CN101405427A - 氧化锌系透明导体以及该透明导体形成用溅射靶 - Google Patents
氧化锌系透明导体以及该透明导体形成用溅射靶 Download PDFInfo
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- CN101405427A CN101405427A CNA2007800095851A CN200780009585A CN101405427A CN 101405427 A CN101405427 A CN 101405427A CN A2007800095851 A CNA2007800095851 A CN A2007800095851A CN 200780009585 A CN200780009585 A CN 200780009585A CN 101405427 A CN101405427 A CN 101405427A
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- Prior art keywords
- zinc oxide
- transparent conductor
- doping agent
- type doping
- nitrogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 title claims abstract description 82
- 239000004020 conductor Substances 0.000 title claims abstract description 49
- 239000011787 zinc oxide Substances 0.000 title claims abstract description 41
- 238000005477 sputtering target Methods 0.000 title claims description 16
- 239000002019 doping agent Substances 0.000 claims abstract description 80
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 71
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 36
- 239000011701 zinc Substances 0.000 claims abstract description 14
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 13
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 claims description 31
- 229910052733 gallium Inorganic materials 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical group [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 7
- 239000004411 aluminium Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 19
- 239000002994 raw material Substances 0.000 abstract description 13
- 230000000052 comparative effect Effects 0.000 description 13
- 230000000694 effects Effects 0.000 description 13
- 239000012535 impurity Substances 0.000 description 13
- 239000000843 powder Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 229910002601 GaN Inorganic materials 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008676 import Effects 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical group O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 150000002831 nitrogen free-radicals Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
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- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
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- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
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- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- C04B35/645—Pressure sintering
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
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- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
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- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
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- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3286—Gallium oxides, gallates, indium oxides, indates, thallium oxides, thallates or oxide forming salts thereof, e.g. zinc gallate
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- C04B2235/38—Non-oxide ceramic constituents or additives
- C04B2235/3852—Nitrides, e.g. oxynitrides, carbonitrides, oxycarbonitrides, lithium nitride, magnesium nitride
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- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
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- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
Abstract
Description
试料No. | n型掺杂元素 | 浓度(原子%) | 氮/Ga+Al(原子数比) | 电阻率(mΩcm) |
实施例1 | Ga | 2 | 0.5 | 0.68 |
实施例2 | Ga | 5 | 0.3 | 0.29 |
实施例3 | Ga | 5 | 0.4 | 0.21 |
实施例4 | Ga | 5 | 0.5 | 0.18 |
实施例5 | Ga | 5 | 0.6 | 0.35 |
实施例6 | Ga | 8 | 0.5 | 0.85 |
实施例7 | Al和Ga | 2 | 0.5 | 0.65 |
实施例8 | Al和Ga | 5 | 0.3 | 0.26 |
实施例9 | Al和Ga | 5 | 0.4 | 0.19 |
实施例10 | Al和Ga | 5 | 0.5 | 0.17 |
实施例11 | Al和Ga | 5 | 0.6 | 0.33 |
实施例12 | Al和Ga | 8 | 0.5 | 0.83 |
比较例1 | In | 2 | 0.5 | 2.58 |
比较例2 | In | 5 | 0.3 | 1.55 |
比较例3 | In | 5 | 0.4 | 1.23 |
比较例4 | In | 5 | 0.5 | 0.98 |
比较例5 | In | 5 | 0.6 | 2.83 |
比较例6 | In | 8 | 0.5 | 3.88 |
Claims (7)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006073822 | 2006-03-17 | ||
JP073822/2006 | 2006-03-17 | ||
PCT/JP2007/052928 WO2007108266A1 (ja) | 2006-03-17 | 2007-02-19 | 酸化亜鉛系透明導電体及び同透明導電体形成用スパッタリングターゲット |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101405427A true CN101405427A (zh) | 2009-04-08 |
CN101405427B CN101405427B (zh) | 2012-07-18 |
Family
ID=38522302
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800095851A Active CN101405427B (zh) | 2006-03-17 | 2007-02-19 | 氧化锌系透明导体以及该透明导体形成用溅射靶 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7699965B2 (zh) |
EP (1) | EP1997931B1 (zh) |
JP (1) | JP4850901B2 (zh) |
KR (1) | KR101028985B1 (zh) |
CN (1) | CN101405427B (zh) |
TW (1) | TW200746180A (zh) |
WO (1) | WO2007108266A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102452195A (zh) * | 2010-10-27 | 2012-05-16 | 鸿富锦精密工业(深圳)有限公司 | 镀膜件及其制备方法 |
Families Citing this family (25)
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EP1897969B1 (en) * | 2005-06-28 | 2019-01-23 | JX Nippon Mining & Metals Corporation | Gallium oxide-zinc oxide sputtering target and method for forming a transparent conductive film using the target |
JP4054054B2 (ja) * | 2005-06-28 | 2008-02-27 | 日鉱金属株式会社 | 酸化ガリウム−酸化亜鉛系スパッタリングターゲット、透明導電膜の形成方法及び透明導電膜 |
US7674404B2 (en) * | 2005-12-08 | 2010-03-09 | Nippon Mining & Metals Co., Ltd. | Gallium oxide/zinc oxide sputtering target, method of forming transparent conductive film and transparent conductive film |
JP5109418B2 (ja) * | 2006-04-26 | 2012-12-26 | 三菱マテリアル株式会社 | ZnO蒸着材及びその製造方法並びにZnO膜の形成方法 |
US8007693B2 (en) * | 2006-08-24 | 2011-08-30 | Jx Nippon Mining & Metals Corporation | Zinc oxide based transparent electric conductor, sputtering target for forming of the conductor and process for producing the target |
US8747630B2 (en) | 2007-01-16 | 2014-06-10 | Alliance For Sustainable Energy, Llc | Transparent conducting oxides and production thereof |
KR20120108062A (ko) * | 2007-06-26 | 2012-10-04 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 아모르퍼스 복합 산화막, 결정질 복합 산화막, 아모르퍼스 복합 산화막의 제조 방법, 결정질 복합 산화막의 제조 방법 및 복합 산화물 소결체 |
US8277694B2 (en) * | 2007-07-13 | 2012-10-02 | Jx Nippon Mining & Metals Corporation | Sintered compact of composite oxide, amorphous film of composite oxide, process for producing said film, crystalline film of composite oxide and process for producing said film |
JP4808682B2 (ja) * | 2007-08-03 | 2011-11-02 | Jx日鉱日石金属株式会社 | 焼結体、透明導電膜の製造方法及び透明導電膜 |
US8253012B2 (en) * | 2008-03-17 | 2012-08-28 | Alliance For Sustainable Energy, Llc | High quality transparent conducting oxide thin films |
CN102016112B (zh) * | 2008-06-10 | 2012-08-08 | Jx日矿日石金属株式会社 | 溅射用氧化物烧结体靶及其制造方法 |
US9260779B2 (en) * | 2009-05-21 | 2016-02-16 | Semiconductor Energy Laboratory Co., Ltd. | Light-transmitting conductive film, display device, electronic device, and manufacturing method of light-transmitting conductive film |
CN102459122B (zh) | 2009-06-05 | 2014-02-05 | 吉坤日矿日石金属株式会社 | 氧化物烧结体、其制造方法以及氧化物烧结体制造用原料粉末 |
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CN102452195A (zh) * | 2010-10-27 | 2012-05-16 | 鸿富锦精密工业(深圳)有限公司 | 镀膜件及其制备方法 |
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KR101028985B1 (ko) | 2011-04-12 |
JP4850901B2 (ja) | 2012-01-11 |
WO2007108266A1 (ja) | 2007-09-27 |
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US20090085014A1 (en) | 2009-04-02 |
TW200746180A (en) | 2007-12-16 |
EP1997931B1 (en) | 2014-01-01 |
EP1997931A4 (en) | 2011-12-21 |
JPWO2007108266A1 (ja) | 2009-08-06 |
EP1997931A1 (en) | 2008-12-03 |
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US7699965B2 (en) | 2010-04-20 |
TWI355005B (zh) | 2011-12-21 |
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