CN104051599A - Method for manufacturing white-light LED fluorescent film based on 3D printing technology - Google Patents
Method for manufacturing white-light LED fluorescent film based on 3D printing technology Download PDFInfo
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- 238000010146 3D printing Methods 0.000 title claims abstract description 19
- 238000005516 engineering process Methods 0.000 title abstract description 18
- 238000004519 manufacturing process Methods 0.000 title abstract description 12
- 239000000463 material Substances 0.000 claims abstract description 47
- 239000000843 powder Substances 0.000 claims abstract description 20
- 239000002002 slurry Substances 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 238000007639 printing Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000012528 membrane Substances 0.000 claims description 31
- 238000002360 preparation method Methods 0.000 claims description 29
- 238000012360 testing method Methods 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
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Abstract
The invention discloses a method for manufacturing a white-light LED fluorescent film based on the 3D printing technology. The method for manufacturing the white-light LED fluorescent film based on the 3D printing technology comprises the following steps that (1) fluorescent powder slurry is prepared; (2) a 3D printer is introduced, and the fluorescent film is printed on an LED chip or on other transparent substrates under the control of a computer; (3) the printed film is cured simultaneously through hot wind scanning or ultraviolet light curing during printing; (4) integral curing is conducted according to an optimized heating technology or an optimized ultraviolet light curing method based on the property of colloid, and then the required fluorescent film is obtained. The method for manufacturing the white-light LED fluorescent film based on the 3D printing technology has the advantages that the printing precision is high, the automation degree is high, material waste is small, 3D patterns in various shapes and with various thicknesses can be printed on various substrates or various objects freely, the method is an advanced manufacturing technology, a complete 3D printer is available at present, automatic production can be achieved, and the method is quite suitable for manufacturing the white-light LED fluorescent film.
Description
Technical field
The invention belongs to technical field of semiconductor illumination, relate to a kind of preparation method of fluorescence membrane, particularly relate to a kind of preparation method of the large power white light LED fluorescence membrane based on 3D printing technique.
Background technology
LED(Light Emitting Diode), light-emitting diode, is a kind of semiconductor Solid light source, because it has the advantages such as energy-efficient, environmental protection, long-life, rich color, is described as the new light sources of 21 century.In all semiconductor illuminating light sources, maximum with the technical difficulty of white light LEDs, highlighted, high-power current white light LEDs especially enters the demand focus in general lighting field, is also the key problem in technology that current white light LEDs product needed solves.Current business-like white light LEDs mainstream technology is to make with blue chip+yellow fluorescent powder, and yellow fluorescent powder is the most common with gluing process, its technical process is first fluorescent material to be mixed with colloid, through stirring, be made into slurry by a certain percentage, and then by gluing process, fluorescent slurry is coated on to LED chip surface, but the white-light LED fluorescence layer that adopts gluing process to make, there is following main problem: in (1) some glue process glue drip with spherical drip on chip after, diffusion shape to gum spot, thickness and surface microscopic form are difficult to control, often easily form thick middle, the fluorescence coating that surrounding is thin, the uniformity of gum spot is poor, thereby easily cause local partially yellow or partially blue inhomogeneous hot spot to occur, (2) because the proportion of fluorescent material is larger, could be completely curing need certain hour again after a glue after, therefore easily there is fluorescent material sedimentation phenomenon, thereby affect uniformity of light, when serious, also can cause reflection or scattering to light, thereby cause light extraction efficiency to reduce, (3) amount of fluorescent material is difficult to realize accurate control, adds equipment running status and difference in actual mechanical process, with the size and dimension of fluorescent film in batch products, also easily produce difference, cause the consistency of product poor, (4) along with the development of large power white light LED part, Large-Area-Uniform film forming requires day by day to increase, remote fluorescence powder technology (being about to fluorescent material separated with chip) more and more comes into one's own, and conventional point adhesive process is difficult to realize large-area even film forming, so the application of this technology is subject to certain limitation.Just because of the existence of the problems referred to above, people are making great efforts to seek technical solution always.
Publication number is that applying for a patent of CN101882663A discloses a kind of preparation method who adopts spraying method to make LED fluorescence coating, it first prepares the fluorescent powder paste material that is suitable for spraying, then by perforate mask plate, carry out physical mask, recycling spraying technology sprays fluorescence membrane at opening area, this method has improved the uniformity of fluorescence membrane to a certain extent, but in adopting physical mask by spraying process, and high-precision physical mask technical costs is higher, and also easily there is shadow effect in the edge in mask aperture, also can cause to a certain extent the inhomogeneities of rete, moreover spraying process is to easily waste and the also more difficult control of its consumption of fluorescent material.
Publication number is that applying for a patent of CN10847680A discloses a kind of method that adopts silk-screen printing technique to make white light LEDs film, adopt screen printing technique can improve by a relatively large margin the uniformity of fluorescence coating, but silk screen printing is had relatively high expectations for slurry, but also can cause the waste of fluorescent powder, be unfavorable for the reduction of LED manufacturing cost.This method can only be printed on other transparent flat carrier in addition, is difficult on chip, directly making fluorescence coating.
In addition Lumileds company and publication number are that CN102842655A application patent of invention discloses and adopts photoresists photoetching process to prepare the technology of phosphor film layer, but this complex process, cost is higher, to such an extent as to this technology fails really to realize commercial Application always.
It is a kind of " increasing material manufacture " that 3D prints, and 3D prints unique manufacturing technology let us can produce the article of unprecedented various shapes.3D printer, under the guiding of design document instruction, first sprays pressed powder or solid-liquid mixed slurry, makes it be cured as a special plane thin layer.After ground floor solidifies, 3D printer port of printer returns, at outside another thin layer that forms of ground floor.After the second layer solidifies, printhead returns again, and at outside another thin layer that forms of the second layer.And so forth, final thin layer accumulation becomes three-dimensional body, it has printing precision and automaticity is high, material waste is few, and can indiscriminately ad. as one wishes on various substrates or object, print the three-dimensional body of various shapes and thickness, be a kind of advanced person's manufacturing technology, and now have ripe 3D printer, and can realize the production of automation, be extremely suitable for the preparation of fluorescence membrane.
Summary of the invention
In order to address the above problem, the invention provides a kind of preparation method of the white-light LED fluorescence film based on 3D printing technique, it is high that the present invention has technology controlling and process automaticity, even film layer, batch high conformity, the feature such as applied widely, is specially adapted to the preparation of large power white light LED fluorescence membrane.
Technical scheme of the present invention is as follows:
The preparation method of the white-light LED fluorescence film based on 3D printing technique of the present invention, take micron or nano level fluorescent powder paste material is raw material, on LED chip or transparent substrate material, utilizes 3D printing technique, it specifically comprises the following steps:
(1) preparation fluorescent powder paste material: fluorescent material adds organic gel, disperses 1 ~ 5h by vacuum stirring or ball milling, forms uniform fluorescent powder paste material, and add defoamer to stir 0.5 ~ 2h, and in vacuum chamber further froth breaking;
(2) by computer graphics Software for Design, go out the three-dimensional dimension of corresponding fluorescence membrane, and after processing by hierarchy slicing, import 3D printer, by the computer controlled printing of carrying out fluorescence membrane on LED chip or other transparent substrate;
(3), in the process of printing, according to organic gel kind, choose hot-air blowing or ultraviolet light polymerization mode is synchronously solidified the thin layer printing;
(4) after required film has been printed, then according to colloidal nature, by the heating process of optimizing or ultraviolet light polymerization mode, carry out integral body and solidify again, obtain needed fluorescence membrane.
Wherein, the YAG:Ce3+ fluorescent powder paste material described in step (1) is that the fluorescent material that is 5 ~ 99.9% by mass percent and 0.1 ~ 95% organic gel are prepared from.
Fluorescent material described in step (1) comprises the mixture of a kind of in YAG base, silicate-base, aluminate-base and nitride based fluorescent material or any two kinds, and particle size range comprises 100nm ~ 30um.
Organic gel described in step (1) comprises the mixture of one or more any proportionings in AB glue, organic silica gel, epoxy resin, acrylic resin or UV glue.
The described fluorescent colloid of step (1) is 5000 ~ 35000mpa.s with the range of viscosities of viscosimeter test;
The described transparent substrate of step (2), its material comprises glass, plastics, PC, acrylic, transparent ceramic, that shape can be is membranaceous, sheet or dome shape.
The temperature of the hot-air blowing that step (3) is described is 40 ~ 150 ℃, and ultraviolet light intensity is 50 ~ 180mW/cm
2, concrete curing mode is determined according to the kind of organic gel.
It is 40 ~ 150 ℃ that the heating process of the described optimization of step (4) or ultraviolet light polymerization mode are carried out the whole temperature that is cured as again heating process, and the time is 0.5 ~ 8h; Or ultraviolet light intensity is 50 ~ 180mW/cm
2, irradiation time is 0.1 ~ 5h, concrete curing mode is determined according to the kind of organic gel; Fluorescence membrane thickness range described in step (4) is at 500nm ~ 50mm.
The present invention also provides the white-light LED fluorescence of being prepared by preparation method described above film.
The good effect that the present invention produces is:
1. the present invention adopts 3D printing technique to print fluorescence membrane, can easily realize the accurate preparation of the fluorescence membrane of various shapes, size, thickness, can effectively improve uniformity and the consistency of fluorescence membrane, the generation of the phenomenon such as the LED product light field of avoiding the inhomogeneities due to fluorescence membrane to cause is inhomogeneous, colour temperature is inconsistent.
2. the present invention, when 3D prints fluorescence membrane, adopts the modes such as heat minute purging or ultraviolet light polymerization synchronously to solidify the film printing, and can effectively prevent the precipitation of fluorescent material and the uneven distribution in glue, improves the light effect that of fluorescence coating.
3. the present invention can also realize the even printing that realizes fluorescence membrane on other transparent substrate material, can be used for making the LED product of remote fluorescence bisque.Automation controllable precision of the present invention is high, and technology is applied widely, and thicknesses of layers is evenly also controllable, and material waste is few, and the encapsulation that is specially adapted to large power white light LED product is made.
Embodiment
In order to understand better the present invention, below in conjunction with embodiment, further illustrate content of the present invention, but content of the present invention is not only confined to the following examples.
Embodiment 1
(1) slurry preparation: be 40% YAG:Ce by mass percentage
3+the ratio of fluorescent material (average grain diameter of fluorescent material is 1.2 μ m) and 60% AB resin glue is prepared burden, and be placed in de-airing mixer, turn speed for 1500r/min stirring 4.5h, the viscosity with viscosimeter testing size under the room temperature of 25 ℃ is 18000mpa.s, packs the print cartridge of 3D printer into;
(2) by Computer Design thickness, be 0.06mm, the 3-D graphic of the circular fluorescent film that diameter is 5mm, and hierarchy slicing processing, import 3D printer;
(3) LED chip of needs being printed is placed in 3D printer station, and carries out 3D printing by computer control, and print procedure adopts hot-air blowing synchronously to solidify, and hot air temperature is 100 ℃;
(4), after 3D has printed, the baking oven that LED film integral is placed in to 135 ℃ solidifies 2h, obtains the fluorescence membrane that 3D prints, its size after solidifying with solidify before be consistent.
(5) after the energising of LED lamp is lighted, without visual gold-tinted or blue light hot spot, LED light field is even, by spectrum and chromaticity coordinate test, is no less than the LED lamp of 30, and its luminous intensity, chromaticity coordinate value and colour temperature and mean value separately differ and is less than 5%.
Embodiment 2
(1) slurry preparation: be 30% YAG:Ce by mass percentage
3+the ratio of fluorescent material (average grain diameter of fluorescent material is 8.7 μ m) and 70% UV glue is prepared burden, and be placed in planetary ball mill, turn speed for 300r/min stirring 5h, then putting into vacuum drying oven vacuumizes and carries out defoaming treatment, viscosity with viscosimeter testing size under the room temperature of 25 ℃ is 35000mpa.s, packs the print cartridge of 3D printer into;
(2) by Computer Design thickness, be 0.10mm, the 3-D graphic of the circular fluorescent film that diameter is 5mm, and hierarchy slicing processing, import 3D printer;
(3) LED chip of needs being printed is placed in 3D printer station, and carries out 3D printing by computer control, and print procedure adopts ultraviolet light beam synchronously to solidify, and ultraviolet light intensity is 150mW/cm
2;
(4), after 3D has printed, it is by force 180 mW/cm that LED film integral ultraviolet lamp box is used up
2solidify 1h, obtain the fluorescence membrane that 3D prints, it is of a size of 0.10mm after solidifying, and diameter is 5mm, with solidify before be consistent.
(5) after the energising of LED lamp is lighted, without visual gold-tinted or blue light hot spot, LED light field is even, by spectrum and chromaticity coordinate test, is no less than the LED lamp of 30, and its luminous intensity, chromaticity coordinate value and colour temperature and mean value separately differ and is less than 5%.
Embodiment 3
(1) slurry preparation: be 20% YAG:Ce by mass percentage
3+the ratio of fluorescent material (average grain diameter of fluorescent material is 600nm) and 80% organic silica gel is prepared burden, and be placed in de-airing mixer, turn speed for 2500r/min stirring 3h, under the room temperature of 25 ℃, the viscosity of testing size is 25000mpa.s, packs the print cartridge of 3D printer into;
(2) by Computer Design thickness, be 0.03mm, be of a size of the 3-D graphic of the cuboid fluorescence membrane of 5.5 * 10.5mm, and hierarchy slicing processing, import 3D printer;
(3) LED chip of needs being printed is placed in 3D printer station, and carries out 3D printing by computer control, and print procedure adopts hot-air blowing synchronously to solidify, and hot air temperature is 125 ℃;
(4), after 3D has printed, the baking oven that LED film integral is placed in to 150 ℃ solidifies 4h, obtains the fluorescence membrane that 3D prints, its size after solidifying with solidify before be consistent.
(5) after the energising of LED lamp is lighted, without visual gold-tinted or blue light hot spot, LED light field is even, by spectrum and chromaticity coordinate test, is no less than the LED lamp of 30, and its luminous intensity, chromaticity coordinate value and colour temperature and mean value separately differ and is less than 5%.
Embodiment 4
(1) slurry preparation: be 20% YAG:Ce by mass percentage
3+the ratio of fluorescent material (average grain diameter of fluorescent material is 200nm) and 40% AB resin glue and 40% UV glue is prepared burden, and be placed in de-airing mixer, turn speed for 2500r/min stirring 4h, viscosity with viscosimeter testing size under the room temperature of 25 ℃ is 30000mpa.s, packs the print cartridge of 3D printer into;
(2) by Computer Design thickness, be 0.05mm, be of a size of the 3-D graphic of the square fluorescence membrane of 50 * 50mm, and hierarchy slicing processing, import 3D printer;
(3) pack the glass substrate cleaning up into printer station, and carry out 3D printing by computer control, print procedure adopts hot-air blowing and ultraviolet light synchronously to solidify, and hot air temperature is 110 ℃, and light intensity is 150 mW/cm
2ultraviolet light be synchronously cured;
(4) after 3D has printed, the baking oven that LED film integral is placed in to 135 ℃ solidifies 2h, then to put into light intensity be 180 mW/cm
2ultraviolet light box in solidify 1h, obtain the fluorescence membrane that 3D prints, its after solidifying, be of a size of with solidify before be consistent.
(5) by packing LED blue chip top fixing after prepared fluorescence membrane cut-parts into, form LED.
(6) after the energising of LED lamp is lighted, without visual gold-tinted or blue light hot spot, LED light field is even, by spectrum and chromaticity coordinate test, is no less than the LED lamp of 30, and its luminous intensity, chromaticity coordinate value and colour temperature and mean value separately differ and is less than 5%.
Embodiment 5
(1) slurry preparation: be 35% YAG:Ce by mass percentage
3+fluorescent material, 3% Ca
2si
5n
3: Eu
2+the ratio of fluorescent material and 62% silica gel is prepared burden, and is placed in de-airing mixer, turns speed for 2000r/min stirring 3.5h, and the viscosity with viscosimeter testing size under the room temperature of 25 ℃ is 30000mpa.s, packs the print cartridge of 3D printer into;
(2) by Computer Design thickness, be 0.15mm, the 3-D graphic of the circular fluorescent film that diameter is 5mm, and hierarchy slicing processing, import 3D printer;
(3) LED chip of needs being printed is placed in 3D printer station, and carries out 3D printing by computer control, and print procedure adopts hot-air blowing synchronously to solidify, and hot air temperature is 120 ℃;
(4), after 3D has printed, the baking oven that LED film integral is placed in to 145 ℃ solidifies 4h, obtains the fluorescence membrane that 3D prints, its size after solidifying with solidify before be consistent.
(5) after the energising of LED lamp is lighted, without visual gold-tinted or blue light hot spot, LED light field is even, by spectrum and chromaticity coordinate test, is no less than the LED lamp of 30, and its luminous intensity, chromaticity coordinate value and colour temperature and mean value separately differ and is less than 5%.
Embodiment 6
(1) slurry preparation: be 25% YAG:Ce by mass percentage
3+fluorescent material, 15% (Al, Ga)
5o
12: Ce
3+the ratio of fluorescent material and 60% silica gel is prepared burden, and is placed in de-airing mixer, turns speed for 2500r/min stirring 3h, and under the room temperature of 25 ℃, the viscosity of testing size is 35000mpa.s, packs the print cartridge of 3D printer into;
(2) by Computer Design thickness, be 0.15mm, the 3-D graphic of the circular fluorescent film that diameter is 5mm, and hierarchy slicing processing, import 3D printer;
(3) chip is packed into printer station, and carry out 3D printing by computer control, print procedure adopts hot-air blowing to solidify, and hot air temperature is 135 ℃;
(4), after 3D has printed, the baking oven that LED film integral is placed in to 145 ℃ solidifies 3h, obtains the fluorescence membrane that 3D prints, its after solidifying, be of a size of with solidify before be consistent.
(5) after the energising of LED lamp is lighted, without visual yellow orange light or blue light hot spot, LED light field is even, by spectrum and chromaticity coordinate test, is no less than the LED lamp of 30, and its luminous intensity, chromaticity coordinate value and colour temperature and mean value separately differ and is less than 5%.
Embodiment 7
(1) slurry preparation: be 20% (Ba YAG:Ce3+ fluorescent material, 8% by mass percentage, Si) ratio of the silica gel of 2 SiO4:Eu2+ fluorescent material and mass percent 72% is prepared burden, and be placed in de-airing mixer, turn speed for 2500r/min stirring 4h, viscosity with viscosimeter testing size under the room temperature of 25 ℃ is 33000mpa.s, packs the print cartridge of 3D printer into;
(2) by Computer Design thickness, be 0.10mm, be of a size of the 3-D graphic of the cuboid fluorescence membrane of 50 * 80mm, and hierarchy slicing processing, import 3D printer;
(3) pack the glass substrate cleaning up into printer station, and carry out 3D printing by computer control, print procedure adopts hot-air blowing synchronously to solidify, and hot air temperature is 125 ℃;
(4), after 3D has printed, the baking oven that LED film integral is placed in to 140 ℃ solidifies 3h, obtains the fluorescence membrane that 3D prints, its after solidifying, be of a size of with solidify before be consistent.
(5) after the energising of LED lamp is lighted, without visual yellow orange light or blue light hot spot, LED light field is even, by spectrum and chromaticity coordinate test, is no less than the LED lamp of 30, and its luminous intensity, chromaticity coordinate value and colour temperature and mean value separately differ and is less than 5%.
Claims (10)
1. a preparation method for the white-light LED fluorescence film based on 3D printing technique, is characterized in that: take micron or nano level fluorescent powder paste material is raw material, on LED chip or transparent substrate material, utilizes 3D printing technique, comprises the steps:
(1) preparation fluorescent powder paste material: fluorescent material adds organic gel, disperses 1 ~ 5h by vacuum stirring or ball milling, forms uniform fluorescent powder paste material, and add defoamer to stir 0.5 ~ 2h, and in vacuum chamber further froth breaking;
(2) by computer graphics Software for Design, go out the three-dimensional dimension of corresponding fluorescence membrane, and after processing by hierarchy slicing, import 3D printer, by the computer controlled printing of carrying out fluorescence membrane on LED chip or other transparent substrate;
(3), in the process of printing, according to organic gel kind, choose hot-air blowing or ultraviolet light polymerization mode is synchronously solidified the thin layer printing;
(4) after required film has been printed, then according to colloidal nature, by the heating process of optimizing or ultraviolet light polymerization mode, carry out integral body and solidify again, obtain needed fluorescence membrane.
2. the preparation method of white-light LED fluorescence film according to claim 1, is characterized in that: the fluorescent material that the fluorescent powder paste material described in step (1) is is 5 ~ 99.9% by mass percent and 0.1 ~ 95% organic gel are prepared from.
3. the preparation method of white-light LED fluorescence film according to claim 1, it is characterized in that: the fluorescent material described in step (1) comprises the mixture of a kind of in YAG base, silicate-base, aluminate-base and nitride based fluorescent material or any two kinds, and particle size range comprises 100nm ~ 30um.
4. the preparation method of white-light LED fluorescence film according to claim 1, is characterized in that: the organic gel described in step (1) comprises the mixture of one or more any proportionings in AB glue, organic silica gel, epoxy resin, acrylic resin or UV glue.
5. the preparation method of white light LED fluorescent powder film according to claim 1, is characterized in that: the described fluorescent slurry of step (1) is 5000 ~ 35000mpa.s with the range of viscosities of viscosimeter test.
6. the preparation method of white light LED fluorescent powder film according to claim 1, is characterized in that: the described transparent substrate of step (2), and its material comprises glass, plastics, PC, acrylic, transparent ceramic, that shape can be is membranaceous, sheet or dome shape.
7. the preparation method of white light LED fluorescent powder film according to claim 1, is characterized in that: the temperature of the hot-air blowing that step (3) is described is 40 ~ 150 ℃, and ultraviolet light intensity is 50 ~ 180mW/cm
2.
8. the preparation method of white light LED fluorescent powder film according to claim 1, is characterized in that: it is 40 ~ 150 ℃ that the heating process of the described optimization of step (4) or ultraviolet light polymerization mode are carried out the whole temperature that is cured as again heating process, and the time is 0.5 ~ 8h; Or ultraviolet light intensity is 50 ~ 180mW/cm2, irradiation time is 0.1 ~ 5h.
9. the preparation method of white light LED fluorescent powder film according to claim 1, is characterized in that: the fluorescence membrane thickness range of step (4) gained is at 500nm ~ 50mm.
10. the white-light LED fluorescence film that prepared by the preparation method as described in claim 1 ~ 9 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410249279.7A CN104051599A (en) | 2014-06-07 | 2014-06-07 | Method for manufacturing white-light LED fluorescent film based on 3D printing technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410249279.7A CN104051599A (en) | 2014-06-07 | 2014-06-07 | Method for manufacturing white-light LED fluorescent film based on 3D printing technology |
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Cited By (8)
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|---|---|---|---|---|
| CN104659071A (en) * | 2015-03-16 | 2015-05-27 | 合肥鑫晟光电科技有限公司 | AMOLED display panel manufacturing method and manufacturing device |
| CN105602546A (en) * | 2015-12-30 | 2016-05-25 | 量子光电科技（天津）有限公司 | Quantum dot light-emitting compound used for 3D printing and preparation method thereof |
| CN105679919A (en) * | 2016-01-08 | 2016-06-15 | 北京大学深圳研究生院 | LED product manufacturing method and LED product |
| CN105938867A (en) * | 2016-06-13 | 2016-09-14 | 深圳市玲涛光电科技有限公司 | Rubber mixing process and LED lamp bead |
| CN106328794A (en) * | 2015-07-02 | 2017-01-11 | 厦门百嘉祥微晶材料科技股份有限公司 | LED packaging technology |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101320772A (en) * | 2008-07-15 | 2008-12-10 | 电子科技大学 | Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method |
| CN103121323A (en) * | 2013-02-23 | 2013-05-29 | 北京印刷学院 | Flexographic plate CTP (computer to plate) direct printing method and equipment based on 3D rapid forming printing principle |
-
2014
- 2014-06-07 CN CN201410249279.7A patent/CN104051599A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101320772A (en) * | 2008-07-15 | 2008-12-10 | 电子科技大学 | Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method |
| CN103121323A (en) * | 2013-02-23 | 2013-05-29 | 北京印刷学院 | Flexographic plate CTP (computer to plate) direct printing method and equipment based on 3D rapid forming printing principle |
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| CN106328794A (en) * | 2015-07-02 | 2017-01-11 | 厦门百嘉祥微晶材料科技股份有限公司 | LED packaging technology |
| CN105602546B (en) * | 2015-12-30 | 2018-06-22 | 马鞍山蓝信环保科技有限公司 | Quantum dot light emitting compound for 3D printing and preparation method thereof |
| CN105602546A (en) * | 2015-12-30 | 2016-05-25 | 量子光电科技（天津）有限公司 | Quantum dot light-emitting compound used for 3D printing and preparation method thereof |
| CN105679919A (en) * | 2016-01-08 | 2016-06-15 | 北京大学深圳研究生院 | LED product manufacturing method and LED product |
| CN105679919B (en) * | 2016-01-08 | 2018-11-30 | 北京大学深圳研究生院 | A kind of LED product manufacturing method and LED product |
| CN105938867A (en) * | 2016-06-13 | 2016-09-14 | 深圳市玲涛光电科技有限公司 | Rubber mixing process and LED lamp bead |
| CN106848040A (en) * | 2016-08-04 | 2017-06-13 | 佛山市中山大学研究院 | A kind of preparation method of the LED quantum dot films based on 3D printing technique |
| CN107579146A (en) * | 2017-09-13 | 2018-01-12 | 上海应用技术大学 | A kind of preparation method of white light LEDs " hamburger " structure fluorescence membrane |
| CN107579146B (en) * | 2017-09-13 | 2019-12-03 | 上海应用技术大学 | A kind of preparation method of white light LEDs " hamburger " structure fluorescence membrane |
| CN110128019A (en) * | 2019-05-15 | 2019-08-16 | 浙江大学 | A kind of preparation method and application of yellow fluorescence glass ceramics |
| CN110128019B (en) * | 2019-05-15 | 2021-01-29 | 浙江大学 | Preparation method and application of yellow fluorescent glass ceramic |
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Application publication date: 20140917 |