CN101320776B - 发光装置及其制作方法、电子装置和移动电话装置 - Google Patents

发光装置及其制作方法、电子装置和移动电话装置 Download PDF

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Publication number
CN101320776B
CN101320776B CN 200810108247 CN200810108247A CN101320776B CN 101320776 B CN101320776 B CN 101320776B CN 200810108247 CN200810108247 CN 200810108247 CN 200810108247 A CN200810108247 A CN 200810108247A CN 101320776 B CN101320776 B CN 101320776B
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CN
China
Prior art keywords
light
resin
emitting device
fluorophor
sealing resin
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Expired - Fee Related
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CN 200810108247
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English (en)
Chinese (zh)
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CN101320776A (zh
Inventor
太田将之
小西正宏
竹中靖二
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Sharp Corp
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Sharp Corp
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Publication of CN101320776A publication Critical patent/CN101320776A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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CN 200810108247 2007-06-05 2008-06-05 发光装置及其制作方法、电子装置和移动电话装置 Expired - Fee Related CN101320776B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2007149815 2007-06-05
JP2007149815 2007-06-05
JP2007-149815 2007-06-05
JP2007-308065 2007-11-28
JP2007308065A JP5230171B2 (ja) 2007-06-05 2007-11-28 発光装置、発光装置の製造方法、電子機器および携帯電話機
JP2007308065 2007-11-28

Publications (2)

Publication Number Publication Date
CN101320776A CN101320776A (zh) 2008-12-10
CN101320776B true CN101320776B (zh) 2012-09-26

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CN 200810108247 Expired - Fee Related CN101320776B (zh) 2007-06-05 2008-06-05 发光装置及其制作方法、电子装置和移动电话装置

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JP (1) JP5230171B2 (ja)
CN (1) CN101320776B (ja)

Cited By (1)

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CN108780831A (zh) * 2016-03-10 2018-11-09 亮锐控股有限公司 Led模块

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CN102292686B (zh) 2009-01-28 2015-02-25 联想创新有限公司（香港) 电子设备
JP5264650B2 (ja) * 2009-08-21 2013-08-14 スタンレー電気株式会社 Ｌｅｄ照明装置
WO2011021402A1 (ja) * 2009-08-21 2011-02-24 パナソニック株式会社 発光装置
JP5870611B2 (ja) * 2010-11-05 2016-03-01 日亜化学工業株式会社 発光装置及びその製造方法
EP2472578B1 (en) * 2010-12-28 2020-06-03 Nichia Corporation Light emitting device
KR101795370B1 (ko) * 2011-07-28 2017-11-08 삼성전자주식회사 발광디바이스의 제조방법
CN105762257A (zh) * 2011-08-02 2016-07-13 亿光电子(中国)有限公司 荧光粉组成及使用该荧光粉组成的白色发光装置
CN103000768A (zh) * 2011-09-09 2013-03-27 展晶科技(深圳)有限公司 发光二极管封装结构的制造方法
WO2013056009A1 (en) * 2011-10-13 2013-04-18 Intematix Corporation Photoluminescence wavelength conversion components for solid-state light emitting devices and lamps
JP2014041993A (ja) 2012-07-24 2014-03-06 Toyoda Gosei Co Ltd 発光装置及びその製造方法
KR102024592B1 (ko) * 2012-11-26 2019-09-24 엘지전자 주식회사 발광 소자 패키지
JP6070498B2 (ja) * 2012-12-21 2017-02-01 信越化学工業株式会社 蛍光体含有層と白色顔料含有層を有する熱硬化性シリコーン樹脂シート、それを使用する発光装置の製造方法及び封止発光半導体装置
WO2015072079A1 (ja) * 2013-11-12 2015-05-21 パナソニックＩｐマネジメント株式会社 発光装置の製造方法、および製造装置
US10120266B2 (en) * 2014-01-06 2018-11-06 Lumileds Llc Thin LED flash for camera
JP2016029686A (ja) * 2014-07-25 2016-03-03 サンケン電気株式会社 発光装置
JP6477361B2 (ja) * 2014-10-31 2019-03-06 日亜化学工業株式会社 発光装置
US9698315B2 (en) 2014-10-31 2017-07-04 Nichia Corporation Light emitting device
JP2015099945A (ja) * 2015-02-27 2015-05-28 日亜化学工業株式会社 発光装置
JP6925100B2 (ja) * 2015-05-21 2021-08-25 日亜化学工業株式会社 発光装置
JP7029963B2 (ja) * 2016-02-02 2022-03-04 シチズン電子株式会社 発光装置およびその製造方法
JP6790564B2 (ja) * 2016-08-05 2020-11-25 日本電気硝子株式会社 波長変換部材の製造方法
JP7053980B2 (ja) * 2016-11-16 2022-04-13 日亜化学工業株式会社 発光装置
JP2019046989A (ja) * 2017-09-04 2019-03-22 スタンレー電気株式会社 半導体発光装置及び半導体発光装置の製造方法
JP6658808B2 (ja) * 2017-12-25 2020-03-04 日亜化学工業株式会社 発光装置および発光装置の製造方法
JP6777104B2 (ja) * 2018-01-31 2020-10-28 日亜化学工業株式会社 発光装置及びその製造方法
JP7277276B2 (ja) * 2019-06-18 2023-05-18 スタンレー電気株式会社 発光装置
JP7277760B2 (ja) * 2019-08-19 2023-05-19 日亜化学工業株式会社 発光装置及びその製造方法
TWI823371B (zh) 2020-01-31 2023-11-21 日商日亞化學工業股份有限公司 面狀光源

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WO2005104247A1 (ja) * 2004-04-19 2005-11-03 Matsushita Electric Industrial Co., Ltd. Ｌｅｄ照明光源の製造方法およびｌｅｄ照明光源
JP2007081090A (ja) * 2005-09-14 2007-03-29 Fujikura Ltd 白色発光体及び照明装置
JP3117306U (ja) * 2005-10-03 2006-01-05 岡谷電機産業株式会社 発光ダイオード
JP4895574B2 (ja) * 2005-11-02 2012-03-14 シャープ株式会社 波長変換部材及び発光装置
US20070096133A1 (en) * 2005-11-02 2007-05-03 Lee Kian S System and method for LED manufacturing

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108780831A (zh) * 2016-03-10 2018-11-09 亮锐控股有限公司 Led模块
CN108780831B (zh) * 2016-03-10 2022-01-11 亮锐控股有限公司 Led模块

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Publication number Publication date
CN101320776A (zh) 2008-12-10
JP5230171B2 (ja) 2013-07-10
JP2009016779A (ja) 2009-01-22

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Granted publication date: 20120926