CN101363975B - Bonding system of ACF (aanisotropic conductive film) - Google Patents
Bonding system of ACF (aanisotropic conductive film) Download PDFInfo
- Publication number
- CN101363975B CN101363975B CN2008101440906A CN200810144090A CN101363975B CN 101363975 B CN101363975 B CN 101363975B CN 2008101440906 A CN2008101440906 A CN 2008101440906A CN 200810144090 A CN200810144090 A CN 200810144090A CN 101363975 B CN101363975 B CN 101363975B
- Authority
- CN
- China
- Prior art keywords
- conductive film
- anisotropic conductive
- acf
- diaphragm
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H41/00—Machines for separating superposed webs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0469—Surface mounting by applying a glue or viscous material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a bonding system of anisotropic conductive film of physical and electrically connective substrate on panel of LCD apparatus, the system comprises a supply section (2) for article to be bonded, a guide lever (8) arranged above the bonding point and in level of ground, more than two units of bonding apparatus (12) moving in more than two directions along the guide lever (8). The units of bonding apparatus (12) comprise an anisotropic conductive film axis loading section for setting anisotropic conductive film axis; an anisotropic conductive film leading-out and supplying section for leading-out anisotropic conductive film and supplying the same; an anisotropic conductive film cutting-off section (40); a bonding section (42); a stripping apparatus for stripping protective film (P), a protective film recycling section; a buffering mechanism arranged between the heating terminal (48) and the protective film (36).
Description
Technical field
The present invention relates to the adhering device of anisotropic conductive film (ACF), more particularly, relate on the panel of liquid crystal indicator (LCD) physics and be electrically connected the adhesive system of the anisotropic conductive film of substrate.
Background technology
As shown in Figure 1, liquid crystal indicator (LCD) comprise the panel that is formed with the picture-display-region territory and along the length direction of this panel side in abutting connection with the substrate (Printed Circuit Board) that is provided with.The engineering of physics and electrical connection panel (LP) and substrate (B) includes TAB (Tape Automated Bonding) engineering, uses ACF (Anisotropic Conductive Film, anisotropic conductive film) in this TAB engineering usually.The structure of ACF is to have disperseed electroconductive particle in thermosetting or thermoplastic resin, and supplies with the state of certain width ground spooling on axle.That is to say, when bonding ACF, be bonded on panel or the substrate while axle is untied.In addition, as shown in the figure, ACF is bonded in a part of interval along the length direction of panel.That is, A2 between A1 and non-adhesion zone is arranged between the adhesion zone of ACF along the length direction of panel.The ACF that is supplied is generally the state that is bonded with protective seam, and in bonding, protective seam will be recovered.
Figure 2 shows that the summary master TV structure figure that is used for ACF is bonded in the existing adhering device on the substrate.
From the structure of existing apparatus, bonding body 110 is as a whole.Then, after ACF is hung between the proparea of panel LP, only undertaken bondingly on A1 between adhesion zone by thermo-compressed, and the ACF material on the A2 is cut off and discards (with reference to Fig. 1) between remaining non-adhesion zone.
That is to say,, become the amount of the ACF between the non-adhesion zone of ratio to go out of use with the total length of panel according to conventional device.This will cause the problem of waste expensive material, and cause discarded and problem of environmental pollution that cause.And, because the consumption of ACF increases, therefore to frequently change, thereby cause the problem of waste activity duration.The maximization of liquid crystal indicator now, this problem will be more severe.
Summary of the invention
At the problems referred to above the present invention is proposed, order of the present invention is to provide a kind of adhesive system of anisotropic conductive film, reduce the manufacturing cost of liquid crystal indicator, required ACF consumption in the bonding process of panel and substrate particularly, thereby make its not waste, and can make the working time of expending when replacing the ACF axle minimum.
In order to achieve the above object, the invention provides a kind of adhesive system of anisotropic conductive film, the ACF that will have diaphragm is adhered between display panels and the tellite, wherein, the adhesive system of described anisotropic conductive film comprises: by supply display panels and tellite, be arranged on the bonding location by sticky object supply department; Be positioned at the top of bonding location, the guide pole that fixedly installs along the first direction that becomes level with ground; And be arranged at the plural unit adhering device of transferring on the frame respectively, this unit adhering device can move to two directions along described guide pole, described unit adhering device is along the length direction of described display panels, and only the part at needs is bonded with described ACF partly;
Described constituent parts adhering device comprises: the ACF axle loading part that is used to be provided with the ACF axle; The ACF that is used to draw and supplies ACF draws supply department; Be used for closing the ACF cut-out portion that paper PF only cuts into the ACF of supply certain-length at the ACF that is supplied with diaphragm P; Utilize temperature and pressure, described ACF is bonded in adhesive portion on described display panels and the tellite; Peel off the stripping off device of described diaphragm P under by bonding state at ACF; Be used to reclaim the diaphragm recoverer of the diaphragm P that peels off from described ACF; In the heat bonding process, prevent described diaphragm welding on the fire end that constitutes described adhesive portion, and be folded in the snubber assembly between described fire end and the described diaphragm simultaneously in order to set level ACF.
On the above-mentioned constituent parts adhering device, also be provided with can remote monitoring camera, can send signal of video signal to supvr by the wire/wireless mode.
Above-mentioned stripping off device also comprises: be arranged on the left and right sides of described handover frame, direction moves up and down respectively, and described diaphragm P mentioned from the edge once after just bonding and peel off peel off cylinder.
Description of drawings
Fig. 1 is the general view of liquid crystal indicator (LCD);
Fig. 2 is the summary master TV structure figure that is used for ACF is bonded in the existing adhering device on the substrate;
Fig. 3 is the outline elevation of adhesive system of the present invention;
Fig. 4 is the summary right view of adhesive system of the present invention;
Fig. 5 is the outline elevation of the unit adhering device of adhesive system;
Fig. 6 is the summary right view of the unit adhering device of adhesive system;
Fig. 7 is the side-looking structural drawing of buffer film supply department of a kind of embodiment of snubber assembly;
Fig. 8 is used to illustrate the structure of diaphragm stripping off device and the structural drawing of effect;
Fig. 9 is the side-looking structural drawing of the heat block of another embodiment of the present invention.
Description of reference numerals:
2: by sticky object supply department 4: base plate strip
6: base plate strip transfer device 8: guide pole
10: body frame 12: the unit adhering device
14: transfer frame 18:ACF axle
20:ACF lead division 22:ACF supply department
32: snubber assembly (buffering means)
34: draw roller 36: the diaphragm recoverer
40: cut-out portion 42: adhesive portion
44: heat block 46: the crimping cylinder
48: heated end portion (heater tip) 50: heat conduction well heater
54: buffer film supply department 55: buffer cover
56: buffer film 68: peel off cylinder
70: camera 72,74: anchor clamps
PF:ACF closes paper P: diaphragm
F：ACF
Embodiment
Below, by the reference Figure of description, illustrate in greater detail embodiments of the present invention.Fig. 3 is the outline elevation of adhesive system of the present invention.Fig. 4 is the summary right view of adhesive system of the present invention.Fig. 5 is the outline elevation of the unit adhering device of adhesive system, and Fig. 6 is the summary right view of the unit adhering device of adhesive system.Fig. 7 is the side-looking structural drawing of the buffer film supply department of snubber assembly.The formation and the action diagram that are used for peeling off the diaphragm stripping off device of diaphragm behind the bonding ACF are shown in Fig. 8.Fig. 9 is the side-looking structural drawing of the heat block of another embodiment of the present invention.
Below, be that the center describes with Fig. 5 to Fig. 6, the part of deficiency is described by indicating necessary figure.
ACF (Anisotropic Conductive Film, anisotropic conductive film) is supplied with the state that is bonded with diaphragm, is generally the state of spooling on axle (reel).
With reference to Fig. 3 to Fig. 4, comprised base plate strip 4 and transfer device 6 thereof by sticky object supply department 2, be used to supply display panels ((LCD panel is hereinafter referred to as panel) and tellite (PCB, hereinafter referred to as substrate), and carry or be arranged on the bonding location.Can to Korean Patent Room application and the license of authorizing number be the 0559791st " go up lower unit and utilize the compound transfer device of the base plate strip of lower unit on this " for the applicant by sticky object supply department 2.Therefore omit detailed description to this.
Guide pole 8 and is fixedly installed on the body frame 10 along the first direction that becomes level with ground above bonding place.
Plural unit adhering device 12 (bonding unit) is arranged to and can be moved to two directions along described guide pole 8, makes it possible to length direction along display panels only at the bonding partly described ACF of the part of necessity.Core content of the present invention is relevant with this unit adhering device 12.That is to say that core of the present invention at the bonding ACF in the position of necessity, eliminates being cut off discarded part by only for having a plurality of units adhering device.
A plurality of units adhering device 12 is the binding function of complete independently of one another.Only be arranged to three according to illustrated unit adhering device 12 in native system, but only be embodiment, and can be arranged to two or four.Should be understood that the quantity of setting is decided according to the expense and the operating efficiency of equipment.
The constituent parts adhering device can use 2-3 to return when a bonding ACF of panel.For example, when bonding location is 4 places, and when being provided with two unit adhering devices, a unit adhering device is alongst at the bonding ACF in two places (4/2=2).The unit adhering device moves repeatedly to about first direction and realizes bonding along guide pole.The unit adhering device need be utilized the electronic control mode of loading routine when direction is transferred to the left and right.
ACF passes through heat and pressure usually by bonding.When bonding, ACF is towards panel and/or substrate setting, and diaphragm is towards the well heater setting.Then, also need to be used to prevent the direct buffer film supply department that contacts with diaphragm in end (tip) of well heater.Adhesive property can improve in this buffer film supply department, as the planarization of ACF.Diaphragm is the complex of rubber and special teflon (teflon), cries sealing clump (seal plex) usually, and just goes out of use after a position is used 50 times.Then, supply intermittently to bonding place.
Below, the structure of the unit's of explanation adhering device and effect successively.Illustrated three unit adhering devices 12 only are its putting position differences, yet its inscape and function are all identical.So, be representative with one of them below, and mainly describe with reference to Fig. 5 to Fig. 6.
Unit adhering device 12 (being designated hereinafter simply as adhering device) is arranged on to be transferred on the frame 14, and can be along guide pole 8 direction handover to the left and right.That is, the inscape of unit adhering device 12 is combined in to be transferred on the frame 14, and can transfer slidably along guide pole 8.
ACF axle loading part is arranged on the top of adhering device 12, also comprises being arranged on the axostylus axostyle of transferring on the frame 14 16.ACF axle 18 is arranged to can rotate on axostylus axostyle and can replace.
ACF draws supply department and is used to draw " ACF that is attached with diaphragm " (PF closes paper hereinafter referred to as ACF) and supply, more specifically says, is divided into lead division 20 that is arranged on the adhesive portion rear end and the supply department 22 that is arranged on the adhesive portion front end.Supply department 22 is the supply roller (not shown) that is driven by first stepping motor 24, can rotate ACF axle 18.The supply roller comprises drive roller and the driven roller that is located on the axostylus axostyle 16.The outside of drive roller is coated with silicon materials, therefore drives driven roller by friction force.Though this has slip in a way, for quiet rotation.
The rear end of supply roller is provided with snubber assembly.The snubber assembly deposit has the ACF of certain-length to close paper (PF), even it is little a lot of the time when closing the paper diameter than initial setting up to twist in ACF on the ACF axle 18, the ACF that also can supply set amount closes paper.
Be provided with the diaphragm recoverer 36 that is used to reclaim diaphragm P at the rear of drawing roller 34.Diaphragm recoverer 36 is a vacuum, inspiration by drawing roller 34 diaphragm P and be recovered in 38 li of drum box bodys.The diaphragm that reclaims goes out of use or is taken out of as re-using product.
ACF close paper (PF) by as above lead division 20 and supply department 22 to cut-out portion described later and adhesive portion supply, and maintain under the suitable state of tension.
ACF cut-out portion 40 is arranged on the rear end of snubber assembly 32, closes in the paper at the ACF that draws and supply, and only the ACF layer is cut off with certain length.ACF by ACF cut-out portion 40 closes paper, owing to be cut off the ACF layer, continues rearward to move according to the tension force of diaphragm P.
In the heat bonding process, weld on the fire end 48 that constitutes adhesive portion in order to prevent diaphragm P, simultaneously in order to set level ACF, snubber assembly is clipped between fire end 48 and the described diaphragm P.
According to one embodiment of the present invention, snubber assembly can be buffer film supply department 54.
Buffer film supply department 54 is supply buffer film 56 between fire end 48 and diaphragm P.Buffer film 56 is used to prevent that fire end and diaphragm from being welded by heat, also sets level ACF in addition and is adhered to by sticky object.The supplier of buffer film 56 to for the supplier that closes paper (PF) with ACF to (perhaps guide pole be provided with direction) rectangular second direction.Buffer film supply department 54 passes through the 3rd stepping motor 58 supply buffer film 56 intermittently, is provided with after bonding 50 times to turn round 1 time.
The side of buffer film supply department 54 constitutes shown in Fig. 7 a and Fig. 7 b.Along with fire end 48 descends (with reference to Fig. 7 b), buffer film 56 elastic elongations and towards the below, and reclaim axle 60 by rotation and draw buffer film 56 from the feed spool 62 that is arranged on the opposite.In order to keep certain moment of torsion, positive moment of torsion device 64 is by being with 66 to be connected with feed spool 62 synchronously.Fig. 7 a illustrates normal condition, and Fig. 7 b illustrates crimped status.
As shown in Figure 9, the snubber assembly of another embodiment of the present invention is as the sheathed buffer cover 55 as the buffering material of silicon materials and so on of lid at the end of fire end 48.
Behind the bonding ACF, the formation and the action diagram that are used for peeling off the diaphragm stripping off device of diaphragm are shown in Fig. 8.This stripping off device is the subsidy means that diaphragm and ACF easily are stripped from.Fig. 8 is equivalent to the part enlarged drawing of Fig. 5 basically.
Peel off cylinder 68 be arranged to can the left and right sides of transferring frame 14 respectively up and down direction move.Just often, buffer film 56 ACF of being arranged on separated by a distance close above the paper.As shown in the figure, buffer film 56 passes through along the direction vertical with the ground in the accompanying drawing (Fig. 8).Therefore represent with the cross section.
Fig. 8 a illustrates normal condition.Display panels and substrate are loaded into bonding location again, and ACF closes paper (PF) and draws and supply to bonding location, and then heat block 44 descends and pushes buffer film 56, meanwhile carries out thermo-compressed (Fig. 8 b) on ACF closes paper (PF).Heat block 44 rises after the crimping, and original state is arrived in buffer film 56 elastic recoveries, and closes paper (PF) from ACF and separate (Fig. 8 c).Under this state, ACF and panel or substrate bonding.Under this state, peel off cylinder 68 and rise, the both sides of the edge of then closing paper (PF) from ACF, diaphragm P begins to be stripped from.Peel off and proceed to about 2/3, i.e. state shown in Fig. 8 d, heat block 44 integral body further rise with peeling off cylinder 68 shown in Fig. 8 e, and rest parts is peeled off fully.
That is to say that stripping off device is little by little peeled off ACF (F) and diaphragm (P), thus can prevent along with moment peel off and the ACF that causes from panel and/or substrate separates or bonding plane partly comes off.According to the situation of peeling off cylinder 68, transfer frame 14 and can only be arranged on a side.
According to the embodiment of the present invention, can also possess in remote ACF detection means with the bonding defective mode of visual surveillance.Finish bonding object and be displaced to the rear by above-mentioned base plate strip transfer device 6 (with reference to Fig. 3 and Fig. 4), and temporary transient the delay.Camera 70 is arranged on the top of this delay position towards straight direction down.Camera 70 is arranged to can the remote monitoring adhering state, and sends the signal of video signal of shooting to supvr by the wire/wireless mode.Camera 70 can be separately positioned on the handover frame 14 of constituent parts adhering device 12 (with reference to Fig. 6), makes the supvr can carefully check all bonding parts.
In an ACF axle,, then need to replace into new ACF axle if whole ACF is consumed.For this reason, on the handover frame 14 of unit adhering device 12, being separated by on the above-below direction in the middle of the ACF transfer line is provided with two anchor clamps 72,74.Each anchor clamps 72,74 by clamping optionally to ACF close that paper (PF) is fixed, switching or ultrasonic wave, the ACF axle that can more renew by this process.
The characteristics of maximum of the present invention are: have can be only bonding to needs the part part structure of bonding ACF (or point).This is independently in a system, and the unit adhering device of the binding function by complete is realized.
Those skilled in the art can change each formation of unit adhering device and the concrete setting of inscape arbitrarily, and therefore technological thought of the present invention is not limited to illustrated shape.
According to said structure, can provide can be only to the bonding part of needs supply with partly, cut-out and bonding ACF, thereby prevent the ACF adhesive system that allows expense of ACF.This just can make the alternately cycle stretch-out of ACF axle, and the working time of waste minimizes when making alternately.In addition, can provide, can carefully monitor the ACF adhesive system of all bonding locations by detection means is set individually.
Claims (4)
1. the adhesive system of an anisotropic conductive film is used for anisotropic conductive film is bonded between display panels and the tellite, and described anisotropic conductive film also is bonded with diaphragm (P); It is characterized in that the adhesive system of described anisotropic conductive film comprises:
By supply display panels and tellite, be arranged on the bonding location by sticky object supply department (2); Be positioned at the top of bonding location, the guide pole (8) that fixedly installs along the first direction that becomes level with ground; And be arranged on the plural unit adhering device of transferring on the frame (14) (12), this unit adhering device (12) can move to two directions along described guide pole (8), described unit adhering device is along the length direction of described display panels, and only the part at needs is bonded with described anisotropic conductive film partly;
Described unit adhering device comprises: the anisotropic conductive film axle loading part that is used to be provided with the anisotropic conductive film axle; The anisotropic conductive film that is used to draw and supplies anisotropic conductive film is drawn supply department; Be used for closing the anisotropic conductive film cut-out portion (40) that paper (PF) only cuts into anisotropic conductive film certain-length in the anisotropic conductive film that is supplied with diaphragm (P); Utilize temperature and pressure, described anisotropic conductive film is bonded in adhesive portion (42) on described display panels and the tellite; Peel off the stripping off device of described diaphragm (P) under by bonding state in anisotropic conductive film; Be used to reclaim the diaphragm recoverer of the diaphragm of peeling off from described anisotropic conductive film (P); In the heat bonding process, prevent described diaphragm welding on the heated end portion (48) that constitutes described adhesive portion, and be folded in the snubber assembly between described fire end and the described diaphragm simultaneously in order to set level anisotropic conductive film.
2. the adhesive system of anisotropic conductive film according to claim 1, it is characterized in that, on described unit adhering device (12), also be provided with can remote monitoring camera (70), can send signal of video signal to supvr by the wire/wireless mode.
3. the adhesive system of anisotropic conductive film according to claim 1; it is characterized in that; described stripping off device also comprises: the left and right sides that is arranged on described handover frame (14); direction moves up and down respectively, and described diaphragm (P) mentioned from the edge once after just bonding and peel off peel off cylinder (68).
4. the adhesive system of anisotropic conductive film according to claim 1 is characterized in that, described snubber assembly is buffer cover (55), and this buffer cover is set in described heated end portion (48), and this buffer cover is made by the buffering material that comprises silicon materials.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070080770A KR100810086B1 (en) | 2007-08-10 | 2007-08-10 | Bonding system of acf[aanisotropic conductive film] |
| KR1020070080770 | 2007-08-10 | ||
| KR10-2007-0080770 | 2007-08-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101363975A CN101363975A (en) | 2009-02-11 |
| CN101363975B true CN101363975B (en) | 2011-01-19 |
Family
ID=39397660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101440906A Expired - Fee Related CN101363975B (en) | 2007-08-10 | 2008-08-06 | Bonding system of ACF (aanisotropic conductive film) |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100810086B1 (en) |
| CN (1) | CN101363975B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100968070B1 (en) | 2009-04-02 | 2010-07-08 | 주식회사 디에스케이 | Anisotropic conductive film bonder and bonding method using the same |
| KR101059104B1 (en) * | 2009-09-15 | 2011-08-24 | (주)에스에이티 | ACF Cutting Part of ACF Adhesive System for Display Panel |
| CN101840081A (en) * | 2010-04-13 | 2010-09-22 | 苏州凯蒂亚半导体制造设备有限公司 | Anisotropic conductive film adhering machine set |
| JP2012038747A (en) * | 2010-08-03 | 2012-02-23 | Hitachi High-Technologies Corp | Acf sticking device for fpd module |
| KR101165306B1 (en) | 2010-09-29 | 2012-07-18 | (주)에스에이티 | Bonding System Of Aanisotropic Conductive Film For Display Panel |
| KR101335272B1 (en) * | 2013-05-21 | 2013-11-29 | 주식회사 에스아이 플렉스 | Subsidiary for fpcb laminated attaching method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1429703A (en) * | 2001-12-28 | 2003-07-16 | 松下电器产业株式会社 | Pressure method and pressure device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010099068A (en) * | 2001-08-23 | 2001-11-09 | 안동철 | A remove film desquamating device of ACF bonding |
-
2007
- 2007-08-10 KR KR1020070080770A patent/KR100810086B1/en active IP Right Grant
-
2008
- 2008-08-06 CN CN2008101440906A patent/CN101363975B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1429703A (en) * | 2001-12-28 | 2003-07-16 | 松下电器产业株式会社 | Pressure method and pressure device |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2004-155593A 2004.06.03 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101363975A (en) | 2009-02-11 |
| KR100810086B1 (en) | 2008-03-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101363975B (en) | Bonding system of ACF (aanisotropic conductive film) | |
| CN102037615B (en) | Adhesive material reel | |
| CN102037614A (en) | Adhesive material reel | |
| CN108140634A (en) | The method that surface installation is carried out to component | |
| KR100970800B1 (en) | Adhesive material tape and method of producing the tape | |
| JP5996241B2 (en) | Adhesive film sticking device, adhesive film sticking method, and connection structure | |
| CN107479274A (en) | The bonding method and display device of display panel and external circuitses | |
| CN100355048C (en) | Adhesive sheet stamping device, adhesive sheet stamping method, part mounter, and display panel manufacturing method | |
| JP3595125B2 (en) | Adhesive sticking device | |
| CN101233608B (en) | Process for producing junction structure | |
| US8105462B2 (en) | Transfer method of adhesive film | |
| JPH08133560A (en) | Applying device and applying method of adhesive tape piece | |
| JP5021394B2 (en) | ACF pasting device and flat panel display manufacturing device | |
| KR100843126B1 (en) | Device for inspecting panel of flat display and method thereof, and system for bonding PCB of flat display and method thereof | |
| KR20050023355A (en) | Adhesive material tape, method of connecting, producing, and press-connecting the tape, adhesive material-tape reel, adhering device, adhesive agent-tape cassette, method of press-connecting adhesive agent using the cassette, and anisotropic electroconductive tape | |
| CN108807482B (en) | OLED display screen module and display device | |
| JP2003066479A (en) | Press-contacting method of tape automatic bonding component to liquid crystal panel | |
| JP2004211017A (en) | Adhesive tape, method of producing the same and compression adhesion method for the same | |
| KR100947561B1 (en) | Flexible printed circuit board bonding device | |
| CN211207002U (en) | ACF feed mechanism of COG binding machine | |
| JP4654566B2 (en) | Adhesive tape connection method and adhesive tape connector | |
| KR100766563B1 (en) | Plasma display panel and method thereof | |
| JP2006096788A (en) | Anisotropic conductive film having nonadhesive film, electro-optic apparatus using anisotropic conductive film having nonadhesive film, method and apparatus for producing electro-optic apparatus, method for producing the same film by using the same production apparatus and electronic equipment | |
| KR101447980B1 (en) | Bonding apparatus of anisotropic conductive film | |
| JP2007005630A (en) | Pressure bonding device and device for manufacturing display unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110119 Termination date: 20210806 |