CN101366117A - 用于小型封装速度传感器的芯片置于引线框上的方法 - Google Patents
用于小型封装速度传感器的芯片置于引线框上的方法 Download PDFInfo
- Publication number
- CN101366117A CN101366117A CNA2006800523239A CN200680052323A CN101366117A CN 101366117 A CN101366117 A CN 101366117A CN A2006800523239 A CNA2006800523239 A CN A2006800523239A CN 200680052323 A CN200680052323 A CN 200680052323A CN 101366117 A CN101366117 A CN 101366117A
- Authority
- CN
- China
- Prior art keywords
- leadframe substrate
- electric member
- substrate
- sensor package
- package apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49575—Assemblies of semiconductor devices on lead frames
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/24—Housings ; Casings for instruments
- G01D11/245—Housings for sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
- G01P3/42—Devices characterised by the use of electric or magnetic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Magnetic Variables (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/295,371 US7378721B2 (en) | 2005-12-05 | 2005-12-05 | Chip on lead frame for small package speed sensor |
US11/295,371 | 2005-12-05 | ||
PCT/US2006/045962 WO2007067422A1 (en) | 2005-12-05 | 2006-11-30 | Chip on lead frame for small package speed sensor |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101366117A true CN101366117A (zh) | 2009-02-11 |
CN101366117B CN101366117B (zh) | 2012-11-07 |
Family
ID=37908134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006800523239A Expired - Fee Related CN101366117B (zh) | 2005-12-05 | 2006-11-30 | 用于小型封装速度传感器的芯片置于引线框上的方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7378721B2 (zh) |
EP (1) | EP1958256A1 (zh) |
JP (1) | JP2009518860A (zh) |
KR (1) | KR20080075549A (zh) |
CN (1) | CN101366117B (zh) |
WO (1) | WO2007067422A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104936428A (zh) * | 2014-03-18 | 2015-09-23 | Trw汽车美国有限责任公司 | 采用分段引线框的电路安装装置及方法 |
CN105518467A (zh) * | 2013-08-29 | 2016-04-20 | 杰凯特技术集团股份公司 | 用于确定可旋转物体的转速的传感器设备以及具有该传感器设备的涡轮增压器 |
CN108666291A (zh) * | 2017-03-28 | 2018-10-16 | 爱信精机株式会社 | 电子元件模块和用于制造电子元件模块的方法 |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7269992B2 (en) * | 2005-06-15 | 2007-09-18 | Honeywell International Inc. | Magnet orientation and calibration for small package turbocharger speed sensor |
US7375406B2 (en) * | 2005-12-20 | 2008-05-20 | Honeywell International Inc. | Thermoplastic overmolding for small package turbocharger speed sensor |
US7573112B2 (en) * | 2006-04-14 | 2009-08-11 | Allegro Microsystems, Inc. | Methods and apparatus for sensor having capacitor on chip |
US7687882B2 (en) * | 2006-04-14 | 2010-03-30 | Allegro Microsystems, Inc. | Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor |
US20080013298A1 (en) | 2006-07-14 | 2008-01-17 | Nirmal Sharma | Methods and apparatus for passive attachment of components for integrated circuits |
DE102006046984A1 (de) * | 2006-10-04 | 2008-04-10 | Siemens Ag | Verfahren zur Herstellung eines Trägerelements mit einem Winkelsensor |
US8093670B2 (en) * | 2008-07-24 | 2012-01-10 | Allegro Microsystems, Inc. | Methods and apparatus for integrated circuit having on chip capacitor with eddy current reductions |
US20100052424A1 (en) * | 2008-08-26 | 2010-03-04 | Taylor William P | Methods and apparatus for integrated circuit having integrated energy storage device |
WO2011009834A2 (de) * | 2009-07-22 | 2011-01-27 | Continental Teves Ag & Co. Ohg | Geschwindigkeitssensor |
US8525321B2 (en) | 2011-07-06 | 2013-09-03 | Fairchild Semiconductor Corporation | Conductive chip disposed on lead semiconductor package |
JP5743871B2 (ja) | 2011-12-07 | 2015-07-01 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
US8629539B2 (en) | 2012-01-16 | 2014-01-14 | Allegro Microsystems, Llc | Methods and apparatus for magnetic sensor having non-conductive die paddle |
US9666788B2 (en) | 2012-03-20 | 2017-05-30 | Allegro Microsystems, Llc | Integrated circuit package having a split lead frame |
US10234513B2 (en) | 2012-03-20 | 2019-03-19 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
US9812588B2 (en) | 2012-03-20 | 2017-11-07 | Allegro Microsystems, Llc | Magnetic field sensor integrated circuit with integral ferromagnetic material |
US9494660B2 (en) | 2012-03-20 | 2016-11-15 | Allegro Microsystems, Llc | Integrated circuit package having a split lead frame |
CN203011935U (zh) * | 2012-09-03 | 2013-06-19 | 大陆汽车电子(长春)有限公司 | 轮速传感器 |
US9411025B2 (en) | 2013-04-26 | 2016-08-09 | Allegro Microsystems, Llc | Integrated circuit package having a split lead frame and a magnet |
DE102014213591A1 (de) * | 2014-07-11 | 2016-01-14 | Continental Teves Ag & Co. Ohg | Neutralteil für einen kundenspezifisch adaptierbaren Sensor |
DE102015008503A1 (de) * | 2015-07-03 | 2017-01-05 | TE Connectivity Sensors Germany GmbH | Elektrisches Bauteil und Herstellungsverfahren zum Herstellen eines solchen elektrischen Bauteils |
US10411498B2 (en) | 2015-10-21 | 2019-09-10 | Allegro Microsystems, Llc | Apparatus and methods for extending sensor integrated circuit operation through a power disturbance |
US9958292B1 (en) | 2016-10-25 | 2018-05-01 | Nxp B.V. | Sensor package with double-sided capacitor attach on same leads and method of fabrication |
JP6458104B2 (ja) * | 2017-09-11 | 2019-01-23 | 日立オートモティブシステムズ株式会社 | 熱式流量計 |
US10703854B2 (en) * | 2017-12-05 | 2020-07-07 | Raytheon Technologies Corporation | Epoxy formula for integral capacitance probe |
US10371497B2 (en) | 2017-12-05 | 2019-08-06 | United Technologies Corporation | Fully integral epoxy cap probe |
US10978897B2 (en) | 2018-04-02 | 2021-04-13 | Allegro Microsystems, Llc | Systems and methods for suppressing undesirable voltage supply artifacts |
JP7028067B2 (ja) * | 2018-05-31 | 2022-03-02 | 日立金属株式会社 | 磁気検出センサ、回転検出センサ及びセンサ付きケーブル |
FR3097969B1 (fr) * | 2019-06-25 | 2021-06-11 | Continental Automotive Gmbh | Capteur et procédé de fabrication |
US10991644B2 (en) | 2019-08-22 | 2021-04-27 | Allegro Microsystems, Llc | Integrated circuit package having a low profile |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5435516A (en) | 1977-08-24 | 1979-03-15 | Nissan Motor Co Ltd | Controller of top speed of car of loading engine with supercharger |
JPS585427A (ja) | 1981-07-01 | 1983-01-12 | Aisin Seiki Co Ltd | 自動車エンジンの過給機用制御装置 |
US4771330A (en) * | 1987-05-13 | 1988-09-13 | Lsi Logic Corporation | Wire bonds and electrical contacts of an integrated circuit device |
DE9311223U1 (de) | 1993-07-27 | 1993-09-09 | Siemens AG, 80333 München | Mikrosensor mit Steckeranschluß |
JP3603406B2 (ja) * | 1995-09-11 | 2004-12-22 | 株式会社デンソー | 磁気検出センサおよびその製造方法 |
US5873248A (en) | 1996-06-21 | 1999-02-23 | Caterpillar Inc. | Turbocharger control system |
US5912556A (en) | 1996-11-06 | 1999-06-15 | Honeywell Inc. | Magnetic sensor with a chip attached to a lead assembly within a cavity at the sensor's sensing face |
JP3671563B2 (ja) * | 1996-12-09 | 2005-07-13 | 株式会社デンソー | モールドicをケースに固定した構造の半導体装置 |
JPH10253648A (ja) * | 1997-03-14 | 1998-09-25 | Denso Corp | 回転検出装置及びその製造方法 |
JP3237565B2 (ja) | 1997-04-02 | 2001-12-10 | 三菱自動車工業株式会社 | 過給機制御装置 |
US6234149B1 (en) | 1999-02-25 | 2001-05-22 | Cummins Engine Company, Inc. | Engine control system for minimizing turbocharger lag including altitude and intake manifold air temperature compensation |
DE10007013B4 (de) | 2000-02-16 | 2009-04-16 | Robert Bosch Gmbh | Vorrichtung zur Begrenzung der Drehzahl eines Abgasturboladers |
DE10035762A1 (de) | 2000-07-22 | 2002-01-31 | Daimler Chrysler Ag | Abgasturbolader für eine Brennkraftmaschine und Verfahren zum Betrieb eines Abgasturboladers |
DE10062184C1 (de) | 2000-12-14 | 2002-07-04 | Bosch Gmbh Robert | Vorrichtung zum Schalten eines Abgasturboladers und Abgasturbolader |
DE10290840B4 (de) | 2001-03-01 | 2007-07-26 | Voith Turbo Gmbh & Co. Kg | Antriebseinheit mit einem Verbrennungsmotor und einem Abgasturbolader |
US6539714B1 (en) | 2002-03-19 | 2003-04-01 | Cummins, Inc. | System for estimating turbocharger rotational speed |
JP2003343312A (ja) | 2002-05-22 | 2003-12-03 | Hitachi Ltd | ターボ過給機を備えた筒内噴射型内燃機関の制御方法及びターボ過給機を備えた筒内噴射型内燃機関 |
JP3925397B2 (ja) | 2002-11-20 | 2007-06-06 | トヨタ自動車株式会社 | 電動機付ターボチャージャ制御装置 |
JP2005030941A (ja) | 2003-07-07 | 2005-02-03 | Denso Corp | センサ装置及びセンサ装置の製造方法 |
US20050017709A1 (en) | 2003-07-25 | 2005-01-27 | Honeywell International Inc. | Magnetoresistive turbocharger compressor wheel speed sensor |
DE10345049B3 (de) * | 2003-09-26 | 2005-02-03 | Siemens Ag | Magnetfeldsensor |
US6871499B1 (en) | 2003-12-20 | 2005-03-29 | Honeywell Interntional, Inc. | Oil pressure detector for electric assisted turbocharger |
JP2005331296A (ja) | 2004-05-18 | 2005-12-02 | Denso Corp | 回転検出装置 |
US7425824B2 (en) * | 2005-05-20 | 2008-09-16 | Honeywell International Inc. | Magnetoresistive sensor |
-
2005
- 2005-12-05 US US11/295,371 patent/US7378721B2/en not_active Expired - Fee Related
-
2006
- 2006-11-30 JP JP2008544389A patent/JP2009518860A/ja not_active Withdrawn
- 2006-11-30 EP EP06838757A patent/EP1958256A1/en not_active Withdrawn
- 2006-11-30 WO PCT/US2006/045962 patent/WO2007067422A1/en active Application Filing
- 2006-11-30 CN CN2006800523239A patent/CN101366117B/zh not_active Expired - Fee Related
- 2006-11-30 KR KR1020087016413A patent/KR20080075549A/ko not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105518467A (zh) * | 2013-08-29 | 2016-04-20 | 杰凯特技术集团股份公司 | 用于确定可旋转物体的转速的传感器设备以及具有该传感器设备的涡轮增压器 |
CN104936428A (zh) * | 2014-03-18 | 2015-09-23 | Trw汽车美国有限责任公司 | 采用分段引线框的电路安装装置及方法 |
CN108666291A (zh) * | 2017-03-28 | 2018-10-16 | 爱信精机株式会社 | 电子元件模块和用于制造电子元件模块的方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2007067422A1 (en) | 2007-06-14 |
CN101366117B (zh) | 2012-11-07 |
US7378721B2 (en) | 2008-05-27 |
JP2009518860A (ja) | 2009-05-07 |
EP1958256A1 (en) | 2008-08-20 |
US20070126088A1 (en) | 2007-06-07 |
KR20080075549A (ko) | 2008-08-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SENSATA TECHNOLOGIES INC. Free format text: FORMER OWNER: HONEYWELL INTERNATIONAL CORP. Effective date: 20110914 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20110914 Address after: Massachusetts USA Applicant after: Sensata Technologies Inc. Address before: new jersey Applicant before: Honeywell International Corp. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121107 Termination date: 20181130 |