CN101371558A - 移动终端以及移动终端的防噪结构 - Google Patents
移动终端以及移动终端的防噪结构 Download PDFInfo
- Publication number
- CN101371558A CN101371558A CN200780002760.4A CN200780002760A CN101371558A CN 101371558 A CN101371558 A CN 101371558A CN 200780002760 A CN200780002760 A CN 200780002760A CN 101371558 A CN101371558 A CN 101371558A
- Authority
- CN
- China
- Prior art keywords
- microphone
- portable terminal
- housing parts
- sound
- sheet metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/19—Arrangements of transmitters, receivers, or complete sets to prevent eavesdropping, to attenuate local noise or to prevent undesired transmission; Mouthpieces or receivers specially adapted therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/08—Mouthpieces; Microphones; Attachments therefor
- H04R1/083—Special constructions of mouthpieces
- H04R1/086—Protective screens, e.g. all weather or wind screens
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0206—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
- H04M1/0208—Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
- H04M1/0214—Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Acoustics & Sound (AREA)
- Telephone Set Structure (AREA)
- Telephone Function (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006012295A JP4710622B2 (ja) | 2006-01-20 | 2006-01-20 | 携帯端末及び携帯端末のノイズ防止構造 |
JP012295/2006 | 2006-01-20 | ||
PCT/JP2007/050762 WO2007083730A1 (ja) | 2006-01-20 | 2007-01-19 | 携帯端末及び携帯端末のノイズ防止構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101371558A true CN101371558A (zh) | 2009-02-18 |
CN101371558B CN101371558B (zh) | 2013-01-23 |
Family
ID=38287681
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200780002760.4A Expired - Fee Related CN101371558B (zh) | 2006-01-20 | 2007-01-19 | 移动终端以及移动终端的防噪结构 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8280460B2 (zh) |
EP (2) | EP1983727A4 (zh) |
JP (1) | JP4710622B2 (zh) |
CN (1) | CN101371558B (zh) |
WO (1) | WO2007083730A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107295449A (zh) * | 2017-06-23 | 2017-10-24 | 深圳天珑无线科技有限公司 | 一种麦克风组件、移动终端及麦克风组件的封装方法 |
CN110856063A (zh) * | 2019-10-29 | 2020-02-28 | 歌尔科技有限公司 | 一种麦克风静电防护结构及电子设备 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4789005B2 (ja) * | 2006-07-27 | 2011-10-05 | 日本電気株式会社 | 携帯端末 |
JP5325554B2 (ja) * | 2008-12-05 | 2013-10-23 | 船井電機株式会社 | 音声入力装置 |
JP5375311B2 (ja) * | 2009-04-28 | 2013-12-25 | オムロン株式会社 | 電子部品実装装置及びその製造方法 |
US20110200220A1 (en) * | 2010-02-12 | 2011-08-18 | Ann Williams Group, Llc. | Sound recordable/playable device, packaging, and method of use |
EP2416544B1 (en) * | 2010-08-06 | 2015-04-29 | BlackBerry Limited | Electromagnetic Shielding and an Acoustic Chamber for a Microphone in a Mobile Electronic Device |
US8340735B2 (en) | 2010-08-06 | 2012-12-25 | Research In Motion Limited | Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device |
US9704663B2 (en) * | 2012-05-21 | 2017-07-11 | Apple Inc. | Accessory button controller assembly |
KR101977083B1 (ko) * | 2012-09-20 | 2019-05-10 | 엘지전자 주식회사 | 이동 단말기 |
US9877097B2 (en) * | 2015-06-10 | 2018-01-23 | Motorola Solutions, Inc. | Slim-tunnel wind port for a communication device |
CN108401201B (zh) * | 2018-05-15 | 2019-12-20 | 歌尔股份有限公司 | 一种麦克风装置及包括该麦克风装置的耳机 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2767998B2 (ja) * | 1990-09-27 | 1998-06-25 | 三菱電機株式会社 | 電子部品のシールド構造 |
US5254500A (en) | 1991-02-05 | 1993-10-19 | Advanced Micro Devices, Inc. | Method for making an integrally molded semiconductor device heat sink |
JPH0677357U (ja) * | 1993-03-31 | 1994-10-28 | 株式会社東芝 | マイクロホン内蔵の卓上形音響機器 |
JP3497230B2 (ja) * | 1994-04-13 | 2004-02-16 | 松下電器産業株式会社 | 電話機のマイク取付装置 |
GB2316814B (en) * | 1996-08-30 | 2001-02-28 | Nokia Mobile Phones Ltd | A radio telephone connector |
JP3306821B2 (ja) * | 1996-09-02 | 2002-07-24 | 株式会社日立国際電気 | 携帯電話機 |
FI970409A (fi) * | 1997-01-31 | 1998-08-01 | Nokia Mobile Phones Ltd | Menetelmä mikrofonin suojaamiseksi ulkoisilta häiriötekijäiltä ja mikrofonin häiriösuojus |
US5937361A (en) * | 1997-05-09 | 1999-08-10 | Ericsson Inc. | Radiotelephones with shielded microphones |
JP3379894B2 (ja) * | 1997-09-30 | 2003-02-24 | 本多通信工業株式会社 | 複合コネクタとコネクタプラグとその接合構造 |
SE9901756L (sv) * | 1999-05-12 | 2000-11-13 | Ericsson Telefon Ab L M | Ett hus för en sändare/mottagare och en metod för dess sammansättning |
DE19963217A1 (de) * | 1999-12-28 | 2001-07-12 | Thomson Brandt Gmbh | Differenzdruckmikrofon |
JP3743315B2 (ja) * | 2001-06-29 | 2006-02-08 | 株式会社デンソー | 無線通信装置 |
JP2003187917A (ja) * | 2001-12-21 | 2003-07-04 | Tyco Electronics Amp Kk | シールドコネクタ組立体およびシールド型コネクタ |
JP2003264355A (ja) | 2002-03-11 | 2003-09-19 | Sharp Corp | 携帯型情報端末 |
JP2003273986A (ja) * | 2002-03-18 | 2003-09-26 | Toshiba Corp | 携帯無線電話機およびコネクタ |
JP2004007330A (ja) * | 2002-05-31 | 2004-01-08 | Goro Yamauchi | マイクロホン用防水風防兼静電遮蔽装置 |
JP2004007156A (ja) * | 2002-05-31 | 2004-01-08 | Matsushita Electric Ind Co Ltd | コンデンサマイクロホン |
JP2004031256A (ja) | 2002-06-28 | 2004-01-29 | Toyota Motor Corp | 固体高分子型燃料電池の検査方法と該方法による固体高分子型燃料電池 |
JP4199037B2 (ja) * | 2003-04-03 | 2008-12-17 | 株式会社日立国際電気エンジニアリング | 音響用開口部の排水構造 |
JP4077377B2 (ja) * | 2003-08-11 | 2008-04-16 | 富士通株式会社 | 計測端末、サービス装置、及び要求端末 |
US6932187B2 (en) * | 2003-10-14 | 2005-08-23 | Gore Enterprise Holdings, Inc. | Protective acoustic cover assembly |
JP4486399B2 (ja) * | 2004-04-16 | 2010-06-23 | セーレン株式会社 | 電子機器筐体開口部用保護材 |
JP4396980B2 (ja) * | 2004-10-18 | 2010-01-13 | Smk株式会社 | マイクロホン取付装置 |
JP4751057B2 (ja) * | 2004-12-15 | 2011-08-17 | シチズン電子株式会社 | コンデンサマイクロホンとその製造方法 |
JP4188325B2 (ja) * | 2005-02-09 | 2008-11-26 | ホシデン株式会社 | 防塵板内蔵マイクロホン |
ATE482564T1 (de) * | 2005-10-26 | 2010-10-15 | Research In Motion Ltd | Mikrofonkoppler für ein kommunikationsgerät |
-
2006
- 2006-01-20 JP JP2006012295A patent/JP4710622B2/ja not_active Expired - Fee Related
-
2007
- 2007-01-19 WO PCT/JP2007/050762 patent/WO2007083730A1/ja active Application Filing
- 2007-01-19 EP EP07713649A patent/EP1983727A4/en not_active Withdrawn
- 2007-01-19 CN CN200780002760.4A patent/CN101371558B/zh not_active Expired - Fee Related
- 2007-01-19 EP EP12174919.6A patent/EP2509288A3/en not_active Withdrawn
- 2007-01-19 US US12/159,969 patent/US8280460B2/en not_active Expired - Fee Related
-
2012
- 2012-07-27 US US13/560,488 patent/US8831693B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107295449A (zh) * | 2017-06-23 | 2017-10-24 | 深圳天珑无线科技有限公司 | 一种麦克风组件、移动终端及麦克风组件的封装方法 |
CN110856063A (zh) * | 2019-10-29 | 2020-02-28 | 歌尔科技有限公司 | 一种麦克风静电防护结构及电子设备 |
Also Published As
Publication number | Publication date |
---|---|
US8831693B2 (en) | 2014-09-09 |
US20090042623A1 (en) | 2009-02-12 |
JP2007195010A (ja) | 2007-08-02 |
EP2509288A3 (en) | 2015-01-21 |
JP4710622B2 (ja) | 2011-06-29 |
EP1983727A4 (en) | 2011-12-14 |
US8280460B2 (en) | 2012-10-02 |
EP1983727A1 (en) | 2008-10-22 |
US20120302296A1 (en) | 2012-11-29 |
EP2509288A2 (en) | 2012-10-10 |
CN101371558B (zh) | 2013-01-23 |
WO2007083730A1 (ja) | 2007-07-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: LENOVO INNOVATION CO., LTD. (HONGKONG) Free format text: FORMER OWNER: NEC CORP. Effective date: 20141125 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: HONG KONG, CHINA |
|
TR01 | Transfer of patent right |
Effective date of registration: 20141125 Address after: Hongkong, China Patentee after: LENOVO INNOVATIONS Co.,Ltd.(HONG KONG) Address before: Tokyo, Japan Patentee before: NEC Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130123 Termination date: 20170119 |
|
CF01 | Termination of patent right due to non-payment of annual fee |