CN103426977A - Method for packaging light-emitting diode - Google Patents
Method for packaging light-emitting diode Download PDFInfo
- Publication number
- CN103426977A CN103426977A CN2012101516526A CN201210151652A CN103426977A CN 103426977 A CN103426977 A CN 103426977A CN 2012101516526 A CN2012101516526 A CN 2012101516526A CN 201210151652 A CN201210151652 A CN 201210151652A CN 103426977 A CN103426977 A CN 103426977A
- Authority
- CN
- China
- Prior art keywords
- substrate
- led
- crystal particle
- mixed solution
- led encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Abstract
A method for packaging a light-emitting diode includes the steps of providing a substrate with electrode structures, arranging light-emitting diode crystalline grains on the substrate, enabling the light-emitting diode crystalline grains to be electrically connected to the electrode structures, spraying a mixed solution containing volatile solutions, fluorescent materials and glue materials onto the substrate, solidifying the glue materials after the volatile solutions in the mixed solution sprayed onto the substrate volatilize, and cutting the substrate to obtain a plurality of separated light-emitting diode packaging units.
Description
Technical field
The present invention relates to a kind of method for making semiconductor, relate in particular to a kind of LED encapsulation method.
Background technology
Than traditional light emitting source, light-emitting diode (Light Emitting Diode, LED) there is the advantages such as lightweight, that volume is little, it is low to pollute, the life-span is long, it is as a kind of novel light emitting source, be applied to more and more in the middle of each field, as street lamp, traffic lights, signal lamp, shot-light and decorative lamp etc.
The light-emitting diode chip for backlight unit that existing package structure for LED generally includes substrate, be positioned at electrode on substrate, be carried on substrate and be electrically connected with electrode and be arranged on light-emitting diode chip for backlight unit fluorescence coating and packaging plastic.When carrying out LED package, usually first LED crystal particle is arranged on substrate, then adopt the mode of injecting glue (injection) or metaideophone shaping (transfer molding) to form the fluorescence coating that includes fluorescent material on LED crystal particle, but this kind of method for packing method is difficult to guarantee the distribution consistency degree of fluorescent material in fluorescence coating, thus affect package structure for LED final go out light effect.
Summary of the invention
In view of this, be necessary to provide a kind of LED encapsulation method that can make fluorescent material be evenly distributed.
A kind of LED encapsulation method comprises the following steps: a substrate with electrode structure is provided; LED crystal particle is set on this substrate, and LED crystal particle is electrically connected to described electrode structure; Spray the mixed solution that includes volatile solvent soln, fluorescent material and glue material to substrate; After making to be sprayed to the volatile solvent soln volatilization in the mixed solution on substrate, solidify described glue material; And cutting substrate is to obtain the LED encapsulation unit of a plurality of separation.
The mixed solution that the mode of this kind of LED encapsulation method utilization sprinkling will be mixed with volatile solvent soln, fluorescent material and glue material is injected on the substrate that is provided with LED crystal particle, contribute to make mixed solution to be attached to uniformly on LED crystal particle, thereby after treating the volatile solvent soln volatilization, described fluorescent material and glue material can be evenly distributed on LED crystal particle, thereby form the equally distributed fluorescence coating of fluorescent material, guarantee package structure for LED final go out light effect.
With reference to the accompanying drawings, in conjunction with embodiment, the invention will be further described.
The accompanying drawing explanation
Each step schematic diagram of the LED encapsulation method that Fig. 1 ~ Figure 11 provides for embodiment of the present invention.
The main element symbol description
| |
10 |
| |
11 |
| |
12 |
| |
20 |
| LED encapsulation unit | 200 |
| |
30 |
| Groove | 300 |
| |
40 |
| |
50 |
| |
500 |
| |
60 |
Following embodiment further illustrates the present invention in connection with above-mentioned accompanying drawing.
Embodiment
The LED encapsulation method that embodiment of the present invention provides comprises the following steps.
The first step, provide a substrate 10 with electrode structure 12.
This substrate 10 is for carrying LED crystal particle.Referring to Fig. 1, in the present embodiment, this substrate 10 comprises a base material 11 and is arranged on the electrode structure 12 on this base material 11, and this base material 11 is insulating substrate, and its material can be the insulating material such as sapphire (Sapphire), carborundum (SiC).This electrode structure 12 can be made of metal, and to be used to follow-up LED crystal particle, provides electrical connection.
Second step, arrange LED crystal particle 20 on this substrate 10, and LED crystal particle 20 is electrically connected to described electrode structure 12.
Referring to Fig. 2, the present embodiment is arranged at LED crystal particle 20 on the electrode structure 12 of substrate 10 and is electrically connected to electrode structure 12, this LED crystal particle 20 can be connected to electrode structure 12 by covering crystalline substance (flip-chip) mode or routing (wire bonding), in the present embodiment, electrode structure 12 is fixed and be electrically connected to LED crystal particle 20 by covering crystal type.The quantity of described LED crystal particle 20 can be one, two or more.In the present embodiment, the quantity of LED crystal particle 20 is three.
The 3rd step, spray to substrate 10 mixed solution 50 that includes volatile solvent soln, fluorescent material and glue material.
In the present embodiment, referring to Fig. 3, Fig. 4, before spraying mixed solution 50 to substrate 10, first provide a patterned layer 30; Then patterned layer 30 is arranged on substrate 10, makes the surface of the local covered substrate 10 of this patterned layer 30 and expose the LED crystal particle 20 be arranged on substrate 10.Because patterned layer 30 itself has certain thickness, after patterned layer 30 is arranged on the surface that is equiped with LED crystal particle 20 of substrate 10, this patterned layer 30 and the common a plurality of grooves 300 that contain LED crystal particle 20 that form of substrate, described LED crystal particle 20 is exposed to the bottom of a plurality of grooves 300, and the mixed solution 50 that described groove 300 is follow-up sprinkling provides accommodation space.
In the present embodiment, while to substrate 10, spraying mixed solution 50, by nozzle 40 alignment indentation 300, to utilize nozzle 40, mixed solution 50 is sprayed to substrate 10 surfaces and the LED crystal particle 20 that are not covered by patterned layer 30 in groove 300, as shown in Figure 5, Figure 6.In this mixed solution 50, the mass ratio of volatile solvent soln, fluorescent material and glue material is 1:2 ~ 3:2.5 ~ 3.5.Described volatile solvent soln is aldehyde compound, ketone compounds or isopropyl alcohol.Described fluorescent material is yttrium aluminium garnet fluorescent powder (YAG), terbium garnet phosphor powder (TAG), silicate (silicate) fluorescent material or nitride (nitride) fluorescent material.Described glue material is thermosetting material, as epoxy resin (epoxy) or silicones (silicone) etc.
Being provided with of described patterned layer 30 is beneficial to and forms regular shape, controlled mixed solution spraying zone on substrate 10, the degree of depth of the formed groove 300 of this patterned layer 30 can effectively limit the amount of spraying mixed solution 50, thereby in successive process after evaporating solution volatilization, the thickness that makes fluorescence coating is controlled and obtain expecting the fluorescence coating of thickness.It should be noted that, this way that patterned layer 30 is set is also nonessential, the 3rd step can directly will be provided with the position of LED crystal particle 20 on nozzle 40 align substrates 10, then spray mixed solution 50 to LED crystal particle 20, and no longer adopt patterned layer 30 as auxiliary, this kind omits the method for the employing of patterned layer 30 can simplify processing procedure under the prerequisite without strict demand to fluorescent layer thickness, thereby enhances productivity.
In the present embodiment, described sprinkling mixed solution 50 is to adopt the method for impulse jet (pulsed-spray) that mixed solution 50 is sprayed to substrate 10.
The 4th step, after making to be sprayed to the volatile solvent soln volatilization in the mixed solution 50 on substrate 10, solidify described glue material.
Referring to Fig. 7, in the present embodiment, after the volatile solvent soln volatilization in mixed solution 50, only the mixture of remaining glue material and fluorescent material is as fluorescence coating 500.Owing to not contained volatile solvent soln in fluorescence coating 500, therefore the height of fluorescence coating 500 before the height of mixed solution 50 in groove 300 slightly descend, now, be mixed with the glue material of fluorescent material, be also fluorescence coating 500, more press close to the surface of LED crystal particle 20.
The 5th step, the LED encapsulation unit 200 of cutting substrate 10 to obtain a plurality of separation.
Referring to Fig. 8, Fig. 9, before cutting substrate 10, the present embodiment also comprises the step that removes patterned layer 30, forms reflector 60 on the substrate 10 between adjacent LED crystal particle 20.Described reflector 60 is around each LED crystal particle 20, with for proofreading and correct the light direction of LED crystal particle 20.In the present embodiment, this reflector 60 is to adopt model technique to make.
Referring to Figure 10, when cutting substrate 10, reflector 60 and substrate 10 structures between the present embodiment LED crystal particle 20 adjacent to each are cut, with the LED encapsulation unit 200 that obtains a plurality of separation, as shown in figure 11.
It should be noted that, when the method does not adopt patterned layer 30, described certainly without the step that removes patterned layer 30.In addition, the step of described formation reflector 60 also can be omitted, thereby does not form reflector 60 on substrate 10, so that LED crystal particle 20 light directions are being simplified to processing procedure under the prerequisite without strict demand, thereby enhances productivity.
The mixed solution 50 that the mode of this kind of LED encapsulation method utilization sprinkling will be mixed with volatile solvent soln, fluorescent material and glue material is injected on the substrate 10 that is provided with LED crystal particle 20, contribute to make mixed solution 50 to be attached to uniformly on LED crystal particle 20, thereby after treating the volatile solvent soln volatilization, described fluorescent material and glue material can be evenly distributed on LED crystal particle 20, thereby form the equally distributed fluorescence coating 500 of fluorescent material, guarantee package structure for LED final go out light effect.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change and distortion all should belong to the protection range of the claims in the present invention.
Claims (10)
1. a LED encapsulation method comprises the following steps:
Step 1, provide a substrate with electrode structure;
Step 2, arrange LED crystal particle on this substrate, and LED crystal particle is electrically connected to described electrode structure;
Step 3, spray the mixed solution that includes volatile solvent soln, fluorescent material and glue material to substrate;
Step 4, after making to be sprayed to the volatile solvent soln volatilization in the mixed solution on substrate, solidify described glue material; And
Step 5, cutting substrate is to obtain the LED encapsulation unit of a plurality of separation.
2. LED encapsulation method as claimed in claim 1, is characterized in that, described step 2 is to adopt Flip Chip be arranged on substrate by LED crystal particle and be electrically connected to described electrode structure.
3. LED encapsulation method as claimed in claim 1, is characterized in that, further comprises step after described step 2, before step 3: provide a patterned layer; Patterned layer is arranged on substrate, makes the surface of the local covered substrate of this patterned layer and expose the LED crystal particle be arranged on substrate.
4. LED encapsulation method as claimed in claim 3, is characterized in that, described step 3 is to spray mixed solution to the substrate surface do not covered by patterned layer and LED crystal particle.
5. LED encapsulation method as claimed in claim 1, is characterized in that, in described step 3 in mixed solution the mass ratio of volatile solvent soln, fluorescent material and glue material be 1:2 ~ 3:2.5 ~ 3.5.
6. LED encapsulation method as claimed in claim 1, it is characterized in that, in the mixed solution that described step 3 adopts, volatile solvent soln is aldehyde compound, ketone compounds or isopropyl alcohol, fluorescent material is yttrium aluminium garnet fluorescent powder, terbium garnet phosphor powder, silicate fluorescent powder or Nitride phosphor, and the glue material is thermosetting material.
7. LED encapsulation method as claimed in claim 1, is characterized in that, described step 3 adopts impulse jet to spray the mixed solution that includes volatile solvent soln, fluorescent material and glue material to substrate.
8. LED encapsulation method as claimed in claim 1, is characterized in that, also is included in the step that forms reflector between adjacent LED crystal particle after described step 4, before step 5.
9. LED encapsulation method as claimed in claim 8, is characterized in that, described reflector is to adopt model technique to make.
10. LED encapsulation method as claimed in claim 8, is characterized in that, described step 5 is that reflector and the substrate between the LED crystal particle adjacent to each cut, to obtain the LED encapsulation unit of a plurality of separation.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210151652.6A CN103426977B (en) | 2012-05-16 | 2012-05-16 | LED encapsulation method |
| TW101118803A TW201349581A (en) | 2012-05-16 | 2012-05-25 | Method for packaging LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210151652.6A CN103426977B (en) | 2012-05-16 | 2012-05-16 | LED encapsulation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103426977A true CN103426977A (en) | 2013-12-04 |
| CN103426977B CN103426977B (en) | 2016-05-04 |
Family
ID=49651456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210151652.6A Expired - Fee Related CN103426977B (en) | 2012-05-16 | 2012-05-16 | LED encapsulation method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103426977B (en) |
| TW (1) | TW201349581A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1665041A (en) * | 2001-01-24 | 2005-09-07 | 日亚化学工业株式会社 | Light emitting diode and method for manufacturing the same |
| CN101320772A (en) * | 2008-07-15 | 2008-12-10 | 电子科技大学 | Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method |
| CN101840973A (en) * | 2009-03-20 | 2010-09-22 | 亿光电子工业股份有限公司 | Light emitting diode encapsulating structure and manufacturing method thereof |
| CN101882663A (en) * | 2010-06-22 | 2010-11-10 | 深圳市瑞丰光电子股份有限公司 | Spraying method of LED fluorescent powder and fluorescent powder layer sprayed by adopting same |
| US20110189803A1 (en) * | 2008-03-07 | 2011-08-04 | Harvatek Corporation | Led chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same |
| CN102222625A (en) * | 2010-04-16 | 2011-10-19 | 展晶科技(深圳)有限公司 | Manufacturing method of light-emitting diode (LED) packaging structure and base thereof |
-
2012
- 2012-05-16 CN CN201210151652.6A patent/CN103426977B/en not_active Expired - Fee Related
- 2012-05-25 TW TW101118803A patent/TW201349581A/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1665041A (en) * | 2001-01-24 | 2005-09-07 | 日亚化学工业株式会社 | Light emitting diode and method for manufacturing the same |
| US20110189803A1 (en) * | 2008-03-07 | 2011-08-04 | Harvatek Corporation | Led chip package structure in order to prevent the light-emitting efficiency of fluorescent powder from decreasing due to high temperature and method for making the same |
| CN101320772A (en) * | 2008-07-15 | 2008-12-10 | 电子科技大学 | Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method |
| CN101840973A (en) * | 2009-03-20 | 2010-09-22 | 亿光电子工业股份有限公司 | Light emitting diode encapsulating structure and manufacturing method thereof |
| CN102222625A (en) * | 2010-04-16 | 2011-10-19 | 展晶科技(深圳)有限公司 | Manufacturing method of light-emitting diode (LED) packaging structure and base thereof |
| CN101882663A (en) * | 2010-06-22 | 2010-11-10 | 深圳市瑞丰光电子股份有限公司 | Spraying method of LED fluorescent powder and fluorescent powder layer sprayed by adopting same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103426977B (en) | 2016-05-04 |
| TW201349581A (en) | 2013-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104393154A (en) | Wafer level packaging method for LED (Light-Emitting Diode) chip level white light source | |
| CN101123286A (en) | LED encapsulation structure and method | |
| CN103311381A (en) | Production method for packaging structures of light-emitting diode | |
| US20070222365A1 (en) | Light-Emitting Diode and Method of Manufacturing the Same | |
| US8883533B2 (en) | Method for manufacturing light emitting diode package | |
| CN102683555A (en) | Packaging structure and packaging method for light-emitting diode | |
| CN102208499A (en) | Manufacturing process of white-light LED chip and product thereof | |
| CN102044624B (en) | Light-emitting device (LED) capable of emitting compound light, light-emitting element and manufacturing methods of LED and light-emitting element | |
| CN105390595A (en) | Preparation method for unidirectional white light component of high color gradation consistency | |
| CN104979452A (en) | Method for manufacturing and packaging light-emitting diode chip on wafer | |
| CN103325926B (en) | LED packaging structure used in on-board chip and fluorescent powder coating method thereof | |
| CN102120213B (en) | LED fluorescent powder spraying process | |
| CN103258936B (en) | A kind of LED package substrate and the method for shape-preserving coating | |
| CN103378271A (en) | Packaging structure of light emitting diode and manufacturing method thereof | |
| CN102931328A (en) | Manufacturing method of LED (Light-Emitting Diode) packaging body | |
| CN100578826C (en) | Making method for white LED chip | |
| CN102227011B (en) | Reflector cup and method for controlling geometric shape of fluorescent powder layer in LED (light-emitting diode) packaging by using same | |
| CN103426977B (en) | LED encapsulation method | |
| CN203205458U (en) | LED package substrate | |
| CN203103350U (en) | White light LED device with fluorescent powder layer | |
| CN103117352B (en) | A kind of LED encapsulation structure and realize the method for fluorescent material shape-preserving coating based on it | |
| CN102593332A (en) | LED (light-emitting diode) luminescent device and manufacturing method thereof | |
| CN102867901A (en) | White light LED (light-emitting diode) device with fluorescent powder layer and manufacturing method thereof | |
| CN103022274A (en) | LED (light-emitting diode) chip and manufacturing method thereof | |
| CN103413886A (en) | Method for manufacturing light emitting diode module with adjustable output light color |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160504 Termination date: 20200516 |