JP2014060204A - Plate-like body holding mechanism and substrate lamination apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plate-like body holding mechanism, capable of stably holding a plate-like body.SOLUTION: A plate-like body holding mechanism 200 includes a suction part 230, a basement part 220, and a support part 210. The suction part 230 electrostatically sucks a display substrate 101. The basement part 220 has one surface to which the suction part 230 is fixed, and has a Young's modulus in the plate thickness direction, which is set to be elastically deformable together with the suction part 230 in accordance with the shape of the lower face of the display substrate 101. The support 210 supports the basement part 220 in an elastically deformable manner.

Description

  The present invention relates to a plate-like body holding mechanism for holding a rectangular plate-like plate-like body, for example, a display substrate or a cover substrate, and substrate bonding for bonding a display substrate and a cover substrate using the plate-like body holding mechanism. It relates to the device.

  The display unit of the display device is provided with a cover substrate such as a substrate with a touch sensor and a protective substrate on a polarizing plate provided on a display substrate such as a liquid crystal module or an organic light emitting diode module. In recent years, such a display unit is produced through a process of attaching a cover substrate to a display substrate. Further, UV curable resins are widely used as a bonding material used when the two substrates are bonded together.

  The process of attaching the cover substrate to the display substrate is performed under vacuum in order to prevent bubbles from entering between the substrates. Patent Document 1 describes a display device manufacturing method in which a display device is manufactured by bonding a display device and a transparent surface material serving as a protective plate of the display device. In this method, the transparent surface material is held by the electrostatic chuck in the decompression device that bonds the display device and the transparent surface material.

  By the way, when adsorbing an object to be adsorbed using an electrostatic chuck, if the surface of the object to be adsorbed is not flat, a portion where the adsorbing surface of the electrostatic chuck and the adsorbed surface of the object to be adsorbed do not come into contact with each other. The chucking force of the electric chuck is insufficient. Therefore, if a portion where the suction surface of the electrostatic chuck and the suction surface of the object to be attracted do not come into contact with each other, the electrostatic chuck cannot stably attract the object to be attracted. Thus, Patent Document 2 describes an electrostatic chuck including a dielectric layer having an adsorption surface that adsorbs an object to be adsorbed and an elastic layer that enables deformation of the dielectric layer. In this electrostatic chuck, the dielectric layer is deformed following the uneven surface shape of the object to be adsorbed, and the entire surface of the object to be adsorbed contacts the adsorption surface of the electrostatic chuck. Occur.

International Publication No. 2011/037035 Pamphlet JP 2007-294852 A

  However, in the electrostatic chuck described in Patent Document 2, when the amount of warping of the display substrate or the cover substrate is larger than the thickness of the elastic layer of the electrostatic chuck, the dielectric layer cannot be deformed following the warping of the substrate. For this reason, a portion where the attracting surface of the electrostatic chuck and the attracted surface of the substrate do not come into contact with each other, and the attracting force of the electrostatic chuck is insufficient. Therefore, the substrate cannot be stably held.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a plate-like body holding mechanism and a substrate bonding apparatus capable of stably holding a plate-like body.

  In order to achieve the above object, the plate-like body holding mechanism of the present invention includes a sheet-like suction part, a base part, and a support part. The adsorption unit electrostatically adsorbs a rectangular plate-shaped plate-like body. The base part is formed in a plate shape, the suction part is fixed on one surface, and the Young's modulus in the thickness direction can be elastically deformed together with the suction part according to the shape of the suction surface of the plate-like body. Is set. The support part supports the base part so as to be elastically deformable.

The substrate bonding apparatus of the present invention is a substrate bonding apparatus for bonding a rectangular first plate-like body and a second plate-like body under a vacuum via an adhesive member, and holds the plate-like body. A mechanism, a holding part, and a drive part are provided.
The plate-like body holding mechanism is formed in a sheet-like suction portion that electrostatically attracts the first plate-like body, and is formed in a plate shape. The suction portion is fixed on one surface, and the Young's modulus in the plate thickness direction is And a base portion set so as to be elastically deformable together with the suction portion according to the shape of the suction surface of the first plate-like body. The plate-like body holding mechanism has a support portion that supports the base portion so as to be elastically deformable. The holding unit holds one surface of the second plate-like member facing the other surface, which is the surface opposite to the surface to be sucked, of the first plate-like member sucked by the suction unit. The drive unit relatively moves the support unit and the holding unit, and moves the other surface of the first plate-like body adsorbed by the adsorption unit and one surface of the second plate-like body held by the holding unit. Make contact.
The support portion can be tilted around an axis extending in a first direction orthogonal to the parallel direction in which the support portion and the base portion are parallel and an axis extending in the second direction orthogonal to the parallel direction and the first direction. Support the base part.

  In the plate-like body holding mechanism and the substrate bonding apparatus according to the present invention, the Young's modulus in the thickness direction of the base portion to which the sheet-like suction portion is fixed is elastic together with the suction portion according to the shape of the suction surface of the plate-like body. It is set to be deformable. The support portion supports the base portion so as to be elastically deformable. For this reason, the suction portion and the base portion are elastically deformed according to the shape of the plate-like body electrostatically attracted by the suction portion. Therefore, even when the amount of warpage of the plate-like body is large, it is possible to prevent the occurrence of a portion where the adsorbing portion and the plate-like body do not contact. For this reason, since the adsorption | suction part can adsorb | suck a plate-shaped body with a strong adsorption force, it can hold | maintain a plate-shaped body stably.

  According to the present invention, the plate-like body can be stably held.

It is explanatory drawing which shows the structure of the display substrate which is one board | substrate bonded together by the board | substrate bonding apparatus which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows the structure of the board | substrate with a touch sensor which is the other board | substrate bonded together by the board | substrate bonding apparatus which concerns on the 1st Embodiment of this invention. It is a perspective view which shows the conveyance part which concerns on the 1st Embodiment of this invention. It is a figure which shows the structure of the board | substrate bonding apparatus which concerns on the 1st Embodiment of this invention, A is principal part front sectional drawing, B is principal part side sectional drawing. It is a perspective view which shows the structure of the plate-shaped body holding mechanism in the board | substrate bonding apparatus of FIG. It is A arrow directional view of FIG. It is a figure which shows the structure of the press part in the board | substrate bonding apparatus of FIG. It is a block diagram which shows the control system in the board | substrate bonding apparatus of FIG. It is a figure which shows the state which the conveyance part of FIG. 3 attracted and held the display substrate. It is explanatory drawing which shows the state which mounted the display board | substrate in the base part in the plate-shaped body holding mechanism of the board | substrate bonding apparatus of FIG. It is explanatory drawing which shows the state which mounted the display board | substrate which has not generate | occur | produced the curvature on the base part of the plate-shaped body holding mechanism. It is explanatory drawing which shows the state which mounted the display board whose upward curvature amount is the maximum curvature amount on the base part of the plate-shaped body holding mechanism. It is explanatory drawing which shows the state which mounted the display board in which the curvature amount to upper direction was less than the maximum curvature amount on the base part of the plate-shaped body holding mechanism. It is explanatory drawing which shows the state which mounted the display board | substrate which curved downward on the base part of a plate-shaped object holding | maintenance mechanism. 3A and 3B are diagrams illustrating the conveyance unit of FIG. 3 when the substrate with the touch sensor is sucked and held, in which A shows a state where the main body is rotated, B shows a state where the substrate with the touch sensor is sucked and held, and C shows FIG. It is a CC sectional view taken on the line. It is explanatory drawing which shows the state which the board | substrate holding part of the board | substrate bonding apparatus of FIG. 10 hold | maintained the board | substrate with a touch sensor. It is explanatory drawing which shows the state which the board | substrate holding part of the board | substrate bonding apparatus of FIG. 16 raised. It is explanatory drawing which shows the state which the lower member of the board | substrate bonding apparatus of FIG. 17 raised and the vacuum chamber was formed. It is explanatory drawing which shows the state which the board | substrate holding part of the board | substrate bonding apparatus of FIG. 18 descend | falls, and the board | substrate with a touch sensor and the display board | substrate were made to contact. It is a figure for demonstrating the effect | action of the plate-shaped body holding mechanism at the time of bonding a board | substrate with a touch sensor to the display board | substrate which was mounted on the base | substrate part of a plate-shaped body holding mechanism, and warped upwards, A is both board | substrates. The plate-like body holding mechanism immediately after contact is shown, and B shows the plate-like body holding mechanism after a predetermined time has elapsed. It is a figure for demonstrating the effect | action of the plate-shaped body holding mechanism at the time of bonding a board | substrate with a touch sensor to the display board | substrate which was mounted in the base | substrate part of a plate-shaped body holding mechanism, and warped below. The plate-like body holding mechanism immediately after contact is shown, and B shows the plate-like body holding mechanism after a predetermined time has elapsed. It is a figure for demonstrating the effect | action of the plate-shaped body holding mechanism when the board | substrate thickness of a display substrate is not uniform, A shows the plate-shaped body holding mechanism before both board | substrates contact | abut, B is both board | substrates contact | abutting The plate-shaped body holding mechanism after performing is shown. 19 is an explanatory view showing a state where the lower member of the substrate bonding apparatus is lowered to the initial position. It is a perspective view which shows the support part of the plate-shaped object holding | maintenance mechanism which concerns on 2nd Embodiment. It is a disassembled perspective view which shows the support part of the plate-shaped object holding | maintenance mechanism which concerns on 2nd Embodiment. It is a perspective view which shows the support part of the plate-shaped object holding | maintenance mechanism which concerns on 3rd Embodiment. It is a perspective view which shows the support part of the plate-shaped object holding | maintenance mechanism which concerns on 4th Embodiment.

<First Embodiment>
Hereinafter, a plate-like body holding mechanism 200 according to an embodiment of the present invention and a substrate bonding apparatus 1 including the plate-like body holding mechanism 200 will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected to the common member in each figure.

[Display board]
First, a display substrate (first plate-like body) 101 as an example of a plate-like body will be described with reference to FIG.
FIG. 1 is an explanatory diagram showing a configuration of a display substrate 101 which is one substrate to be bonded by the substrate bonding apparatus 1.

As shown in FIG. 1, the display substrate 101 is, for example, an LCD module (LCM), a substrate main body 102 using liquid crystal, a frame 103 that accommodates one surface of the substrate main body 102 exposed, and a substrate main body. A polarizing plate 104 attached to one surface of 102 is provided.
The display substrate 101 according to the present invention may be an organic light emitting diode (OLED) module or other display module.

The substrate body 102 is formed in a rectangular plate shape, and one surface serves as a display surface.
In addition, the substrate body 102 is formed in a multilayer shape including a layer formed by frame printing formed by laminating a plurality of members into a rectangular frame shape (not shown). The contour of the inner periphery of the frame printing is substantially equal to the contour of the outer periphery of the polarizing plate 104. The frame printing is formed, for example, by sputtering metal chromium on the substrate body 102 and removing unnecessary portions by etching.

The frame 103 covers the four sides of the substrate body 102 and the other surface of the substrate body 102.
The polarizing plate 104 is formed in a rectangular shape and has a smaller outer contour than the substrate body 102. That is, the contour of the outer periphery of the polarizing plate 104 is formed to have a size approximately equal to the display area of the substrate body 102. The polarizing plate 104 side of the display substrate 101 is attached to a substrate 121 with a touch sensor described later via an adhesive member, for example, an ultraviolet curable resin. The adhesive member is not limited to the ultraviolet curable resin. For example, other photocuring resins or thermosetting resins may be used.

[Board with touch sensor]
Next, a substrate with a touch sensor (second plate-like body) 121 will be described with reference to FIG. 2 as another example of the plate-like body.
FIG. 2 is an explanatory diagram showing a configuration of the substrate 121 with a touch sensor.

  As shown in FIG. 2, the substrate 121 with a touch sensor has a substrate body 122, and frame printing 123 is applied to one surface of the substrate body 122. The substrate body 122 is formed in a rectangular plate shape. The contour of the outer periphery of the substrate 121 with the touch sensor is formed larger than the contour of the outer periphery of the frame 103 in the display substrate 101.

  The contour of the outer periphery of the frame printing 123 is substantially equal to the contour of the outer periphery of the substrate body 122, and the contour of the inner periphery is substantially equal to the contour of the outer periphery of the polarizing plate 104 in the display substrate 101. The frame printing 123 is formed, for example, by sputtering metal chromium on one surface of the substrate body 122 and removing unnecessary portions by etching.

  In the present embodiment, the substrate 121 with a touch sensor is described as an example of the cover substrate. However, the cover substrate according to the present invention is not limited to the substrate 121 with a touch sensor, and for example, a protection formed by a glass material. It may be a substrate.

[Board bonding equipment]
Next, the structure of the board | substrate bonding apparatus 1 of this embodiment is demonstrated with reference to FIGS.
First, the transport unit 2 of the substrate bonding apparatus 1 that transports the display substrate 101 and the substrate 121 with the touch sensor will be described with reference to FIG.
FIG. 3 is a perspective view of the transport unit 2.

  The transport unit 2 includes a main body 21 formed in a substantially rectangular flat plate shape, and a transport unit operating mechanism (not shown) that moves or rotates the main body 21. The transport unit operating mechanism rotates the main body 21 around an axis passing through the approximate center of the short side of the main body 21.

  The main body 21 is formed with a notch 22 that is notched from one short side to a substantially central portion in the longitudinal direction of the main body. A plurality of cylindrical suction portions 23 made of an elastic member are formed around the notch 22 on one surface of the main body 21. The cylindrical hole 24 of the suction part 23 is connected to a vacuum pump (not shown). The suction portion 23 includes a suction portion 23a disposed on the outer peripheral edge side of the main body portion 21, and a suction portion 23b disposed on the inner side (notch portion 22 side) than the suction portion 23a. The suction part 23b is formed to have a shorter length in a direction protruding from one surface of the main body part 21 than the suction part 23a. In the following description, when the adsorption unit 23a and the adsorption unit 23b are not distinguished, they are referred to as the adsorption unit 23.

  One end of a wiring (not shown) is connected to the transport unit 2. The other end of the wiring is connected to a control unit 14 (see FIG. 8) described later. The control unit 14 drives the transport unit operating mechanism to move or rotate the main body unit 21. Also, the display unit 101 and the substrate 121 with the touch sensor are sucked and held by the transport unit 2 by driving the vacuum pump.

  4A shows a front cross-sectional view of the main part of the substrate bonding apparatus 1, and FIG. 4B shows a side cross-sectional view of the main part. In addition, in FIG. 4, illustration of the conveyance part 2 is abbreviate | omitted. Further, only the inner bottom surface 32 of the enclosure that accommodates the substrate bonding apparatus 1 and prevents the diffusion of the organic solvent is shown, and the other configurations of the enclosure are not shown. One direction along the inner bottom surface 32 of the enclosure on which the substrate bonding apparatus 1 is placed is defined as an X direction, and a direction parallel to the inner bottom surface 32 and perpendicular to the X direction is defined as a Y direction. A direction orthogonal to the X direction and the Y direction is defined as a Z direction (up and down direction).

  As shown in FIG. 4A, the substrate bonding apparatus 1 includes a support frame 4. The support frame 4 includes a flat plate-like suspension portion 41 that extends along the X direction, and a pair of leg portions 42 that extend downward from both ends of the suspension portion 41 in the X direction. A holding part moving mechanism 12 to be described later is fixed to a substantially central part in the X direction and Y direction of the suspension part 41, and the holding part moving mechanism 12 supports a substrate holding part 11 to be described later so as to be movable in the vertical direction. doing.

  The lower portion of the leg portion 42 is fixed to the inner bottom surface 32 of the enclosure. A peripheral wall portion 72 of the upper member 7 described later is fixed to the upper portion of the leg portion 42.

The substrate bonding apparatus 1 includes an upper member 7, a lower member 8, and a lower member moving mechanism 9.
The upper member 7 and the lower member 8 are in contact with each other to form a vacuum container 10 having a vacuum chamber 10a (see FIG. 18) which is a sealed internal space.

  The upper member 7 is formed in a hollow rectangular parallelepiped shape having an open lower portion, and has an upper lid portion 71 formed in a square plate shape and a peripheral wall portion 72 that extends downward continuously from the four sides of the upper lid portion 71. doing. The peripheral wall portion 72 includes wall pieces 72a and 72b that face in the X direction and wall pieces 72c and 72d that face in the Y direction.

The wall piece 72c is formed with an exhaust port 73 for degassing the vacuum chamber 10a and an intake port 74 for sucking outside air into the vacuum chamber 10a. The exhaust port 73 is provided with an exhaust valve 75 (see FIG. 8) for opening or closing the exhaust port 73, and the intake port 74 is provided with an intake valve 76 (see FIG. 8) for opening or closing the intake port 74. Yes. One end of a wiring (not shown) is connected to the exhaust valve 75 and the intake valve 76. The other end of the wiring is connected to a control unit 14 (see FIG. 8) described later.
When the intake port 74 is opened by the intake valve 76, the vacuum chamber 10 a communicates with the space in the enclosure through the intake port 74.

  One end of an exhaust pipe (not shown) is connected to the exhaust port 73. The other end of the exhaust pipe is connected to a vacuum pump 77 (see FIG. 8) described later. When the exhaust port 73 is opened by the exhaust valve 75 and the vacuum pump 77 is driven, the gas in the vacuum chamber 10a is exhausted through the exhaust port 73 and the exhaust pipe. The exhaust port 73 and the intake port 74 may be formed in any of the wall pieces 72a, 72b, 72d instead of the wall piece 72c.

  The upper cover portion 71 of the upper member 7 is provided with a substrate holding portion 11 as an example of a holding portion according to the present invention. The substrate holding unit 11 is a clamp unit (not shown) and holds the substrate 121 with a touch sensor. In addition, it may replace with a clamp part and may provide the adhesive sheet which can peel to the board | substrate holding part 11, and may hold | maintain the board | substrate 121 with a touch sensor.

  The substrate holding unit 11 holds the plane of the substrate 121 with the touch sensor on the side where the frame printing 123 is not provided with the clamp unit, and restricts the movement of the substrate 121 with the touch sensor in the X direction, the Y direction, and the Z direction. . The board | substrate holding | maintenance part 11 hold | maintains the board | substrate 121 with a touch sensor so that the long side which the board | substrate 121 with a touch sensor mutually opposes extends along a X direction.

  The substrate holding part 11 includes a holding plate part 111 provided with a clamp part for holding the substrate 121 with a touch sensor, a cylindrical part 112 extending upward from a substantially central part of the holding plate part 111, and a cylindrical hole of the cylindrical part 112. And a shaft 113 that is movable in the vertical direction (not shown). The upper end portion of the shaft 113 penetrates the upper lid portion 71 in the vertical direction and is fixed to a piston rod of the holding portion moving mechanism 12 described later. The lower end portion of the shaft 113 is provided with a substantially disc-shaped disc portion (not shown) that engages with the inner edge portion at the upper end of the cylindrical portion 112. The disc portion prevents the shaft 113 from coming out of the cylindrical hole.

  The holding part moving mechanism 12 is composed of an air cylinder, for example, and is fixed to the support frame 4. One end of a wiring (not shown) is connected to the side of the holding portion moving mechanism 12 that protrudes from the outer surface of the upper lid portion 71. The other end of the wiring is connected to a control unit 14 (see FIG. 8) described later. One end of the piston rod of the holding unit moving mechanism 12 is fixed to the upper end of the shaft 113 of the substrate holding unit 11. The holding unit moving mechanism 12 moves the substrate holding unit 11 in the same direction by moving the shaft 113 in the vertical direction (Z direction). Although not shown, the upper cover 71 of the upper member is provided with a pair of stabilizers with a predetermined distance between the holding unit moving mechanism 12. The upper end portion of the cylindrical portion constituting the upper portion of the stabilizer is fixed to the upper lid portion 71. The lower end portion of the columnar portion constituting the lower portion of the stabilizer is fixed to the upper surface of the holding plate portion 111 of the substrate holding portion 11. The upper end portion of the cylindrical portion is connected to the cylindrical portion in a nested manner. The cylindrical portion of the stabilizer moves in the tube hole of the tube portion so as to keep the holding plate portion 111 horizontal with respect to the inner bottom surface 32 of the enclosure.

  The lower member moving mechanism 9 is fixed to the inner bottom surface 32 of the enclosure 3. The lower member moving mechanism 9 moves or rotates the lower member 8 in the θ direction centered on axes extending in the X direction, the Y direction, the Z direction, and the Z direction (hereinafter, simply referred to as movement).

  The lower member 8 is formed in a hollow rectangular parallelepiped shape having an open top, and has a bottom portion 81 formed in a square plate shape and a peripheral wall portion 82 that extends upward continuously from the four sides of the bottom portion 81. Yes. The contour of the outer periphery of the peripheral wall portion 82 is formed smaller than the contour of the outer periphery of the peripheral wall portion 72 of the upper member 7. Further, the inner peripheral contour of the peripheral wall portion 82 is formed to have a size substantially equal to the inner peripheral contour of the peripheral wall portion 72 of the upper member 7.

  A seal member 83 is attached to the distal end portion of the peripheral wall portion 82. The seal member 83 comes into contact with and closely contacts the upper member 7, and seals between the front end portion of the peripheral wall portion 82 and the upper member 7. As a material of the seal member 83, for example, a rubber member such as natural rubber, isoprene rubber, silicone rubber, urethane rubber, or the like can be used.

  When the lower member 8 is moved by the lower member moving mechanism 9 and comes into contact with the upper member 7 via the seal member 83, a vacuum chamber 10a (see FIG. 18) is formed between the upper member 7 and the lower member 8. . A plate-like body holding mechanism 200 is provided on the bottom 81 of the lower member 8.

Next, the plate-like body holding mechanism 200 will be described with reference to FIGS. FIG. 5 is a perspective view of the plate-like body holding mechanism 200. 6 is a view taken in the direction of arrow A in FIG.
The plate-like body holding mechanism 200 holds the display substrate 101 from below. The plate-like body holding mechanism 200 includes a support part 210, a base part 220, and a suction part 230.

  The support part 210 supports the base part 220 from below. The support portion 210 includes a first pedestal portion 211 formed in a rectangular flat plate shape, and a second pedestal portion 212 provided at a substantially central portion of the first pedestal portion 211. At the four corners of the first pedestal portion 211, pressing portions 13 are provided.

The second pedestal portion 212 includes a pair of leaf spring support portions 213, a leaf spring 214 supported by the leaf spring support portions 213, and a base support portion 215 fixed to the upper surface of the leaf spring 214. It is configured.
The pair of leaf spring support portions 213 are fixed to the upper surface of the first pedestal portion 211. The pair of leaf spring support portions 213 are arranged at a central portion in the X direction of the first base portion 211 with a predetermined distance in the Y direction. The leaf spring support 213 is formed in a metal prism shape.

  The leaf spring 214 is formed in a metal rectangular plate shape, and the long sides facing each other extend along the Y direction, and the short sides facing each other extend along the X direction. Screw holes (not shown) penetrating in the vertical direction are provided at both ends in the Y direction of the leaf spring 214. The leaf spring 214 is formed on the upper surface of the leaf spring support portion 213 by a screw that passes through the screw hole. It is fixed. Accordingly, the leaf spring 214 is suspended on the leaf spring support portion 213. The rigidity of the leaf spring 214 is set to allow the leaf spring 214 to be elastically deformed and twisted about the central axis O extending along the Y direction by a force input from above. When the leaf spring 214 is twisted about the central axis O, the base support portion 215 fixed to the upper surface of the leaf spring 214 is inclined in the direction of arrow B in FIG.

  The base support part 215 includes a leaf spring joint part 216, a base fixing part 217, and a coupling part 218. The leaf spring joint portion 216, the base fixing portion 217, and the coupling portion 218 are integrally formed.

  The leaf spring joint 216 is formed in a rectangular plate shape made of metal, and the long sides facing each other extend along the Y direction, and the short sides facing each other extend along the X direction. The lower surface of the leaf spring joint 216 is fixed to the upper surface of the substantially central portion of the leaf spring 214. The length of the long side (length in the Y direction) of the leaf spring joint 216 is set to be shorter than the length of the long side of the leaf spring 214.

  The base fixing portion 217 is formed in a metal rectangular plate shape, and the long sides facing each other extend along the Y direction, and the short sides facing each other extend along the X direction. The long side length (the length in the Y direction) of the base fixing portion 217 is set to be longer than the long side length of the leaf spring joint portion 216 and shorter than the long side length of the leaf spring 214. .

The coupling portion 218 is formed in a plate shape having two planes orthogonal to the Y direction, extends downward from the lower surface of the base fixing portion 217, and continues to the upper surface of the leaf spring joint portion 216.
The coupling portion 218 is set to be lower in rigidity than the leaf spring joint portion 216 and the base fixing portion 217, and can be elastically deformed. When the coupling portion 218 is elastically deformed, the base fixing portion 217 is inclined such that the long side is inclined with respect to the Y direction.

  The height of the coupling part 218 is such that the base fixing part 217 is inclined by the elastic deformation of the coupling part 218, and the base fixing part 217 passes through the base end of the coupling part 218 and extends along the X axis. The height is set to be substantially equal to the inclination in the arrow C direction. Therefore, even if the base fixing part 217 is inclined due to the elastic deformation of the coupling part 218, the base part 220 fixed to the base fixing part 217 does not change the horizontal position, as will be described later. It inclines with the inclination of 217.

  The base portion 220 is formed in a rectangular plate shape made of resin (for example, PET resin or polycarbonate), long sides facing each other extend along the X direction, and short sides facing each other along the Y direction. It is extended. The length of the short side (the length in the Y direction) of the base part 220 is set equal to the length of the long side of the base fixing part 217.

  A central portion in the X direction on the lower surface of the base portion 220 is fixed to the upper surface of the base fixing portion 217 with an adhesive or a screw. Accordingly, the base portion 220 is supported by the support portion 210 so as to be tiltable about an axis extending along the X-axis direction and an axis extending along the Y-axis direction. Note that the support part 210 restricts the base part 220 from moving in the X direction, the Y direction, and the θ direction.

  The rigidity of the base portion 220 in the thickness direction is set to be weaker than the rigidity of the display substrate 101. The Young's modulus in the plate thickness direction of the base portion 220 is set to be lower than the Young's modulus of the substrate held by the plate-like body holding mechanism 200, in this embodiment, the display substrate 101.

  The base portion 220 is formed to warp upward as it goes from the central portion in the X direction to both end portions in the X direction (hereinafter sometimes referred to simply as upward). The warpage amount of the base portion 220 is set equal to the maximum warpage amount of the display substrate 101 held by the plate-like body holding mechanism 200. As will be described later, the display substrate 101 placed on the base portion 220 so that the long sides facing each other extend along the X direction is the both ends of the same direction from the center portion in the longitudinal direction (X direction). It tends to warp upward or downward as it goes to. The maximum warpage amount of the display substrate 101 is the maximum value in the predicted value of the warpage amount of the display substrate 101 calculated in advance based on the physical properties of the display substrate 101 or experimental data at the time of design. The maximum amount of warpage in the present embodiment is calculated as the amount of warpage when the display substrate 101 warps upward as it goes from the central portion in the longitudinal direction toward both ends in the same direction.

  The adsorption unit 230 is a rectangular electrostatic chuck sheet in which an application electrode is enclosed in an insulating film. Long sides facing each other of the suction portion 230 extend along the X direction, and short sides facing each other extend along the Y direction. The lower surface of the adsorption part 230 is fixed to the upper surface of the base part 220 with an adhesive. The adsorption part 230 has elasticity and elastically deforms following the elastic deformation of the base part 220. The application electrode of the adsorption unit 230 is connected to the control unit 14 (see FIG. 8) described later. The adsorption unit 230 is controlled by the control unit 14 and electrostatically adsorbs the display substrate 101 placed on the base unit 220.

The display substrate 101 is placed on the upper surface of the base part 220 via the suction part 230. The area of the surface of the base portion 220 facing the display substrate 101 is smaller than the area of the surface of the display substrate 101 facing the base portion 220. For this reason, the base portion 220 faces the display substrate 101 in a predetermined region including the central portion of the display substrate 101 and does not face the outer edge portion of the display substrate 101.
The plate-like body holding mechanism 200 moves in the X direction, the Y direction, the Z direction, and the θ direction as the lower member 8 is moved by the lower member moving mechanism 9.

Next, the structure of the press part 13 of this embodiment is demonstrated with reference to FIG. FIG. 7 is a diagram illustrating the configuration of the pressing portion 13.
The pressing unit 13 includes a voice coil motor 131 and a pressing member 132.

  The voice coil motor 131 includes a coil 133, a magnet 134 disposed around the coil 133, and a shaft 135. The shaft 135 is made of, for example, iron and has a base portion 136 and a cylindrical portion 137. The base portion 136 is formed in a substantially circular flat plate shape, and the columnar portion 137 extends from a substantially central portion of the base portion 136. The cylindrical portion 137 is inserted through the inside of the coil 133 along the central axis of the coil 133. A pressing member 132 is joined to the tip of the cylindrical portion 137. The pressing member 132 is formed in a substantially cylindrical shape by an elastic member, for example, rubber or resin. And the front-end | tip part of the press member 132 is formed in the spherical surface.

  When a current flows through the coil 133, the shaft 135 and the pressing member 132 move upward or downward in accordance with the amount and direction of the flowing current. One end of wiring (not shown) is connected to the voice coil motor 131. The other end of this wiring is connected to a servo driver 16 (see FIG. 8) described later.

[Control system for substrate bonding equipment]
Next, a control system of the substrate bonding apparatus 1 will be described with reference to FIG.
FIG. 8 is a block diagram showing a control system of the bonding apparatus 1.

  As shown in FIG. 8, the substrate bonding apparatus 1 includes a control unit 14. The control unit 14 includes, for example, a CPU (Central Processing Unit), a ROM (Read Only Memory) for storing programs executed by the CPU, and a RAM (Random Access Memory) used as a work area of the CPU. And have.

  The control unit 14 is electrically connected to the transport unit 2, the substrate holding unit 11, the lower member moving mechanism 9, and the suction unit 230. The control unit 14 is electrically connected to the exhaust valve 75, the intake valve 76, the pressure sensor 15, and the vacuum pump 77. The holding unit moving mechanism 12, the servo driver 16 of each pressing unit 13, and an analog / digital converter (hereinafter referred to as A / D converter) 17 are electrically connected.

  The control unit 14 controls driving of the transport unit operating mechanism of the transport unit 2 to move the main body 21 of the transport unit 2 in the X direction, the Y direction, and the θ direction, and the display substrate 101 or the touch sensor is attached by a vacuum pump. The substrate 121 is sucked and held. In addition, the control unit 14 moves the main body 21 of the transport unit 2 that sucks and holds the display substrate 101 or the substrate 121 with the touch sensor in the X direction, the Y direction, and the θ direction, and thereby the display substrate 101 or the substrate 121 with the touch sensor. Are arranged at predetermined positions in the horizontal direction. Specifically, the control unit 14 moves the main body unit 21 of the transport unit 2 based on position data stored in advance, and arranges the display substrate 101 or the substrate 121 with the touch sensor at a predetermined position. Various sensors such as a photo sensor and a pressure sensor are provided in the substrate bonding apparatus 1, and the control unit 14 attaches the display substrate 101 or the substrate 121 with the touch sensor to a predetermined base on the basis of signals output from these sensors. You may arrange in a position.

The control unit 14 controls the adsorption operation of the adsorption unit 230 by controlling the application of voltage to the application electrode of the adsorption unit 230. The adsorption unit 230 electrostatically adsorbs the display substrate 101 placed at a predetermined position by the conveyance unit 2 according to the control of the control unit 14.
The substrate holding unit 11 is controlled by the control unit 14 to operate the clamp unit, and holds the substrate 121 with a touch sensor arranged at a predetermined position by the transport unit 2.

  The control unit 14 controls the drive of the lower member moving mechanism 9 to move (lift) the lower member 8 upward from a predetermined initial position so as to contact the upper member 7. Thus, the vacuum container 10 is formed by the upper member 7 and the lower member 8.

  The control unit 14 controls the operations of the exhaust valve 75 and the intake valve 76 to close or open the exhaust port 73 and the intake port 74. For example, the control unit 14 drives the exhaust valve 75 and the intake valve 76 to completely open the exhaust port 73 and the intake port 74, and a small amount open state in which the open amount is small compared to the open state. Set to the fully closed state. Note that the opening amounts of the exhaust port 73 and the intake port 74 in the small amount open state can be arbitrarily set.

  The pressure sensor 15 is provided on the first base portion 211. The pressure sensor 15 detects the atmospheric pressure in the vacuum chamber 10a (see FIG. 18) of the vacuum vessel 10 formed by the upper member 7 and the lower member 8, and outputs the detection result to the control unit 14.

  The vacuum pump 77 is controlled by the control unit 14 and sucks air in the vacuum chamber 10 a of the vacuum vessel 10 through the exhaust port 73. Thereby, the vacuum chamber 10a is deaerated. Based on the detection result of the pressure sensor 15, the control unit 14 drives the exhaust valve 75, the intake valve 76, and the vacuum pump 77 to set the vacuum chamber 10a to a predetermined degree of vacuum. The predetermined degree of vacuum is set to a value lower than atmospheric pressure, for example, 10 to 100 Pa.

  The control unit 14 controls driving of the holding unit moving mechanism 12 to move the substrate holding unit 11 in the Z direction. The control unit 14 lowers the substrate holding unit 11 holding the substrate 121 with a touch sensor in the vacuum chamber 10a. As a result, in a vacuum state in which the vacuum chamber 10a is set to a predetermined degree of vacuum, the substrate 121 with a touch sensor held by the substrate holding unit 11 and the display substrate 101 supported by the plate-like body holding mechanism 200 are brought into contact with each other. Make contact.

The A / D converter 17 is connected to the amplifier 18. The amplifier 18 is connected to a displacement detection sensor (detection unit) 19.

  The displacement detection sensor 19 is provided in the vicinity of the voice coil motor 131 in each pressing portion 13 provided in the first pedestal portion 211. Each displacement detection sensor 19 outputs to the amplifier 18 a voltage that changes as the base portion 136 of each voice coil motor 131 moves in the vertical direction. In the present embodiment, the output voltage of the displacement detection sensor 19 is maximized when the base 136 and the displacement detection sensor 19 are closest to each other. Further, this output voltage decreases as the base portion 136 rises and moves away from the displacement detection sensor 19, and becomes minimum when the base portion 136 and the displacement detection sensor 19 are farthest from each other.

  The amplifier 18 amplifies the voltage output from the displacement detection sensor 19. The A / D converter 17 generates a digital signal based on the amplified voltage, and transmits the generated digital signal to the control unit 14.

  Each servo driver 16 is controlled in operation by the control unit 14 and drives the voice coil motor 131 of the pressing unit 13 with the direction and amount of current instructed by the control unit 14. The control unit 14 determines the direction and amount of current based on the digital signal transmitted from the A / D converter 17, and controls each servo to drive the voice coil motor 131 with the determined direction and amount of current. An instruction signal is transmitted to the driver 16. That is, the control unit 14 controls driving of each pressing unit 13.

[Operation of substrate bonding equipment]
Next, operation | movement and an effect | action of the board | substrate bonding apparatus 1 and the plate-shaped object holding mechanism 200 are demonstrated with reference to FIGS. 9-23 is explanatory drawing explaining the operation | movement and effect | action of the board | substrate bonding apparatus 1 and the plate-shaped body holding mechanism 200. FIG.
First, a display substrate 101 and a substrate 121 with a touch sensor are prepared. And the ultraviolet curable resin is apply | coated inside the frame printing 123 in the surface in which the frame printing 123 of the board | substrate 121 with a touch sensor is formed by the resin application part not shown.

  Next, as shown in FIG. 9, the control unit 14 sucks and holds the display substrate 101 on the main body 21 of the transport unit 2. Specifically, first, the display substrate 101 is placed so as to cover the notch 22 of the main body 21 with an arm (not shown). At this time, the surface of the display substrate 101 on the frame 103 side is in contact with the suction portion 23b, and the surface to which the polarizing plate 104 is attached faces upward. Next, the control unit 14 drives the vacuum pump connected to the transport unit 2 to make the tube hole 24 of the suction unit 23 b have a negative pressure, thereby causing the transport unit 2 to hold the display substrate 101 by suction.

  Next, the control unit 14 controls the transport unit operating mechanism of the transport unit 2 to move the main body unit 21 in the state shown in FIG. 9 to place the display substrate 101 at a predetermined position. The display substrate 101 arranged at a predetermined position is located above the base portion 220 in the plate-like body holding mechanism 200. The control unit 14 controls the lower member moving mechanism 9 so that the lower member 8 is arranged in advance at an initial position with a predetermined distance from the upper member 7 in the vertical direction.

  Next, as shown in FIG. 10, the control unit 14 places the display substrate 101 on the upper surface of the base unit 220. The display substrate 101 is placed on the base portion 220 such that long sides facing each other extend along the X direction. The control unit 14 controls the suction unit 230 fixed to the upper surface of the base unit 220 and causes the display unit 101 to electrostatically attract to the suction unit 230.

  Here, the action of the plate-like body holding mechanism 200 when the display substrate 101 is placed on the base portion 220 of the plate-like body holding mechanism 200 will be described with reference to FIGS. FIG. 11 is an explanatory view showing a state in which the display substrate 101 with no warpage is placed on the base portion 220 of the plate-like body holding mechanism 200. FIG. 12 is an explanatory view showing a state in which the display substrate 101 having the maximum amount of warpage is placed on the base portion 220 of the plate-like body holding mechanism 200. FIG. 13 is an explanatory view showing a state in which the display substrate 101 whose upward warping amount is less than the maximum warping amount is placed on the base portion 220 of the plate-like body holding mechanism 200. FIG. 14 is an explanatory view showing a state in which the display substrate 101 warped downward is placed on the base portion 220 of the plate-like body holding mechanism 200. 11 to 14, members other than the plate-like body holding mechanism 200 and the display substrate 101 are not shown.

  First, the operation when placing the display substrate 101 with no warpage on the base 220 of the plate-like body holding mechanism 200 will be described with reference to FIG. As described above, the base portion 220 is warped upward, and the suction portion 230 is fixed to the upper surface of the base portion 220, so that the lower surface of the display substrate 101 placed at a predetermined position by the transport portion 2 is First, it abuts on the suction part 230 on both ends in the X direction of the base part 220. Thereafter, when the transport unit 2 places the display substrate 101 on the base unit 220 via the suction unit 230, the load of the display substrate 101 is applied to both ends of the base unit 220 in the X direction via the suction unit 230. The base part 220 is pressed against the display substrate 101. As described above, the rigidity of the base portion 220 in the thickness direction is set to be weaker than the rigidity of the display substrate 101. Further, the Young's modulus in the plate thickness direction of the base portion 220 is set to be lower than the Young's modulus of the display substrate 101. For this reason, as shown in FIG. 11, the base portion 220 is elastically deformed so as to follow the shape of the lower surface of the display substrate 101, and the upper surface of the base portion 220 is in close contact with the lower surface of the display substrate 101 via the suction portion 230. .

  Next, when the display substrate 101 is placed on the base portion 220 of the plate-like body holding mechanism 200 that is warped upward, that is, the short sides of the display substrate 101 facing each other are positioned above the center portion. The operation of will be described with reference to FIGS. As described above, the warpage amount of the base portion 220 is set equal to the maximum warpage amount. For this reason, when the amount of warpage upward of the display substrate 101 is the maximum amount of warpage, the upper surface of the base portion 220 is disposed at a predetermined position without elastic deformation of the base portion 220 as shown in FIG. The display substrate 101 is in close contact with the lower surface of the display substrate 101 via the suction portion 230.

  In addition, when the amount of warping upward of the display substrate 101 is less than the maximum amount of warping, the lower surface of the display substrate 101 placed at a predetermined position by the transport unit 2 is first on both end portions in the X direction of the base portion 220. The abutting portion 230 is contacted. After that, when the transport unit 2 places the display substrate 101 on the base 220 via the suction unit 230, the load of the display substrate 101 is applied to both ends in the X direction of the base 220 through the suction unit 230. The part 220 is pressed against the display substrate 101. For this reason, as shown in FIG. 13, the base portion 220 is elastically deformed so as to follow the shape of the lower surface of the display substrate 101, and the upper surface of the base portion 220 is in close contact with the lower surface of the display substrate 101 via the adsorption portion 230. .

  Next, when the display substrate 101 is placed on the base portion 220 of the plate-like body holding mechanism 200, which is warped downward, that is, the opposite short side of the display substrate 101 is located below the center portion. The operation will be described with reference to FIG. The lower surface of the display substrate 101 placed at a predetermined position by the transport unit 2 first comes into contact with the suction units 230 on both ends in the X direction of the base unit 220. After that, when the transport unit 2 places the display substrate 101 on the base 220 via the suction unit 230, the load of the display substrate 101 is applied to both ends in the X direction of the base 220 through the suction unit 230. The part 220 is pressed against the display substrate 101. For this reason, the base portion 220 is elastically deformed so as to follow the shape of the lower surface of the display substrate 101, that is, both end portions of the base portion 220 in the X direction warp downward. And as shown in FIG. 14, the upper surface of the base | substrate part 220 closely_contact | adheres via the adsorption | suction part 230 to the lower surface of the display substrate 101. FIG.

  After placing the display substrate 101 on the base 220 of the plate-like body holding mechanism 200, the control unit 14 controls the suction unit 230 to electrostatically attract the display substrate 101. Thereafter, as shown in FIG. 15A, the control unit 14 moves the main body 21 of the transport unit 2 to the vicinity of the pallet P on which the touch sensor-equipped substrate 121 coated with the ultraviolet curable resin is placed. And the control part 14 rotates the conveyance part 2 so that the one surface in which the adsorption | suction part 23 was provided becomes a lower surface. In FIG. 15A, the region of the substrate body 122 to which the ultraviolet curable resin is applied is shown by shading.

  Next, the control part 14 moves the conveyance part 2 to the arrow direction of FIG. 15A, and arrange | positions it above the board | substrate 121 with a touch sensor. Next, the control unit 14 lowers the main body 21 of the transport unit 2 and abuts the suction unit 23a on a portion of the substrate main body 122 where the ultraviolet curable resin is not applied, that is, a portion where the frame printing 123 is formed. Let And the control part 14 drives the vacuum pump connected to the main-body part 21 of the conveyance part 2, and makes the cylinder hole 24 of the adsorption | suction part 23a a negative pressure. Accordingly, the substrate 121 with a touch sensor is sucked and held on the main body 21 of the transport unit 2.

Next, the control part 14 rotates the conveyance part 2 in the arrow direction of FIG. 15B, and orient | assigns the one surface in which the adsorption | suction part 23 was provided upwards, as shown to FIG. 15B. Thereby, the surface on which the ultraviolet curable resin is applied of the substrate 121 with a touch sensor faces downward. As shown in FIG. 15C, the adsorbing portion 23b is formed to have a shorter length in the direction protruding from one surface of the main body portion 21 than the adsorbing portion 23a, and therefore the adsorbing portion 23b is made of the ultraviolet curable resin of the substrate main body 122. Do not touch the area where it is applied. In FIG. 15C as well, the region of the substrate body 122 to which the ultraviolet curable resin is applied is shaded.
And the control part 14 moves the main-body part 21 of the conveyance part 2, and arrange | positions the board | substrate 121 with a touch sensor in a predetermined position. The touch sensor-equipped substrate 121 disposed at a predetermined position is located below the substrate holding unit 11. The control unit 14 drives the holding unit moving mechanism 12 so that the substrate holding unit 11 is arranged in advance at a position below the lower end portion of the peripheral wall 72 in the upper member 7.

  Next, as shown in FIG. 16, the control unit 14 causes the substrate holding unit 11 to hold the substrate 121 with a touch sensor. The substrate 121 with a touch sensor is held by the substrate holder 11 such that long sides facing each other extend along the X direction. Accordingly, the surface of the substrate 121 with the touch sensor to which the ultraviolet curable resin is applied is opposed to the surface of the display substrate 101 to which the polarizing plate 104 is attached.

  Next, as shown in FIG. 17, the control unit 14 drives the holding unit moving mechanism 12 to raise the substrate holding unit 11 and arranges the substrate 121 with the touch sensor inside the upper member 7.

  Next, as shown in FIG. 18, the control unit 14 drives the lower member moving mechanism 9 to raise the lower member 8. As a result, the lower member 8 contacts the upper member 7, and the upper member 7 and the lower member 8 form a vacuum container 10.

  Next, the control unit 14 drives the intake valve 76 to set the intake port 74 in a closed state. Further, the exhaust valve 75 is driven to set the exhaust port 73 to a small open state, and the vacuum pump 77 is driven to start deaeration (evacuation) of the vacuum chamber 10a. When the pressure in the vacuum chamber 10a detected by the pressure sensor 15 becomes lower than a predetermined pressure after deaeration is started, the control unit 14 drives the exhaust valve 75 to set the exhaust port 73 to a fully open state. This accelerates the progress of deaeration of the vacuum chamber 10a.

  And the control part 14 stops the drive of the vacuum pump 77, when the vacuum chamber 10a is set to the predetermined degree of vacuum. Thus, the control unit 14 can set the vacuum chamber 10a to a predetermined degree of vacuum, that is, set the inside of the vacuum vessel 10 to a vacuum state. First, the exhaust port 73 is set in a small open state to prevent the pressure in the vacuum chamber 10a from rapidly decreasing. Accordingly, it is possible to prevent the display substrate 101 from being broken by the rapid expansion of air remaining between the layers in the display substrate 101 formed in a multilayer shape. Further, when the pressure in the vacuum chamber 10a becomes lower than a predetermined pressure, the exhaust port 73 is set to a fully open state and the progress of deaeration of the vacuum chamber 10a is accelerated, so that the time required for making the vacuum state is shortened. Can do.

  Next, as shown in FIG. 19, the control unit 14 drives the holding unit moving mechanism 12 to lower the substrate holding unit 11. Specifically, the control unit 14 drives the holding unit moving mechanism 12 to lower the shaft 113 by a predetermined distance. This predetermined distance is set to be longer than the distance between the substrate 121 with a touch sensor held by the substrate holder 11 before being lowered and the display substrate 101 held by the plate-like body holding mechanism 200.

  For this reason, before the shaft 113 descends by a predetermined distance, the substrate 121 with a touch sensor and the display substrate 101 come into contact with each other, and both the substrates 101 and 121 are disposed at the bonding position. After the contact, the engagement between the disc portion of the shaft 113 and the cylindrical portion 112 is released, and the shaft 113 moves downward in the cylindrical hole of the cylindrical portion 112 and stops after driving for a predetermined distance. To do.

  In addition, after the substrates 101 and 121 are disposed at the bonding position, the load of the holding plate portion 111 and the cylindrical portion 112 of the substrate holding portion 11 and the substrate 121 with the touch sensor held by the substrate holding portion 11 is as follows: It covers the display substrate 101. Due to this load, the substrate 121 with a touch sensor and the display substrate 101 are bonded together with an ultraviolet curable resin interposed between the substrates 101 and 121. The control unit 14 may drive the holding unit moving mechanism 12 and lower the substrate holding unit 11 in parallel with the degassing of the vacuum chamber 10a.

Here, the action of the plate-like body holding mechanism 200 when the display substrate 101 placed on the base 220 in the plate-like body holding mechanism 200 of the present embodiment and the substrate 121 with the touch sensor are bonded together will be described with reference to FIGS. This will be described with reference to FIG.
FIG. 20 is a diagram for explaining the operation of the plate-shaped body holding mechanism 200 when the substrate 121 with a touch sensor is bonded to the display substrate 101 that is placed on the base portion 220 of the plate-shaped body holding mechanism 200 and warps upward. FIG. FIG. 21 is a diagram for explaining the operation of the plate-shaped body holding mechanism 200 when the substrate 121 with a touch sensor is bonded to the display substrate 101 warped downward placed on the base portion 220 of the plate-shaped body holding mechanism 200. FIG.

  First, an operation when the substrate 121 with a touch sensor is bonded to the display substrate 101 warped upward will be described. As shown in FIG. 20A, the lower surface of the substrate 121 with the touch sensor that is held by the substrate holding unit 11 and moved to the bonding position is in contact with both ends of the display substrate 101 in the X direction.

  Loads such as the substrate 121 with a touch sensor are applied to both ends of the display substrate 101 in the X direction, and the display substrate 101 is elastically deformed to follow the shape of the lower surface of the substrate 121 with a touch sensor as shown in FIG. 20B. Then, the upper surface of the display substrate 101 is in close contact with the lower surface of the substrate 121 with a touch sensor. Further, as the display substrate 101 is elastically deformed, the base portion 220 is elastically deformed, and the state where the upper surface of the base portion 220 is in close contact with the lower surface of the display substrate 101 is maintained. In addition, you may provide the base part movement mechanism in the 1st base part 211 which moves the 2nd base part 212 to an up-down direction. This pedestal portion moving mechanism moves the second pedestal portion 212 upward, thereby elastically deforming the display substrate 101 and the base portion 220 to bring the upper surface of the display substrate 101 into close contact with the lower surface of the substrate 121 with the touch sensor. it can.

  Then, the control unit 14 raises the pressing member 132 of the pressing unit 13. As a result, the pressing members 132 of the pressing unit 13 push up the four corners of the display substrate 101, and reliably bring the four corners of the display substrate 101 into contact with the substrate 121 with the touch sensor. In addition, control of the press part 13 of the control part 14 is mentioned later.

  Next, an operation when the substrate 121 with a touch sensor is bonded to the display substrate 101 warped downward will be described. As shown in FIG. 21A, the lower surface of the substrate 121 with the touch sensor that has been held by the substrate holding unit 11 and moved to the bonding position first comes into contact with the center of the display substrate 101 in the X direction.

  A load such as the substrate 121 with a touch sensor is applied to the central portion of the display substrate 101 in the X direction. For this reason, the display substrate 101 is elastically deformed so as to follow the lower surface of the substrate 121 with a touch sensor. Here, when the amount of warping downward of the display substrate 101 is large, only the elastic deformation of the display substrate 101 due to the load described above causes both ends of the display substrate 101 in the X direction and the substrate 121 with the touch sensor as shown in FIG. 21A. There is a possibility that a portion where both ends of the X direction do not come into contact with each other. Therefore, in the plate-like body holding mechanism 200 of the present embodiment, the pressing members 132 of the pressing unit 13 push up the four corners of the display substrate 101 as shown in FIG. 21B. For this reason, the display substrate 101 can be elastically deformed so that both ends in the X direction of the display substrate 101 and both ends in the X direction of the substrate 121 with the touch sensor can be brought into contact with each other. Thereby, the display substrate 101 and the substrate 121 with the touch sensor are brought into close contact with each other. Further, as the display substrate 101 is elastically deformed, the base portion 220 is elastically deformed, and the state where the upper surface of the base portion 220 is in close contact with the lower surface of the display substrate 101 is maintained.

  The operation of the substrate bonding apparatus 1 when the pressing member 132 of the pressing unit 13 pushes up the four corners of the display substrate 101 will be specifically described. First, the control unit 14 instructs the servo driver 16 (see FIG. 8) to drive the voice coil motor 131 by specifying the direction and amount of current to be supplied in order to raise the pressing member 132 of the pressing unit 13. To do. The servo driver 16 drives the voice coil motor 131 according to the designated current direction and current amount, and raises the shaft 135 (see FIG. 7) and the pressing member 132 of the voice coil motor 131.

  The control unit 14 receives the output voltage of the displacement detection sensor 19 (see FIG. 8) that changes as the shaft 135 and the pressing member 132 move, as a digital signal via the amplifier 18 and the A / D converter 17. To do.

  If the output voltage of the displacement detection sensor 19 does not change, it is considered that the shaft 135 did not rise at the current amount specified last time, so the servo driver is configured to flow a larger amount of current than the current amount specified last time. 16 is instructed.

  On the other hand, when the output voltage of the displacement detection sensor 19 has changed (becomes small), the servo driver is configured to flow the current of the current amount instructed in order to continuously raise the shaft 135 and the pressing member 132. 16 is instructed.

  When the shaft 135 and the pressing member 132 of each pressing portion 13 are raised, the pressing member 132 comes into contact with the four corners of the display substrate 101 from below. Then, the pressing member 132 pushes up the four corners of the display substrate 101 so as to contact the four corners of the substrate 121 with the touch sensor. As a result, the outer edges of both substrates 101 and 121 come into contact with each other.

  When the four corners of the display substrate 101 abut on the four corners of the substrate 121 with the touch sensor, the upward movement of the pressing member 132 and the shaft 135 is restricted. Therefore, thereafter, the output voltage of the displacement detection sensor 19 becomes constant, and the amount of current that the control unit 14 instructs the servo driver 16 continues to increase. Therefore, the amount of change in the amount of current in a predetermined time increases.

  Each time the controller 14 instructs the servo driver 16 to drive the voice coil motor 131, the controller 14 monitors the amount of change in the current amount, and determines whether or not the rate of change in the current value over a predetermined time has exceeded a predetermined threshold value.

  When the amount of change exceeds a predetermined threshold value, the amount of current supplied to the voice coil motor 131 to the servo driver 16 is fixed to the current value immediately before the change rate of the monitored current value changes suddenly. That is, the voice coil motor 131 is instructed to be pressed with a minimum force so that both substrates come into contact with each other. Thus, the four corners of the display substrate 101 are not pressed more than necessary after the two substrates 101 and 121 come into contact with each other. Therefore, it is possible to prevent the ultraviolet curable resin from protruding between the two substrates 101 and 121.

  Next, an operation when the thickness of the display substrate 101 or the substrate 121 with the touch sensor is not uniform will be described with reference to FIG. FIG. 22 is a diagram for explaining the operation when the thickness of the display substrate 101 is not uniform.

  As described above, the display substrate 101 and the touch sensor-equipped substrate 121 have a multilayer structure in which a plurality of members are stacked. For example, as shown in FIG. 22A, the plate thickness of one end in the X direction of the display substrate 101 may be thicker than the plate thickness of the other end. In this case, when the display substrate 101 and the touch sensor-equipped substrate 121 are bonded to each other, a gap may be generated between the other end portion of the display substrate 101 and the touch sensor-equipped substrate 121. Therefore, in the plate-like body holding mechanism 200 of the present embodiment, as described above, the support portion 210 tilts the base portion 220 around the axis extending along the X-axis direction and the axis extending along the Y-axis direction. I support it. For this reason, after the substrate 121 with the touch sensor arranged at the bonding position comes into contact with one end portion in the X direction of the display substrate 101, the base portion 220 as shown in FIG. Is inclined about an axis extending along the Y direction. As a result, the upper surface of the display substrate 101 placed on the base portion 220 and the lower surface of the substrate 121 with the touch sensor can be made parallel and in close contact with each other.

  Then, in the control unit 14, the pressing members 132 of the pressing unit 13 push up the four corners of the display substrate 101 so that the four corners of the display substrate 101 are brought into contact with the substrate 121 with a touch sensor. In addition, about the control of the press part 13 of the control part 14, it abbreviate | omits.

  After bringing the display substrate 101 and the touch sensor-equipped substrate 121 into close contact, the control unit 14 drives the exhaust valve 75 to set the exhaust port 73 in a closed state. Further, the intake valve 76 is driven, the intake port 74 is set to a small open state, and the air in the enclosure is sucked from the intake port 74 into the vacuum chamber 10a. When the pressure in the vacuum chamber 10a detected by the pressure sensor 15 becomes higher than a predetermined pressure after starting the intake of air, the control unit 14 drives the intake valve 76 to set the intake port 74 to a fully open state. . This speeds up the inhalation process.

  When the pressure in the vacuum chamber 10a becomes equal to the atmospheric pressure, if a gap is generated inside the substrates 101 and 121, as described above, the gap is a closed space. The resin is sucked and the gap can be crushed. Thus, the assembly of the substrate assembly 150 in which the display substrate 101 and the touch sensor-equipped substrate 121 are bonded together is completed.

  Next, the control unit 14 releases the holding of the substrate 121 with the touch sensor by the substrate holding unit 11. Subsequently, as shown in FIG. 23, the control unit 14 drives the lower member moving mechanism 9 to lower the lower member 8 to the initial position.

  Thereafter, the control unit 14 drives the transport unit 2 to transport the substrate assembly 150 to a resin curing unit (not shown). The resin curing unit cures the UV curable resin of the supplied substrate assembly 150.

  In the substrate bonding apparatus 1 of this embodiment, the base portion 220 is elastically deformed following the shape of the lower surface of the display substrate 101. For this reason, the lower surface of the display substrate 101 and the upper surface of the base portion 220 can be brought into close contact with each other through the suction portion 230 regardless of whether the display substrate 101 is warped or not. For this reason, it can prevent that a clearance gap produces between the display substrate 101 and the adsorption | suction part 230. FIG. Therefore, the adsorption unit 230 can reliably adsorb the display substrate 101 electrostatically. Accordingly, the display substrate 101 can be stably held by the plate-like body holding mechanism 200.

  Further, in the substrate bonding apparatus 1 of the present embodiment, the display substrate 101 and the substrate 121 with the touch sensor can be adhered and bonded regardless of the presence or absence of the display substrate 101 and the direction of the warp.

  Further, in the substrate bonding apparatus 1 of the present embodiment, the support portion 210 supports the base portion 220 so as to be tiltable about an axis extending along the X-axis direction and an axis extending along the Y-axis direction. . For this reason, when the board thickness of both the boards 101 and 121 or any one of the boards is not uniform, the base portion 220 has a thicker side that combines the boards 101 and 121 due to the load of the board 121 with the touch sensor. Tilt to lower. For this reason, the upper surface of the display substrate 101 can be made parallel to the lower surface of the substrate 121 with a touch sensor. As a result, a gap is hardly generated between the upper surface of the display substrate 101 and the lower surface of the substrate 121 with the touch sensor, and the degree of adhesion between the substrates 101 and 121 can be increased.

  Further, in the substrate bonding apparatus according to the present embodiment, when the display substrate 101 and the substrate 121 with a touch sensor are bonded together, the pressing member 132 pushes up the four corners of the display substrate 101 upward, and the four corners of the substrate 121 with a touch sensor. Abut. Thereby, the outer edge portions of both the substrates 101 and 121 are in contact with each other via the ultraviolet curable resin, and the occurrence of a separation portion where the outer edge portions of the both substrates 101 and 121 are separated can be prevented. For this reason, even when a gap is formed inside the two substrates 101 and 121 with the UV curable resin interposed therebetween, the outer edge of both the substrates 101 and 121 abuts, so that the gap becomes a closed space. Therefore, when the pressure in the vacuum chamber 10a becomes equal to the atmospheric pressure, the surrounding ultraviolet curable resin is sucked into the gap, and the gap can be crushed. Therefore, the substrates 101 and 121 can be bonded with high accuracy without generating bubbles between the substrates 101 and 121.

<Second Embodiment>
Hereinafter, a plate-like body holding mechanism 300 of a substrate bonding apparatus according to a second embodiment of the present invention will be described with reference to FIGS. FIG. 24 is a perspective view showing the support portion 301 of the plate-like body holding mechanism 300 according to the second embodiment. FIG. 25 is an exploded perspective view of the support portion 301 of the plate-like body holding mechanism 300 according to the second embodiment.

  24 and 25, the same reference numerals are given to members common to the first embodiment, and the description thereof is omitted. The plate-like body holding mechanism 300 according to the second embodiment is different from the plate-like body holding mechanism 200 according to the first embodiment in that the plate-like body holding mechanism 300 has a pedestal joint 304.

The plate-like body holding mechanism 300 holds the display substrate 101 from below. The plate-like body holding mechanism 300 includes a support portion 301, a base portion 220 and a suction portion 230 that are not shown in FIGS. 24 and 25.
The support part 301 supports the base part 220 from below. The support portion 301 includes a first pedestal portion 302 formed in a rectangular flat plate shape, and a second pedestal portion 303 provided at a substantially central portion of the first pedestal portion 302. At the four corners of the first pedestal portion 302, the pressing portions 13 are provided.

The second pedestal portion 303 includes a pedestal joint portion 304 and a base support portion 309.
The base joint portion 304 includes a joint portion 305, a connecting portion 306, a fixing portion 307, and a pair of coil springs 308. The joining portion 305, the connecting portion 306, and the fixing portion 307 are integrally formed.

  The joint portion 305 is formed in a metal rectangular plate shape, and the long sides facing each other extend along the X direction, and the short sides facing each other extend along the Y direction. The lower surface of the joint portion 305 is fixed to the upper surface of the substantially central portion of the first pedestal portion 302.

  The fixing portion 307 is formed in a metal rectangular plate shape, and the long sides facing each other extend along the X direction, and the short sides facing each other extend along the Y direction. The length of the long side of the fixing portion 307 (the length in the X direction) is set to be approximately equal to the length of the joint portion 305.

The connecting portion 306 is formed in a plate shape having two planes orthogonal to the X direction, and extends downward from the lower surface of the fixed portion 307 and continues to the upper surface of the joint portion 305.
The connecting portion 306 is set to be lower in rigidity than the joint portion 305 and the fixing portion 307, and can be elastically deformed. When the connecting portion 306 is elastically deformed, the fixing portion 307 is inclined such that the long side is inclined with respect to the Y direction.

  The pair of coil springs 308 are provided with the connecting portion 306 sandwiched between the joint portion 305 and the fixing portion 307, and urge the fixing portion 307 upward so that the fixing portion 307 remains horizontal. When a force larger than the urging force of the coil spring 308 is input to the fixed portion 307 and the connecting portion 306 is elastically deformed and the fixed portion 307 is inclined, the pair of coil springs 308 expands and contracts with this inclination.

  The height of the connecting portion 306 is that the fixing portion 307 is inclined due to the elastic deformation of the connecting portion 306, and the fixing portion 307 is inclined about the axis extending through the base end of the connecting portion 306 along the Y axis. The height is set to be approximately equal.

  The base support part 309 includes a joining part 310, a coupling part 311, and a base fixing part 312. The joint portion 310, the joint portion 311 and the base fixing portion 312 are integrally formed.

  The joint portion 310 is formed in a metal rectangular plate shape, and the long sides facing each other extend along the Y direction, and the short sides facing each other extend along the X direction. The lower surface of the joint portion 310 is fixed to the upper surface of the substantially central portion in the X direction of the fixing portion 307 of the base joint portion 304. The length of the long side of the joint part 310 is set substantially equal to the length of the short side of the fixed part 307 of the base joint part 304.

  The base fixing portion 312 is formed in a metal rectangular plate shape, and the long sides facing each other extend along the Y direction, and the short sides facing each other extend along the X direction. The length of the long side (the length in the Y direction) of the base fixing part 312 is set longer than the length of the joint part 310.

The coupling portion 311 is formed in a plate shape having two planes orthogonal to the Y direction, and extends downward from the lower surface of the base fixing portion 312 and continues to the upper surface of the joining portion 310.
The joint portion 311 is set to be lower in rigidity than the joint portion 310 and the base fixing portion 312 and can be elastically deformed. As the coupling portion 311 is elastically deformed, the base fixing portion 312 is inclined such that the long side is inclined with respect to the Y direction.

The height of the coupling part 311 is such that the base fixing part 312 is inclined due to elastic deformation of the coupling part 311, and the base fixing part 312 is tilted around an axis extending through the base end of the coupling part 311 along the X axis. The height is set to be approximately equal to that.
As described above, the fixing portion 307 of the base joint portion 304 is tilted around the axis extending along the Y axis, and the base fixing portion 312 of the base support portion 309 is tilted around the axis extending along the X axis. Therefore, the support portion 301 supports the base portion 220 so as to be tiltable about an axis extending along the Y axis and an axis extending along the X axis. The support portion 301 restricts the base portion 220 from moving in the X direction, the Y direction, and the θ direction.

  In the substrate bonding apparatus according to the present embodiment, the support portion 301 supports the base portion 220 so as to be tiltable around an axis extending along the X-axis direction and an axis extending along the Y-axis direction. For this reason, when the board thickness of both the boards 101 and 121 or any one of the boards is not uniform (see FIG. 22), the base 220 combines the boards 101 and 121 by the load of the touch sensor-equipped board 121 or the like. Inclined so that the thicker side is lower. Therefore, the upper surface of the display substrate 101 can be made parallel to the lower surface of the substrate 121 with a touch sensor. As a result, a gap is hardly generated between the upper surface of the display substrate 101 and the lower surface of the substrate 121 with the touch sensor, and the degree of adhesion between the substrates 101 and 121 can be increased.

<Third Embodiment>
Hereinafter, a plate-like body holding mechanism 400 according to a third embodiment of the present invention will be described with reference to FIG. FIG. 26 is a perspective view showing the support portion 401 of the plate-like body holding mechanism 400 according to the third embodiment.

  In FIG. 26, members common to the first embodiment are denoted by the same reference numerals, and description thereof is omitted. The plate-like body holding mechanism 400 according to the third embodiment is different from the plate-like body holding mechanisms 200 and 300 according to the first embodiment and the second embodiment in that the plate-like body holding mechanism 400 has coil springs 407 in four directions. Is different.

The plate-like body holding mechanism 400 holds the display substrate 101 from below. The plate-like body holding mechanism 400 includes a support portion 401 and a base portion 220 and a suction portion 230 that are not shown in FIG.
The support part 401 supports the base part 220 from below. The support portion 401 includes a first pedestal portion 402 formed in a rectangular flat plate shape, and a second pedestal portion 403 provided at a substantially central portion of the first pedestal portion 402. At the four corners of the first pedestal portion 402, pressing portions 13 are provided.

  The second pedestal portion 403 includes a first flat plate portion 404, a second flat plate portion 405, a support body 406, and a coil spring 407. The first flat plate portion 404 is formed in a rectangular plate shape, and long sides facing each other extend along the Y direction, and short sides facing each other extend along the X direction. The lower surface of the first flat plate portion 404 is fixed to the central portion of the upper surface of the first pedestal portion 402.

  The second flat plate portion 405 is formed in a rectangular plate shape, and the long sides facing each other extend along the Y direction, and the short sides facing each other extend along the X direction. The length of the long side and the short side of the second flat plate portion 405 is equal to the length of the long side and the short side of the first flat plate portion 404. The upper surface of the second flat plate portion 405 is fixed to the central portion of the lower surface of the base portion 220 with an adhesive or a screw.

  The support body 406 is formed in a cylindrical shape with an elastic material such as elastic resin or rubber, the lower end portion is fixed to the center portion of the upper surface of the first flat plate portion 404, and the upper end portion is the center of the lower surface of the second flat plate portion 405. It is fixed to the part. The support body 406 regulates the movement of the second flat plate portion 405 and the base portion 220 joined to the second flat plate portion 405 in the X direction, the Y direction, and the θ direction. Note that a steel ball may be used as the support 406.

The coil spring 407 is arranged in four directions between the first flat plate portion 404 and the second flat plate portion 405, the lower end portion is fixed to the upper surface of the first flat plate portion 404, and the upper end portion is on the lower surface of the second flat plate portion 405. It is fixed. These coil springs 407 expand and contract according to the inclination of the second flat plate portion 405. Instead of the coil spring 407, another elastic member such as a leaf spring may be used.
By the support part 401 configured as described above, the base part 220 has all the axes (an axis extending along the X axis direction and an axis extending along the Y axis direction) formed in the radiation direction along the XY plane from the center. Including the center) so that it can tilt.

  In the substrate bonding apparatus of the present embodiment, the support portion 401 supports the base portion 220 so as to be tiltable about all axes formed in the radiation direction along the XY plane from the center. For this reason, when the board thickness of both the boards 101 and 121 or any one of the boards is not uniform (see FIG. 22), the base 220 combines the boards 101 and 121 by the load of the touch sensor-equipped board 121 or the like. Inclined so that the thicker side is lower. For this reason, the upper surface of the display substrate 101 can be made parallel to the lower surface of the substrate 121 with a touch sensor. As a result, a gap is hardly generated between the upper surface of the display substrate 101 and the lower surface of the substrate 121 with the touch sensor, and the degree of adhesion between the substrates 101 and 121 can be increased.

<Fourth Embodiment>
Hereinafter, a plate-like body holding mechanism 500 according to a fourth embodiment of the present invention will be described with reference to FIG. FIG. 27 is a perspective view showing the support portion 501 of the plate-like body holding mechanism 500 according to the fourth embodiment. The plate-like body holding mechanism 500 according to the fourth embodiment is different from the plate-like body holding mechanisms 200, 300, and 400 according to other embodiments in that a plate spring 505 is provided.

The plate-like body holding mechanism 500 holds the display substrate 101 from below. The plate-like body holding mechanism 500 includes a support portion 501 and a base portion 220 and a suction portion 230 that are not shown in FIG.
The support part 501 supports the base part 220 from below. The support portion 501 includes a flat plate-like first pedestal portion 502 and a second pedestal portion 503 provided at a substantially central portion of the first pedestal portion 502. The pressing portions 13 are provided at the four corners of the first pedestal portion 502.

  The second pedestal portion 503 includes a pair of leaf spring support portions 504, a leaf spring 505 supported by these leaf spring support portions 504, and a base support portion 508 fixed to the upper surface of the leaf spring 505. It is configured.

  The pair of leaf spring support portions 504 are fixed to the upper surface of the first pedestal portion 502. The pair of leaf spring support portions 504 are arranged at a central portion in the X direction of the first pedestal portion 502 with a predetermined distance in the Y direction. The leaf spring support portion 504 is formed in a metal prism shape.

  The plate spring 505 includes a joining plate portion 506 in which long sides facing each other extend in the Y direction and short sides facing each other in the X direction, and long sides facing each other in the X direction. And a fixed plate portion 507 having short sides that extend along the Y direction. The central portion of the joining plate portion 506 and the central portion of the fixed plate portion 507 are integrally formed, and the leaf spring 505 is formed in a substantially cross shape when viewed from above.

Both ends in the Y direction of the joining plate portion 506 are provided with screw holes (not shown) penetrating in the up-down direction. The joining plate portion 506 is formed by the screws that pass through the screw holes. It is fixed on the top surface. Accordingly, the leaf spring 505 is suspended from the leaf spring support portion 504.
A base support portion 508 is fixed to the upper surfaces of both end portions in the X direction of the fixing plate portion 507 with an adhesive or a screw.

  The rigidity of the joining plate portion 506 and the fixed plate portion 507 is set so as to allow torsion by being elastically deformed around the central axis P and the central axis Q by a force inputted from above. When the joining plate portion 506 is twisted about the central axis P extending along the Y direction, the base support portion 508 fixed to the upper surface of the leaf spring 505 is inclined in the direction of arrow D in FIG. .

  In addition, when the fixed plate portion 507 is twisted about the central axis Q extending along the X direction, the base support portion 508 fixed to the upper surface of the plate spring 505 moves in the direction of arrow E in FIG. Tilt.

  The base support portion 508 is formed in a metal rectangular plate shape, and the long sides facing each other extend along the X direction, and the short sides facing each other extend along the Y direction. The length of the long side of the base support portion 508 (the length in the X direction) is set equal to the length of the long side of the fixed plate portion 507 of the leaf spring 505. At both ends of the base support portion 508 in the X direction, prismatic leg portions 509 projecting downward are provided. The lower surface of the leg portion 509 is fixed to the upper surface of the fixed plate portion 507. Further, the lower surface of the central portion in the Y direction of the base portion 220 (not shown) is fixed to the upper surface of the base support portion 508. Accordingly, the base portion 220 is supported by the support portion 501 so as to be tiltable about an axis extending along the X-axis direction and an axis extending along the Y-axis direction. The support portion 501 restricts the base portion 220 from moving in the X direction, the Y direction, and the θ direction.

In the substrate bonding apparatus of the present embodiment, the support portion 501 supports the base portion 220 so as to be tiltable about an axis extending along the X-axis direction and an axis extending along the Y-axis direction. For this reason, when the board thickness of both the boards 101 and 121 or any one of the boards is not uniform (see FIG. 22), the base 220 combines the boards 101 and 121 by the load of the touch sensor-equipped board 121 or the like. Inclined so that the thicker side is lower. Therefore, the upper surface of the display substrate 101 can be made parallel to the lower surface of the substrate 121 with a touch sensor. As a result, a gap is hardly generated between the upper surface of the display substrate 101 and the lower surface of the substrate 121 with the touch sensor, and the degree of adhesion between the substrates 101 and 121 can be increased.
Further, the structure of the support portion 501 can be simplified.

  The embodiment of the substrate bonding apparatus of the present invention has been described above including the effects thereof. However, the plate-like body holding mechanism and the substrate bonding apparatus of the present invention are not limited to the above-described embodiments, and various modifications may be made without departing from the spirit of the invention described in the claims. Is possible.

For example, in the first to third embodiments, the mode in which the display substrate 101 is supported by the plate-like body holding mechanisms 200, 300, 400, and 500 has been described, but the plate-like body holding mechanisms 200, 300, 400, and 500 are described. Thus, the substrate 121 with a touch sensor may be held. In this case, the display substrate 101 is held by the substrate holding unit 11.
Further, the substrate holding unit 11 may be configured in the same manner as the plate-like body holding mechanism 200, 300, 400, 500.

  In addition, after the substrates 101 and 121 are brought into close contact with each other, before the air is sucked from the intake port 74, the control unit 14 detects a position of both the substrates 101 and 121 provided in the substrate bonding apparatus 1. Alignment may be performed based on the detection result output from the above. In this case, the alignment is performed by the control unit 14 controlling the operation of the lower member moving mechanism 9 to move or rotate the lower member 8 in the X direction, the Y direction, and the θ direction.

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate bonding apparatus, 2 ... Conveyance part, 4 ... Support frame, 7 ... Upper member, 8 ... Lower member, 9 ... Lower member moving mechanism, 10 ... Vacuum container, 10a ... Vacuum chamber, 11 ... Substrate holding part ( Holding part), 12 ... holding part moving mechanism (driving part), 13 ... pressing part, 14 ... control part, 19 ... displacement detection sensor, 101 ... display substrate (plate-like body, first plate-like body), 121 ... Substrate with touch sensor (second plate-like body), 200 ... plate-like body holding mechanism, 210 ... support portion, 211 ... first pedestal portion, 212 ... second pedestal portion, 213 ... leaf spring support portion, 214 ... plate Spring, 215 ... base support part, 216 ... joint part, 217 ... base fixing part, 218 ... coupling part, 220 ... base part, 230 ... adsorption part

Claims (4)

A sheet-like adsorption portion that electrostatically adsorbs a rectangular plate-like plate-like body;
It is formed in a plate shape, the suction part is fixed on one surface, and the Young's modulus in the plate thickness direction is set so that it can be elastically deformed together with the suction part according to the shape of the suction target surface of the plate-like body The base part made,
A plate-like body holding mechanism comprising: a support portion that supports the base portion so as to be elastically deformable. The base portion is formed in a rectangular plate shape,
The plate-like body holding mechanism according to claim 1, wherein the long side of the one surface of the base part is warped with a warpage amount equal to the maximum upward warping amount at both ends of the long side of the plate-like body. The support portion is centered on an axis extending in a first direction orthogonal to the parallel direction in which the support portion and the base portion are parallel, and an axis extending in the second direction orthogonal to the parallel direction and the first direction. The plate-like body holding mechanism according to claim 1, wherein the base portion is supported so as to be tiltable. In the substrate laminating apparatus for laminating the rectangular plate-like first plate-like body and the second plate-like body under vacuum via an adhesive member,
A sheet-like suction portion that electrostatically attracts the first plate-like body, and is formed in a plate shape, the suction portion is fixed to one surface, and the Young's modulus in the plate thickness direction is the first plate-like shape. A plate-like body holding mechanism having a base part set so as to be elastically deformable together with the suction part according to the shape of the attracted surface of the body, and a support part that supports the base part elastically deformable;
A holding unit that holds one surface of the second plate-like member facing the other surface, which is the surface opposite to the surface to be sucked in the first plate-like member sucked by the suction unit;
The support part and the holding part are relatively moved, the other surface of the first plate-like body adsorbed by the adsorption part, and the second plate-like body held by the holding part A drive unit for contacting the one surface,
The support portion is centered on an axis extending in a first direction orthogonal to the parallel direction in which the support portion and the base portion are parallel, and an axis extending in the second direction orthogonal to the parallel direction and the first direction. A substrate bonding apparatus that supports the base portion so as to be tiltable.