A and 27B, and the relative positions of the substrates 101 and 121 are adjusted based on the detection results. Thereafter, the temporary fixing light source 28 irradiates ultraviolet rays to a plurality of portions of the ultraviolet curable resin interposed between the substrates 101 and 102.
[Selection] Figure 8

Description

  The present invention relates to a substrate bonding apparatus and a substrate bonding method for bonding a display substrate such as a liquid crystal module (LCM) or an organic light emitting diode (OLED) module to a cover substrate such as a substrate with a touch sensor or a protective substrate. Is.

  The display unit of the display device is provided with a cover substrate such as a substrate with a touch sensor and a protective substrate on a polarizing plate provided on a display substrate such as a liquid crystal module or an organic light emitting diode module. In recent years, such a display unit is produced through a process of attaching a cover substrate to a display substrate. Moreover, as a joining material used when bonding both substrates together, it has shifted from a double-sided tape to an optical transparent double-sided tape (OCA tape) and a UV curable resin.

  The step of attaching the cover substrate to the display substrate is performed in a vacuum environment in order to prevent bubbles from entering between the substrates. Patent Document 1 discloses a method for manufacturing a display device in which a drive panel and a sealing panel are bonded together in a vacuum container. A manufacturing apparatus that performs the manufacturing method disclosed in Patent Document 1 includes a vacuum container that can be evacuated. The vacuum vessel includes a base that supports the driving panel, a moving mechanism that supports the sealing panel and moves it relative to the driving panel, and a UV curable resin between the driving panel and the sealing panel. A pressurizing member for interposing and contacting is provided.

  In the method for manufacturing a display device disclosed in Patent Document 1, after the drive panel and the sealing panel are bonded together in a vacuum, the vacuum in the vacuum vessel is released. And the drive panel and sealing panel which were bonded together are taken out from a vacuum vessel, and a driving panel and a sealing panel are correctly aligned in an alignment apparatus. Thereafter, the adhesive resin for temporary fixing is cured by ultraviolet irradiation or the like, and the accurate positional relationship between the aligned driving panel and the sealing panel is fixed.

JP 2005-243413 A

  However, in the method for manufacturing a display device disclosed in Patent Document 1, when the drive panel and the sealing panel are bonded together in the vacuum vessel, the drive panel and the sealing panel may be relatively displaced.

  Moreover, in the manufacturing method of the display device disclosed in Patent Document 1, the drive panel and the sealing panel before being temporarily fixed are taken out of the vacuum container. At this time, the relative positions of the drive panel and the sealing panel are There is a risk of a significant shift. As a result, the time required for accurately aligning the drive panel and the sealing panel taken out of the vacuum container with the alignment device becomes long, and shortening of the manufacturing time is hindered.

  In order to prevent the relative positions of the two from deviating significantly, it is necessary to set the transport speed of the drive panel and the sealing panel before temporary fixing to be low. However, if the conveyance speed is set to be slow, shortening of the manufacturing time is hindered.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate bonding apparatus and a substrate bonding method capable of shortening manufacturing time and performing substrate bonding with high accuracy in consideration of the actual situation in the prior art. There is to do.

In order to solve the above problems and achieve the object of the present invention, a substrate bonding apparatus of the present invention includes a vacuum vessel, a substrate holding unit, a substrate support, an imaging unit, a drive control unit, and temporary fixing. A light source.
The substrate holding unit is disposed in the vacuum container and holds the cover substrate or the display substrate.
The substrate support is disposed in the vacuum vessel and supports the display substrate or the cover substrate coated with the ultraviolet curable resin.
The imaging unit is at least partially disposed in the vacuum container and detects the relative positions of the display substrate and the cover substrate held on the substrate support and the substrate holding unit.
The drive control unit moves the substrate holding unit and the substrate support base relative to each other based on the detection result of the imaging unit and relatively positions the display substrate and the cover substrate, and evacuates the vacuum container. Control. Further, based on the control result of bonding the display substrate and the cover substrate by relatively moving the substrate holding unit and the substrate support base, and the detection result of the relative position of the display substrate and the cover substrate after being bonded, Control for adjusting the relative positions of the display substrate and the cover substrate is performed.
The light source for temporary fixing is disposed in a vacuum vessel and is applied to a plurality of locations of uncured ultraviolet curable resin interposed between the display substrate and the cover substrate, the relative positions of which are adjusted after being bonded to each other. Irradiate ultraviolet rays.

The substrate bonding method of the present invention is a substrate bonding method using the substrate bonding apparatus of the present invention, and is performed, for example, by the following procedure. First, a substrate support placed in a vacuum vessel supports a display substrate or cover substrate coated with an ultraviolet curable resin. In addition, a substrate holding unit arranged in the vacuum container holds the cover substrate or the display substrate.
Next, the imaging unit at least a part of which is disposed in the vacuum vessel detects the relative positions of the display substrate and the cover substrate held by the substrate holding unit and the substrate support.
Subsequently, based on the detection result of the imaging unit, the substrate holding unit and the substrate support base move relatively to position the display substrate and the cover substrate relatively.
Next, the inside of the vacuum vessel is evacuated. This deaeration may be performed while the relative position between the display substrate and the cover substrate is detected, or while the display substrate and the cover substrate are relatively positioned.
Thereafter, the substrate holding part and the substrate support are moved relative to each other, and the display substrate and the cover substrate are bonded together.
Then, the imaging unit detects a relative position between the display substrate and the cover substrate after being bonded.
Next, based on the detection result detected by the imaging unit after the display substrate and the cover substrate are bonded together, the substrate holding unit and the substrate support base move relatively, and the relative relationship between the bonded display substrate and the cover substrate is determined. The correct position.
Subsequently, the temporary fixing light source disposed in the vacuum vessel is applied to a plurality of positions of the uncured ultraviolet curable resin interposed between the display substrate and the cover substrate after the relative position adjustment is completed. Irradiate ultraviolet rays.

  In the substrate bonding apparatus and the substrate bonding method of the present invention, the relative positions of the display substrate and the cover substrate after the imaging unit is bonded are detected, and the bonded display substrates are based on the detection result. And the relative position of the cover substrate are adjusted. Accordingly, even when the display substrate and the cover substrate are bonded to each other, even if the two are relatively displaced, the displacement can be corrected. In addition, when the display substrate and the cover substrate are bonded together, if the two are not relatively displaced or if the relative displacement between the two is within an allowable range, it is necessary to adjust the relative positions of the two. There is no.

  In the substrate bonding apparatus and the substrate bonding method of the present invention, the temporary fixing light source is interposed between the display substrate and the cover substrate after adjusting the relative positions of the display substrate and the cover substrate. Ultraviolet rays are irradiated to a plurality of locations of the uncured ultraviolet curable resin. Thereby, since the display substrate and the cover substrate are temporarily fixed, even if the subsequent transfer speed of the display substrate and the cover substrate is set to be high, the both do not shift. Therefore, the manufacturing time can be shortened, and the display substrate and the cover substrate can be bonded with high accuracy.

  According to the substrate bonding apparatus and the substrate bonding method of the present invention, the manufacturing time can be shortened, and the substrates can be bonded with high accuracy.

It is explanatory drawing which shows schematic structure of the display substrate which is one board | substrate bonded by the bonding apparatus of the board | substrate of this invention. It is explanatory drawing which shows schematic structure of the cover board | substrate which is the other board | substrate bonded by the bonding apparatus of the board | substrate of this invention. It is sectional drawing which shows schematic structure of one Embodiment of the bonding apparatus of the board | substrate of this invention. It is a block diagram which shows the control system of one Embodiment of the bonding apparatus of the board | substrate of this invention. It is explanatory drawing which shows the state which mounted the display board | substrate on the board | substrate support stand in one Embodiment of the bonding apparatus of the board | substrate of this invention. It is explanatory drawing which shows the state which supplied the cover board | substrate to the board | substrate delivery part in one Embodiment of the bonding apparatus of the board | substrate of this invention. It is explanatory drawing which shows the state which the board | substrate delivery part in one Embodiment of the board | substrate bonding apparatus of this invention raises, and passes a cover board | substrate to a board | substrate holding part. It is explanatory drawing which shows the state in which the board | substrate holding part in one Embodiment of the board | substrate bonding apparatus of this invention hold | maintained the cover board | substrate. It is explanatory drawing which shows the state which the movable stand raised in one Embodiment of the bonding apparatus of the board | substrate of this invention, and formed the vacuum chamber for bonding. It is explanatory drawing which shows the state which the board | substrate holding part in one Embodiment of the board | substrate bonding apparatus of this invention descend | falls, and the cover board | substrate and the display board were bonded together. It is explanatory drawing which shows the state which the board | substrate holding part in one Embodiment of the board | substrate bonding apparatus of this invention lifted | released holding | maintenance of a cover board | substrate. It is explanatory drawing which shows the state which the movable stand descend | falls in one Embodiment of the bonding apparatus of the board | substrate of this invention, and opened the vacuum chamber for bonding. It is explanatory drawing which shows the state which the upper member in one Embodiment of the board | substrate bonding apparatus of this invention moved with respect to the lower member, and opened the vacuum vessel.

  Hereinafter, embodiments for implementing a substrate bonding apparatus and a substrate bonding method will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the common member in each figure.

[Display board]
First, the display substrate will be described with reference to FIG.
FIG. 1 is an explanatory diagram showing a schematic configuration of a display substrate which is one substrate to be bonded by a substrate bonding apparatus.

As shown in FIG. 1, the display substrate 101 is, for example, a liquid crystal module (LCM), a substrate body 102 in which liquid crystal is used, and a frame 103 that houses one surface of the substrate body 102 with the surface exposed. A polarizing plate 104 attached to one surface of the substrate body 102 is provided.
The display substrate according to the present invention may be an organic light emitting diode (OLED) module or other display module.

  The substrate body 102 is formed in a rectangular plate shape, and one surface serves as a display surface. An alignment mark 105 is formed on one short side of the substrate body 102. The alignment mark 105 is used to detect the position of the display substrate 101 when a component is mounted on the peripheral edge of the display substrate 101.

The frame 103 covers the four sides of the substrate body 102 and the other surface of the substrate body 102.
The polarizing plate 104 is formed in a rectangular shape and has a smaller outer contour than the substrate body 102. That is, the contour of the outer periphery of the polarizing plate 104 is formed to have a size approximately equal to the display area of the substrate body 102. The polarizing plate 104 side of the display substrate 101 is attached to a substrate 121 with a touch sensor to be described later via an ultraviolet curable resin.

[Cover substrate]
Next, a substrate 121 with a touch sensor showing a specific example of a cover substrate will be described with reference to FIG.
FIG. 2 is an explanatory diagram showing a schematic configuration of the substrate 121 with a touch sensor.

  As shown in FIG. 2, the substrate 121 with a touch sensor includes a substrate body 122 and a black matrix (BM) 123 provided on one surface of the substrate body 122. The substrate body 122 is formed in a rectangular plate shape. The contour of the outer periphery of the substrate 121 with the touch sensor is formed to have a size substantially equal to the contour of the outer periphery of the frame 103 in the display substrate 101.

  The black matrix 123 is formed in a rectangular frame shape. The outer peripheral contour of the black matrix 123 is substantially equal to the outer peripheral contour of the substrate body 122, and the inner peripheral contour is substantially equal to the outer peripheral contour of the polarizing plate 104 in the display substrate 101. The black matrix 123 is formed, for example, by sputtering metal chromium on one surface of the substrate body 122 and removing unnecessary portions by etching.

  Note that the cover substrate according to the present invention is not limited to the substrate 121 with a touch sensor, and may be a protective substrate formed of a glass material, for example.

[Board bonding equipment]
Next, an embodiment of the substrate bonding apparatus of the present invention will be described with reference to FIG.
FIG. 3 is a cross-sectional view showing a schematic configuration of one embodiment of the substrate bonding apparatus of the present invention.

As shown in FIG. 3, the substrate bonding apparatus 1 includes an upper member 6 and a lower member 7. The upper member 6 and the lower member 7 are in contact with each other to form a vacuum container 20 having a sealed internal space (vacuum chamber 20a).
The upper member 6 is formed in a hollow rectangular parallelepiped shape having an open lower portion, and has an upper lid portion 21 formed in a rectangular plate shape and a peripheral wall portion 22 that extends downward continuously from the four sides of the upper lid portion. ing.

Here, a direction in which two wall pieces of the peripheral wall portion 22 face each other is a first direction X, and a direction in which the remaining two wall pieces face each other is a second direction Y. A vertical direction in which the upper member 6 and the lower member 7 face each other is a third direction Z. The first direction X and the second direction Y are parallel to a horizontal plane orthogonal to the third direction Z and are orthogonal to each other.
The upper member 6 is moved in the first direction X and the third direction Z by the upper member moving mechanism 29 (see FIG. 4).

The peripheral wall portion 22 of the upper member 6 is formed in a rectangular frame shape, and the tip portion becomes the lower end of the upper member 6. A seal member (not shown) is attached to the distal end portion of the peripheral wall portion 22. The seal member comes into contact with and closely contacts the lower member 7, and seals between the distal end portion of the peripheral wall portion 22 and the lower member 7. Further, the seal member comes into contact with and comes into close contact with a movable table 37 to be described later, and seals between the distal end portion of the peripheral wall portion 22 and the movable table 37.
As a material of the seal member, for example, a rubber member such as natural rubber, isoprene rubber, silicone rubber, urethane rubber can be applied.

  The upper cover portion 21 of the upper member 6 is formed with an exhaust port 23 for degassing a bonding vacuum chamber 20b (see FIG. 9) described later. One end of an exhaust pipe (not shown) is connected to the exhaust port 23. The other end of the exhaust pipe is connected to a vacuum pump 46 (see FIG. 4) described later. When the vacuum pump 46 is driven, the gas in the bonding vacuum chamber 20b is exhausted through the exhaust port 23 and the exhaust pipe.

  The upper lid portion 21 is provided with a substrate holding portion 25 as an example of a holding means for the substrate 121 with a touch sensor. The substrate holding unit 25 electrostatically attracts the substrate 121 with a touch sensor by generating static electricity. The display substrate 101 is disposed in the vacuum container 20 (see FIG. 11) and bonded to the substrate 121 with a touch sensor. Therefore, when the display substrate 101 is adsorbed in the vacuum container 20, it is necessary to use a method other than negative pressure suction. As another method for adsorbing the display substrate 101, for example, a method using an adsorbing sheet having peelable adhesiveness may be mentioned.

  The substrate holding unit 25 sucks the plane of the substrate 121 with a touch sensor where the black matrix 123 is not provided, and the first direction X, the second direction Y, and the third direction Z of the substrate 121 with a touch sensor. Restrict movement to

  In addition, when the adsorption | suction force (holding force) of the board | substrate holding | maintenance part 25 is insufficient, you may provide a clamp part in the inner surface of the surrounding wall part 22. FIG. Alternatively, instead of the substrate holding part 25, a clamp part may be provided on the inner surface of the peripheral wall part 22. The clamp portion extends substantially perpendicular to the inner surface of the peripheral wall portion 22 and is configured to be able to be fed out by a drive mechanism such as an air cylinder or a hydraulic cylinder. The clamp part configured in this manner holds the side part of the substrate 121 with a touch sensor sandwiched between them.

  The substrate holding unit 25 is fixed to the holding unit moving mechanism 26. The holding portion moving mechanism 26 is attached to the upper lid portion 21 and penetrates the upper lid portion 21. One end of a wiring (not shown) is connected to the side of the holding portion moving mechanism 26 that protrudes from the outer surface of the upper lid portion 21. The other end of the wiring is connected to a drive control unit 61 (see FIG. 4) described later. The holding unit moving mechanism 26 moves the substrate holding unit 25 in the third direction Z.

  The upper lid portion 21 is provided with imaging units 27A and 27B and a temporary fixing light source 28. The imaging units 27 </ b> A and 27 </ b> B penetrate the upper lid 21. One end of a wiring (not shown) is connected to the side of the imaging units 27A and 27B that protrudes from the outer surface of the upper lid portion 21. The other end of this wiring is connected to a drive control unit 61 (see FIG. 4) described later.

  The imaging units 27A and 27B image the display substrate 101 and the touch sensor-equipped substrate 121, and detect the relative positions of the two. The imaging units 27A and 27B each have a lens barrel 27a and a signal processing unit 27b. The lens barrel 27a faces downward, and an objective lens (not shown) faces the display substrate 101 and the substrate 121 with a touch sensor. The imaging units 27A and 27B capture, for example, the diagonal or opposite sides of the display substrate 101 and the touch sensor-equipped substrate 121.

The temporarily fixing light source 28 is attached to the inner surface of the upper lid 21 and is connected to the drive control unit 61 (see FIG. 4) by a wiring (not shown). The temporary fixing light source 28 emits ultraviolet rays. The ultraviolet rays emitted from the temporary fixing light source 28 are irradiated to a plurality of portions of the ultraviolet curable resin interposed between the display substrate 101 and the substrate 121 with the touch sensor. Thereby, the display substrate 101 and the substrate 121 with the touch sensor can be temporarily fixed, and both can be prevented from being relatively displaced.
As the temporarily fixing light source 28, for example, a spot light source or a surface light source that irradiates ultraviolet rays onto a substantially circular predetermined region can be employed.

  The lower member 7 is formed in a hollow rectangular parallelepiped shape having an open top, and includes a bottom portion 31 formed in a rectangular plate shape, and a peripheral wall portion 32 extending upward continuously from the four sides of the bottom portion 31. Yes. The contour of the outer periphery of the peripheral wall portion 32 is formed substantially equal to the contour of the outer periphery of the peripheral wall portion 22 in the upper member 6.

  On the other hand, the inner peripheral contour of the peripheral wall portion 32 is formed larger than the inner peripheral contour of the peripheral wall portion 22 in the upper member 6. Therefore, a region that does not contact the tip of the peripheral wall 32 of the lower member 7 is formed at the tip of the peripheral wall 22 of the upper member 6. In this region, a peripheral wall piece 42 of the movable table 37 described later is brought into contact.

  An exhaust port 33 for degassing the vacuum chamber 20 a is formed in the peripheral wall portion 32 of the lower member 7. One end of an exhaust pipe (not shown) is connected to the exhaust port 33. The other end of the exhaust pipe is connected to a vacuum pump 46 (see FIG. 4) described later. When the vacuum pump 46 is driven, the gas in the vacuum chamber 20a is exhausted through the exhaust port 33 and the exhaust pipe. In addition, as a vacuum pump which concerns on this invention, you may provide separately what deaerates the vacuum chamber 20a, and what deaerates the vacuum chamber 20b for bonding (refer FIG. 9).

Further, the peripheral wall portion 32 of the lower member 7 is provided with a substrate insertion opening (not shown) for inserting the substrate 121 with a touch sensor into the lower member 7. The board insertion opening is closed by a shutter part (not shown). That is, when the upper member 6 and the lower member 7 come into contact with each other via the seal member and the shutter portion closes the substrate insertion opening, the vacuum chamber 20a is sealed.
A substrate insertion opening (not shown) can also be used when the display substrate 101 is inserted into the lower member 7.

  Inside the lower member 7, substrate support tables 35 A and 35 B, transfer units 36 A and 36 B, a movable table 37, and a support table moving mechanism 38 are provided. The substrate support bases 35A and 35B and the transfer portions 36A and 36B are disposed on the movable base 37.

  The movable table 37 includes a pedestal 41 formed in a rectangular plate shape and a peripheral wall piece 42 that extends upward continuously from the four sides of the pedestal 41. The distal end portion of the peripheral wall piece 42 faces the distal end portion (lower end) of the peripheral wall portion 22 in the upper member 6. When the peripheral wall piece 42 comes into contact with the distal end portion of the peripheral wall portion 22 via the above-described seal member, a bonding vacuum chamber 20b (see FIG. 9) is formed between the upper member 6 and the movable base 37. The vacuum chamber 20b for bonding is smaller in volume than the vacuum chamber 20a formed between the upper member 6 and the lower member 7.

  On the pedestal 41, mounting bases 44A and 44B are provided. The mounting bases 44A and 44B are formed in a rectangular parallelepiped shape extending in the second direction Y, and are opposed to each other in the first direction X. The mounting base 44A is fixed to the pedestal 41. On the other hand, the mounting base 44 </ b> B is attached to the base 41 via the mounting base moving mechanism 45. The mounting base moving mechanism 45 moves the mounting base 44B in the first direction X.

  The mounting base moving mechanism 45 is a mechanism provided to sandwich the side portion of the display substrate 101 by the substrate support bases 35A and 35B. Therefore, as the mounting base moving mechanism according to the present invention, the mounting base 44A may be moved in the first direction X, and may be provided for the mounting bases 44A and 44B, respectively.

  Substrate support bases 35A and 35B are attached to the surfaces of the mounting bases 44A and 44B facing each other. Further, delivery portions 36A and 36B are attached to the upper surfaces of the mounting bases 44A and 44B, respectively.

  The substrate supporters 35A and 35B support the display substrate 101 on which the ultraviolet curable resin is applied. The substrate supporters 35A and 35B each have a placement surface 35a on which the display substrate 101 is placed and a sandwiching surface 35b that sandwiches the opposing side portions of the display substrate 101. The placement surface 35a and the sandwiching surface 35b regulate the movement of the display substrate 101 in the first direction X, the second direction Y, and the third direction Z with respect to the substrate support bases 35A and 35B.

  In addition, as a board | substrate support stand which concerns on this invention, the display substrate 101 may be electrostatically adsorbed. Moreover, as a board | substrate support stand which concerns on this invention, the structure which adsorb | sucks the board | substrate 121 with a touch sensor by methods other than negative-pressure suction is also employable.

  The transfer units 36 </ b> A and 36 </ b> B support the plane on the 122 side of the substrate 121 with a touch sensor, and transfer the substrate 121 with a touch sensor to the substrate holding unit 25. The transfer portions 36A and 36B have a base 36a and a support arm 36b protruding from the base 36a in the first direction X. The support arm 36b is moved by a driving mechanism such as an air cylinder or a hydraulic cylinder, and can be extended from the base 36a.

  The support arm 36b is deformed into a support state (see FIG. 6) for supporting the substrate 121 with the touch sensor and a standby state in which the length protruding from the base 36a is shorter than the support state. For example, when the display substrate 101 is placed on the substrate support bases 35A and 35B or when the display substrate 101 and the substrate 121 with the touch sensor are bonded to each other, the support arm 36b enters a standby state, and the display substrate 101 or the touch sensor. Avoid interference with the substrate 121.

  The support table moving mechanism 38 supports the lower part of the movable table 37, and the substrate support tables 35A and 35B are moved through the movable table 37 in the first direction X, the second direction Y, the third direction Z, and the third. Is moved in the rotation direction θ about the axis extending in the direction Z.

[Control system for substrate bonding equipment]
Next, a control system of the substrate bonding apparatus 1 will be described with reference to FIG.
FIG. 4 is a block diagram showing a control system of the bonding apparatus 1.

  As shown in FIG. 4, the substrate bonding apparatus 1 includes a drive control unit 61. The drive control unit 61 includes, for example, a CPU (Central Processing Unit), a ROM (Read Only Memory) for storing programs executed by the CPU, and a RAM (Random Access Memory) used as a work area of the CPU. ).

  The drive control unit 61 is electrically connected to the substrate holding unit 25, the holding unit moving mechanism 26, the imaging units 27 </ b> A and 27 </ b> B, the temporarily fixing light source 28, and the upper member moving mechanism 29. Further, the drive control unit 61 is electrically connected to the transfer units 36 </ b> A and 36 </ b> B, the support table moving mechanism 38, the mounting table moving mechanism 45, and the vacuum pump 46.

  The substrate holding unit 25 is controlled by the drive control unit 61 to electrostatically attract the substrate 121 with a touch sensor. The holding unit moving mechanism 26 is driven by the drive control unit 61 and moves the substrate holding unit 25 in the third direction Z. The upper member moving mechanism 29 is driven by the drive control unit 61 and moves the upper member 6 (see FIG. 3).

  The delivery units 36 </ b> A and 36 </ b> B are controlled by the drive control unit 61 to bring the support arm 36 b into a support state when receiving the substrate 121 with a touch sensor. On the other hand, the support arm 36b is set in a standby state to avoid interference with the display substrate 101 or the substrate 121 with the touch sensor.

  The support table moving mechanism 38 is controlled by the drive control unit 61 to drive the movable table 37 and the substrate support tables 35A and 35B in the first direction X, the second direction Y, the third direction Z, and the third direction. It is moved in the rotation direction θ about the axis extending in the direction Z. The mounting base moving mechanism 45 is controlled by the drive control unit 61 to move the mounting base 44B in the first direction X.

  The drive of the vacuum pump 46 is controlled by the drive control unit 61, and the air in the vacuum chamber 20a of the vacuum vessel 20 or the vacuum chamber 20b for bonding is sucked. Thereby, the vacuum chamber 20a or the vacuum chamber 20b for bonding is deaerated.

  The imaging units 27A and 27B image the substrate 121 with a touch sensor held by the substrate holding unit 25 and the display substrate 101 supported by the substrate support bases 35A and 35B, and detect the relative positions of the two. Then, the detection result is transmitted to the drive control unit 61.

  The drive control unit 61 controls the driving of the support table moving mechanism 38 based on the detection results of the imaging units 27A and 27B, and controls the substrate support tables 35A and 35B in the first direction X, the second direction Y, and the rotation direction. Move to θ. Thereby, the display substrate 101 is positioned with respect to the substrate 121 with the touch sensor. That is, the display substrate 101 and the substrate 121 with a touch sensor are relatively positioned.

  Further, the drive control unit 61 controls the drive of the support base moving mechanism 38, moves (lifts) the substrate support bases 35A and 35B in the third direction Z, and attaches the display substrate 101 to the substrate 121 with the touch sensor. Match.

  The temporarily fixing light source 28 is driven by the drive control unit 61 and irradiates ultraviolet rays to a plurality of portions of the ultraviolet curable resin interposed between the bonded display substrate 101 and the substrate 121 with the touch sensor. Thereby, the bonded display substrate 101 and the substrate 121 with the touch sensor are temporarily fixed.

[Board bonding method]
Next, a substrate bonding method performed by the substrate bonding apparatus 1 will be described with reference to FIGS.
5-13 is explanatory drawing explaining the bonding method of the board | substrate performed by the bonding apparatus 1 of a board | substrate.

  The substrate bonding method performed by the substrate bonding apparatus 1 first prepares a display substrate 101 and a substrate 121 with a touch sensor. And an ultraviolet curable resin is apply | coated to the polarizing plate 104 side of the display substrate 101 by the resin application part not shown.

  Next, a substrate transport unit (not shown) places the display substrate 101 to which the ultraviolet curable resin is applied on the placement surface 35 a of the substrate support bases 35 </ b> A and 35 </ b> B disposed on the lower member 7. At this time, the upper member 6 is moved relative to the lower member 7 to open the upper portion of the lower member 7.

  When the display substrate 101 is placed on the placement surfaces 35a of the substrate support tables 35A and 35B, the mounting table moving mechanism 45 is driven to move the mounting table 44B and the substrate support table 35B toward the substrate support table 35A. As a result, the holding surfaces 35b of the substrate support bases 35A and 35B come into contact with the side portions of the display substrate 101. As a result, the substrate supporters 35A and 35B regulate the movement of the display substrate 101 in the first direction X, the second direction Y, and the third direction Z (downward).

  Further, when the display substrate 101 is placed on the placement surfaces 35a of the substrate support bases 35A and 35B, the upper member 6 moves with respect to the lower member 7, and the distal end portion (lower end) of the peripheral wall portion 22 in the upper member 6 is moved. ) Abuts on the tip end (upper end) of the peripheral wall portion 32 of the lower member 7 via a seal member. Thereby, the vacuum container 20 is formed (refer FIG. 5).

  Next, the imaging units 27A and 27B detect the horizontal position of the display substrate 101 supported by the substrate support bases 35A and 35B. The imaging units 27A and 27B capture image light from a predetermined area of the display substrate 101. For example, a black matrix (not shown) is provided on the substrate main body 102 (see FIG. 1) of the display substrate 101. The imaging units 27A and 27B respectively capture the area including the end of the black matrix on the display substrate 101. Then, the horizontal position of the display substrate 101 is detected from the position inside the black matrix (the side forming the contour of the inner periphery), and the center position of the display substrate 101 is calculated.

  In the present embodiment, the position of the display substrate 101 is detected using the black matrix, but the detection of the position of the display substrate 101 is not limited to using the black matrix. For example, the position of the display substrate 101 may be detected from the alignment mark 105 provided on the display substrate 101 or the position of the end surface of the substrate body 102 on the display substrate 101.

  Next, the support table moving mechanism 38 is driven to lower the movable table 37. Thereby, the space which receives the board | substrate 121 with a touch sensor is ensured between the board | substrate holding | maintenance part 25 and the delivery parts 36A and 36B. Then, the support arms 36b of the transfer portions 36A and 36B are extended from the base 36a to be in a support state.

  Subsequently, a substrate supply unit (not shown) inserts the substrate 121 with a touch sensor from a substrate insertion opening (not shown) and places it on the support arms 36b of the transfer units 36A and 36B (see FIG. 6). As a result, the substrate 121 with a touch sensor is supported by the support arms 36b of the transfer units 36A and 36B and faces the display substrate 101 to which the ultraviolet curable resin is applied.

  When the substrate 121 with a touch sensor is placed on the support arm 36b of the transfer portions 36A and 36B, a shutter portion (not shown) closes the substrate insertion opening. Thereby, the vacuum chamber 20a which is the inside of the vacuum vessel 20 is sealed.

  And deaeration (evacuation) of the vacuum chamber 20a is started. That is, the gas in the vacuum chamber 20 a is exhausted from the exhaust port 33. At this time, the gas in the vacuum chamber 20 a may be exhausted not only from the exhaust port 33 but also from the exhaust port 23. The deaeration operation is continuously performed during the subsequent relative positioning operation of the display substrate 101 and the substrate 121 with the touch sensor.

  A certain amount of time is required until the degree of vacuum of the vacuum chamber 20a and the vacuum chamber 20b for bonding is set to a predetermined value. Therefore, in this embodiment, the deaeration operation and the positioning operation are performed in parallel to reduce the tact time.

  In parallel with the deaeration operation of the vacuum chamber 20a, the imaging units 27A and 27B detect the horizontal position of the substrate 121 with a touch sensor supported by the support arms 36b of the transfer units 36A and 36B. The imaging units 27A and 27B capture image light from a predetermined area of the substrate 121 with a touch sensor.

  The imaging units 27A and 27B according to the present embodiment image an area including the end of the black matrix 123 in the substrate 121 with a touch sensor. Then, the position in the horizontal direction of the substrate 121 with the touch sensor is detected based on the position inside the black matrix 123 (side forming the contour of the inner periphery), and the center position of the substrate 121 with the touch sensor is calculated. Thereby, the relative position of the display substrate 101 and the substrate 121 with the touch sensor is detected, and the relative shift amount between the display substrate 101 and the substrate 121 with the touch sensor is detected.

  In this embodiment, the position of the substrate 121 with a touch sensor is detected using the black matrix 123, but the detection of the position of the substrate 121 with a touch sensor is not limited to using the black matrix 123. For example, the position of the substrate 121 with the touch sensor may be detected from an ITO (Indium Tin Oxide) pattern provided on the substrate 121 with the touch sensor, the position of the end surface of the substrate body 122 in the substrate 121 with the touch sensor, or the like.

  In the present embodiment, the case where the two imaging units 27A and 27B are provided has been described as an example. However, one or three or more imaging units according to the present invention may be provided. Note that it is preferable to provide two or more imaging units according to the present invention in order to improve accuracy and shorten tact time.

Thereafter, the support table moving mechanism 38 is driven to move the movable table 37 and the substrate support tables 35A and 35B in the first direction X, the second direction Y, and the rotation direction θ, and the display substrate 101 with respect to the substrate 121 with the touch sensor. Perform position alignment.
That is, the drive control unit 61 controls the drive of the support base moving mechanism 38 based on the relative positions of the display substrate 101 and the substrate 121 with the touch sensor. Thereby, the substrate support bases 35A and 35B provided on the movable base 37 move, and the display substrate 101 and the substrate 121 with the touch sensor are relatively positioned.

  Next, the support table moving mechanism 38 is driven to raise the movable table 37. As a result, the transfer units 36A and 36B approach the substrate holding unit 25, and the substrate 121 with the touch sensor comes into contact with the substrate holding unit 25 (see FIG. 7). And the board | substrate holding | maintenance part 25 carries out electrostatic adsorption of the board | substrate 121 with a touch sensor.

  In the present embodiment, before the delivery units 36A and 36B deliver the substrate 121 with a touch sensor to the substrate holding unit 25, the horizontal position of the substrate 121 with a touch sensor is detected by the imaging units 27A and 27B. However, as a substrate bonding apparatus and a substrate bonding method according to the present invention, after the substrate holding unit 25 holds the substrate 121 with the touch sensor, the horizontal position of the substrate 121 with the touch sensor may be detected. .

  That is, the touch sensor-equipped substrate 121 supported by the transfer units 36A and 36B is transferred to the substrate holding unit 25 without changing the horizontal position. Therefore, detecting the horizontal position of the touch sensor-equipped substrate 121 supported by the transfer units 36A and 36B is detecting the horizontal position of the touch sensor-equipped substrate 121 held by the substrate holding unit 25. It does not change substantially.

Next, the support table moving mechanism 38 is driven to lower the movable table 37. Then, the support arms 36b of the transfer portions 36A and 36B enter the base 36a and enter a standby state (see FIG. 8).
Thereby, the support arms 36b of the transfer portions 36A and 36B are not interposed between the substrate 121 with a touch sensor and the display substrate 101. Therefore, the support arm 36 b does not interfere with the substrate 121 with the touch sensor and the display substrate 101 when the substrate 121 with the touch sensor and the display substrate 101 are bonded together.

  Subsequently, the support table moving mechanism 38 is driven to raise the movable table 37. Thereby, the front-end | tip part of the surrounding wall piece 42 in the movable stand 37 contact | abuts to the front-end | tip part (lower end) of the surrounding wall part 22 in the upper member 6. FIG. As a result, a bonding-use vacuum chamber 20b for accommodating the substrate 121 with a touch sensor and the display substrate 101 is formed between the upper member 6 and the movable base 37 (see FIG. 9).

Thereafter, deaeration (evacuation) of the vacuum chamber for bonding 20b is started. That is, the gas in the bonding vacuum chamber 20 b is exhausted from the exhaust port 23. At this time, the degree of vacuum in the bonding vacuum chamber 20b having a smaller volume than the vacuum chamber 20a may be set to a specified value.
Therefore, the time required for setting the degree of vacuum of the vacuum chamber 20b for bonding to a predetermined value is shorter than the time required for setting the degree of vacuum of the vacuum chamber 20a to a predetermined value.

  Further, since the air in the vacuum chamber 20a has been exhausted from the exhaust port 33 in advance, the pressure in the bonding vacuum chamber 20b is lower than the atmospheric pressure when the bonding vacuum chamber 20b is formed. . Therefore, the time required for the degree of vacuum of the vacuum chamber 20b for bonding to reach a predetermined value can be shortened.

When the degree of vacuum of the bonding vacuum chamber 20b reaches a predetermined value, the degassing of the bonding vacuum chamber 20b is stopped. Then, the holding unit moving mechanism 26 is driven to lower the substrate holding unit 25 and attach the substrate 121 with a touch sensor to the display substrate 101 (see FIG. 10).
Thereby, the display substrate 101 and the substrate 121 with the touch sensor are bonded together with the ultraviolet curable resin interposed therebetween. Since the substrate bonding step is performed under vacuum in the bonding vacuum chamber 20b, it is possible to prevent bubbles from entering the ultraviolet curable resin.

Next, the imaging units 27A and 27B detect the relative positions of the bonded display substrate 101 and the substrate 121 with the touch sensor. Then, based on the detection result, the support table moving mechanism 38 is driven to move the movable table 37 and the substrate support tables 35A and 35B in the first direction X, the second direction Y, and the rotation direction θ, and the touch sensor. The position of the display substrate 101 with respect to the attached substrate 121 is adjusted.
As a result, even when the display substrate 101 and the touch sensor substrate 121 are bonded together, the relative displacement between the display substrate 101 and the touch sensor substrate 121 may be reduced before the display substrate 101 and the touch sensor substrate 121 are temporarily fixed. It can be corrected.

  Subsequently, the temporarily fixing light source 28 is driven to irradiate a plurality of portions of the ultraviolet curable resin interposed between the display substrate 101 and the substrate with touch sensor 121 with ultraviolet rays. When a predetermined time elapses, a plurality of portions of the ultraviolet curable resin are cured, and the display substrate 101 and the touch sensor-equipped substrate 121 are temporarily fixed. As a result, the assembly of the substrate assembly 150 in which the display substrate 101 and the substrate 121 with the touch sensor are bonded and temporarily fixed is completed.

  Next, the substrate holding unit 25 stops electrostatic adsorption of the substrate 121 with a touch sensor. Subsequently, the holding unit moving mechanism 26 is driven to raise the substrate holding unit 25 (see FIG. 11). Thereby, the board | substrate holding | maintenance part 25 leaves | separates from the board | substrate 121 with a touch sensor. Further, the exhaust port 23 is opened, and the bonding vacuum chamber 20b is gradually returned to atmospheric pressure.

  Subsequently, the support table moving mechanism 38 is driven to lower the movable table 37 and the substrate support tables 35A and 35B (see FIG. 12). Thereafter, the upper member moving mechanism 29 (see FIG. 4) is driven to move the upper member 6 relative to the lower member 7 (see FIG. 13). At this time, the upper member moving mechanism 29 moves the upper member 6 in the first direction X after slightly raising the upper member 6.

  Further, the mounting base moving mechanism 45 is driven to transfer the mounting base 44B to the side opposite to the mounting base 44A. As a result, the mounting base 44B is separated from the mounting base 44A, and the display substrate 101 and the touch sensor-equipped substrate 121, which are bonded and temporarily fixed by being bonded to the touch-sensor-equipped substrate 121, can be taken out.

Thereafter, a substrate transport unit (not shown) is driven to transport the substrate assembly 150 to a resin curing unit (not shown). The resin curing unit cures the UV curable resin of the supplied substrate assembly 150.
Further, the display substrate 101 coated with the ultraviolet curable resin is transported to the substrate support bases 35A and 35B from which the substrate assembly 150 has been taken out by a substrate transport unit (not shown).

  In the substrate bonding apparatus 1 and the bonding method of the present embodiment, the upper member 6 and the lower member 7 are brought into contact with each other to form the vacuum container 20 that accommodates the display substrate 101 and the substrate 121 with the touch sensor. . And the board | substrate 121 with a touch sensor is hold | maintained by the board | substrate holding | maintenance part 25 provided in the upper member 6, and the display board | substrate 101 is supported by the board | substrate support bases 35A and 35B provided in the lower member 7. FIG.

  Thereby, the upper member 6 has the function of holding and moving the substrate 121 with the touch sensor and the function of forming the vacuum container 20. Therefore, the number of parts of the apparatus can be reduced, and equipment for bonding the two substrates 101 and 121 can be realized with a simple configuration. In addition, a configuration in which the two substrates 101 and 102 are relatively moved and bonded to each other is provided separately from the vacuum vessel, and the volume in the vacuum vessel can be reduced as compared with the case where the substrates are arranged in the vacuum vessel. As a result, the time required to evacuate the vacuum container 20 is shortened, and the tact time can be shortened.

In this embodiment, the relative positions of the display substrate 101 and the substrate 121 with the touch sensor are detected by the imaging units 27A and 27B. Then, based on the detection result, the substrate support bases 35A and 35B are moved in the first direction X, the second direction Y, and the rotation direction θ to position the display substrate 101 with respect to the substrate 121 with the touch sensor. After the display substrate 101 and the touch sensor-equipped substrate 121 are bonded together, the imaging units 27A and 27B once again detect the relative positions of the display substrate 101 and the touch sensor-equipped substrate 121, and determine the relative positions of the two. adjust.
As a result, even when the display substrate 101 and the touch sensor substrate 121 are bonded together, the relative displacement between the display substrate 101 and the touch sensor substrate 121 may be reduced before the display substrate 101 and the touch sensor substrate 121 are temporarily fixed. It can be corrected.

  In this embodiment, the vacuum chamber 20a is degassed while the display substrate 101 and the touch sensor-equipped substrate 121 are relatively positioned. Therefore, the time required for assembling the substrate assembly 150 by bonding the display substrate 101 and the substrate 121 with the touch sensor can be shortened.

Further, in the present embodiment, a bonding vacuum chamber 20b having a smaller volume than the vacuum chamber 20a is formed by the upper member 6 and the movable table 37, and the display substrate 101 and the touch sensor are formed in the bonding vacuum chamber 20b. The attached substrate 121 is attached.
As a result, the volume of the vacuum chamber that requires a predetermined degree of vacuum can be reduced, and the time for deaeration can be shortened.

In this embodiment, after adjusting the relative positions of the bonded display substrate 101 and the substrate 121 with the touch sensor, the ultraviolet light is emitted from the temporary fixing light source 28 without removing both the substrates 101 and 121 from the vacuum container. Curing a plurality of locations of the cured resin.
As a result, the substrates 101 and 121 are not relatively displaced during the conveyance of the substrate assembly 150 thereafter, and the yield can be improved. In addition, since both the substrates 101 and 121 are not relatively displaced, it is possible to increase the transport speed when transporting the substrate assembly 150 to a resin curing unit (not shown).

[Modification]
The embodiments of the substrate bonding apparatus and the substrate bonding method of the present invention have been described above, including the effects thereof. However, the substrate bonding apparatus and the substrate bonding method of the present invention are not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention described in the claims. Implementation is possible.

  For example, the substrate laminating apparatus 1 according to the present embodiment is configured so that the upper member 6 provided with the substrate holding unit 25 and the lower member 7 provided with the substrate support bases 35A and 35B are brought into contact with each other to hold the vacuum container 20 together. It was set as the structure to form. However, the substrate bonding apparatus according to the present invention may have a configuration in which the substrate holding unit, the substrate support base, and the imaging unit are provided separately from the vacuum vessel and arranged in the vacuum vessel.

  In the substrate bonding apparatus 1 according to the present embodiment, the temporary fixing light source 28 is disposed on the upper member 6 and irradiates the planes of the bonded display substrate 101 and the substrate 121 with the touch sensor with ultraviolet rays. The configuration. However, the position of the temporarily fixing light source according to the present invention is not limited to the upper member 6.

  The temporary fixing light source according to the present invention may be provided, for example, above the substrate support bases 35A and 35B. In this case, ultraviolet rays are irradiated to the side surface of the ultraviolet curable resin interposed between the display substrate 101 and the substrate 121 with the touch sensor. Thereby, the side surface of the ultraviolet curable resin is cured, and the display substrate 101 and the substrate 121 with the touch sensor are temporarily fixed. Further, if the temporary fixing light source 28 emits ultraviolet rays linearly along the side surfaces of the ultraviolet curable resin, the ultraviolet curable resin does not leak from between the display substrate 101 and the substrate 121 with the touch sensor. can do.

  In the substrate bonding apparatus 1 according to the present embodiment, the substrate holding unit 25 of the upper member 6 holds the substrate 121 with a touch sensor, and the substrate support bases 35A and 35B of the lower member 7 support the display substrate 101. The configuration. However, the substrate holding unit 25 may hold the display substrate 101 and the substrate support bases 35A and 35B may support the substrate 121 with a touch sensor. In this case, an ultraviolet curable resin is applied to the black matrix 123 side of the substrate 121 with a touch sensor.

  Further, the substrate bonding apparatus 1 of the present embodiment includes the holding unit moving mechanism 26 and the support base moving mechanism 38. However, the configuration for moving the substrate according to the present invention can be changed as appropriate.

For example, in the present embodiment, the holding unit moving mechanism 26 moves the substrate holding unit 25 (the substrate 121 with the touch sensor) in the third direction Z. However, the holding unit moving mechanism according to the present invention may be configured to move the substrate holding unit 25 in the first direction X, the second direction Y, the third direction Z, and the rotation direction θ. In this case, the substrate 121 with a touch sensor can be positioned with respect to the display substrate 101.
In other words, the substrate bonding apparatus of the present invention only needs to have a mechanism for relatively moving the display substrate 101 and the substrate 121 with the touch sensor.

In the present embodiment, the support table moving mechanism 38 also serves as a movable table moving mechanism that moves the movable table 37. However, the support table moving mechanism according to the present invention may be provided separately from the movable table moving mechanism that moves the movable table 37. In this case, the support base moving mechanism may be provided on the base 41 of the movable base 37, for example. The support base moving mechanism provided on the base 41 is configured to move the support bases 35A and 35B in at least the first direction X, the second direction Y, and the rotation direction θ. A movable table moving mechanism for moving the movable table 37 in at least the third direction (vertical direction) Z is provided. In this case, the movable table moving mechanism constitutes a part of the support table moving mechanism.
Note that the support base moving mechanism provided on the base 41 may have a configuration in which the support bases 35A and 35B are moved in the third direction Z. Even in this case, a movable table moving mechanism for moving the movable table 37 in at least the third direction (vertical direction) Z is required.

Further, in this embodiment, after positioning the display substrate 101 and the substrate 121 with the touch sensor, the bonding-time vacuum chamber 20b is deaerated (evacuated). However, as the substrate bonding apparatus according to the present invention, the display substrate 101 and the substrate 121 with the touch sensor may be positioned after the vacuum chamber 20b for bonding is evacuated.
Further, the deaeration of the bonding-time vacuum chamber 20b and the positioning of the display substrate 101 and the substrate 121 with the touch sensor may be performed in parallel.

Further, in the present embodiment, the upper member 6 is formed in a rectangular parallelepiped shape with the lower part opened, and the lower member 7 is formed in a rectangular parallelepiped form with the upper part opened. However, the shape of the upper member and the lower member according to the present invention can be appropriately changed as long as they form a vacuum container by contacting each other.
For example, the upper member according to the present invention may be formed in a rectangular parallelepiped shape with the lower part opened, and the lower member may be formed in a plate shape. Further, the upper member may be formed in a plate shape, and the lower member may be formed in a rectangular parallelepiped shape having an upper portion opened.
Furthermore, the vacuum container formed by the upper member and the lower member is not limited to a rectangular parallelepiped, and may have any shape as long as a vacuum chamber that accommodates the display substrate and the cover substrate is secured. May be.

  In the present embodiment, the upper vacuum chamber 20b is formed by the upper member 6 and the movable table 37. However, the substrate bonding apparatus of the present invention may be configured to bond the display substrate 101 and the substrate 121 with the touch sensor in the vacuum chamber 20a without forming the bonding vacuum chamber 20b.

  In the present embodiment, the substrate support base (35A, 35B) is configured by two members. However, as the substrate support base according to the present invention, any structure can be used as long as the display substrate or the cover substrate is supported from below. Can be changed. As the substrate support base according to the present invention, for example, it may be formed in a single plate shape and electrostatically adsorb the display substrate or the cover substrate.

  In addition, the substrate bonding apparatus according to the present invention may be configured such that a resin coating portion is disposed in the vacuum container 20. The resin application unit applies the ultraviolet curable resin to one plane of the display substrate or the cover substrate by, for example, a slit coater or screen printing.

  In the present embodiment, after the upper member 6 and the lower member 7 are brought into contact with each other to form the vacuum container 20, the substrate holding unit 25 holds the substrate 121 with the touch sensor. However, as a substrate bonding apparatus according to the present invention, after a vacuum vessel is formed, the substrate supporter supports the display substrate (or the substrate with the touch sensor), and the substrate holding unit is the substrate with the touch sensor (or the display). (Substrate) may be held.

  Further, as a substrate bonding apparatus according to the present invention, before the vacuum container is formed with the upper member and the lower member, the substrate support base supports the display substrate (or the substrate with the touch sensor), and the substrate holding unit touches. It may be configured to hold a sensor-equipped substrate (or display substrate). In this case, when the vacuum container is formed, the display substrate and the substrate with the touch sensor are opposed to each other. Therefore, an imaging unit for detecting the position of the display substrate and an imaging unit for detecting the position of the substrate with the touch sensor are separately provided (at least It is preferable to use separate optical systems.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate bonding apparatus, 6 ... Upper member, 7 ... Lower member, 20 ... Vacuum container, 20a ... Vacuum chamber, 20b ... Vacuum chamber for bonding, 25 ... Substrate holding part, 26 ... Holding part moving mechanism, 27A, 27B ... Imaging unit, 28 ... Temporary fixing light source, 29 ... Upper member moving mechanism, 35A, 35B ... Substrate support table, 36A, 36B ... Delivery unit, 37 ... Movable table, 38 ... Support table moving mechanism, 46 ... Vacuum pump, 61 ... Drive control unit, 101 ... Display substrate, 121 ... Substrate with touch sensor, 150 ... Substrate assembly

Claims (12)

  1. In a substrate laminating apparatus for laminating a display substrate and a cover substrate under a vacuum via an ultraviolet curable resin,
    A vacuum vessel;
    A substrate holding part disposed in the vacuum vessel and holding the cover substrate or the display substrate;
    A substrate support that is arranged in the vacuum vessel and supports the display substrate or the cover substrate coated with the ultraviolet curable resin;
    An imaging unit that is at least partially disposed in the vacuum vessel and detects a relative position of the display substrate and the cover substrate held on the substrate support and the substrate holding unit;
    Based on the detection result of the imaging unit, the substrate holding unit and the substrate support are relatively moved to relatively position the display substrate and the cover substrate, and the inside of the vacuum vessel is removed. Control to control, control to bond the display substrate and the cover substrate by relatively moving the substrate holding portion and the substrate support, and the relative relationship between the display substrate and the cover substrate after the bonding A drive control unit that performs control for adjusting a relative position between the display substrate and the cover substrate based on a detection result of a correct position;
    Irradiate ultraviolet rays to a plurality of uncured ultraviolet curable resins interposed between the display substrate and the cover substrate, which are arranged in the vacuum vessel and are adjusted relative positions after being bonded. A temporary fixing light source,
    A substrate bonding apparatus comprising:
  2. The substrate bonding apparatus according to claim 1, wherein the drive control unit performs control to deaerate the inside of the vacuum vessel while performing control to relatively position the display substrate and the cover substrate.
  3. A holding unit moving mechanism that moves the substrate holding unit in a vertical direction in which the display substrate and the cover substrate face each other;
    A support base moving mechanism that moves the substrate support base in a rotational direction centered on the vertical direction, a horizontal direction orthogonal to the vertical direction, and an axis extending in the vertical direction;
    A substrate bonding apparatus according to claim 1, comprising:
  4. The vacuum container has an upper member and a lower member that form a vacuum chamber by contacting each other,
    The substrate bonding apparatus according to claim 1, wherein the substrate holding unit is provided on the upper member, and the substrate support is provided on the lower member.
  5. A movable table on which the substrate support is disposed;
    The substrate bonding apparatus according to claim 4, wherein the movable table and the upper member are in contact with each other to form a bonding vacuum chamber having a smaller volume than the vacuum chamber.
  6. The substrate bonding apparatus according to claim 5, further comprising a movable table moving mechanism that moves the movable table in the vertical direction.
  7. The substrate bonding apparatus according to claim 4, wherein the imaging unit is attached to the upper member.
  8. The substrate bonding apparatus according to claim 4, wherein the temporary fixing light source is attached to the upper member.
  9. A step of supporting a display substrate or a cover substrate coated with an ultraviolet curable resin by a substrate support arranged in a vacuum vessel;
    A step of holding a cover substrate or a display substrate by a substrate holder disposed in the vacuum vessel;
    An imaging unit detecting a relative position between the display substrate and the cover substrate held by the substrate holding unit and the substrate support;
    A step of relatively moving the substrate holding unit and the substrate support base based on the detection result of the imaging unit to relatively position the display substrate and the cover substrate;
    Degassing the vacuum vessel;
    A step of relatively moving the substrate holding portion and the substrate support, and bonding the display substrate and the cover substrate;
    A step of detecting a relative position of the display substrate and the cover substrate after the imaging unit is bonded;
    Based on the detection result detected by the imaging unit after the display substrate and the cover substrate are bonded together, the substrate holding unit and the substrate support base move relatively, and the bonded display substrate and the cover are bonded together. Adjusting the relative position with the substrate;
    With respect to a plurality of uncured ultraviolet curable resins that are interposed between the display substrate and the cover substrate that have been adjusted in relative position by the light source for temporary fixing disposed in the vacuum vessel. A process of irradiating with ultraviolet rays;
    A method for laminating a substrate having:
  10. The substrate bonding method according to claim 9, wherein the step of degassing the inside of the vacuum container is started when the display substrate and the cover substrate are arranged in the vacuum container.
  11. The vacuum container has an upper member and a lower member that form a vacuum chamber by contacting each other,
    10. The method of forming the vacuum container for housing the display substrate and the cover substrate by bringing the upper member and the lower member into contact with each other before bonding the display substrate and the cover substrate at least. 10. A method for bonding substrates according to 10.
  12. After the step of forming the vacuum container, the movable base on which the substrate support base is disposed and the upper member are brought into contact with each other to form a bonding vacuum chamber having a smaller volume than the vacuum chamber. The substrate bonding method according to claim 11, further comprising a step.
JP2012030206A 2012-02-15 2012-02-15 Substrate bonding device, and substrate bonding method Pending JP2013167712A (en)

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