CN102244158A - LED encapsulation method for dispersing fluorescent powder - Google Patents
LED encapsulation method for dispersing fluorescent powder Download PDFInfo
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- CN102244158A CN102244158A CN201110173857XA CN201110173857A CN102244158A CN 102244158 A CN102244158 A CN 102244158A CN 201110173857X A CN201110173857X A CN 201110173857XA CN 201110173857 A CN201110173857 A CN 201110173857A CN 102244158 A CN102244158 A CN 102244158A
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- fluorescent material
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Abstract
The invention discloses a light-emitting diode (LED) encapsulation method for dispersing fluorescent powder, and relates to the technology of the encapsulation of LED devices. By the LED encapsulation method, the problem that after powder glue is cured and the problem that the fluorescent powder is non-uniform in the distribution of the powder glue are solved. In the technical scheme, the method comprises the following steps of: adding the fluorescent powder and a doped mixture into mixed powder glue to prepare the powder glue, wherein doped mixture comprises a substance capable of releasing water due to heating and super absorbent polymer (SAP) powder, and the substance capable of releasing the water due to heating can release water molecules in the process of heating and curing the powder glue; mixing a curing agent into the powder glue, and dispensing on an LED chip; and heating, so that a crystalline hydrate releases the water molecules, SAP absorbs the water molecules to be expanded, and the fluorescent powder is carried by the expanded SAP and is dispersed in the powder glue until the powder glue is cured. By the LED encapsulation method, the problem of nonuniform distribution of the fluorescent powder in the LED encapsulation devices is solved, the utilization rate of the fluorescent powder is improved, colors of light beams emitted by the devices are more uniform, the effect is better, and the quality is higher.
Description
Technical field
The present invention relates to a kind of encapsulation technology of LED device.
Background technology
The existing large power white light LED of using is blue-ray LED and excites its surperficial gold-tinted fluorescent material to send gold-tinted, presents the white light vision behind the blue light gold-tinted.Because fluorescent material is rare earth compound, its density is generally at 3g/cm
3More than, mix the epoxy resin of arogel and the 1g/cm of silica gel with respect to conduct
3Big a lot.In the adhesive curing of led chip point, in arogel, be easy to generate the fluorescent material deposited phenomenon, this phenomenon causes the utilance of fluorescent material to reduce and causes waste, and has fluorescent material problem pockety, and the light that causes light fixture to send is local yellow partially.
Summary of the invention
The technical problem to be solved in the present invention provides a kind of LED method for packing that fluorescent material is carried out dispersion treatment, it is used for solving arogel and solidifies back fluorescent material in the arogel problem of uneven distribution, and the LED encapsulation arogel of a kind of anti-fluorescent material precipitation that this method relates to also is to be used to solve this technical problem.
For addressing the above problem, the present invention proposes a kind of fluorescent material to be carried out the LED method for packing of dispersion treatment,
The mixture that adds fluorescent material and doping in mixing arogel is made arogel, and described doping comprises being heated releases water thing and hydroscopic high-molecular resin SAP powder, and described being heated released water thing meeting release hydrone in the process that arogel is heating and curing;
In arogel, sneak into curing agent, on led chip, put glue;
Heating then makes crystalline hydrate discharge hydrone, and hydroscopic high-molecular resin absorbs this hydrone and expands, and the hydroscopic high-molecular resin after the expansion carries fluorescent material, and fluorescent material is disperseed in arogel, solidifies to arogel.
The present invention relates to a kind of LED encapsulation arogel of anti-fluorescent material precipitation, this arogel composition comprises mixed arogel, fluorescent material, is heated and releases water thing and hydroscopic high-molecular resin composition.Mixed arogel is fluorescent material and other carriers that mixes, and can be the various packaging plastics such as UV glue of epoxy resin, silica gel or ultraviolet curing.The composition ratio of releasing water thing and hydroscopic high-molecular resin of being heated can be carried out modulating ligand according to actual needs than determining.Requirement is in the process of package curing at mixed arogel, and the water yield of releasing the release of water thing of being heated is absorbed by hydroscopic high-molecular resin basically, does not produce excess water.That is to say that when there was the ratio value a of the balance release water and suction in the amount of releasing water thing and hydroscopic high-molecular resin when being heated, the ratio b of the actual amount of releasing water thing and hydroscopic high-molecular resin of being heated that should add was not more than a.Because if the dilutional hyponatremia that discharges can cause the failure of encapsulation; And water is on the low side, and hydroscopic high-molecular resin is in the semi-saturation state, can not have a negative impact basically.The temperature of package curing can be one and raise gradually, progressively make to be heated and release the process that the water thing progressively dewaters, also can be the directly package curing between 110 ° to 180 ° a temperature next time property make to be heated and release the dehydration of water thing.Doping can also comprise stabilizer and dispersant.Arogel cooperates fixative to use.Mixed arogel can be epoxy resin and silica gel, can also be other encapsulation colloid.The present invention also comprises a kind of LED matrix that is packaged with fluorescent material, and it comprises the LED encapsulation arogel of above-mentioned anti-fluorescent material precipitation.The arogel main component of the inside is fluorescent material, is heated and releases water thing and hydroscopic high-molecular resin that can also comprise stabilizer and dispersant, consumption can lack than prior art in this LED matrix.Arogel can also can use in the LED matrix that does not have the bowl cup in the LED that the bowl cup is arranged, device.
Preferably: described being heated released the water thing and comprised in crystalline hydrate, oxide hydrate and the organic substance hydrate one or more.
Preferably: described being heated released the water thing and comprised seven water nickelous sulfates, white vitriol, epsom salt, Sodium Citrate, usp, Dihydrate Powder, kaolin, barium chloride, calcium sulphate dihydrate, alum, saltcake, blue stone, green-vitriol, nine water sodium metasilicate, chloral hydrate, Co (ClO
4)
26H
2O and [Cr (H
2O)
4Cl
2] Cl2H
2In one or more mixing.
Preferably: described SAP is Sodium Polyacrylate or polyethylene glycol double methacrylate.
Preferably: described doping comprises stabilizer and dispersant.
Preferably: after being mixed with arogel, arogel is ground to the requirement that reaches granularity.
Preferably: led chip is the through-hole vertical structure LED that need not to beat gold thread, and its surface has passivation layer.
Preferably: described fluorescent material is gold-tinted fluorescent material, and described led chip is a blue chip, and blue chip excites gold-tinted fluorescent material to send white light.
Preferably: described fluorescent material is one or more the mixing in gold-tinted fluorescent material, red light fluorescent powder, blue light fluorescent powder or the green light fluorescent powder.
This beneficial effect of the invention:
Compared to existing technology, the present invention adds in arogel as releasing pigment end and SAP imbibition material, be subjected in the process of hot curing at arogel, release the pigment end and discharge hydrone, this hydrone is absorbed by the SAP particle, the SAP particle volume sharply expands, in the process that the SAP particle expands, the fluorescent material that carries on the SAP particle is also followed and is distributed in the arogel everywhere, and at this moment, the SAP particle can be to a kind of obstruction of mobile formation of fluorescent material, and because it plays certain supporting role to phosphor particles, phosphor particles is not easy to precipitate under the effect of gravity, arogel solidify finish in, fluorescent material just can be evenly distributed in the arogel everywhere.The invention solves the fluorescent material problem of uneven distribution in the LED packaging, the utilance that it has improved fluorescent material, the light color that device is sent is more even, better effects if, quality is higher.Under the situation of the continuous double rise of rare earth price at present, technical solution of the present invention can reduce the consumption of fluorescent material, reduces production costs.
Description of drawings
Fig. 1 structure chart of the present invention.
Fig. 2 is a schematic flow sheet of the present invention.
Embodiment
The present invention proposes a kind of LED method for packing that fluorescent material is carried out dispersion treatment, the mixture that adds fluorescent material and doping in mixing arogel is made arogel, doping comprises being heated releases water thing and hydroscopic high-molecular resin SAP powder, is heated and releases water thing meeting release hydrone in the process that arogel is heating and curing; In arogel, sneak into curing agent, on led chip, put glue; Heating then makes crystalline hydrate discharge hydrone, and hydroscopic high-molecular resin absorbs this hydrone and expands, and the hydroscopic high-molecular resin after the expansion carries fluorescent material, and fluorescent material is disperseed in arogel, solidifies to arogel.
The arogel composition that the present invention relates to is an important feature of the present invention.It is a kind of LED encapsulation arogel of anti-fluorescent material precipitation, and this arogel comprises mixed arogel, fluorescent material, is heated and releases water thing and hydroscopic high-molecular resin composition.The composition ratio of releasing water thing and hydroscopic high-molecular resin of being heated can be carried out modulating ligand according to actual needs than determining.Doping can also comprise stabilizer and dispersant.Arogel cooperates fixative to use.
The present invention is described in detail by the following examples, and step is referring to shown in Figure 2.
Select fluorescent material earlier for use, the powder of releasing water thing, hydroscopic high-molecular resin (being called for short SAP) that is heated mixes with epoxy resin.
Led chip is selected blue chip for use, and fluorescent material is that to excite the Yttrium aluminium garnet (YAG) type rare earth compound of gold-tinted be YAG.This fluorescent material can keep stable state at 300 °.The type of led chip is optional, and according to the emission type of led chip, fluorescent material can also be TAG, and other excites versicolor fluorescent material, as three primary colors mixed fluorescent powder, violet, pink etc.
Being heated and releasing the water thing is saltcake.The molecular formula of saltcake is Na
2SO
412H
2O, its 32.38 degrees centigrade begin dehydration, 100 degrees centigrade of dehydrations fully.If releasing the water thing so be heated is saltcake, then arogel can guarantee that in 110-180 degree centigrade curing temperature scope the water-absorbing resin expansion is stable.
Be heated and release the water thing and be not limited to saltcake, also can select seven water nickelous sulfates, white vitriol (alum), epsom salt, barium chloride for use; And Sodium Citrate, usp, Dihydrate Powder, and other salt, the hydration natrium citricum generally begins dehydration at 70 °-75 °; And kaolin, the kaolin Main Ingredients and Appearance is hydrated alumina/silica, it begins dehydration at 40 to 60 degree, and comparatively significantly dehydration takes place in the time of 110 degree; And calcium sulphate dihydrate (gypsum), it begins to be dehydrated into semi-hydrated gypsum at 152 °, and semi-hydrated gypsum presents than strong basicity, and therefore, release the water material as being heated not fine; And alum, it begins dehydration at 64.5 °, begins to lose 9 hydrones about 92.5 degree, and it just can lose 12 whole hydrones at 200 °, and therefore, under the general arogel curing temperature, the alum dehydration is imperfect; And blue stone, present blueness under the normal temperature, under 113 °, begin to lose 4 hydrones, present white or colourless simultaneously, just can slough last hydrone in the time of 258 °, therefore, it can not dewater in the arogel setting up period fully; And green-vitriol, claim green vitriol again, be green under the normal temperature, 64 ° begin dehydration, present white or colourless after the dehydration, can slough 20% water for 300 °, are heated for a kind of incomplete dehydration and release the water material; And nine water sodium metasilicate, be commonly called as waterglass, 100 ° can be dewatered fully; And chloral hydrate, Co (ClO
4)
26H
2O and [Cr (H
2O)
4Cl
2] Cl2H
2
Saltcake can also mix as being heated with above-mentioned alternative material and release the water thing.Above-mentioned being heated released the water material and is heated promptly that to release the water thing can be single compound, also can be their one or more mixture.Wherein present acidity or alkalescence after some material dehydration, therefore selecting it to release the water material as being heated should be careful, in order to avoid have a negative impact, influences the performance and the life-span of LED device.
Above-mentioned being heated of exemplifying released the water owner and will be classified as crystalline hydrate, oxide hydrate and organic substance hydrate, and they can release the water thing as being heated by homogenous material, also can be multiple mixing.
SAP is Sodium Polyacrylate or polyethylene glycol double methacrylate.Because hydroscopic high-molecular resin is numerous at present, therefore, is not limited to the selection of the material of above-mentioned two kinds of compositions.Hydroscopic high-molecular resin has expansion multiple inequality according to the difference of its composition.Expansion multiple is also relevant with the water yield that is absorbed, and at present more common expansion multiple is preferably the SAP of white between 30-1000 times, yellow SAP is also arranged.SAP suction back still can maintain moisture content under LED heating environment.Under the encirclement of epoxy resin, can not discharge hydrone easily around.Even the LED temperature reach 100 ° in addition more than, the lock water that SAP can both be stable.
With fluorescent material, be heated release the water thing, SAP disposes arogel, for example the center powder of fluorescent material footpath D50/um is 6.0, the granular size of the hydroscopic high-molecular resin of then selecting for use is at 1-2um.This size range the best of fluorescent material is 5-10um, and the granular size of macromolecule resin is 1/3rd to 1/10th of a fluorescent material size, but is not limited to this proportion.The particle size of releasing the water thing of being heated can be screened with reference to the granular size of fluorescent material.
In addition, doping comprises stabilizer and dispersant.They help improving the distribution before heating process or in the process of other doping.They can use on a small quantity, also can not use.
After being mixed with arogel, arogel is ground to the requirement that reaches granularity.Grind mainly is to remove the particle obvious bigger than normal that exists in the arogel.Grinding can also make the particle in the arogel distribute more uniformly except can improving granular size, interlacedly refers and synthesizes and depends on, even form lightly crosslinkedly, and this step can be improved the distribution situation that is entrained in the arogel.But this step is optional.
After grinding is finished, sneak into curing agent again and stir, put glue then, arogel is put in the bowl cup of led chip.
Referring to Fig. 1, led chip is the through-hole vertical structure LED that need not to beat gold thread, in the surface coverage of chip 1 arogel 2 is arranged, and SAP particle 3 is arranged, the state that expands after these SAP particle 3 suctions in the arogel 2.Its surface has passivation layer, and passivation layer is optional, and it mainly has been electric leakage, electric action.The structure of chip of the present invention is not limited to structure among Fig. 1, if any the structure of beating gold thread also in protection scope of the present invention.
After some glue is finished, arogel is being heated.Present embodiment is carried out at normal temperatures, and ambient temperature is assumed to be about 20 degrees centigrade.The temperature of the release hydrone of saltcake begins to discharge hydrone at 32.38 °, gradually arogel is heated up.The hydrone that saltcake discharges is absorbed by the SAP particle, expands in SAP particle suction back.
The volume ratio of joining glue is 1: 1 as epoxy resin and curing agent (being A glue B glue) proportioning.Wherein the fluorescent material of Can Zaing is 0.09 unit, but is not limited to above-mentioned 0.09 unit, for example can be 0.15 unit, and promptly A glue, B glue and fluorescent material also can be 1: 1: 0.15.Saltcake also can be 0.15 unit, and hydroscopic high-molecular resin is 0.05 unit.Need to prove that the amount of saltcake can be adjusted as required, and the amount of hydroscopic high-molecular resin also can be released how much adjusting of the water yield that the water thing discharges according to being heated.
In fact, be heated that to release what of the water yield that the water material discharges relevant, also relevant with the temperature of being heated with the moisture ratio of material itself.Different material institute water content are different.Even same material, under the different curing temperatures, the hydrone quantity of release also is different.For example, alum discharges 9 hydrones at 92.5 °, and just can lose whole hydrones at 200 °.In addition, also relevant with the time of solidifying, it is long more much to release the time that the water material is heated, and it is many more to decompose the water that comes out.Be 1 hour the curing time of general arogel, and curing time is by the curing attribute decision of epoxy resin.Strengthen its consumption for releasing the little water material require of releasing of the water yield, and can reduce its consumption releasing the big material of the water yield.
Also there are a lot of types in hydroscopic high-molecular resin, has different water absorbing capacities and expanding volume.General suction multiple is 100 times and gets final product, if water absorbing capacity is very strong, can reach 1400 times as the highest, then can further reduce the amount of hydroscopic high-molecular resin, but in order to help the distribution of hydroscopic high-molecular resin in arogel, it need be processed into the particle of littler order number, as 5000 orders (2.6um), even 10,000 orders (1.3um) and more than.The water of releasing the release of water thing that is heated generally speaking can directly be adsorbed by hydroscopic high-molecular resin, be suspended in the arogel, sharply expand in arogel suction back, fluorescent powder grain all directions expansion in arogel is carried on its surface, thereby fluorescent material is diffused into each corner of arogel, fluorescent material is evenly distributed in the arogel very much.
Some is heated and releases colour developing under the water thing normal temperature, shows green down as green vitriol normal temperature, but after the thermal dehydration, becomes colourless transparent crystal, therefore can not influence the luminous of led chip.For be faintly acid after the dehydration, the weakly alkaline water material of releasing generally is not optimized transformation, and first-selected neutral material or to chip and the destructive little material of epoxy resin.
Of the present invention being heated released the water thing and hydroscopic high-molecular resin is not limited to the above-mentioned material of mentioning, all can be applied to the material alternative of the technology of the present invention all in protection scope of the present invention.
Claims (9)
1. one kind is carried out the LED method for packing of dispersion treatment to fluorescent material,
The mixture that adds fluorescent material and doping in mixing arogel is made arogel, and described doping comprises being heated releases water thing and hydroscopic high-molecular resin SAP powder, and described being heated released water thing meeting release hydrone in the process that arogel is heating and curing;
In arogel, sneak into curing agent, on led chip, put glue;
Heating then makes crystalline hydrate discharge hydrone, and hydroscopic high-molecular resin absorbs this hydrone and expands, and the hydroscopic high-molecular resin after the expansion carries fluorescent material, and fluorescent material is disperseed in arogel, solidifies to arogel.
2. according to claim 1 fluorescent material is carried out the LED method for packing of dispersion treatment, it is characterized in that:
Described being heated released the water thing and comprised in crystalline hydrate, oxide hydrate and the organic substance hydrate one or more.
3. according to claim 1 fluorescent material is carried out the LED method for packing of dispersion treatment, it is characterized in that:
Described being heated released the water thing and comprised seven water nickelous sulfates, white vitriol, epsom salt, Sodium Citrate, usp, Dihydrate Powder, kaolin, barium chloride, calcium sulphate dihydrate, alum, saltcake, blue stone, green-vitriol, nine water sodium metasilicate, chloral hydrate, Co (ClO
4)
26H
2O and [Cr (H
2O)
4Cl
2] Cl2H
2In one or more mixing.
4. according to claim 1 fluorescent material is carried out the LED method for packing of dispersion treatment, it is characterized in that:
Described SAP is Sodium Polyacrylate or polyethylene glycol double methacrylate.
5. according to claim 1 fluorescent material is carried out the LED method for packing of dispersion treatment, it is characterized in that: described doping comprises stabilizer and dispersant.
6. according to claim 1 fluorescent material is carried out the LED method for packing of dispersion treatment, it is characterized in that:
After being mixed with arogel, arogel is ground to the requirement that reaches granularity.
7. according to claim 1 fluorescent material is carried out the LED method for packing of dispersion treatment, it is characterized in that: described led chip is the through-hole vertical structure LED that need not to beat gold thread, and its surface has passivation layer.
8. according to claim 1 fluorescent material is carried out the LED method for packing of dispersion treatment, it is characterized in that:
Described fluorescent material is gold-tinted fluorescent material, and described led chip is a blue chip, and blue chip excites gold-tinted fluorescent material to send white light.
9. according to claim 1 fluorescent material is carried out the LED method for packing of dispersion treatment, it is characterized in that:
Described fluorescent material is one or more the mixing in gold-tinted fluorescent material, red light fluorescent powder, blue light fluorescent powder or the green light fluorescent powder.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110173857 CN102244158B (en) | 2011-06-24 | 2011-06-24 | LED encapsulation method for dispersing fluorescent powder |
| CN201310024230.7A CN103107267B (en) | 2011-06-24 | 2011-06-24 | The LED arogel of anti-fluorescent material precipitation and LED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110173857 CN102244158B (en) | 2011-06-24 | 2011-06-24 | LED encapsulation method for dispersing fluorescent powder |
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|---|---|---|---|
| CN201310024230.7A Division CN103107267B (en) | 2011-06-24 | 2011-06-24 | The LED arogel of anti-fluorescent material precipitation and LED device |
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| CN102244158A true CN102244158A (en) | 2011-11-16 |
| CN102244158B CN102244158B (en) | 2013-02-13 |
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ID=44962106
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| CN201310024230.7A Expired - Fee Related CN103107267B (en) | 2011-06-24 | 2011-06-24 | The LED arogel of anti-fluorescent material precipitation and LED device |
| CN 201110173857 Expired - Fee Related CN102244158B (en) | 2011-06-24 | 2011-06-24 | LED encapsulation method for dispersing fluorescent powder |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105092421A (en) * | 2015-09-09 | 2015-11-25 | 长安大学 | Device and method for testing water releasing capacity of super absorbent polymer (SAP) for road |
| CN106903043A (en) * | 2017-03-24 | 2017-06-30 | 芜湖聚飞光电科技有限公司 | Fluorescent material particle size sorting and LED encapsulation method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104559838A (en) * | 2014-12-16 | 2015-04-29 | 江门市赛宁灯饰有限公司 | Fluorescent powder precipitation resistant LED package powder glue |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037295A (en) * | 2001-07-05 | 2003-02-07 | Taiwan Lite On Electronics Inc | Light-emitting diode and manufacturing method therefor |
| CN101320772A (en) * | 2008-07-15 | 2008-12-10 | 电子科技大学 | Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method |
| CN101916811A (en) * | 2010-07-09 | 2010-12-15 | 电子科技大学 | Light-emitting diode and preparation method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20060000313A (en) * | 2004-06-28 | 2006-01-06 | 루미마이크로 주식회사 | White led comprising photo-luminescent powder with large mean particle size and manufacturing method thereof and transparent resin composition used therein |
| CN102002269B (en) * | 2009-09-03 | 2013-11-20 | 佛山市国星光电股份有限公司 | Fluorescent powder coating liquid of white light emitting diode as well as preparation method and coating method thereof |
-
2011
- 2011-06-24 CN CN201310024230.7A patent/CN103107267B/en not_active Expired - Fee Related
- 2011-06-24 CN CN 201110173857 patent/CN102244158B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003037295A (en) * | 2001-07-05 | 2003-02-07 | Taiwan Lite On Electronics Inc | Light-emitting diode and manufacturing method therefor |
| CN101320772A (en) * | 2008-07-15 | 2008-12-10 | 电子科技大学 | Preparation for LED packaged fluorescent powder dispersoid and ink-jet printing method |
| CN101916811A (en) * | 2010-07-09 | 2010-12-15 | 电子科技大学 | Light-emitting diode and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105092421A (en) * | 2015-09-09 | 2015-11-25 | 长安大学 | Device and method for testing water releasing capacity of super absorbent polymer (SAP) for road |
| CN105092421B (en) * | 2015-09-09 | 2017-09-22 | 长安大学 | Outlet capacity test device and method are released with super water absorbent resin in a kind of road |
| CN106903043A (en) * | 2017-03-24 | 2017-06-30 | 芜湖聚飞光电科技有限公司 | Fluorescent material particle size sorting and LED encapsulation method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102244158B (en) | 2013-02-13 |
| CN103107267A (en) | 2013-05-15 |
| CN103107267B (en) | 2015-08-26 |
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Address after: 518000, 95, Fifth Industrial Zone, Mashan village, Gongming Town, Shenzhen, Guangdong, Baoan District Patentee after: SHENZHEN LIGHT ELECTRONICS CO., LTD. Address before: 518000, 95, Fifth Industrial Zone, Mashan village, Gongming Town, Shenzhen, Guangdong, Baoan District Patentee before: Shenzhen LIGHT Electronics Co., Ltd. |
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Granted publication date: 20130213 Termination date: 20160624 |