CN101320772A - Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method - Google Patents
Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method Download PDFInfo
- Publication number
- CN101320772A CN101320772A CNA2008100455675A CN200810045567A CN101320772A CN 101320772 A CN101320772 A CN 101320772A CN A2008100455675 A CNA2008100455675 A CN A2008100455675A CN 200810045567 A CN200810045567 A CN 200810045567A CN 101320772 A CN101320772 A CN 101320772A
- Authority
- CN
- China
- Prior art keywords
- resin
- ink
- fluorescent material
- jet
- fluorescent powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Led Device Packages (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The invention discloses a preparation for the fluorescent powder dispersoid for the LED package and a ink-jet printing method, comprising the following steps: (1) preparing the resin: mixing the resin and the firming agent with a proper volume proportion; (2) diluting the resin: mixing the resin with high adhesive prepared in the step (1) to the ether or ester organic solvent with proper proportion, reducing the adhesive of the resin; (3) preparing the fluorescent powder and dispersoid: mixing the fluorescent powder with the resin diluted by the step (2) with a proper proportion , dispersing evenly to form the fluorescent powder dispersoid; (4) ink-jet printing package: loading the fluorescent powder dispersoid with the qualified adhesive prepared in the step (3) in the ink-jet printing head, achieving a resin covering, which is a fluorescent powder layer, with shape and thickness controllable resin covering on the LED chip surface via the control for the ink-jet time and the ink-jet path for the ink-jet printer. The method overcomes the defects in the current packaging technology, which can effectively enhance the integral performance for the LED devices and satisfy the requests of industrialized volume-produce.
Description
Technical field
The present invention relates to field of application of photoelectric technology, be specifically related to a kind of preparation and inkjet printing methods of fluorescent powder dispersoid of the LED of being used for encapsulation.
Background technology
LED is the abbreviation of light emitting diode.Since first red light emitting diodes came out in the world, the LED technology had experienced evolution at full speed, and the LED of various glow colors is born in succession.Japan at first obtained technological break-through on blue GaN-LED in 1993, and realized white light LEDs in 1996, in recent years, was the 4th generation lighting technology-semiconductor lighting Study on Technology of representative and exploitation has been subjected to height in the whole world attention with the white light LEDs.Advantages such as that white light LEDs has is pollution-free, low-power consumption, highly reliable, long-life are a kind of environmental protection, energy-conservation green illumination light sources of meeting.
At present, realize that white light LEDs has four approach, one of them important channel is at the suitable yellow fluorescent powder (YAG:Ce of surface-coated one layer thickness of blue-light LED chip
3+), yellow fluorescent powder absorbs the part blue light that sends from the blue led chip and also into the gold-tinted of partly changing, and the gold-tinted of generation and non-switched blue light form white light by the stack of colour mixture principle.White light LEDs for this fluorescent material conversion, the technology of main flow is that fluorescent powder grain is mixed with transparent colloid (as epoxy glue, silica gel etc.) at present, by a glue, on led chip, apply the mixed layer of fluorescent material and colloid, but the phosphor powder layer thickness structure that obtains like this is inhomogeneous, thereby the lack of homogeneity that causes the LED bright dipping, and the fluorescent material thickness poor repeatability between device have greatly restricted batch process and rate of finished products.
Summary of the invention
Technical problem to be solved by this invention is preparation and the inkjet printing methods how a kind of fluorescent powder dispersoid of the LED of being used for encapsulation is provided, this method target is to realize the phosphor powder layer of shape, controllable thickness on the led chip surface, overcome existing defective in the prior art, improve the overall performance of LED device, and satisfied the needs that industrialization is produced in batches.
Technical problem proposed by the invention is to solve like this: a kind of preparation and inkjet printing methods of fluorescent powder dispersoid of the LED of being used for encapsulation are provided, it is characterized in that, may further comprise the steps:
1. prepare resin: the volume ratio of resin and curing agent being pressed condition of cure mixes, and stirs;
2. letdown resin: the full-bodied resin that will 1. prepare and ethers or ester class organic solvent reduce the viscosity of resin by 1: 0.1～1: 10 mixed by the diluting effect of ethers or ester class organic solvent;
3. prepare the dispersion of fluorescent material and resin: the fluorescent material and the resin of 2. dilution are pressed 5mg: the mixed of 1ml～500mg: 1ml, evenly disperse, the fluorescent material resin dispersion that viscosity requires is satisfied in formation, generally its viscosity need be reduced to 10～12mPas even following, to satisfy the requirement of conventional ink-jet printer;
4. inkjet printing encapsulation: step is met the fluorescent material resin dispersion that viscosity requires-the be ink-jet ink ink jet-print head of packing in 3., by control, realize resinous coat-fluorescent material bisque that the fluorescent material of shape, controllable thickness disperses on the led chip surface to ink-jet printer ink-jet time and ink-jet path.
Preparation and inkjet printing methods according to the fluorescent powder dispersoid of LED provided by the present invention encapsulation is characterized in that described resin comprises optics silica gel, and as silica gel A and silica gel B, wherein silica gel B plays the curing agent effect.
Preparation and inkjet printing methods according to the fluorescent powder dispersoid of LED provided by the present invention encapsulation is characterized in that, 1. step is prepared in the resin process by vacuumizing or leave standstill dual mode and eliminated wherein bubble.
Preparation and inkjet printing methods according to the fluorescent powder dispersoid of LED provided by the present invention encapsulation is characterized in that, described ether organic solvent be oxolane (THF) and modify after derivative, as dimethyl-tetrahydrofuran.
Preparation and inkjet printing methods according to the fluorescent powder dispersoid of LED provided by the present invention encapsulation, it is characterized in that described ester class organic solvent is meant lower, the volatile ester class of boiling point organic solvents such as ethyl acetate, propyl acetate, butyl acetate, ethyl butyrate.
Preparation and inkjet printing methods according to the fluorescent powder dispersoid of LED provided by the present invention encapsulation is characterized in that, step 3. described in fluorescent material can be a kind of or its combination in yellow fluorescent powder, red fluorescence powder, green emitting phosphor and the blue colour fluorescent powder.
Preparation and inkjet printing methods according to the fluorescent powder dispersoid of LED provided by the present invention encapsulation, it is characterized in that 3. step in mixed process, can produce a large amount of bubbles, at room temperature static to the bubble complete obiteration or in vacuum environment, the bubble in the eliminating fluorescent powder dispersoid of bleeding.
Preparation and inkjet printing methods according to the fluorescent powder dispersoid of LED provided by the present invention encapsulation, it is characterized in that alternate manners (being different from step inkjet printing 4.) such as the fluorescent material resin dispersion that 3. step obtains can operating point glue, even glue are realized fluorescent coating on the led chip surface.
A kind of preparation and inkjet printing methods that is used for the fluorescent powder dispersoid of LED encapsulation is characterized in that, may further comprise the steps:
1. prepare resin: resin and the curing agent requirement volume ratio by condition of cure is mixed, stir;
2. prepare the dispersion of fluorescent material and resin: with fluorescent material and step 1. the gained resin press 5mg: the mixed of 1ml～500mg: 1ml, evenly disperse, form uniform fluorescent material resin dispersion;
3. dilute the fluorescent material resin dispersion: the full-bodied fluorescent material resin dispersion that 2. step is prepared mixes by 1: 0.1～1: 10 with ethers or ester class organic solvent, to reduce the viscosity of fluorescent material resin dispersion;
4. inkjet printing encapsulation: with the fluorescent material resin dispersion-ink-jet ink of step in the 3. ink jet-print head of packing into, by control, realize resinous coat-fluorescent material bisque that the fluorescent material of shape, controllable thickness disperses on the led chip surface to ink-jet printer ink-jet time and ink-jet path.
A kind of preparation and inkjet printing methods that is used for the fluorescent powder dispersoid of LED encapsulation is characterized in that, may further comprise the steps:
1. letdown resin: full-bodied resin is mixed by 1: 0.1～1: 10 with ethers or ester class organic solvent, reduce the viscosity of resin;
2. prepare resin: the resin that 1. step is diluted mixes with the requirement volume ratio of curing agent by condition of cure, stirs;
3. prepare the dispersion of fluorescent material and resin: fluorescent material and step resin are 2. pressed 5mg: the mixed of 1ml～500mg: 1ml, evenly disperse, form and satisfy the fluorescent material resin dispersion that viscosity requires;
4. inkjet printing encapsulation: step is met fluorescent material resin dispersion-ink-jet ink that viscosity requires ink jet-print head of packing in 3., by control, realize resinous coat-fluorescent material bisque that the fluorescent material of shape, controllable thickness disperses on the led chip surface to ink-jet printer ink-jet time and ink-jet path.
With step 1., 2., the 3. change of order, do not influence the reduction of fluorescent material resin dispersion viscosity in this method, and the inkjet printing of led chip surface fluorescence powder coating is realized.
Preparation and the inkjet printing methods that is used for the fluorescent powder dispersoid of LED encapsulation provided by the invention, by dilution to high viscosity fluorescent material resin dispersion, the concentration of fluorescent material, ink-jet time, the isoparametric control in ink-jet path, can form the phosphor powder layer of shape, controllable thickness at led chip surface inkjet printing, improve the structure and the physicochemical characteristic of phosphor powder layer, improve the overall performance of LED device, satisfy the needs that industrialization is produced in batches.
Embodiment
The present invention is further described below in conjunction with embodiment.
Embodiment 1
Get silica gel A and each 1ml of silica gel B, stir, form and mix silica gel, left standstill about 10 hours, treat bubble complete obiteration wherein; Measure a certain amount of oxolane organic solvent, stirring makes the viscosity of silica gel reduce to 10～12mPa.s even following by original about 400mPas; Weigh phosphor powder 500mg mixed with mixing in the silica gel after the dilution, stirred the fluorescent material that the viscosity of the suitable inkjet printing of formation is suitable and the dispersion of resin; By to inkjet printing time, the isoparametric phosphor powder layer that forms shape, controllable thickness on the led chip surface that is controlled in ink-jet path.
Embodiment 2
Get silica gel A and each 1ml of silica gel B, stir, form and mix silica gel, left standstill about 10 hours, treat bubble complete obiteration wherein; Measure a certain amount of ethyl acetate organic solvent, stirring makes the viscosity of silica gel reduce to 10～12mPas even following by original about 400mPas; Weigh phosphor powder 500mg mixed with mixing in the silica gel after the dilution, stirred the fluorescent material that the viscosity of the suitable inkjet printing of formation is suitable and the dispersion of resin; By to inkjet printing time, the isoparametric phosphor powder layer that forms shape, controllable thickness on the led chip surface that is controlled in ink-jet path.
Embodiment 3
Each 1ml of extracting epoxy resin and curing agent thereof evenly mixes; Weigh phosphor powder 500mg adds in the epoxy resin of having prepared, stirs; Measure a certain amount of oxolane organic solvent, mixing, stirring make the viscosity of fluorescent material epoxy resin dispersion drop to 10～12mPas, form to be fit to the suitable fluorescent material of the viscosity of inkjet printing and the dispersion of resin, by to inkjet printing time, the isoparametric phosphor powder layer that forms shape, controllable thickness on the led chip surface that is controlled in ink-jet path.
Claims (9)
1, a kind of preparation and inkjet printing methods that is used for the fluorescent powder dispersoid of LED encapsulation is characterized in that, may further comprise the steps:
1. prepare resin: the volume ratio of resin and curing agent being pressed condition of cure mixes, and stirs;
2. letdown resin: the full-bodied resin that will 1. prepare and ethers or ester class organic solvent reduce the viscosity of resin by 1: 0.1～1: 10 mixed;
3. prepare the dispersion of fluorescent material and resin: the fluorescent material and the resin of 2. dilution are pressed 5mg: the mixed of 1ml～500mg: 1ml, evenly disperse, form the fluorescent material resin dispersion;
4. inkjet printing encapsulation: with step 3. in the fluorescent material resin dispersion ink jet-print head of packing into, by control, realize resinous coat-fluorescent material bisque that the fluorescent material of shape, controllable thickness disperses on the led chip surface to ink-jet printer ink-jet time and ink-jet path.
2, preparation and the inkjet printing methods that is used for the fluorescent powder dispersoid of LED encapsulation according to claim 1 is characterized in that described resin comprises optics silica gel, and as silica gel A and silica gel B, wherein silica gel B plays the curing agent effect.
3, preparation and the inkjet printing methods that is used for the fluorescent powder dispersoid of LED encapsulation according to claim 1 is characterized in that, 1. step is prepared in the resin process by vacuumizing or leave standstill dual mode elimination bubble wherein.
4, preparation and the inkjet printing methods that is used for the fluorescent powder dispersoid of LED encapsulation according to claim 1 is characterized in that, described ether organic solvent is the derivative after oxolane and the modification thereof.
5, preparation and the inkjet printing methods that is used for the fluorescent powder dispersoid of LED encapsulation according to claim 1 is characterized in that described ester class organic solvent is meant ethyl acetate, propyl acetate, butyl acetate or ethyl butyrate.
6, according to described preparation and the inkjet printing methods that is used for the fluorescent powder dispersoid of LED encapsulation of claim 1, it is characterized in that, step 3. described in fluorescent material be a kind of or its combination in yellow fluorescent powder, red fluorescence powder, green emitting phosphor and the blue colour fluorescent powder.
7, preparation and the inkjet printing methods that is used for the fluorescent powder dispersoid of LED encapsulation according to claim 1, it is characterized in that, step is 3. in mixed process, and is at room temperature static to the bubble complete obiteration or in vacuum environment, bleeds and gets rid of bubble in the fluorescent powder dispersoid.
8, a kind of preparation and inkjet printing methods that is used for the fluorescent powder dispersoid of LED encapsulation is characterized in that, may further comprise the steps:
1. prepare resin: resin and the curing agent requirement volume ratio by condition of cure is mixed, stir;
2. prepare the dispersion of fluorescent material and resin: with fluorescent material and step 1. the gained resin press 5mg: the mixed of 1ml～500mg: 1ml, evenly disperse, form uniform fluorescent material resin dispersion;
3. dilute the fluorescent material resin dispersion: the full-bodied fluorescent material resin dispersion that 2. step is prepared mixes by 1: 0.1～1: 10 with ethers or ester class organic solvent, to reduce the viscosity of fluorescent material resin dispersion;
4. inkjet printing encapsulation: with the fluorescent material resin dispersion-ink-jet ink of step in the 3. ink jet-print head of packing into, by control, realize resinous coat-fluorescent material bisque that the fluorescent material of shape, controllable thickness disperses on the led chip surface to ink-jet printer ink-jet time and ink-jet path.
9, a kind of preparation and inkjet printing methods that is used for the fluorescent powder dispersoid of LED encapsulation is characterized in that, may further comprise the steps:
1. letdown resin: full-bodied resin is mixed by 1: 0.1～1: 10 with ethers or ester class organic solvent, reduce the viscosity of resin;
2. prepare resin: the resin that 1. step is diluted mixes with the requirement volume ratio of curing agent by condition of cure, stirs;
3. prepare the dispersion of fluorescent material and resin: fluorescent material and step resin are 2. pressed 5mg: the mixed of 1ml～500mg: 1ml, evenly disperse, form and satisfy the fluorescent material resin dispersion that viscosity requires;
4. inkjet printing encapsulation: step is met fluorescent material resin dispersion-ink-jet ink that viscosity requires ink jet-print head of packing in 3., by control, realize resinous coat-fluorescent material bisque that the fluorescent material of shape, controllable thickness disperses on the led chip surface to ink-jet printer ink-jet time and ink-jet path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100455675A CN101320772B (en) | 2008-07-15 | 2008-07-15 | Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100455675A CN101320772B (en) | 2008-07-15 | 2008-07-15 | Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101320772A true CN101320772A (en) | 2008-12-10 |
| CN101320772B CN101320772B (en) | 2010-06-02 |
Family
ID=40180707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100455675A Expired - Fee Related CN101320772B (en) | 2008-07-15 | 2008-07-15 | Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101320772B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244158A (en) * | 2011-06-24 | 2011-11-16 | 深圳莱特光电有限公司 | LED encapsulation method for dispersing fluorescent powder |
| CN102260438A (en) * | 2011-05-09 | 2011-11-30 | 香港应用科技研究院有限公司 | LED fluorescence ink composite used for ink jet printing |
| CN102290498A (en) * | 2011-05-27 | 2011-12-21 | 协鑫光电科技（张家港）有限公司 | Method for manufacturing LED (light-emitting diode) capable of generating white light by plane fluorescent powder of chip step |
| CN103426977A (en) * | 2012-05-16 | 2013-12-04 | 展晶科技(深圳)有限公司 | Method for packaging light-emitting diode |
| CN104051599A (en) * | 2014-06-07 | 2014-09-17 | 桂林电子科技大学 | Method for manufacturing white-light LED fluorescent film based on 3D printing technology |
| CN108807221A (en) * | 2018-04-25 | 2018-11-13 | 四川省欧玛科技有限公司 | LED fluorescent powder spraying method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8785222B2 (en) | 2011-05-09 | 2014-07-22 | Hong Kong Applied Science and Technology Research Institute Company Limited | Phosphor ink composition |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6066357A (en) * | 1998-12-21 | 2000-05-23 | Eastman Kodak Company | Methods of making a full-color organic light-emitting display |
| US6650044B1 (en) * | 2000-10-13 | 2003-11-18 | Lumileds Lighting U.S., Llc | Stenciling phosphor layers on light emitting diodes |
| TW490863B (en) * | 2001-02-12 | 2002-06-11 | Arima Optoelectronics Corp | Manufacturing method of LED with uniform color temperature |
-
2008
- 2008-07-15 CN CN2008100455675A patent/CN101320772B/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102260438A (en) * | 2011-05-09 | 2011-11-30 | 香港应用科技研究院有限公司 | LED fluorescence ink composite used for ink jet printing |
| WO2012151765A1 (en) * | 2011-05-09 | 2012-11-15 | Hong Kong Applied Science And Technology Research Institute Co., Ltd. | Led phosphor ink composition for ink-jet printing |
| US8329485B2 (en) | 2011-05-09 | 2012-12-11 | Hong Kong Applied Science and Technology Research Institute Company Limited | LED phosphor ink composition for ink-jet printing |
| CN102260438B (en) * | 2011-05-09 | 2015-07-15 | 香港应用科技研究院有限公司 | LED fluorescence ink composite used for ink jet printing |
| CN102290498A (en) * | 2011-05-27 | 2011-12-21 | 协鑫光电科技（张家港）有限公司 | Method for manufacturing LED (light-emitting diode) capable of generating white light by plane fluorescent powder of chip step |
| CN102244158A (en) * | 2011-06-24 | 2011-11-16 | 深圳莱特光电有限公司 | LED encapsulation method for dispersing fluorescent powder |
| CN103426977A (en) * | 2012-05-16 | 2013-12-04 | 展晶科技(深圳)有限公司 | Method for packaging light-emitting diode |
| CN103426977B (en) * | 2012-05-16 | 2016-05-04 | 展晶科技(深圳)有限公司 | LED encapsulation method |
| CN104051599A (en) * | 2014-06-07 | 2014-09-17 | 桂林电子科技大学 | Method for manufacturing white-light LED fluorescent film based on 3D printing technology |
| CN108807221A (en) * | 2018-04-25 | 2018-11-13 | 四川省欧玛科技有限公司 | LED fluorescent powder spraying method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101320772B (en) | 2010-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101320772B (en) | Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method | |
| CN106746687B (en) | A method of LED encapsulation fluorescent glass piece is prepared using silk screen print method | |
| CN102983250B (en) | Silica-gel lens and preparation method thereof, containing its LED | |
| CN106653985A (en) | Multi-layer packaged quantum dot LED structure | |
| CN101699638A (en) | Phosphor powder film making method and obtained phosphor powder film encapsulating method | |
| CN105112044B (en) | Fluorescent carbon quantum dot composite luminescent material and its preparation and the application on LED | |
| CN102723424A (en) | Method for preparing fluorescent wafer for LED (light-emitting diode) | |
| CN105936815A (en) | Thixotropic epoxy resin, preparation method and application thereof in LED chip packaging | |
| CN103872225A (en) | Light-emitting film used for LED lighting and provided with micro-mirror structure and preparing method thereof | |
| CN102718492A (en) | Method for producing transparent ceramic fluorescence substrate used for LED | |
| CN102218391A (en) | Plane coating method of fluorescent glue in package of white-light LED | |
| CN104051599A (en) | Method for manufacturing white-light LED fluorescent film based on 3D printing technology | |
| CN106098907A (en) | High colour gamut phosphor combination, white light LEDs and preparation method thereof | |
| CN105567105A (en) | Chip level encapsulated LED white light chip fluorescent coating with high refractive index and preparation method thereof | |
| CN101599521A (en) | A kind of encapsulating structure of great power LED | |
| CN102437255A (en) | Fluorescent chip for white light LED (light-emitting diode) prepared by spinning coating process | |
| CN101442087B (en) | Low power low light loss white light LED | |
| CN101887941A (en) | Preparation method of LED phosphor layer | |
| CN102376857A (en) | Packaging method for light-emitting manner of LED (Light-Emitting Diode) with specific wavelength | |
| CN109935677B (en) | Fluorescent film structure for white light LED and preparation method thereof | |
| CN105244427B (en) | A kind of white-light LED fluorescence film and the LED based on fluorescent film | |
| CN107546313A (en) | LED light source and preparation method thereof | |
| CN109742220A (en) | White light LEDs of the quantum dot containing liquid and preparation method thereof | |
| CN207009474U (en) | A kind of quantum dot LED structure of multilayer encapsulation | |
| CN102109382B (en) | Method and system for detecting color temperature of mixed light of fluorescent powder |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100602 Termination date: 20160715 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |