CN101358998B - 复数梁合成型接触端子 - Google Patents

复数梁合成型接触端子 Download PDF

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Publication number
CN101358998B
CN101358998B CN2008101348153A CN200810134815A CN101358998B CN 101358998 B CN101358998 B CN 101358998B CN 2008101348153 A CN2008101348153 A CN 2008101348153A CN 200810134815 A CN200810134815 A CN 200810134815A CN 101358998 B CN101358998 B CN 101358998B
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China
Prior art keywords
probe
vertical
horizontal beams
contact
weld pad
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN2008101348153A
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Chinese (zh)
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CN101358998A (zh
Inventor
木本军生
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN2008101348153A 2007-08-03 2008-07-31 复数梁合成型接触端子 Expired - Fee Related CN101358998B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007223232 2007-08-03
JP2007223232A JP5099487B2 (ja) 2007-08-03 2007-08-03 複数梁合成型接触子
JP2007-223232 2007-08-03

Publications (2)

Publication Number Publication Date
CN101358998A CN101358998A (zh) 2009-02-04
CN101358998B true CN101358998B (zh) 2011-10-05

Family

ID=40331498

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101348153A Expired - Fee Related CN101358998B (zh) 2007-08-03 2008-07-31 复数梁合成型接触端子

Country Status (5)

Country Link
US (1) US7808261B2 (https=)
JP (1) JP5099487B2 (https=)
KR (1) KR20090014107A (https=)
CN (1) CN101358998B (https=)
TW (1) TW200907351A (https=)

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JP4859820B2 (ja) * 2007-12-05 2012-01-25 東京エレクトロン株式会社 プローブ
JP2011141126A (ja) * 2010-01-05 2011-07-21 Toshiba Corp プローブカード
JP2011242377A (ja) * 2010-05-19 2011-12-01 Kimoto Gunsei プローブ
JP4883215B1 (ja) * 2010-10-29 2012-02-22 オムロン株式会社 端子およびこれを用いたコネクタ
JP4811530B1 (ja) * 2010-11-04 2011-11-09 オムロン株式会社 端子およびこれを用いたコネクタ
JP5083426B2 (ja) * 2011-03-14 2012-11-28 オムロン株式会社 端子およびこれを用いたコネクタ
JP5083427B2 (ja) 2011-03-14 2012-11-28 オムロン株式会社 端子およびこれを用いたコネクタ
US9702904B2 (en) 2011-03-21 2017-07-11 Formfactor, Inc. Non-linear vertical leaf spring
CN104155491A (zh) * 2013-05-13 2014-11-19 木本军生 探针
JP6491409B2 (ja) * 2013-12-27 2019-03-27 富士電機株式会社 接触子及び半導体試験装置
TWI603090B (zh) * 2016-09-06 2017-10-21 Mpi Corp A vertical probe, a method of manufacturing the same, and a probe head and a probe card using the same
DE102017209510A1 (de) * 2017-06-06 2018-12-06 Feinmetall Gmbh Kontaktelementsystem
TWI783074B (zh) * 2017-11-09 2022-11-11 義大利商探針科技公司 用於測試高頻裝置的測試頭的接觸探針
US11973301B2 (en) 2018-09-26 2024-04-30 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
US12181493B2 (en) 2018-10-26 2024-12-31 Microfabrica Inc. Compliant probes including dual independently operable probe contact elements including at least one flat extension spring, methods for making, and methods for using
US12000865B2 (en) 2019-02-14 2024-06-04 Microfabrica Inc. Multi-beam vertical probes with independent arms formed of a high conductivity metal for enhancing current carrying capacity and methods for making such probes
US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
JP2021028603A (ja) * 2019-08-09 2021-02-25 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置
US11761982B1 (en) 2019-12-31 2023-09-19 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact and methods for making such probes
US12196781B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US12196782B2 (en) 2019-12-31 2025-01-14 Microfabrica Inc. Probes with planar unbiased spring elements for electronic component contact, methods for making such probes, and methods for using such probes
US11802891B1 (en) 2019-12-31 2023-10-31 Microfabrica Inc. Compliant pin probes with multiple spring segments and compression spring deflection stabilization structures, methods for making, and methods for using
CN111579835B (zh) * 2020-05-18 2023-05-16 武汉精毅通电子技术有限公司 一种适用于大电流高速信号测试的探针及连接器
US11774467B1 (en) 2020-09-01 2023-10-03 Microfabrica Inc. Method of in situ modulation of structural material properties and/or template shape
CN112147380A (zh) * 2020-09-03 2020-12-29 渭南高新区木王科技有限公司 一种弹片针
US12146898B2 (en) 2020-10-02 2024-11-19 Microfabrica Inc. Multi-beam probes with decoupled structural and current carrying beams and methods of making
KR102892995B1 (ko) * 2021-03-24 2025-12-05 삼성전자주식회사 반도체 소자 검사용 프로브 및 이를 포함하는 프로브 카드
JP2022176778A (ja) * 2021-05-17 2022-11-30 株式会社片岡製作所 充放電検査装置
CN114200278B (zh) * 2021-11-29 2022-12-27 强一半导体（苏州）有限公司 一种薄膜探针卡及其探针头

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618821A (en) * 1983-09-19 1986-10-21 Lenz Seymour S Test probe assembly for microelectronic circuits
CN1936596A (zh) * 2005-09-19 2007-03-28 木本军生 接点组装体及其lsi芯片检查装置

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US5599194A (en) * 1992-08-18 1997-02-04 Enplas Corporation IC socket and its contact pin
JP3762444B2 (ja) * 1993-08-24 2006-04-05 信昭 鈴木 回路基板の検査用プローブとその取付構造
KR100212169B1 (ko) * 1996-02-13 1999-08-02 오쿠보 마사오 프로브, 프로브의 제조, 그리고 프로브를 사용한 수직동작형 프로브 카드 어셈블리
US5764072A (en) * 1996-12-20 1998-06-09 Probe Technology Dual contact probe assembly for testing integrated circuits
US7063541B2 (en) * 1997-03-17 2006-06-20 Formfactor, Inc. Composite microelectronic spring structure and method for making same
US6127832A (en) * 1998-01-06 2000-10-03 International Business Machines Corporation Electrical test tool having easily replaceable electrical probe
JP3346279B2 (ja) * 1998-05-18 2002-11-18 三菱マテリアル株式会社 コンタクトプローブおよびそれを備えたプローブ装置並びにコンタクトプローブの製造方法
JP2000338133A (ja) * 1999-05-31 2000-12-08 Isao Kimoto 接触子
JP4579361B2 (ja) * 1999-09-24 2010-11-10 軍生 木本 接触子組立体
US7254889B1 (en) * 2000-09-08 2007-08-14 Gabe Cherian Interconnection devices
US20040051541A1 (en) * 2002-09-04 2004-03-18 Yu Zhou Contact structure with flexible cable and probe contact assembly using same
SG124273A1 (en) * 2004-03-08 2006-08-30 Tan Yin Leong Non-abrasive electrical test contact
WO2005011069A1 (ja) * 2003-07-29 2005-02-03 Advantest Corporation ソケット、及び試験装置
TWI286606B (en) * 2004-03-16 2007-09-11 Gunsei Kimoto Electric signal connecting device, and probe assembly and prober device using it
JP4571511B2 (ja) * 2005-01-07 2010-10-27 株式会社日本マイクロニクス 通電試験用プローブ
TWI397696B (zh) * 2006-02-19 2013-06-01 木本軍生 Probe assembly
JP4522975B2 (ja) * 2006-06-19 2010-08-11 東京エレクトロン株式会社 プローブカード
JP5077735B2 (ja) * 2006-08-07 2012-11-21 軍生 木本 複数梁合成型接触子組立
JP2008122356A (ja) * 2006-10-18 2008-05-29 Isao Kimoto プローブ
JP5030060B2 (ja) * 2007-08-01 2012-09-19 軍生 木本 電気信号接続装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4618821A (en) * 1983-09-19 1986-10-21 Lenz Seymour S Test probe assembly for microelectronic circuits
CN1936596A (zh) * 2005-09-19 2007-03-28 木本军生 接点组装体及其lsi芯片检查装置

Also Published As

Publication number Publication date
JP5099487B2 (ja) 2012-12-19
CN101358998A (zh) 2009-02-04
JP2009036744A (ja) 2009-02-19
US20090045831A1 (en) 2009-02-19
TW200907351A (en) 2009-02-16
US7808261B2 (en) 2010-10-05
TWI375035B (https=) 2012-10-21
KR20090014107A (ko) 2009-02-06

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