CN101326597B - 感应器件 - Google Patents
感应器件 Download PDFInfo
- Publication number
- CN101326597B CN101326597B CN2007800005291A CN200780000529A CN101326597B CN 101326597 B CN101326597 B CN 101326597B CN 2007800005291 A CN2007800005291 A CN 2007800005291A CN 200780000529 A CN200780000529 A CN 200780000529A CN 101326597 B CN101326597 B CN 101326597B
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- CN
- China
- Prior art keywords
- groove
- magnetic layer
- sensing device
- roughly
- shape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011159 matrix material Substances 0.000 claims description 75
- 230000002093 peripheral effect Effects 0.000 claims description 34
- 238000009413 insulation Methods 0.000 claims description 9
- 239000000696 magnetic material Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 abstract description 10
- 230000008602 contraction Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000004804 winding Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 49
- 239000000843 powder Substances 0.000 description 20
- 210000002683 foot Anatomy 0.000 description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 10
- 239000000956 alloy Substances 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 10
- 238000005755 formation reaction Methods 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000006247 magnetic powder Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229910001021 Ferroalloy Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 210000003491 skin Anatomy 0.000 description 5
- 229910000859 α-Fe Inorganic materials 0.000 description 5
- 229910000640 Fe alloy Inorganic materials 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910017061 Fe Co Inorganic materials 0.000 description 2
- 229910002546 FeCo Inorganic materials 0.000 description 2
- 229910002555 FeNi Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 229910017318 Mo—Ni Inorganic materials 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- -1 organic siliconresin Polymers 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910019819 Cr—Si Inorganic materials 0.000 description 1
- 229910017082 Fe-Si Inorganic materials 0.000 description 1
- 229910017133 Fe—Si Inorganic materials 0.000 description 1
- 229910017706 MgZn Inorganic materials 0.000 description 1
- 229910003962 NiZn Inorganic materials 0.000 description 1
- 229910002796 Si–Al Inorganic materials 0.000 description 1
- 229910008423 Si—B Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000002615 epidermis Anatomy 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- WQLQSBNFVQMAKD-UHFFFAOYSA-N methane;silicon Chemical class C.[Si] WQLQSBNFVQMAKD-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Coils Or Transformers For Communication (AREA)
- Measuring Magnetic Variables (AREA)
Applications Claiming Priority (15)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006082278A JP5082271B2 (ja) | 2006-03-24 | 2006-03-24 | チップコイルとその製造方法 |
JP082278/2006 | 2006-03-24 | ||
JP113152/2006 | 2006-04-17 | ||
JP2006113152A JP5082282B2 (ja) | 2006-04-17 | 2006-04-17 | インダクタンス部品とその製造方法 |
JP113151/2006 | 2006-04-17 | ||
JP2006113151A JP5286645B2 (ja) | 2006-04-17 | 2006-04-17 | インダクタンス部品とその製造方法 |
JP2006131329A JP2007305717A (ja) | 2006-05-10 | 2006-05-10 | インダクタンス部品とその製造方法 |
JP131329/2006 | 2006-05-10 | ||
JP133305/2006 | 2006-05-12 | ||
JP2006133305A JP5082293B2 (ja) | 2006-05-12 | 2006-05-12 | インダクタンス部品とその製造方法 |
JP180663/2006 | 2006-06-30 | ||
JP180661/2006 | 2006-06-30 | ||
JP2006180663A JP2008010697A (ja) | 2006-06-30 | 2006-06-30 | インダクタンス部品 |
JP2006180661A JP2008010695A (ja) | 2006-06-30 | 2006-06-30 | インダクタンス部品 |
PCT/JP2007/055535 WO2007119426A1 (ja) | 2006-03-24 | 2007-03-19 | インダクタンス部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101326597A CN101326597A (zh) | 2008-12-17 |
CN101326597B true CN101326597B (zh) | 2012-05-02 |
Family
ID=38632445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800005291A Expired - Fee Related CN101326597B (zh) | 2006-03-24 | 2007-03-19 | 感应器件 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5082271B2 (ja) |
CN (1) | CN101326597B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5359842B2 (ja) * | 2009-12-11 | 2013-12-04 | Tdk株式会社 | 積層型コモンモードフィルタ |
KR101862409B1 (ko) * | 2011-12-22 | 2018-07-05 | 삼성전기주식회사 | 칩 인덕터 및 칩 인덕터 제조방법 |
JP6265031B2 (ja) * | 2014-04-25 | 2018-01-24 | 住友電装株式会社 | コア片及びリアクトル |
KR101681406B1 (ko) * | 2015-04-01 | 2016-12-12 | 삼성전기주식회사 | 코일 전자부품 및 그 제조방법 |
US10269481B2 (en) | 2016-05-27 | 2019-04-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stacked coil for wireless charging structure on InFO package |
KR101994754B1 (ko) * | 2017-08-23 | 2019-07-01 | 삼성전기주식회사 | 인덕터 |
JP7140481B2 (ja) | 2017-09-25 | 2022-09-21 | 日東電工株式会社 | インダクタおよびその製造方法 |
WO2020022393A1 (ja) * | 2018-07-25 | 2020-01-30 | 味の素株式会社 | 磁性ペースト |
JP7081667B2 (ja) * | 2018-07-25 | 2022-06-07 | 味の素株式会社 | 磁性ペースト |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2986520B2 (ja) * | 1990-07-31 | 1999-12-06 | ティーディーケイ株式会社 | 電子部品及びその製造方法 |
JPH04101403A (ja) * | 1990-08-21 | 1992-04-02 | Tdk Corp | 電子部品及びその製造方法 |
JP2003158017A (ja) * | 2001-11-21 | 2003-05-30 | Jhc Osaka:Kk | トランス |
-
2006
- 2006-03-24 JP JP2006082278A patent/JP5082271B2/ja not_active Expired - Fee Related
-
2007
- 2007-03-19 CN CN2007800005291A patent/CN101326597B/zh not_active Expired - Fee Related
Non-Patent Citations (4)
Title |
---|
JP平4-88608A 1992.03.23 |
JP特开2003-158017A 2003.05.30 |
JP特开2005-340586A 2005.12.08 |
JP特开平9-55316A 1997.02.25 |
Also Published As
Publication number | Publication date |
---|---|
JP2007258521A (ja) | 2007-10-04 |
CN101326597A (zh) | 2008-12-17 |
JP5082271B2 (ja) | 2012-11-28 |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120502 |
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