CN101380692A - Laser surface micro forming device and method - Google Patents
Laser surface micro forming device and method Download PDFInfo
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- CN101380692A CN101380692A CN 200810155787 CN200810155787A CN101380692A CN 101380692 A CN101380692 A CN 101380692A CN 200810155787 CN200810155787 CN 200810155787 CN 200810155787 A CN200810155787 A CN 200810155787A CN 101380692 A CN101380692 A CN 101380692A
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Abstract
The invention discloses a laser surface micro-processing device and a method thereof. The laser surface micro-processing device consists of a laser, an external light path part, a rotating and moving workpiece as well as a control part controlling the laser and the rotating and moving of the workpiece. After the processed workpiece moves in a rotating way with a main shaft, a pulse signal which shows the rotating position of the workpiece is output by an incremental encoder, thus leading the pulse emitting time of the laser to be coupled with the rotating time of the workpiece and just walking through the rotating distance between two processing points on the workpiece in the clearance time of two or a plurality of pulses; the control signal of an acoustooptic Q switch output by an industrial personal computer after frequency demultiplication controls the laser to output a single-pulse laser beam; a four-shaft moving control card controls the moving of a two-dimensional lead rail and a lead rail to lead the laser beam and the surface of the workpiece to generate feed movement for processing a micro concave cavity and a micro groove. The invention can lead the adverse thermal effect brought by the laser during processing to be reduced to be lowest and can ensure the surface processing quality of a feature to the largest extent simultaneously when considering the processing efficiency and processing cost.
Description
Technical field
The present invention relates to the Laser Micro-Machining field, particularly a kind of laser surface micro-moulding technology that can process nick chamber and micro groove at surface of the work.
Background technology
Process suitable surface microscopic topographic at surface of friction pair, can significantly improve the greasy property of friction pair, improve the service life of friction pair.In order to reach these requirements, just must guarantee the suface processing quality of pattern; Simultaneously, in order to apply, also must to improve working (machining) efficiency as much as possible, reduce cost in the industrial production field.
The laser surface micro-moulding technology is a kind of modernized processing method easy to control, high efficiency.Actual that is that all right is ripe but prior art is used for industrial production, and particularly for the surface micro-moulding of metal material, its crudy is difficult to control especially.For example: 1. traditional CO2 laser instrument and YAG laser instrument, its output wavelength is in infrared band, and focal beam spot is bigger, so processing dimension is also corresponding bigger, and the interaction between its laser and the material is thermal process, can cause the carbonization and the suface processing quality variation of material.2. copper evaporation laser instrument can output wavelength be blue light 511nm and gold-tinted 578nm, power output can reach several hectowatts, good beam quality can be focused into severally to tens microns very little hot spots, is used for pottery, diamond, silicon, high molecular polymer and various metal material are carried out microfabrication.But copper evaporation laser instrument appearance and size is huge, costs an arm and a leg, poor reliability, and the maintaining workload is big, is not suitable for a large amount of industrial production.3. application number is that 200310111573.3 patent application discloses a kind of PRK electrochemistry method for manufacturing microstructure and device thereof, can on substrates such as semiconductor, metal, process the micro-structural of micron dimension, but this method exist running expense height, stability not enough, be difficult to shortcoming such as processing ceramic material.4. application number is that the patent application of 03116837.x discloses a kind of method of utilizing femtosecond laser processing periodic micro-structural on metallic film, but femto-second laser is bulky, and complex structure costs an arm and a leg, and its stability and reliability are relatively poor.
At present, owing to the amount that a laser pulse can be removed material is limited, in order to reach the desired depth of surface topography, add man-hour like this, need play a plurality of pulses at same some place with pulse laser, traditional pulse mode of beating is " a pulse continuous several times ", promptly repeat continuously at same some place to beat repeatedly with pulse laser, this mode is owing to be to beat continuously, and the time is longer, the negative effect of heat affecting is more serious, machined surface second-rate.
Summary of the invention
The objective of the invention is to have proposed high laser surface micro forming device of a kind of crudy and method in order to overcome above-mentioned the deficiencies in the prior art,
The technical scheme that apparatus of the present invention adopt is: form by the control section that the rotation of laser instrument, outer light path part, rotation and travelling workpiece parts, control laser instrument and control workpiece is moved, along the optical path direction of described laser instrument built-in successively laser aid, two adjustable direction total reflective mirrors, acousto-optic Q modulation switch, diaphragm, optical gate, laser generator and outgoing mirrors; Described outer light path part connects laser instrument and CCD camera, reflective mirror and laser head is installed from top to bottom successively by light pipe, and the fixing Z that is connected with servomotor of outer light path part one side is to vertical moving guide rail, and expansion bracket is fixed on the guide rail; Described rotation and travelling workpiece parts are positioned at the laser head below, comprise rotary main shaft and planar guide rail, connect servomotor respectively, in the main shaft coaxial direction one incremental encoder are installed; Control section comprises industrial computer, servomotor and motor servo driver.
The technical scheme that the inventive method adopts is to comprise the steps:
(A) workpiece to be processed is fixed on the main shaft, rotates with main shaft; Turn over the pulse signal of position by incremental encoder output reflection workpiece, encoded device numbered card quadruple, counting are handled, make laser pulse send the coupling of time and workpiece rotational time, the rotary distance on the workpiece of promptly in the aperture time of two or more pulses, just in time passing by between two processing stands;
(B) export the pulse laser beam by the control signal control laser instrument of output acousto-optic Q modulation switch behind the industrial computer frequency division; Laser beam focuses on by light path system and is radiated at surface of the work; Control moving of two-dimentional guide rail and guide rail by four-axis movement control card, make laser beam and surface of the work produce feed motion;
(C) feed motion that the control of main shaft and laser instrument and workpiece and laser beam is produced by means of D/A card and encoder to count card, a plurality of laser pulses are beaten at interval repeatedly by same some place at surface of the work, but process the nick chamber and the micro groove of controlling depth.
The invention has the beneficial effects as follows:
1, adds the hot negative effect of bringing by laser man-hour and drop to minimumly by adjusting the interval on a plurality of pulse operating times in same some place on the workpiece, can making, when taking into account working (machining) efficiency, processing cost, farthest guarantee the suface processing quality of pattern.
2, can carry out the moulding of little hole or groove on the inside and outside wall surface of bucket class workpiece such as for example cylinder jacket, the spacing of little hole or groove and depth controlled under the workpiece duty, form hydrldynamic pressure lubrication on its surface, thereby reduce wearing and tearing, increase the service life.
3, can carry out the moulding of little hole at plane class surface of the work, little hole spacing and depth controlled, be suitable for mechanical seal, thrust bearing, gather and become the cavity of oil storage in a large amount of little hole on sealing ring surface, mechanical seal is operated under zero leakage, the contactless state, prolongs its service life greatly.
4, can carry out the moulding of little hole as space curved surface class surface of the works such as the cam of camshaft, ball-joints, in working order down, form elastohydrodynamic lubrication, the effect of can obtain anti-attrition, lengthening the life on its surface.
Description of drawings
Fig. 1 is the structural representation of apparatus of the present invention;
Fig. 2 is laser instrument 2 cut-away views among Fig. 1;
Fig. 3 is outside light channel structure figure among Fig. 1, and wherein (a) is the curved head type laser head, (b) is straight peen type laser head;
Fig. 4 is the control section block diagram of Fig. 1;
Fig. 5 is a processing technology schematic diagram of the present invention;
Fig. 6 is the schematic cross-sectional view in the nick chamber 39 that processes with the inventive method;
Fig. 7 is the schematic cross-sectional view of the micro groove 38 that processes with the inventive method;
Fig. 8 be in the embodiment of the invention 1 to cylinder sleeve workpiece 35 micro forming schematic diagrames;
Fig. 9 is the expanded view of cylinder sleeve workpiece 35 among Fig. 8;
Figure 10 is the micro forming schematic diagram of sealing ring workpiece 36 in the embodiment of the invention 2;
Figure 11 is the process principle figure of wide helicla flute 40;
Figure 12 is the A partial enlarged drawing of wide helicla flute 40 among Figure 11.
Among the figure: 1. laser power supply; 2. laser instrument; 3. tailstock; 4. Q-switch driver; 5. light pipe; 6. laser head; 7.CCD camera; 8. servomotor; 9. protecgulum; 10.Z to vertical rail; 11. expansion bracket; 12. sleeve; 13. servomotor; 14. main shaft; 15. servomotor; 16.Y to moving guide rail; 17. servomotor; 18.X to moving guide rail; 19. base; 20. laser aid; 21, the adjustable total reflective mirror of 22. directions; 23. total reflective mirror; 24. acousto-optic Q modulation switch; 25. diaphragm; 26. optical gate; 27. laser generator; 28. outgoing mirror; 29. speculum; 30. condenser lens; 31. total reflective mirror; 32. protective glass; 33. outside optical system; 34. laser; 35. cylinder sleeve workpiece; 36. sealing ring workpiece; 37. workbench; 38. micro groove; 39. nick chamber; 40. wide helicla flute; r
p. nick chamber radius; h
p. the nick chamber degree of depth; b
g. the micro groove width; h
g. the micro groove degree of depth; 1 ', 2 ', 3 ' ... n-1 ', n '. cavity number numbering.
The specific embodiment
As Figure 1-3, laser surface micro forming device of the present invention mainly comprise laser instrument 2 with outer light path part, worktable part, be used to control the control section composition of workbench and laser instrument 2.Laser instrument 2 is fixed in tailstock 3 tops, along optical path direction built-in successively HeNe laser aid 20, the two adjustable total reflective mirrors 21 of direction and 22, total reflective mirror 23, acousto-optic Q modulation switch 24, diaphragm 25, optical gate 26 laser generators 27 and outgoing mirrors 28.Laser power supply 1 and Q-switch driver 4 are fixed on the tailstock 3.Outer light path part is positioned at the right-hand of laser instrument 2 and fixing with protecgulum 9, is followed successively by CCD camera 7, reflective mirror 29 and laser head 6 from top to bottom, and laser head 6 is made up of condenser lens 30, total reflective mirror 31, protective glass 32 successively.Metal sleeve 12 is connected with laser head 6.The side direction of outer light path part has the assist gas injection apparatus, is fixed on the expansion bracket 11, and expansion bracket 11 is fixed in Z on vertical moving guide rail 10, and guide rail is driven by ball-screw by servomotor 8; Laser instrument 2 is to be connected by light pipe 5 with outer light path part.Workbench 37 parts that are installed on the base 19 are positioned at laser head 6 belows, comprise the two-dimentional moving guide rail 16,18 of rotary main shaft 14 and plane X, Y direction, are driven by servomotor 13,15,17 respectively; Main shaft 14 coaxial direction are installed a high accuracy incremental encoder.
As Fig. 4, control section comprises industrial computer, motor servo driver and servomotor; A four-axis movement control card is equipped with in parallel connection on the isa bus in the industrial computer, an electricity is isolated D/A card, a block encoder numbered card; Four-axis movement control card control X, Y, Z motor servo driver, D/A card control main axle servo motor driver, encoder to count card control Q-switch driver 4, optical gate 26 and air valve.
Shown in Fig. 1,5, workpiece to be processed is fixed on the main shaft 14, rotate with main shaft 14; Turn over the pulse signal of position by the high accuracy incremental encoder output reflection workpiece that is installed in main shaft 14 coaxial direction, encoded device numbered card quadruple, counting are handled, make laser instrument 2 pulses send time and the coupling of workpiece rotational time, promptly in the aperture time of two or more pulses, just in time pass by on the workpiece rotary distance between two processing stands, by the control signal of output acousto-optic Q modulation switch 24 behind the industrial computer frequency division, control laser instrument generator 27 is exported pulse laser 34 again; Laser beam is again by being radiated at surface of the work through laser head condenser lens 30 again after outside optical system 33, total reflective mirror 22 reflections; By four-axis movement control card control Y to moving guide rail 16 and X to moving guide rail 18 these two two-dimentional guide rails and Z to the moving of vertical rail 10, make laser beam 34 and surface of the work produce feed motion; The feed motion that the Collaborative Control of main shaft 14 and laser instrument 2 and workpiece and laser beam is produced by means of D/A card and encoder to count card, and in conjunction with pulse point interval Laser Processing new technology repeatedly together, promptly pass through at same some place, beat a plurality of laser pulses repeatedly at interval, but process the nick chamber 39 and the micro groove 38 of controlling depth at surface of the work.
As Fig. 5, specifically add and on workpiece, make a call to earlier the individual nick of a circle n ' chamber 39 man-hour, each nick chamber 39 needs to beat m pulse, wherein be starting point 1 ' o'clock, pulse laser is then beaten next point 2 ' after starting point 1 ' locates to make a call to a pulse, order has been beaten the individual nick of first lap n ' chamber 39 successively; Workpiece rotates second circle when getting back to 1 ' then, to playing a pulse for the second time 1 ' o'clock, follow plaing second pulse 2 ' o'clock, and the like, enclose up to having changeed m, to the 39 dozens of intact m pulses in each nick chamber.This method realizes that laser pulse is sent the time and the workpiece rotational time is coupled, promptly in the aperture time of two or more pulses, just in time pass by on the workpiece rotary distance between two processing stands, finish the single laser pulse output on the surface of the work assigned position, can fully guarantee to add the efficient in man-hour like this.
As Fig. 6,7, the diameter r in the nick chamber 39 that processes
pWith degree of depth h
pControlled, r
pBetween 20um～60um, h
pBetween 1um～20um; The micro groove of processing 38 width b
gWith degree of depth h
gControlled, b
gBetween 40um～120um, h
gBetween 1um～20um.
The present invention processes the wide groove of macro morphology on various workpiece, method is: earlier be processed into narrow groove with nick chamber 39 is overlapping, again by the overlapping wide groove that is processed into of narrow groove, promptly obtain the wide groove of surperficial macroscopical moulding.
The present invention can be used for the surface micro-moulding of most of metal materials and nonmetallic materials workpiece, shape of processing work etc. is not had specific (special) requirements, such as the nick chamber and the micro groove that can be used to cylinder sleeve surface in processing cylinder sleeve/piston ring friction pair system; Can also be used to the microcosmic lubricating cavity of processing equipment sealing ring end face and macroscopical pumping groove or the like.
Further specify the present invention below by 2 embodiment:
As Fig. 8, present embodiment is the cylinder sleeve workpiece 35 Surface Machining nick chambeies in cylinder sleeve workpiece/piston ring system, or intersection nick chamber or both combinations.
Adopt a flat base 19, fixing directions X guide rail 18 thereon, model is that the servomotor 17 of MSMA102A1G drives Y traversing guide platform along guide rail 18 move left and right by ball-screw; Model is that the servomotor 15 of MSMA102A1G drives turntable by ball-screw and does along guide rail 16 and move forward and backward; Model is that the servomotor 13 of MSMA102A1C rotates by belt transmission drive shaft 14, in main shaft 14 coaxial direction the incremental encoder that one model is 1fa-500a-25000 is installed; Model is that the servomotor 8 of MSMA022A1A drives expansion bracket 11 by ball-screw and does to vertical rail 10 along Z and move up and down, fixed laser head 6 on expansion bracket 11, and laser head 6 and metal sleeve 12 are by being threaded.
Be inserted with the encoder to count card on the isa bus in the industrial computer, model is 4 axis motion control cards of MC8041A and the PCL728D/A card that model is, incremental encoder signal input coding device numbered card, handle by quadruple, counting, by outputing signal to Q-switch driver 4 behind the industrial computer frequency division, the folding of control Q-switch 24.4 axis motion control cards output pulse/direction signal to servomotor 8,15,17 is operated in position control mode.The D/A card outputs voltage signal to the driver that model is the servomotor 13 of MSDA103A1A, and servomotor 13 is operated in speed control mode.Other servicing units such as optical gate 26 etc. are controlled by the relay on the encoder to count card.The relation of control section as shown in Figure 4.
As shown in Figure 5, workpiece to be processed is fixed on the main shaft 14, rotates with main shaft 14; Turn over the pulse signal of position by the high accuracy incremental encoder output reflection workpiece that is installed in main shaft 14 coaxial direction, encoded device numbered card quadruple, counting are handled, by output Q-switched switch 24 control signals behind the industrial computer frequency division, control laser instrument 2 is exported the pulse laser again; Laser beam focuses on through laser head 6 by speculum 29 reflections and is radiated at surface of the work; Control two- dimentional guide rail 16,18 and Z to the moving of vertical rail 10 by four-axis movement control card, make laser beam and surface of the work produce feed motion.
According to the processing schematic diagram shown in Fig. 8,9, utilize the laser surface micro-moulding system of processing respectively in area I, processing nick chamber, III place 39, at area I I place processing micro groove 38.When area I, III processing nick chamber 39, can beat the laser pulse number and come controlling depth h by controlling each 39 place, nick chamber
p, owing to adopted pulse with putting at interval repeatedly technology, h
pCan be according to the formed material removal amount linear superposition of each laser pulse, h
pGenerally can be from 1um～20um; By control optical maser wavelength length, or the radius r in nick chamber 39 is controlled in focus lamp focal length and focus point position
p, r
pGenerally can be by 20um～60um; And the spacing between the cavity can be preestablished by software and realizes.Specific process is such: adjust to the processing original position earlier, simultaneously as requested, set machined parameters by control software, begin processing then.Just can reach degree of depth requirement such as plaing 5 pulses, then keep the z axle not move, need change 5 circles, and then move, to the processing of next Working position along the axial machine direction of z at this H height and position in each nick chamber, working height H place.Fig. 6 has shown the schematic cross-sectional view in the nick chamber 39 of processing.
At area I I machining cross micro groove 38, micro groove 38 is that the overlapping grooving by a series of nicks chamber 39 realizes its degree of depth h
gOverlapping degree by nick chamber 39 is controlled, and its overlapping degree is represented that by overlap coefficient n% n% is from 75%～95%, and its degree of depth generally can be from 1um～20um; Equally also can be by control optical maser wavelength, or micro groove 38 width b are controlled in focus lamp focal length and focus point position
g, b
gGenerally can be by 40um～120um; And micro groove 38 intersecting angles, circumferencial direction slot pitch can be preestablished by software and realize.Detailed process is such: adjust to the processing original position earlier, simultaneously as requested, set machined parameters, begin processing then.Different is with top processing nick chamber 39, when processing micro groove 38, the z axle can not be parked in certain height, but uniform motion, control distance between each overlapping nick chamber 39 of z direction by coupling z axle translational speed and cylinder sleeve rotating speed, thus control micro groove 38 degree of depth.After processing a direction, the z axle returns in the other direction and can form micro groove 38.Fig. 7 has shown the schematic cross-sectional view of the micro groove 38 of processing.
Shown in Figure 10-12, processing nick chamber 39 and micro groove 38 on the contactless novel mechanical sealing ring of zero leakage workpiece 36, its basic principle is with the processing of cylinder sleeve workpiece 35 among the embodiment 1, just because the sealing ring end face is the plane, so laser machining nozzle becomes straight peen among Fig. 3 (b) by the elbow among Fig. 3 (a).As Figure 11, when working depth is that 1um～20um micron dimension, width are when being the wide helicla flute 40 of millimeter magnitude more than the 1mm, can be overlapped into narrow groove by cavity, the method that is overlapped into wide groove by narrow groove is finished again, the profile of this macroscopical shallow slot can be realized by control software as arc groove, helicla flute etc.
Claims (5)
1. laser surface micro forming device, by laser instrument (2), outer light path part, rotation and travelling workpiece parts, control laser instrument (2) with control the control section that the rotation of workpiece moves and form, it is characterized in that: along the optical path direction of described laser instrument (2) built-in successively laser aid (20), two adjustable direction total reflective mirrors (21,22), total reflective mirror (23), acousto-optic Q modulation switch (24), diaphragm (25), optical gate (26), laser generator (27) and outgoing mirror (28); Described outer light path part connects laser instrument (2) and CCD camera (7), reflective mirror (29) and laser head (6) is installed from top to bottom successively by light pipe (5), the fixing Z that is connected with servomotor (8) of outer light path part one side is to vertical moving guide rail (10), and expansion bracket (11) is fixed on the guide rail (10); Described rotation and travelling workpiece parts are positioned at laser head (6) below, comprise rotary main shaft (14) and planar guide rail (16,18), connect servomotor (13,15,17) respectively, in main shaft (14) coaxial direction one incremental encoder are installed; Control section comprises industrial computer, servomotor and motor servo driver.
2. a kind of laser surface micro forming device according to claim 1 is characterized in that: on the isa bus in the described industrial computer and connect a four-axis movement control card, an electricity is isolated a D/A card and a block encoder numbered card.
3. laser surface micro molding process, its feature mainly in turn includes the following steps:
(A) workpiece to be processed is fixed on the main shaft (14), rotates with main shaft (14); Turn over the pulse signal of position by incremental encoder output reflection workpiece, encoded device numbered card quadruple, counting are handled, make laser instrument (2) pulse send the coupling of time and workpiece rotational time, the rotary distance on the workpiece of promptly in the aperture time of two or more pulses, just in time passing by between two processing stands;
(B) export the pulse laser beam by the control signal control laser instrument of output acousto-optic Q modulation switch (24) behind the industrial computer frequency division; Laser beam focuses on by light path system and is radiated at surface of the work; Control moving of two-dimentional guide rail (16,18) and guide rail (10) by four-axis movement control card, make laser beam and surface of the work produce feed motion;
(C) feed motion that the control of main shaft (14) and laser instrument (2) and workpiece and laser beam is produced by D/A card and encoder to count card, a plurality of laser pulses are beaten at interval repeatedly by same some place at surface of the work, but process the nick chamber (39) and the micro groove (38) of controlling depth.
4. the method for a kind of laser surface micro-moulding according to claim 3, it is characterized in that: the diameter in the nick chamber (39) that step (C) is processed is 20～60um, the degree of depth is 1～20um; The width of micro groove (38) is 40～120um, and the degree of depth is 1～20um.
5. the method for a kind of laser surface micro-moulding according to claim 3 is characterized in that: be processed into narrow groove with nick chamber (39) are overlapping earlier, be processed into the wide groove that wide groove can obtain surperficial macroscopical moulding by narrow groove is overlapping again.
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