CN101363884B - 电路板测试方法 - Google Patents
电路板测试方法 Download PDFInfo
- Publication number
- CN101363884B CN101363884B CN2007100756682A CN200710075668A CN101363884B CN 101363884 B CN101363884 B CN 101363884B CN 2007100756682 A CN2007100756682 A CN 2007100756682A CN 200710075668 A CN200710075668 A CN 200710075668A CN 101363884 B CN101363884 B CN 101363884B
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- China
- Prior art keywords
- resistance
- circuit board
- conductive path
- bad
- change
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Abstract
Description
待测量导电路径编号 | 待测量导电路径标准电阻 | 电路板编号及其电阻值变化 |
S1 | 0.01Ω | L1-0.004Ω、... |
S2 | 0.05Ω | ... |
S3 | 0.1Ω | ... |
S4 | 0.2Ω | ... |
S5 | 0.3Ω | ... |
... | ||
S21 | 1.9Ω | ... |
S22 | 2Ω | ... |
待测量导电路径编号 | 待测量导电路径标准电阻 | 电阻值变化 |
S1 | 0.01Ω | ΔY<sub>11</sub>、ΔY<sub>12</sub>、...、ΔY<sub>1n</sub> |
S2 | 0.05Ω | ΔY<sub>21</sub>、ΔY<sub>22</sub>、...、ΔY<sub>2n</sub> |
S3 | 0.1Ω | ΔY<sub>31</sub>、ΔY<sub>32</sub>、...、ΔY<sub>3n</sub> |
S4 | 0.2Ω | ΔY<sub>41</sub>、ΔY<sub>42</sub>、...、ΔY<sub>4n</sub> |
S5 | 0.3Ω | ΔY<sub>51</sub>、ΔY<sub>52</sub>、...、ΔY<sub>5n</sub> |
... | ... | ... |
待测量导电路径编号 | 待测量导电路径标准电阻 | 电阻值变化 |
S21 | 1.9Ω | ΔY<sub>211</sub>、ΔY<sub>212</sub>、...、ΔY<sub>21n</sub> |
S22 | 2Ω | ΔY<sub>221</sub>、ΔY<sub>222</sub>、...、ΔY<sub>22n</sub> |
待测量导电路径编号 | 待测量导电路径标准电阻 | 电阻值变化最大值 | 电阻值变化最小值 |
S1 | 0.01Ω | Max1 | Min1 |
S2 | 0.05Ω | Max2 | Min2 |
S3 | 0.1Ω | Max3 | Min3 |
S4 | 0.2Ω | Max4 | Min4 |
S5 | 0.3Ω | Max5 | Min5 |
... | ... | ... | ... |
S21 | 1.9Ω | Max21 | Min21 |
S22 | 2Ω | Max22 | Min22 |
Claims (10)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100756682A CN101363884B (zh) | 2007-08-10 | 2007-08-10 | 电路板测试方法 |
US12/143,632 US8049511B2 (en) | 2007-08-10 | 2008-06-20 | Method of detecting faulty via holes in printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007100756682A CN101363884B (zh) | 2007-08-10 | 2007-08-10 | 电路板测试方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101363884A CN101363884A (zh) | 2009-02-11 |
CN101363884B true CN101363884B (zh) | 2010-10-06 |
Family
ID=40345870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007100756682A Expired - Fee Related CN101363884B (zh) | 2007-08-10 | 2007-08-10 | 电路板测试方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8049511B2 (zh) |
CN (1) | CN101363884B (zh) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101907657B (zh) * | 2010-06-11 | 2015-08-19 | 上海华虹宏力半导体制造有限公司 | 探针电阻的检测方法 |
CN102445466B (zh) * | 2010-09-30 | 2014-02-26 | 北大方正集团有限公司 | 确定电路板耐热性的方法和设备 |
CN102548219B (zh) * | 2010-12-28 | 2014-04-09 | 富葵精密组件(深圳)有限公司 | 电路板的制作方法 |
CN102548220A (zh) * | 2010-12-29 | 2012-07-04 | 富葵精密组件(深圳)有限公司 | 电路板的制作方法 |
US8427329B2 (en) * | 2011-05-10 | 2013-04-23 | GM Global Technology Operations LLC | Method of testing and monitoring joint health |
JP2013024582A (ja) * | 2011-07-15 | 2013-02-04 | Nidec-Read Corp | 基板検査装置及び基板検査方法 |
CN103185736B (zh) * | 2012-01-03 | 2015-05-27 | 宏恒胜电子科技(淮安)有限公司 | 电路板孔内焊锡的测试方法 |
CN103675575B (zh) * | 2012-09-18 | 2016-07-20 | 英业达科技有限公司 | 使用单个短路点群组测试被测板卡的系统及其方法 |
KR101474620B1 (ko) * | 2012-12-27 | 2014-12-18 | 삼성전기주식회사 | 기판 검사 장치 및 기판 검사 방법 |
CN103323734A (zh) * | 2013-06-27 | 2013-09-25 | 深圳市中软信达电子有限公司 | 一种柔性电路板的线路短路/开路测试方法 |
CN106980083A (zh) * | 2017-05-17 | 2017-07-25 | 重庆艾申特电子科技有限公司 | 一种电路板电阻检测夹具 |
CN109462112B (zh) * | 2018-09-27 | 2020-11-13 | 珠海格力电器股份有限公司 | 接线端子处理方法、处理装置和转接装置 |
CN109342926A (zh) * | 2018-10-25 | 2019-02-15 | 昆山中哲电子有限公司 | 一种电路板盲孔检测方法及其检测设备 |
CN109696616A (zh) * | 2019-01-30 | 2019-04-30 | 大族激光科技产业集团股份有限公司 | 飞针测试机的测试方法及装置 |
CN109782110A (zh) * | 2019-02-19 | 2019-05-21 | 深圳崇达多层线路板有限公司 | 一种检测线圈板是否短路的测试方法 |
CN112528588B (zh) * | 2021-02-08 | 2021-05-28 | 深圳市微特精密科技股份有限公司 | 一种印制电路板检测用治具的孔位设计方法、装置及系统 |
CN113051853B (zh) * | 2021-03-05 | 2022-05-31 | 奥特斯科技(重庆)有限公司 | 受损部件载体确定方法、计算机程序、计算机可读介质以及检测系统 |
CN113325295B (zh) * | 2021-05-13 | 2022-07-19 | 江苏普诺威电子股份有限公司 | 平面埋容基板微短路的可靠性测试方法 |
CN114167259A (zh) * | 2021-12-07 | 2022-03-11 | 华东光电集成器件研究所 | 一种编程测试多连片基板通孔通断的方法 |
TWI799109B (zh) * | 2022-01-25 | 2023-04-11 | 福懋科技股份有限公司 | 基板導孔測試方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2368042Y (zh) * | 1999-02-12 | 2000-03-08 | 大众电脑股份有限公司 | 印刷电路板的电气特性检测机构 |
CN1940580A (zh) * | 2005-09-30 | 2007-04-04 | 英业达股份有限公司 | 电路板特性阻抗测量方法及系统 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5550844A (en) * | 1992-11-19 | 1996-08-27 | Proteus Corporation | Printed circuit board fault injection circuit |
JPH07140209A (ja) * | 1993-09-20 | 1995-06-02 | Fujitsu Ltd | 回路配線基板の検査装置およびその検査方法 |
US6940288B2 (en) * | 2003-06-04 | 2005-09-06 | Hewlett-Packard Development Company, L.P. | Apparatus and method for monitoring and predicting failures in system interconnect |
TWI222848B (en) * | 2003-11-26 | 2004-10-21 | Asustek Comp Inc | Mechanism for testing printed circuit board |
JP4959942B2 (ja) | 2005-01-18 | 2012-06-27 | 日本電産リード株式会社 | 基板検査装置、基板検査プログラム及び基板検査方法 |
US7514941B2 (en) * | 2006-03-15 | 2009-04-07 | Raytheon Company | Method and apparatus for predicting the reliability of electronic systems |
-
2007
- 2007-08-10 CN CN2007100756682A patent/CN101363884B/zh not_active Expired - Fee Related
-
2008
- 2008-06-20 US US12/143,632 patent/US8049511B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2368042Y (zh) * | 1999-02-12 | 2000-03-08 | 大众电脑股份有限公司 | 印刷电路板的电气特性检测机构 |
CN1940580A (zh) * | 2005-09-30 | 2007-04-04 | 英业达股份有限公司 | 电路板特性阻抗测量方法及系统 |
Non-Patent Citations (2)
Title |
---|
JP平2-147969A 1990.06.06 |
JP特开平10-93297A 1998.04.10 |
Also Published As
Publication number | Publication date |
---|---|
US8049511B2 (en) | 2011-11-01 |
CN101363884A (zh) | 2009-02-11 |
US20090039895A1 (en) | 2009-02-12 |
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Address after: 518103 Guangdong city of Shenzhen province Baoan District Fuyong Zhen Tang Wei Cun Xinyuan Industrial Zone Co-patentee after: Zhending Technology Co., Ltd. Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Address before: 518103 Guangdong city of Shenzhen province Baoan District Fuyong Zhen Tang Wei Cun Xinyuan Industrial Zone Co-patentee before: Honsentech Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |
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Granted publication date: 20101006 Termination date: 20160810 |